1232718 玖、發明說明： 【發明所屬之技術領域】 本發明係有關於一種印刷電路板之電路製造方法，尤 指一種軟性印刷電路板之電路製造方法。 【先前技術】 杈，軟性印刷電路板藉其具有可撓性或彎曲性，而能 提供不同於硬質印刷電路板之使用功能，使軟性印刷電= 板能隨產品可利用$間之大小及形狀進行三度空間立體配 線，以付合產品輕、薄、短、小之需求，所以此類軟性印 刷電路板乃為照相機、攝影機、音響設備……等電子產品中 耐曲性配線所不可欠缺之組件。 習知軟性印刷電路板之電路製造，乃先以附有導電層 之权性基板的半成品，依序經由塗佈光阻、曝光、顯影、 濕蝕刻等過程，將不要之導電層部份予以去除，留下所需 之電路部份；而前述軟性基板附有導電層之半成品的製造 過程，乃如第一圖所示，先在一軟性基板u上，藉由塗佈 接者劑12而貼合一層導電層13，藉此獲得前述之半成品。 上述習知軟性印刷電路板之電路製造過程中，其軟性 基板11係使用絕緣材料所製成，如聚醯亞胺（p〇iyimide)， 该導電層13則以貼合方式固定於該軟性基板11上，因此所 使用之；電層13厚度須較厚，約須25#即『6瓜），該習知 孝人〖生電路板之電路製造過程存在有如下之缺點·· +1、電路之接著力差：由於導電層13係藉由接著劑12 黏者於軟性基板11 i，因此所製造出之電路的附著性較差 !232718 ^ 2 '導電層13厚度較厚，濕蝕刻過程較為費時：由於 I電層13係經由濕蝕刻過程將不要之部份去除，僅留下所 =之電路部份，因此導電層13之厚度越厚，將使濕触刻過 程越費時。 、有鑑於習知軟性印刷電路板之電路製造過程存在有上 述缺失，本發人明即針對此等缺失加以改善而進行萌思設 計’遂開發出本發明。 【發明内容】 因此，本發明之目的，即在提供一種軟性印刷電路板 =電路製造方法，使其無須進行#刻，且所製出之電路附 著力佳、厚度薄’可撓性與熱安定性佳。 於是，本發明軟性印刷電路板之電路製造方法包含： 在軟性基板上濺鍍一層與所需電路對應之附著層的第一步 驟，疋在一軟性基板配合罩設一罩冑，將不欲設置電路之 面積加以遮蔽，並於前處理後進行_，其所使用之賤鑛 革巴材係為能和軟性基板具有良好附著性之材料，而在軟性 基板上欲設置電路之對應部位濺鍍附著一層附著層；在附 =層上濺料電層m是在前述濺鍍有附著層之 I f生基板上’同樣配合罩設_罩體，將不欲設置電路之面 =加以遮蔽及進㈣鑛，該步驟所制之藏餘材為銅材 貝而在附著層上滅鑛附著一層導電層，且前述附著層所 使用之職鑛革巴材亦與該導電層具有良好附著性；藉上^步 驟使所製出軟性印刷電路板之電路的附著力佳、厚度薄 1232718 且可撓性與熱安定性佳。 【實施方式】 有關本發明之前述及其他技術内容、特點與功效，在 以下配合參考圖式之一較佳實施例的詳細說明中，將可清 5 楚的明白。 參閱苐一圖’本發明軟性印刷電路板之電路製造方法 的較佳可行實施例包含有：在軟性基板上濺鍍一層與所需 電路對應之附著層的第一步驟；在附著層上濺鍍導電層之 第二步驟；電錢之第三步驟。 ° 以下續就上述各步驟之過程詳作說明： 第一步驟，在軟性基板上濺鍍一層與所需電路對應之 附著層：參閱第三圖，係將一由絕緣材料如聚醯亞胺 (polyimide)所製成之片狀軟性基板31配合罩設一罩體32， 將不从ό又置電路之面積加以遮蔽，並利用Ar或ο〗的電漿 5 進行前處理約30秒〜2分鐘以達清潔作用後，在軟性基板 31上欲設置電路之對應部位濺鍍附著一層由多數附著塊 331所構成之附著層33，其工作溫度在2〇(rc以下。該軟性 基板31可耐高溫約在22〇〜26〇。〇，較上述2〇〇。〇工作溫度 為向，其使用厚度可在12·5/ζ m〜125# m。該附著層33，其 〇 所使用革巴材必須能和軟性基板31具有良好附著性:、 例如可使用鉻或鎳材質，該步驟之濺鍍過程所獲得沉積於 軟性基板31的附著層33厚度，約在4〇〇〜8〇〇Α(1〇_1(^)。 第二步驟，在附著層上濺鍍導電層：參閱第四圖，前 述/賤鍍有各附著塊331之軟性基板31上，同樣配合單設前 1232718 述之罩體32’將不置電路之面積加以遮蔽及進行滅鑛 ’該步驟所使用之滅㈣材為銅材質，而在各附著塊331 上舰附著-層由多數導電塊341所構成之導電層％，厚 度約在卜，當然該導電層34之各導電塊341附著在 各附著塊33 1上後，即構成為所需之電路部份。 第三步驟，電鑛：參閱第五圖，可視電路部份厚度之 需求，將第二步驟中各導電塊⑷進行電鑛，使各導電塊 341鍵上—層電鍍層35,以增加其厚度，製造上該步驟並 非絕對必要。 10 15 由以上本實施例的實施可 相較具有如下之優點：了…見’本貫施例與習知者 1、電路之接著力佳·士认 荽；^ 由於本貫施例第一步驟中之附 者層33’係❹能和難基板31與導電層3 附著力之材質，且各者間 /、有良好 電声3“y… 鍍方式作結合，使得導 罨層34的接著力強。相 丁守 軟性基板11上藉由接著 "/ 方法中’在 上猎由接讀12黏著導 顯比本實施例者為弱。 的附者力，明 2、可形成甚薄之導電層34· 以濺鍍方式在附著声 ·貫也例之第二步驟係 甘丨1了考禮33上附著所需之導 層34暨構成電路之各導 g 34,使該導電 較之下，前述的厚度可為1力相 25_，實遠大於本實施例之導電声 J 13的厚度為 方法所製成之電路厚声f 的厗度，因此習知 3、可㈣L 敍於本#_所製出者。 由於形成之導電層34與附著層33皆 20 12327181232718 发明 Description of the invention: [Technical field to which the invention belongs] The present invention relates to a circuit manufacturing method for a printed circuit board, and particularly to a circuit manufacturing method for a flexible printed circuit board. [Previous technology] Flexible printed circuit boards, by virtue of their flexibility or bendability, can provide functions different from rigid printed circuit boards, so that flexible printed circuit boards can be used with the size and shape of the product. Three-dimensional three-dimensional wiring is used to meet the needs of light, thin, short, and small products. Therefore, such flexible printed circuit boards are indispensable for flexible wiring in electronic products such as cameras, video cameras, audio equipment, and so on. Components. The circuit manufacturing of conventional flexible printed circuit boards is based on the semi-finished product of a weighted substrate with a conductive layer, which is sequentially removed through the process of coating photoresist, exposure, development, wet etching, etc., and the unnecessary conductive layer is removed. , Leaving the required circuit part; and the manufacturing process of the semi-finished product with the conductive layer on the flexible substrate is as shown in the first figure, first on a flexible substrate u, coated with the adhesive 12 A conductive layer 13 is laminated to obtain the aforementioned semi-finished product. In the conventional manufacturing process of a flexible printed circuit board, the flexible substrate 11 is made of an insulating material, such as polyimide, and the conductive layer 13 is fixed to the flexible substrate in a bonding manner. The thickness of the electrical layer 13 must be thicker, about 25 #, that is, "6 melons." The filial piety of the traditional circuit board manufacturing process has the following shortcomings: +1, Poor adhesion: Because the conductive layer 13 is adhered to the flexible substrate 11 i by the adhesive 12, the manufactured circuit has poor adhesion! 232718 ^ 2 'The conductive layer 13 is thick, and the wet etching process is time-consuming: Since the I electrical layer 13 is removed through the wet etching process, leaving only the circuit part, the thicker the conductive layer 13 is, the more time-consuming the wet contact process is. In view of the above-mentioned defects in the conventional flexible printed circuit board manufacturing process, the present inventors have developed the present invention by designing and improving these defects. [Summary of the Invention] Therefore, the object of the present invention is to provide a flexible printed circuit board = circuit manufacturing method so that it does not need to be engraved, and the produced circuit has good adhesion, thin thickness, flexibility and thermal stability. Good sex. Therefore, the method for manufacturing a flexible printed circuit board according to the present invention includes: a first step of sputtering an adhesive layer corresponding to a desired circuit on a flexible substrate; The area of the circuit is shielded, and it is carried out after pre-treatment. The base mineral leather used is a material that can have good adhesion to the flexible substrate, and the corresponding part of the circuit where the circuit is to be sputtered and attached An adhesion layer; the sputtered electrical layer m on the attachment layer is the same as the above-mentioned I f green substrate sputtered with the adhesion layer, and the same as the cover_cover, the surface where the circuit is not to be set = shielded and inserted Mine, the remaining material produced in this step is copper, and a conductive layer is adhered to the adhesive layer, and the leather and bacon materials used in the foregoing adhesive layer also have good adhesion to the conductive layer; borrow ^ The steps make the circuit of the flexible printed circuit board have good adhesion, thin thickness 1232718, and good flexibility and thermal stability. [Embodiment] The foregoing and other technical contents, features, and effects of the present invention will be clearly understood in the following detailed description of a preferred embodiment with reference to the accompanying drawings. Refer to FIG. 1 for a preferred embodiment of a circuit manufacturing method of a flexible printed circuit board according to the present invention includes: a first step of sputtering an adhesion layer corresponding to a desired circuit on a flexible substrate; and sputtering on the adhesion layer The second step of the conductive layer; the third step of the money. ° The following is a detailed description of the process of the above steps: The first step is to sputter a layer of an adhesive layer corresponding to the required circuit on the flexible substrate: refer to the third figure, which consists of an insulating material such as polyimide ( A sheet-shaped flexible substrate 31 made of polyimide) is provided with a cover body 32 to cover the area where the circuit is not placed, and the pre-processing is performed by using Ar or o's plasma 5 for about 30 seconds to 2 minutes. After the cleaning effect is achieved, an adhesion layer 33 composed of a plurality of adhesion blocks 331 is sputtered and attached to the corresponding portion of the circuit on the flexible substrate 31, and the operating temperature is below 20 ° C. The flexible substrate 31 can withstand high temperatures It is about 2200 ~ 26.0%, which is more than the above 20.0% working temperature, and its use thickness can be 12.5 / ζ m ~ 125 # m. The adhesive layer 33, which is used as a leather material Must have good adhesion to the flexible substrate 31: For example, chrome or nickel can be used. The thickness of the adhesion layer 33 deposited on the flexible substrate 31 obtained by the sputtering process in this step is about 400 ~ 800. 1〇_1 (^). In the second step, a conductive layer is sputtered on the adhesion layer: see section In the fourth figure, the aforementioned / base plated flexible substrate 31 with each attachment block 331 is also used in conjunction with the cover 32 'described in the previous 1232718 to cover the area without the circuit and to perform demineralization. It is made of copper, and the adhesion layer on each attachment block 331 is a conductive layer composed of most of the conductive blocks 341. The thickness is about 1.00. Of course, each conductive block 341 of the conductive layer 34 is attached to each attachment block 331. After that, it is constituted as the required circuit part. The third step, power ore: See the fifth figure, depending on the thickness of the circuit part, the conductive blocks in the second step are power ore, so that each conductive block 341 On the key—a layer of electroplated layer 35 is added to increase its thickness. This step is not absolutely necessary for manufacturing. 10 15 From the above, the implementation of this embodiment may have the following advantages compared to the following: see… 1. The adhesion of the circuit is good; the recognition is good; ^ Because the attachment layer 33 'in the first step of this embodiment is a material that can resist the adhesion between the substrate 31 and the conductive layer 3, and // Good electro-acoustic 3 "y ... The combination of plating methods makes the conductive layer 34 The adhesion force is strong. The adhesion on the flexible substrate 11 by the "in the method" on the hunting read 12 is weaker than that of this embodiment. The attachment force, Ming 2, can be formed very thin Conductive layer 34. The second step of attaching the sound to the conductive layer by sputtering is to attach the required conductive layer 34 and the conductive layers 34 constituting the circuit on the test 33 to make this conductive In the following, the aforementioned thickness may be 1 force phase 25_, which is much larger than the thickness of the conductive sound J 13 in this embodiment, which is the thickness of the thick sound f of the circuit made by the method. _Manufactured. Because the conductive layer 34 and the adhesion layer 33 formed are both 20 1232718.
，相對地使其熱安定性較佳， :由於本實施例之附著層33與導電層 ，因此其間之熱膨脹係數的差異較小 性較佳，對於講究對準性之導通孔一 類設計’可減少材制因熱膨脹之差異造成偏離情形，而 能有效降低產品的不良率。 故歸納上述本發明軟性印刷電路板之電路製造方法， 確實可使製造出之電路的附著力佳且厚度較薄。 10 15 綜觀上述，本發明之實施的確能提供一種軟性印刷電鲁 路板之電路製造方法，使其無須進行蝕刻，且所製出之電 路附著力佳、厚度薄，而具有甚佳之產業上利用價值。 惟以上所述僅為本發明一較佳可行實施例，舉凡熟習 此項技藝人仕，其依本發明精神範疇所作之修飾或變更， 均理應包含在本案申請專利範圍内。 【圖式簡單說明】 第一圖所示係一種習知軟性印刷電路板製造過程中在 軟性基板上藉接著劑而貼合一導電層之構造示意圖。 第二圖所示係本發明軟性印刷電路板之電路製造方法 · 之較佳可行實施例的方塊流程圖。 第三圖所示係該較佳實施例中在軟性基板上濺鍍一層 與所需電路對應之附著層後的過程示意圖。 第四圖所示係該較佳實施例中在附著層上濺鍍導電層 後的過程示意圖。 第五圖所示係該較佳實施例中在導電層上電鍍一層電 9 1232718 鍍層後的過程示意圖。 1232718 【圖式之主要元件代表符號說明】 31 軟性基板 34 32 罩體 341 33 附著層 35 331 附著塊 導電層 導電塊 電鍍層 11Relatively better thermal stability: Because of the adhesion layer 33 and the conductive layer of this embodiment, the difference in thermal expansion coefficient between them is relatively small, and the design of the through-holes that focus on alignment can be reduced. The deviation of the material due to the difference in thermal expansion can effectively reduce the defective rate of the product. Therefore, summarizing the circuit manufacturing method of the flexible printed circuit board of the present invention described above can indeed make the manufactured circuit have good adhesion and thin thickness. 10 15 In summary, the implementation of the present invention can indeed provide a circuit manufacturing method for a flexible printed electrical circuit board, so that it does not need to be etched, and the produced circuit has good adhesion and thin thickness, and has excellent industrial use. value. However, the above is only a preferred and feasible embodiment of the present invention. Modifications or changes made by those skilled in the art in accordance with the spirit and scope of the present invention should be included in the scope of patent application for this case. [Brief description of the drawings] The first diagram is a schematic diagram of a conventional flexible printed circuit board manufacturing process in which a conductive layer is bonded by an adhesive on a flexible substrate. Shown in the second figure is a block flow diagram of a preferred method for manufacturing a flexible printed circuit board circuit of the present invention. The third figure shows a schematic diagram of the process after the adhesion of a layer corresponding to the required circuit on the flexible substrate in the preferred embodiment. The fourth figure is a schematic diagram of the process after the conductive layer is sputtered on the adhesion layer in the preferred embodiment. The fifth diagram is a schematic diagram of the electroplating process on the conductive layer in the preferred embodiment. 1232718 [Description of the main symbols of the drawings] 31 Flexible substrate 34 32 Cover 341 33 Adhesive layer 35 331 Adhesive block Conductive layer Conductive block Plating layer 11