JP2000286530A - Manufacture of flexible circuit board - Google Patents
Manufacture of flexible circuit boardInfo
- Publication number
- JP2000286530A JP2000286530A JP11088201A JP8820199A JP2000286530A JP 2000286530 A JP2000286530 A JP 2000286530A JP 11088201 A JP11088201 A JP 11088201A JP 8820199 A JP8820199 A JP 8820199A JP 2000286530 A JP2000286530 A JP 2000286530A
- Authority
- JP
- Japan
- Prior art keywords
- wiring pattern
- base material
- pattern
- circuit board
- flexible circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 239000000463 material Substances 0.000 claims abstract description 31
- 238000004544 sputter deposition Methods 0.000 claims abstract description 15
- 239000007788 liquid Substances 0.000 claims abstract description 11
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000010936 titanium Substances 0.000 claims abstract description 7
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims description 33
- 238000007740 vapor deposition Methods 0.000 claims description 12
- 229920002120 photoresistant polymer Polymers 0.000 claims description 6
- 239000000654 additive Substances 0.000 claims description 5
- 230000000996 additive effect Effects 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000004519 grease Substances 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 abstract description 10
- 239000002184 metal Substances 0.000 abstract description 10
- 238000000151 deposition Methods 0.000 abstract description 4
- 230000005855 radiation Effects 0.000 abstract description 4
- 238000009413 insulation Methods 0.000 abstract 4
- 238000009713 electroplating Methods 0.000 description 11
- 230000008021 deposition Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、スパッタリング法
又は蒸着法によるリフトオフ法を採用しながら電解メッ
キ手段等では形成できない金属で所要の配線パタ−ンを
好適に形成可能な可撓性回路基板の製造法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible circuit board capable of suitably forming a required wiring pattern with a metal which cannot be formed by electrolytic plating or the like while employing a lift-off method by a sputtering method or a vapor deposition method. Related to manufacturing method.
【０００２】[0002]
【従来の技術】この種の可撓性回路基板を製作する従来
の手法としては、サブトラクティブ法又はアディティブ
法がある。サブトラクティブ法は、可撓性絶縁べ−ス材
に銅箔等の導電層を積層したもの又は可撓性絶縁べ−ス
材の少なくとも一方面に電解メッキ等の手段で導電層を
一様に形成したものを用意し、その導電層の必要部分を
フォトレジスト材等を用いてマスキング処理した後、露
出している不要な導電層領域をエッチング手段で除去す
ることによって所要の配線パタ−ンを形成するものであ
る。2. Description of the Related Art As a conventional method for manufacturing such a flexible circuit board, there is a subtractive method or an additive method. In the subtractive method, a conductive layer such as a copper foil is laminated on a flexible insulating base material, or the conductive layer is uniformly formed on at least one surface of the flexible insulating base material by electrolytic plating or the like. A prepared wiring is prepared, a necessary portion of the conductive layer is subjected to a masking process using a photoresist material or the like, and then an unnecessary unnecessary conductive layer region is removed by etching means, thereby forming a required wiring pattern. To form.
【０００３】また、アディティブ法によって可撓性回路
基板を製作するには、適当な可撓性絶縁べ−ス材の表面
にメッキリ−ドとなるシ−ド層を形成した後、所要の配
線パタ−ンを形成できるパタ−ンでシ−ド層の表面にフ
ォトレジスト材等を用いてマスクパタ−ンを形成し、次
に、電解メッキ法によりシ−ド層の露出した領域に銅等
の導電性部材を被着して配線パタ−ンを形成し、また、
必要に応じてそれらの配線パタ−ンの表面には同じく電
解メッキ法で金等の異種金属を用いて表面導電層を形成
し、最後に、不要となったマスクパタ−ン及びその底部
に位置するシ−ド層の領域を除去することにより、可撓
性絶縁べ−ス材の上面にシ−ド層部分、配線パタ−ン及
び表面導電層等から構成される所要の配線パタ−ンを形
成するものである。In order to manufacture a flexible circuit board by the additive method, a required wiring pattern is formed after a seed layer serving as a plating lead is formed on the surface of a suitable flexible insulating base material. A mask pattern is formed on the surface of the shield layer using a photoresist material or the like with a pattern capable of forming a pattern, and then a conductive material such as copper is formed on an exposed region of the shield layer by electrolytic plating. Forming a wiring pattern by attaching a conductive member;
If necessary, a surface conductive layer is formed on the surface of the wiring pattern by using a dissimilar metal such as gold by electrolytic plating, and finally, the mask pattern becomes unnecessary and is located on the bottom thereof. By removing the area of the shield layer, a required wiring pattern including a shield layer portion, a wiring pattern, a surface conductive layer, and the like is formed on the upper surface of the flexible insulating base material. Is what you do.
【０００４】[0004]
【発明が解決しようとする課題】上記従来の手法では、
必要な配線パタ−ンの形成を電解メッキ手段で行うのが
主体である為、配線パタ−ンの材質は電解メッキ法で形
成可能な材質に限定されてしまう。従って、実装時に於
ける電子部品との電気的接合性或いは配線パタ−ンの耐
環境性等を高める為に、配線パタ−ンを電解メッキでは
形成できないチタンなどの金属で形成することは不可能
であった。In the above conventional method,
Since a necessary wiring pattern is mainly formed by electrolytic plating, the material of the wiring pattern is limited to a material that can be formed by the electrolytic plating method. Therefore, it is impossible to form the wiring pattern with a metal such as titanium, which cannot be formed by electrolytic plating, in order to improve the electrical bonding property with the electronic component at the time of mounting or the environmental resistance of the wiring pattern. Met.
【０００５】このような不都合を解消する他の手法とし
てはリフトオフ法がある。このリフトオフ法は、可撓性
絶縁べ−ス材の表面の不要領域部分にフォトレジスト材
等を用いてマスキング処理を施した後、スパッタリング
法又は蒸着法により所要の金属を被着させて導電層を形
成し、次いで不要となったマスク部材を除去することに
より所要の配線パタ−ンを形成するものである。[0005] As another method for solving such inconvenience, there is a lift-off method. In this lift-off method, a masking process is performed on an unnecessary area on the surface of a flexible insulating base material using a photoresist material or the like, and then a required metal is applied by a sputtering method or a vapor deposition method to form a conductive layer. Is formed, and then unnecessary mask members are removed to form a required wiring pattern.
【０００６】しかし、可撓性絶縁べ−ス材は薄く剛性が
ない為に放熱板に密着しないことから、スパッタリング
又は蒸着時にマスク部材の放熱が十分に行われない為、
このマスク部材が熱による損傷を受けて適正な配線パタ
−ンを形成することが不可能な場合がある。However, since the flexible insulating base material is thin and has no rigidity and does not adhere to the heat radiating plate, the mask member does not sufficiently radiate heat during sputtering or vapor deposition.
In some cases, the mask member is damaged by heat and it is impossible to form a proper wiring pattern.
【０００７】そこで、本発明では、スパッタリング法又
は蒸着法によるリフトオフ法を採用した場合でも電解メ
ッキ手段等では形成できない金属で所要の配線パタ−ン
を好適に形成可能な可撓性回路基板の製造法を提供する
ものである。Therefore, according to the present invention, a flexible circuit board capable of suitably forming a required wiring pattern with a metal which cannot be formed by electrolytic plating means or the like even when a lift-off method by a sputtering method or a vapor deposition method is employed. It provides the law.
【０００８】[0008]
【課題を解決するための手段】その為に、本発明に係る
可撓性回路基板の製造法では、上面に所要の配線パタ−
ンを形成できるパタ−ンでフォトレジスト材等のマスク
パタ−ンを形成した可撓性絶縁べ−ス材を高真空下でも
ガスの発生しない耐熱性高真空用シリコングリス等から
なる密着液を介して放熱板に密着させた状態で前記可撓
性絶縁べ−ス材の上面にスパッタリング法又は蒸着法で
チタン等の金属によって所要の配線パタ−ンを形成する
ものである。Therefore, in the method of manufacturing a flexible circuit board according to the present invention, a required wiring pattern is formed on the upper surface.
A flexible insulating base material formed of a mask pattern such as a photoresist material with a pattern capable of forming a pattern is passed through an adhesive liquid made of heat-resistant high-vacuum silicon grease which does not generate gas even under a high vacuum. A required wiring pattern is formed on the upper surface of the flexible insulating base material by sputtering or vapor deposition with a metal such as titanium by being adhered to the heat sink.
【０００９】その場合、前記スパッタリング法又は蒸着
法により前記所要の配線パタ−ンを形成する工程の前
に、サブトラクティブ法又はアディティブ法で前記配線
パタ−ンの下地を形成することもできる。In this case, before the step of forming the required wiring pattern by the sputtering method or the vapor deposition method, a base of the wiring pattern may be formed by a subtractive method or an additive method.
【００１０】[0010]
【発明の実施の形態】以下、図示の実施例を参照しなが
ら本発明を更に詳述する。図１は、本発明の一実施例に
よる可撓性回路基板の製造工程図である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in further detail with reference to the illustrated embodiments. FIG. 1 is a manufacturing process diagram of a flexible circuit board according to an embodiment of the present invention.
【００１１】先ず、図１（１）の如く、ポリイミドフィ
ルム等の適当な可撓性絶縁べ−ス材１の表面に所要の配
線パタ−ンを形成できるパタ−ンでフォトレジスト材等
を用いてマスクパタ−ン２を形成する。First, as shown in FIG. 1A, a photoresist material or the like is used in a pattern capable of forming a required wiring pattern on the surface of a suitable flexible insulating base material 1 such as a polyimide film. To form a mask pattern 2.
【００１２】上記のマスクパタ−ン２の膜厚は、形成す
べき所要の配線パタ−ンの厚みより厚く形成し、また、
そのマスクパタ−ン２の側面形状は垂直又は逆台形に形
成することができる。The mask pattern 2 is formed to be thicker than a required wiring pattern to be formed.
The side surface of the mask pattern 2 can be formed in a vertical or inverted trapezoidal shape.
【００１３】次いで、同図（２）の如く、可撓性絶縁べ
−ス材１の裏面に耐熱性であって高真空下でもガスの発
生しない高真空用シリコングリス等からなる密着液６を
一様に介在させて放熱板５を配置し、これにより可撓性
絶縁べ−ス材１と放熱板５とを密着液６を介して均一に
密着させて、マスクパタ−ン２の放熱性を確保してお
く。Next, as shown in FIG. 2B, an adhesive liquid 6 made of silicon grease for high vacuum or the like which is heat-resistant and does not generate gas even under high vacuum is applied to the back surface of the flexible insulating base material 1. The heat radiating plate 5 is disposed uniformly interposed therebetween, and thereby the flexible insulating base material 1 and the heat radiating plate 5 are uniformly brought into close contact with each other via the contact liquid 6, so that the heat radiation of the mask pattern 2 is improved. Reserve it.
【００１４】そこで、矢印で示す如く、電解メッキ法で
は形成できないチタン等の金属をスパッタリング法又は
蒸着法により被着して配線パタ−ン３を形成するが、そ
の際にはマスクパタ−ン２の上面にも被着層４が形成さ
れる。Therefore, as shown by the arrow, a metal such as titanium which cannot be formed by electrolytic plating is applied by sputtering or vapor deposition to form a wiring pattern 3. In this case, a mask pattern 2 is formed. The deposition layer 4 is also formed on the upper surface.
【００１５】斯かるリフトオフ法による配線パタ−ン３
の形成時には、可撓性絶縁べ−ス材１と放熱板５とが密
着液６を介して均一に密着して、マスクパタ−ン２の放
熱性が確保されているので、スパッタリング又は蒸着時
にマスクパタ−ン２の損傷が好適に防止され、これによ
り精度の良好な高品質の配線パタ−ン３を形成すること
ができる。The wiring pattern 3 by the lift-off method
During the formation of the mask pattern, the flexible insulating base material 1 and the heat radiating plate 5 are uniformly adhered to each other via the contact liquid 6, and the heat radiation of the mask pattern 2 is ensured. In this way, damage to the wiring pattern 2 can be suitably prevented, so that a high-precision and high-quality wiring pattern 3 can be formed.
【００１６】最後に、同図（３）のように、被着層４と
共に不要となったマスクパタ−ン２を除去することによ
り、可撓性絶縁べ−ス材１の上面に電解メッキ法では形
成できないチタン等の金属からなる所要の配線パタ−ン
３を形成した可撓性回路基板を得ることができる。Finally, as shown in FIG. 3 (3), by removing the mask pattern 2 which is no longer needed together with the deposition layer 4, the upper surface of the flexible insulating base material 1 is formed by electrolytic plating. A flexible circuit board having a required wiring pattern 3 made of a metal such as titanium which cannot be formed can be obtained.
【００１７】なお、上記のリフトオフ法による配線パタ
−ン３の形成前に、サブトラクティブ法又はアディティ
ブ法でその配線パタ−ンの下地を形成することもでき
る。Prior to the formation of the wiring pattern 3 by the lift-off method, a base of the wiring pattern can be formed by a subtractive method or an additive method.
【００１８】[0018]
【発明の効果】本発明による可撓性回路基板の製造法に
よれば、リフトオフ法による配線パタ−ンの形成時に、
可撓性絶縁べ−ス材と放熱板とが密着液を介して均一に
密着して、マスクパタ−ンの放熱性が確保されているの
で、スパッタリング又は蒸着時にマスクパタ−ンの損傷
が好適に防止され、従って、精度の良好な高品質の配線
パタ−ンを形成することができる。According to the method of manufacturing a flexible circuit board according to the present invention, when a wiring pattern is formed by a lift-off method,
The flexible insulating base material and the heat radiating plate are uniformly adhered to each other via the contact liquid, and the heat radiation of the mask pattern is secured, so that the damage of the mask pattern during sputtering or vapor deposition is suitably prevented. Therefore, a high-quality wiring pattern with good precision can be formed.
【００１９】上記手法の採用により、本発明によれば従
来の電解メッキ手段では形成できないチタン等の金属を
スパッタリング法又は蒸着法で被着して確実に所要の配
線パタ−ンを形成することができる。By employing the above method, according to the present invention, a metal such as titanium which cannot be formed by the conventional electrolytic plating means can be deposited by sputtering or vapor deposition to reliably form a required wiring pattern. it can.
【００２０】従って、実装時に於ける電子部品との電気
的接合性或いは配線パタ−ンの耐環境性等を高めること
の可能な可撓性回路基板を安定的に製作できる。Accordingly, it is possible to stably produce a flexible circuit board capable of improving the electrical connection with the electronic components during mounting and the environmental resistance of the wiring pattern.
【図１】本発明の一実施例による可撓性回路基板の製造
工程図。FIG. 1 is a manufacturing process diagram of a flexible circuit board according to an embodiment of the present invention.
１ 可撓性絶縁べ−ス材 ２ マスクパタ−ン ３ 配線パタ−ン ４ 被着層 ５ 放熱板 ６ 密着液 DESCRIPTION OF SYMBOLS 1 Flexible insulating base material 2 Mask pattern 3 Wiring pattern 4 Deposition layer 5 Heat sink 6 Adhesive liquid
フロントページの続き Ｆターム(参考） 5E339 AA02 AB02 AD01 BC01 BD05 BD13 EE10 GG02 5E343 AA18 AA33 BB35 DD23 DD25 ER11 GG08 Continued on the front page F term (reference) 5E339 AA02 AB02 AD01 BC01 BD05 BD13 EE10 GG02 5E343 AA18 AA33 BB35 DD23 DD25 ER11 GG08
Claims (5)
タ−ンでマスクパタ−ンを形成した可撓性絶縁べ−ス材
を密着液を介して放熱板に密着させた状態で前記可撓性
絶縁べ−ス材の上面にスパッタリング法又は蒸着法で所
要の配線パタ−ンを形成することを特徴とする可撓性回
路基板の製造法。A flexible insulating base material having a mask pattern formed of a pattern capable of forming a required wiring pattern on an upper surface thereof is adhered to a heat radiating plate via an adhesive liquid. A method of manufacturing a flexible circuit board, wherein a required wiring pattern is formed on the upper surface of a flexible insulating base material by a sputtering method or a vapor deposition method.
い耐熱性高真空用シリコングリスである請求項１の可撓
性回路基板の製造法。2. The method for manufacturing a flexible circuit board according to claim 1, wherein said adhesive liquid is heat-resistant silicon grease for high vacuum which does not generate gas even under high vacuum.
使用して形成された請求項１又は２の可撓性回路基板の
製造法。3. The method for manufacturing a flexible circuit board according to claim 1, wherein said mask pattern is formed using a photoresist material.
れる配線パタ−ンの材質がチタンである請求項１〜３の
いずれかの可撓性回路基板の製造法。4. The method of manufacturing a flexible circuit board according to claim 1, wherein the material of the wiring pattern formed by the sputtering method or the vapor deposition method is titanium.
記所要の配線パタ−ンを形成する工程の前に、サブトラ
クティブ法又はアディティブ法で前記配線パタ−ンの下
地を形成することを特徴とする請求項１〜４のいずれか
の可撓性回路基板の製造法。5. A method according to claim 1, wherein a base of said wiring pattern is formed by a subtractive method or an additive method before the step of forming said required wiring pattern by said sputtering method or vapor deposition method. Item 5. The method for manufacturing a flexible circuit board according to any one of Items 1 to 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP08820199A JP3606763B2 (en) | 1999-03-30 | 1999-03-30 | Method for manufacturing flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP08820199A JP3606763B2 (en) | 1999-03-30 | 1999-03-30 | Method for manufacturing flexible circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000286530A true JP2000286530A (en) | 2000-10-13 |
| JP3606763B2 JP3606763B2 (en) | 2005-01-05 |
Family
ID=13936295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP08820199A Expired - Fee Related JP3606763B2 (en) | 1999-03-30 | 1999-03-30 | Method for manufacturing flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3606763B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8138423B2 (en) | 2004-11-19 | 2012-03-20 | Toyo Kohan Co., Ltd. | Printed wiring board and method for manufacturing printed wiring board |
| JP2017104547A (en) * | 2015-12-09 | 2017-06-15 | バイオセンス・ウエブスター・(イスラエル)・リミテッドBiosense Webster (Israel), Ltd. | Ablation catheter with light-based contact sensors |
-
1999
- 1999-03-30 JP JP08820199A patent/JP3606763B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8138423B2 (en) | 2004-11-19 | 2012-03-20 | Toyo Kohan Co., Ltd. | Printed wiring board and method for manufacturing printed wiring board |
| JP2017104547A (en) * | 2015-12-09 | 2017-06-15 | バイオセンス・ウエブスター・(イスラエル)・リミテッドBiosense Webster (Israel), Ltd. | Ablation catheter with light-based contact sensors |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3606763B2 (en) | 2005-01-05 |
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