TWI232566B - Packaging structure of oscillator and its device mounting method - Google Patents

Abstract

A packaging structure of oscillator and its device mounting method are disclosed in the present invention. In the invention, the principles of capillarity and surface tension axioms of fluid are used such that the oscillator size can be shrunk and simultaneously the piezoelectric device can be protected from being contaminated. The oscillator packaging structure proposed by the invention contains: a platform containing an upper surface and a lower surface; one upward opened container, which is formed by extending plural sides upwards to have a height at the periphery of the upper surface together with the upper surface of the platform and is capable of accommodating at least one piezoelectric device; one upper covering cap that covers the upward opened container to form a closed environment; a printed circuit, which is distributed on the lower surface and is capable of connecting at least one electronic device; plural frames, which have the same height and are distributed on the printed circuit; one lower covering cap, which is connected to these frames and is combined with the lower surface to jointly form one partially-opened environment such that the lower covering cap has a rubber-filling hole; and the plastic material that fills into the partially-opened environment through the rubber-filling hole.

Description

1232566 V. Description of the invention (1) [Technical field to which the invention belongs] Especially the oscillator seal I _ This invention belongs to the field of frequency control devices and its component mounting method. .Prior art]

The C / Depth compensation quartz oscillator (Temperature Compensated r ^ Stal 〇SeiUat〇r, TCX0) is a frequency controller commonly used in electronic products. A typical temperature compensated quartz oscillator uses a piezoelectric element

Piezoelectric Mq + ^ ·, x ^ ^, ^ ^. Materlal), usually a quartz crystal, which is related to #% τ π f 4! Mobile telephones, pagers or wireless modems in a changing environment. As the size of electronic products tends to be thin, thin, short, and short, the percentage of people who are happy with P also needs to comply with this trend. "The first picture of the packaging structure of the Beiui device is a schematic diagram of the structure of a temperature-compensated quartz shock soup in the conventional art. The temperature compensation of the temperature compensation 箪 雷 i 11 0 0 seal, Λ1 and paved pebbles Yang Zhensheng made 100 packs of a piezoelectric element 101, a temperature-compensated integrated circuit 102, a plurality of input / output pads (not shown),-covering 102, and humming this Φ; Λ cover 104 and housing 105 can store 7L electronic parts and form a tight space with the cover 104. The characteristic of a piezoelectric element lies in its rhetoric φ — a. It makes the surface generate electric charges. And cause electricity: poor ...: When the yoke is stressed, the pen position difference will be 'in contrast, when an electric field is applied to the piezoelectric element, it will cause deformation, which can produce 镅' Radio Frequency). When a voltage is applied to the piezoelectric element m, the piezoelectric element

1232566 V. Description of the invention (2)-: i'1 can generate resonance frequency. However, if the temperature inside the enclosure changes, the resonance frequency # may result in a slight deviation # (Drift) n due to the temperature change outside the 105 ° 1 degree compensation device is usually integrated as compensation? The body circuit 102 is placed in the casing 105 to provide compensation information about the soil / broiler degree. However, the above-mentioned temperature-compensated quartz oscillator 丨 00 structure encapsulates the piezoelectric π member 101 and the temperature-compensated integrated circuit 102 in the same closed space 7. On the one hand, the structure is not conducive to reducing the temperature-compensated quartz oscillator 0 positive package volume, on the other hand, the temperature compensation integrated circuit i 〇2 is usually covered with an epoxy (Epoxy) as a protection of the temperature compensation integrated circuit 102 and other electronic parts, and the ring Oxygen resin will cause pollution to the piezoelectric element 101, and thus affect the change of its resonance frequency. In view of this, a modified temperature-compensated quartz oscillator structure is shown in Figure 28 and Figure 2B. Figure A is a cross-sectional view of a modified temperature-compensated quartz oscillator 2000. The main structure of the temperature-compensated quartz oscillator 2000 is a platform 201. A plurality of side edges 202 extend upward around the platform 201 and terminate at a plurality of metal contact holes 2 1 0 to form an upwardly open. The container 204 is formed by a plurality of contact holes 210 for connecting an external circuit, and a plurality of side edges 203 extend downward around the platform 201 to form a downwardly opened container 205. A central part of the platform 201 in the open container 204 can be provided with a temperature compensation detection circuit 2 06 and a plurality of capacitors 207 or other electronic components; and the downwardly opened container 2 0 5 The internal platform 201 can be configured with a piezoelectric element 208 and a cover 209 to form a sealed environment. The temperature compensates for quartz shock

Page 6 1232566 V. Description of the invention (3) The oscillator 2 0 0 is structured such that the temperature compensation integrated circuit 2 0 6 and the piezoelectric element 2 0 8 are respectively arranged on the upper and lower sides of the platform 2 0 1, so, After the temperature-compensated integrated circuit 206 is covered with epoxy resin, the piezoelectric element 208 will not be contaminated because it is sealed in the container 205 placed downward. Therefore, the stability and reliability of the resonance frequency of the piezoelectric element 208 can be maintained. However, if it is desired to reduce the size and volume of the structure of the temperature-compensated quartz oscillator, the use of the above-mentioned structure will have some limitations and difficulties. The second diagram B is a top view of the temperature-compensated quartz oscillator 20 0. In the second figure B, there are a plurality of metal pads 2 1 1 on the upper side 2 2 of the temperature-compensated quartz oscillator 2 0 0, and the pads 2 1 1 are used for the temperature-compensated quartz. The oscillator 200 is bonded to a printed circuit board or other substrate of an electronic product to which it is applied. Since the bonding pads 2 1 1 for bonding must have a fixed size area, while reducing the size of the temperature-compensated quartz oscillator 20 0, the upper surface of the platform 201 can be used for the temperature-compensated integrated circuit 2 0 The area used by 6 and other electronic components will also be reduced accordingly. This will increase the difficulty of installing the temperature compensation integrated circuit 2 06 and other electronic components, which will cause problems such as increased costs or lower yields. To sum up, in order to solve the problems that the size reduction of the temperature-compensated quartz oscillator and the protection of the piezoelectric element from being contaminated cannot be overcome at the same time in the conventional technique, the present invention proposes an oscillator package structure and a component mounting method thereof, which can simultaneously solve the conventional technique The problems or limitations caused by medium temperature compensated quartz oscillators can be further applied to other oscillator packages or related semiconductor component packages.

1232566 V. Description of the invention (4) [Summary of the invention] The present invention proposes a method for packaging structure of an oscillator and its component mounting, which utilizes the capillary phenomenon of fluid and the principle of surface tension to simultaneously reduce the size of the oscillator and protect the pressure. Electrical components are not contaminated. The oscillator package structure proposed by the present invention comprises: a platform including an upper surface and a lower surface; a plurality of sides extending upwardly around the upper surface by a height to form an upward opening with the upper surface of the platform. The container can contain at least one piezoelectric element; an upper cover covers the upwardly open container to form a closed environment; a printed circuit is distributed on the lower surface to be connected to at least one electronic component; a plurality of brackets of the same height are distributed on the On the printed circuit; a lower cover is joined to the brackets and forms a partially open environment with the lower surface, wherein the lower cover has a glue hole; and a plastic material is filled in the partially opened hole through the glue hole. surroundings. The invention provides a method for mounting structural components of an oscillator package, comprising: providing a packaging structure having a container with an open upper end and a lower surface; joining and sealing a piezoelectric element in the container placed on the upper end; and joining a plurality of electrons The component is on the lower surface of the packaging structure; a plurality of brackets are made on the lower surface of the packaging structure; a plastic hole is covered under the brackets to cover the brackets to form a part of the open environment; a plastic material is filled through the irrigation The glue hole is in an environment where the part is open; and adjusting the frequency of the piezoelectric element. The package structure and component mounting method of the oscillator proposed by the present invention described above can substantially solve the problem of the size limitation of the temperature compensated quartz oscillator and the pollution of the piezoelectric element caused by the conventional technology. The oscillator package provided by the present invention Structure can reduce the size of the oscillator and protect the piezoelectric element from dirt

Page 8 1232566 V. Description of the invention (5) — ---- wood 'and can be further applied to its strong package. Others: Encapsulation or related semiconductor components. [Embodiment] 1 will be described in detail with the drawings. The invention of the invention = three pictures to the seventh picture is the first implementation of the invention: ... The second picture is the first of the invention. The top view of the components of the second Qianshi & Bech example. As shown in the figure, the present invention includes a platform 301, a piezoelectric element (main structure of the structure), a top cover 32, a piece 310, and an integrated circuit 350 (fourth top Covering 3 2 0, several brackets 33〇 and _ The platform 301 can be a pottery ware from "ice A, ^ Bu Xin ware 34ϋ 〇ηο" material, which has an upper surface and lower surface 307 and a plurality of Side surface 305, where the work =: the surrounding part extends a height upwards to form a plurality of side edges 303, and the top of the side = 〇3 has a plurality of 塾 3, where the pads 309 can be : Metal pad with specific thickness or—thinner metal plating film, which is represented by metal plating film in the third round. The side edges 303, solder pads 309 and the upper surface 302 of the platform 301 are jointly formed. A container opened upward, wherein the upper surface 3 0 2 of the platform 3 〇 1 is disposed in the container opened upward and is provided with a plurality of welding pads 3 0 4. A piezoelectric element 3 1 0 is provided with a plurality of welding pads 3丨 2 and electrode 3 丨 i, wherein the piezoelectric element 310 may be an AT-CUT quartz crystal or other similar structures. The piezoelectric element 3 1 0 may be connected with The pads 30 4 on the upper surface 3 0 2 of the platform 3 0 1 are joined, and the piezoelectric elements 3 1 0 can be connected to the platform 3 0 1 through the pads 304, 31 2 and the electrodes 311. The plurality of conducting electrodes 30 6 on the side surface 3 05 or an internal circuit 308.

Page 9 1232566 V. Description of the invention (6) " ~ " " " The upper cover 3 2 0 then covers the platform 3 0 1 and the sides 3 0 3 to form the upwardly open container. Above, wherein the upper cover may include a metal. After the upper cover 3 2 0 and the platform 3 0 1 are subjected to the same high temperature environment, the upper cover 3 2 0 is joined to the solder pads 3 009 at the tops of the side edges 3 0 3, so the upper cover 3 2 0 and the upwardly open container together form a closed environment, wherein the closed environment can completely house the piezoelectric element 3 丨 0. The fourth figure is an exploded bottom view of the first embodiment of the present invention. The lower surface 307 of the platform 301 has an internal circuit 308. The internal circuit 308 can be configured with a plurality of capacitors 351 and can be connected to an integrated circuit 350 through a plurality of metal wires 352. The integrated circuit 35. It can be a temperature compensated integrated circuit. In addition, a plurality of brackets 3 3 0 of the same height are arranged on the internal circuit 3 0 8 of the lower surface 3 7. The brackets 3 3 0 include at least one conductive material and the height thereof can be 20 0 # m to 100. 0 / zm. The fifth figure is a component mounting diagram of the first embodiment of the present invention. The lower cover 3 4 0 may be composed of a ceramic material or a printed circuit board material. 'The lower cover 34 0 has a glue hole 341 and a plurality of pads 342, wherein the solder pads 342 are evenly distributed on the lower cover by the same number. The upper and lower surfaces of 34 ° are connected to each other. Next, as shown in the fifth figure, the lower cover is joined to the brackets 3 3 0 by the solder pads 342. On the one hand, the lower cover ^ 0 may be common with the lower surface 3 0 7 of the platform 3 0 丨Forming a partially open environment 'On the other hand, the pads 3 4 2 can conduct the electronic components contained in the partially open environment to an external circuit. The sixth diagram A is a view showing that a plastic material is filled in the lower cover 3 4 0 and the lower surface 3 0 7 of the platform 3 0 1 together to form a partially open environment in the present invention.

1232566 V. Description of Invention (7) " " ----- Intention. As shown in the sixth figure, when the upper cover 320 and the lower cover 340 are installed to the flat port 301, a syringe 4 0 0 is filled with a plastic material through the filling hole 341 of the lower cover 340. Up to the partially open environment formed by the lower cover 34o and the lower surface 3007 of the platform 3101, the plastic material 4101 may be epoxy resin. Since the distance between the lower cover 3 40 and the lower surface 3 007 of the platform 301 is determined by the height of the brackets 3 〇, it can be 2000 V m to 1000 μm That is, when the plastic material 4 q 1 is injected into the open environment of the part, it will diffuse due to the capillary phenomenon of the fluid itself and fill the open environment of the part. Furthermore, the filled plastic material 40 1 diffuses. To the boundary of the partially open environment

At the end of the boundary, it can be seen that the plastic U Γ and has this principle. For the plastic material_fill:! Buffer space to reduce the excess or deficiency of π to 4, so the yield of the shaker 300 can be improved. 'χ VII ^ shows the package structure of the oscillator of the present invention. After the plastic material 401 is filled, the solvent contained in the resin is volatilized and solidified, and the structure is acceptable. Finally, adjust the output frequency of the oscillating 3 | 3 〇 + not only in the figure, and measure the standing position. Yes, that is to complete the oscillating device 3 0 0 packaging structure of the present invention. Force measurement, force Figures 8 to 10 are the second embodiment of the present invention. The eighth figure is an exploded top view of a second embodiment of the present invention. The method of the second embodiment of the present invention is substantially the same as that of the first embodiment, but

Page 11 1232566 V. Description of the invention (8) Moreover, as shown in the eighth and ninth figures, the brackets 3 3 0 can also be arranged on the solder pads 342 of the lower cover 34 0 to make the lower cover 34 0 includes a glue filling hole 341 and the brackets 330, wherein the brackets 33 0 include at least a conductive material and the height thereof may be 200 / zm to 100 0 / zm. The ninth figure is an exploded bottom view of the second embodiment of the present invention. As shown in the tenth figure, the lower cover 34 0 and the lower surface 3 0 7 of the platform 301 are joined to the lower surface 3 0 7 of the platform 30 1 by the brackets 33 0 engaging the internal circuit 30 8 on the lower surface 30 7 of the platform 301. In a partially open environment, the electronic components stored in the partially opened environment can be conducted to an external circuit by the brackets 3 3 0. Then, the plastic material 40 1 is filled in the lower cover 34 0 and the lower surface 30 7 of the platform 30 1 according to the methods shown in the sixth and seventh figures to form a partially open environment. Due to the principle of capillary phenomenon and surface tension, the same post-heating and frequency-adjusting steps can be used to obtain the same oscillator package structure as in the seventh figure. The oscillator package structure and component mounting method proposed so far in the present invention can be applied to the temperature-compensated quartz oscillator and other oscillator fields, and even the packaging of related semiconductor components. Therefore, the above should be clear to those skilled in the art, and modifications and changes can be made without departing from the spirit and scope of the invention. Therefore, it means that the modifications and changes disclosed in the present invention and which may be related to the present invention should be included in the scope of the following rights.

Page 12 1232566 Brief description of the diagram The first diagram is a schematic diagram of the package structure of a temperature-compensated quartz oscillator 100 in the conventional art. The second A diagram is a cross-sectional view of a temperature-compensated quartz oscillator 200, which is an improvement. The second diagram B is a top view of the temperature-compensated quartz oscillator 200. The third figure is an exploded top view of the components of the first embodiment of the present invention. The fourth figure is an exploded bottom view of a component according to the first embodiment of the present invention. The fifth figure is a component mounting diagram of the first embodiment of the present invention. The sixth diagram A is a schematic view of filling a plastic material 4 0 1 in the present invention with the lower cover 3 4 0 and the lower surface 3 0 7 of the platform 3 0 1 forming a partially open environment. The sixth diagrams B and C are schematic diagrams of the structure of the filling material 401 in the present invention due to capillary phenomenon and surface tension. The seventh figure is a schematic diagram of the package structure of the oscillator according to the present invention. The eighth figure is an exploded top view of a second embodiment of the present invention. The ninth figure is an exploded bottom view of a component according to a second embodiment of the present invention. The tenth figure is a schematic diagram of component mounting of the second embodiment of the present invention. [Description of component symbols] 1 0 0 Temperature compensated quartz oscillator 1 0 1 Piezo element 1 0 2 Temperature compensated integrated circuit 10 3 Capacitor 10 4 Cover 1 0 5 Housing

Page 13 12566 Description of the diagram 2 0 0 Temperature compensated quartz oscillator 201 platform '2 0 2 side 2 0 3 side 2 0 4 container opened upward 2 0 5 container opened downward 2 0 6 temperature compensation product Body circuit 2 0 7 Capacitor 2 0 8 Piezo element 2 0 9 Cover 2 1 0 Contact hole 21 1 Solder pad 3 0 0 Oscillator 301 Platform 3 0 2 Upper surface 3 0 3 Side 3 0 4 Solder pad 3 0 5 Side 3 0 6 Conduction electrode 3 0 7 Lower surface 3 0 8 Internal circuit 3 0 9 Pad 3 1 0 Piezo element 31 1 electrode

Page 14 1232566 Simple illustration of the drawing 3 12 solder pads 3 2 0 upper cover 3 3 0 bracket 3 4 0 lower cover 3 41 glue hole 3 4 2 solder pad 3 5 0 integrated circuit 351 capacitor 3 5 2 metal wire 4 0 0 syringe 4 0 1 plastic material 4 0 2 concave structure 4 0 3 convex structure

Page 15

Claims (1)

1232566 _ Case No. 93102777_ Year Month Amendment _ 6. Scope of Patent Application The component can be an integrated circuit and a plurality of capacitors. 8. The structure according to item 1 of the patent application scope, wherein the upper cover comprises at least one metal. 9. The structure described in item 1 of the patent application scope, wherein the brackets include at least one conductive material. 10. The structure according to item 1 of the scope of patent application, wherein the lower cover may be made of a ceramic material or a printed circuit board material. 1 1. The structure described in item 1 of the scope of patent application, wherein the lower cover further includes an upper surface and a lower surface, wherein the upper surface and the lower surface of the lower cover are respectively provided with a plurality of metal pads which can be conducted The brackets are connected to an external circuit. 12. The structure as described in item 1 of the scope of patent application, wherein the plastic material can be an epoxy resin. 1 3. The structure as described in item 1 of the scope of patent application, which uses capillarity and surface tension to limit the plastic material to the lower cover, and the part and the lower surface jointly form the open environment of the part. By. 14. An oscillator packaging structure comprising: a platform including an upper surface and a lower surface; a plurality of sides extending upwardly around the upper surface by a height to form an upwardly open container with the upper surface of the platform At least one piezoelectric element can be stored; an upper cover covers the upwardly open container to form a closed environment; a printed circuit is distributed on the lower surface to connect at least one electronic component; a lower cover includes a glue hole and a plurality of same Height bracket Page 17 1232566 _Case No. 93102777_Year_Month__ Sixth, the scope of the patent application shall cover the use of the brackets to join the internal circuit to form a partially open environment with the lower surface of the platform; And a plastic material is filled in the partially open environment through the filling hole. 15. The structure according to item 14 of the scope of patent application, wherein the platform further includes a plurality of sides, and a plurality of conducting electrodes are distributed on the sides to conduct the printed circuit to an external circuit. 16. The structure described in item 14 of the scope of patent application, wherein the material of the platform may be a ceramic material. 17. The structure according to item 14 of the scope of patent application, wherein the plurality of side tops further include a plurality of pads, and the pads are used to engage the upper cover. 18. The structure as described in item 17 of the scope of patent application, wherein the pads can be a metal with a specific thickness or a metal plating film. 19. The structure described in item 14 of the scope of patent application, wherein the piezoelectric element may be an AT-CUT quartz crystal. 20. The structure as described in item 14 of the scope of patent application, wherein the at least one electronic component may be an integrated circuit and a plurality of capacitors. 2 1. The structure according to item 14 of the scope of patent application, wherein the upper cover contains at least one metal. 2 2. The structure as described in item 14 of the scope of patent application, wherein the lower cover further comprises a plurality of metal pads, wherein the metal pads can conduct the printed circuit to an external circuit. 2 3. The structure described in item 14 of the scope of patent application, wherein 1232566 _ Case No. 93102777_ Year Month Amendment _ 6. Scope of Patent Application These brackets contain at least one conductive material. 2 4. The structure as described in item 14 of the scope of patent application, wherein the lower cover may be made of a ceramic material or a printed circuit board material. 25. The structure according to item 14 of the scope of patent application, wherein the plastic material can be an epoxy resin. 26. The structure as described in item 14 of the scope of patent application, which uses capillary phenomenon and surface tension to limit the plastic material to the lower cover, and the part and the lower surface jointly form the open environment of the part. In the middle. 27.—A component mounting method for an oscillator package, including: Provide a packaging structure having a container with an open upper end and a lower surface; join and seal a piezoelectric element in the container placed on the upper end; join a plurality of electronic components to a lower surface of the package structure; make a plurality of brackets in the package The lower surface of the structure; joining a bracket with a glue hole covering the brackets to form a partially open environment; filling a plastic material through the glue hole to the partially open environment; and adjusting the frequency of the oscillator And test the function of the oscillator. Page 19