12301¾ 月 日修正 欢、發明說明·· .發J月所屬領域 本發明係有關異向性導電 多占荖添丨丨之帝玖此A * , 路連接用黏著劑、使用該 々占者片j之电路板的連接方法與 鳍，朽古門彳 、路連接構造.體，更詳細地 3兄係有關低溫快速硬化性優里 、击4立♦ /、，且保存安定性也良好、 連接電P亦安定之異向性導電 該黏著劑之電路板的連接方*連接用㈣劑，及使用 先前拮術 及連接構造體者。 近年，在半導體或液晶顯示哭 子零件，或為了進行電路連接^ 4考中’為了固定電 等用诗中…心 連接而使用各種黏著材料，在此 寺用途中，越來越邁向高宓 ^ 牡 也要求有高黏著力或古可心、局精細化’黏著劑方面 百X/ A回可信賴度。 尤其做為電路連接材料者 或是FPC肖TCP之連接 ：使用―、與Μ 用在黏者劑中分散有導電粒 安疋便 著劑。最近在美也μ "向性導電電路連接用黏 ^ # "板構裝半導體矽晶片時，並不是採用《 統的導線連結，而是進杆你生、首 乃才卫不疋知用傳 構裝在基板上之所謂壓 朝下直接 使用異向性導電電路連^ lpehlp)構裝’在此也開始 號、特開昭6。叫9〗228广者劑（特開昭59- 12。㈣ 卜刪7號公報）。號、特開平1 一训87號、特開平 又’近年在精密電子機哭 化，電極幅寬及電技門 #中，電路正邁向高密度 用产…二 間隔變得極為狹窄，為此，在-向使 用％乳Μ脂系之電路連 ▲ a 门便 運接用‘者劑之連接條件下，會產生 5 3]3294 1230191 92 9. 26 年月日修正/更正/蒱充 配線脫落、制蝕、# m 洛_、位置不吻合等問題。 強力要求連接時間兩纩 挺阿生產率， 及丧叶間而乡侣紐在10秒鐘以 因而成為不可或缺之' 低概快速硬化性 J A缺之要求。為此，在特 號公報中揭示使用白人 ]十10〜273630 用自由基聚合性物質之電路連接…。 …、，含有（曱基）丙烯酸酯 '磷酸st " 由基聚合性物質與導電粒子之：知化合物等之自 連接後之連接電阻會有上昇之；：=右放置在空氣中，則 本發明提供低溫快速硬 連接電阻安定之保存安定性良好、 文疋之包路連接用黏著劑，古、θ 存期限優異之異向性導帝 巧機度條件下之保 黏著劑之電路拓、“ 著劑，以及使用該 冬剧之电路板連接方法與連接構造體。 本發明是有關以使導電粒子均句分 膜狀生成物中，至少θ 成之樹脂薄 ^ ,s 至乂疋由以下成分所構成為1特杓夕思人 性V電電路連接用黏著劑： ，玉之"向 (1) 在表面不露出銀、金、鉑以外之過 子、 、疚盃屬的導電粒 (2) 自由基聚合性物質、 (3) 由加熱或光產生游離基之硬化劑。 又，本發明是有關以使導電粒子均 薄膜狀生成物φ „ Ν Θ ' 刀放而成之樹脂 至 > 瓦由以下成分戶斤構成為i 向性導電電路連接用黏著劑： 冓成為“徵之異 子、⑴在表面不露出銀、金、轴以外之過渡金屬的導電粒 31329412301¾ Correction of the day of the month, description of the invention ... The field of the present invention is related to anisotropic conductivity, which is more important for the A *, the adhesive for road connection, and the use of the occupant sheet j. The connection method of the circuit board and the connection structure of the fins, ancient gates, and roads. The body is more detailed about the low temperature and rapid hardening properties, and the temperature is 4 liters, and the storage stability is also good. An anisotropic conductive circuit board for connection of the adhesive * a tincture for connection, and a person who has used a previous technique and a connection structure. In recent years, in semiconductor or liquid crystal display parts, or in order to make circuit connections ^ 4 test 'for fixing electricity and other poetry ... heart connection using various adhesive materials, in this temple use, more and more high ^ Mu also requires a high degree of adhesion or Gokuxin, local fine 'adhesive' hundred H / A back reliability. Especially as a circuit connection material or FPC Xiao TCP connection: use-, and M are used to disperse conductive particles in the adhesive agent An sizing agent. Recently in the United States, μ " Adhesive for connection of directional conductive circuits ^ # " When mounting semiconductor silicon wafers on the board, it is not a "conductor wire connection", but you are not familiar with it. The so-called pressure-down structure mounted on the substrate directly uses an anisotropic conductive circuit (^ lpehlp). Called 9〗 228 Guangzhe agent (Japanese Patent Laid-Open No. 59-12. ㈣ Bulletin No. 7 Bulletin). No. 87, No.1 Kaiping No.1, No.87 No.1, No.1 Kaiping has been crying in precision electronic machines in recent years, the width of the electrodes and the electric technology gate #, the circuit is moving towards high-density production ... The second interval has become extremely narrow, for this reason Under the connection condition of-to the circuit using% milk fat system, ▲ a door transport connection, it will produce 5 3] 3294 1230191 92 9. 26/26 correction / correction / discharge of the wiring , Eclipse, # m 洛 _, mismatched positions, etc. The connection time is strongly required, and the productivity is very high, and the loss of leaves is 10 seconds, so it becomes indispensable. For this reason, the use of white men is disclosed in Japanese Patent Publication No. 10 ~ 273630. Circuit connection with radical polymerizable substances ... …, Containing (fluorenyl) acrylate 'phosphoric acid st " The polymerizable substance and conductive particles: the connection resistance of the compound and the like will increase after connection; == right placed in the air, the The invention provides a low-temperature fast hard-connected resistor with stable storage stability, an adhesive for package connection, and an anisotropic circuit with excellent ancient and θ shelf life. This invention relates to a method for connecting a circuit board and a connection structure using the winter drama. The present invention relates to a thin film-forming product in which conductive particles are evenly divided into at least θ, and s to 乂 疋 are composed of the following components It is composed of 1 special adhesive for human V electrical circuit connection: Jade " (1) does not expose silver, gold, platinum or other conductive particles on the surface, or conductive particles of guinea cup (2) Radical polymerizable substance, (3) A hardener that generates free radicals by heating or light. The present invention relates to a resin made by cutting a conductive film into a film-like product φ „Ν Θ 'to a watt of> It is composed of the following components: Adhesives for conductive circuit connection: 冓 becomes the "sign of difference", ⑴ does not expose conductive particles of silver, gold, or transition metals other than shafts on the surface 313294
2G 1230191 年松 日修正/更责 (2) 自由基聚合性物質、 (3) 由加熱或光產生游離基之硬化劑，及 (4) 磷酸酯化合物 本發明亦有關將上述異向性導電電路 介入具有相對向電路#朽M A 4 用站者劑 丁门兒路毛極的基板間，加壓 電極的基板，同時，依^人 屬相對向電超 ^ %合不同，照射光（活性於、店、 加壓方向之電極間以電 匕源）將 I乳運接電路板之連接方法。 本發明又有關將上述異向性導電… 介入具有相對向電路命朽沾且4 θ 要用站者劑 q电路电極的基板間，加壓具 電極的基板後，將加壓 ^ ϋ电路 造體。 土方向之电極間以電氣連接之連接構 本發明之異向性導電電路連接 室溫高濕度下，在遠技、* 即使放置在 在：^接初期經耐濕試驗、泠埶 信賴性試驗後7…、循％寺各種 丁欠 _制連接電&之上昇哎遠接^ 下降，顯示具有優異連接可信度。 次連接強度之 異向性導電電路連接用黏著劑· 表面形成之異向性導電樹脂。 身膜、破黏著體 本發明又有闕λ Β , ρ 〆、有相對向電路雷；』 壓具有相對向電路電極的基板後 Ζ反間’加 電氣連接之異向性導電電路連^方向之電極間以 化合物及至少有Γ;:/聚合性化合物… 化-物…：氧基之化合物所成組群中至少-種 。物進订表面處理後之導種 路連接用黏著劑。上述異 ;之異向性導電電 v电電路連接用黏著劑，係 7 3J3294 123019? 9 2 日修正/尾正 年月 以含有由光或加熱產生自由基之化合物或磷酸醋化合物者 為佳。再者，本發明之異向性導電電路連接用黏著劑1 以表面處理中使用之驗性化合物為胺系化合物者為佳。 用，明之另-種形態’是將異向性導電電路連接 在具有相對向電路電極的基板間，加壓具有 相對向電路電極的基板後，將 巧 壓方向之電極間以電氣連 =之連接構造體，異向性導電電路連接用黏著劑係有 關.有經由選自⑴自由基聚合性化合物，及 化合物及至少有丨個環氧基之化合 w 化合物進行表面處 : 且群中至少一種 電路連接構造體。 ％衫之黏著劑的異向性導電 本發明的異向性導電電路 電粒子表面上不露出却入接用4者劑，是使用在導 +路出銀、金、翻以外… 電粒子。Λ 了 7、 卜之鎖寺過渡金屬的導 最表面之全| y + θ .、、、保存期限及連接可信度， 之孟屬必需是銀、金、鉑族之貴 在本發明的異向性導電 二，而以金較佳。 導電粒子，D 妾用#者劑中使用之 特別限定，^ 得到電氣連接之導電性即可，而益 J限疋，但可以列舉如金、 …、 屬粒子气發室 、·、” 銅、鈷、錫等之金 一飞石厌寺。又，也可以使 之非導電性之破璃、陶穿、，述孟屬導電物質被覆 厚度，為了可以Γ 塑膠等。此時，被覆金屬層之 在"、鋅、：=:導電：’以上為宜。 金屬類層之缺損戈 W屬上6又置貴金屬類層時，因貴 心缺彳Λ或導電粒子八 D刀放化所產生之貴金屬類 8 313294 1230191 松 9 2e 年月日修正 層缺損等所產生& g儿、典&仏 t虱化遂原作用，會產生游離基而引起保 存期限減短，所道+』 厅乂 V电粒子品經表面處理。導電粒子之 用範圍為相當於命攸、志4立 I路連接用黏著劑成分之〇.1至體積 .%，最好使用。·…。體積%之範圍。 為“粒子表面處理之化合物，以對酸性物質具有 反應性之化合物來虛 — 異向性導電電 ^為且’依此處理可以顯著提高上述 电路連接用黏著劑之保存安定性。 做為導電粒子表面處 少具有！個環氧…Γ “勿，以鹼性化合物或至 以胺系化合物為：。°物為宜’尤其做為鹼性化合物者 做為胺系化合物者，液俨、 解到有機溶劑或水等〜广 都可以，固體需先溶 以溶解在有:然後使用。又，液體之化合物中，也 合解在有機溶劑等然後使用 乜 要能溶解蠢系各入^ μ 做為有機溶劑者，只 所试系化合物而不盥裊 別限制，但以甲 〃、…口物反應者即可，無特 .甲苯等處理後" …異丙醇、甲乙^、醋酸乙酯、 里谈月匕乾燥導電粒子者為宜。 … &理〉夜中所含胺系 %為宜，夫· 义/辰度，以0.05至20重奮 未滿0.05重量％時不能 亶里 20重量％時導#初 > I仃表面處理，超過 電阻變高。 乱π化合物量變多，連接 做為至少具有丨個環 可以，固體之場合+ ” 土 5物者，液體、固體都 又，液體之化合物也以:广：有機溶劑或水等然後使用。 宜。做為有機溶劑者，口 到有機溶劑等然後使用為 /、要旎溶解至Φ目 干王/具有1個環氧基之 9 313294 月 日修正/要正/補充 與f少具有1個環氧基之化合㈣^ 才別限制，但以甲醇、乙醇、 酯、甲贫#主二士 ，、丙醇、曱乙酮、gf酸乙 I本寺表面處理後能乾燥導電粒子者為宜。 處理液中所含至少呈古 0 〇5 5 〇π 少^有1個環氧基之化合物濃度，„ ·υ5至20重量％為宜，夫、本 又以 面處理，Μ 2〇 ^。/ 重量％時不能有效進行表 \里’超過20重量〇/〇時，導畲 1個卢於甘 V毛粒子表面被覆之至少具有 展虱基之化合物量變多，遠 八 夕埂接電阻變高。 表面處理時之溫度、時間等 告，丨 夸处理條件，並無特別限 制，但處理溫度是以室溫（25。 …限 以、 C )至loot、處理時間是 乂 1 〇秒至1小時之範圍為宜。 疋 又，處理後之導電粒子是細、風、各 伙姓仏 疋、、工過濾後乾燥才使用，乾燥 铋件Ik使用之有機溶劑而作適者 /、 W週田之選擇，但在 至loot：中進行。 、3匕j 本發明之表面處理所使用之驗 么儿人h丄 注化合物，尤其做為氨 乐化3物者可以列舉如，三乙胺、- 一乙胺、丁胺、乙二胺、 /、甲基二胺、苯胺、胺基丙基三 丁乳暴石夕统、口米口坐、2 —乙 基一 4 一甲基咪唑、2一苯基—丨〜 Λ基乙基味哇、苯乙基。米 。坐、苯乙基啶等，胺系中可以列裹〗⑼〇 幻举〗級、2級、3級胺， 也可以使用混合2種類以上者。 本發明之表面處理所使用之至少 王夕具有1個環氧基之化 合物，可以使用苯基縮水甘油醚、（甲 _ r基）丙烯酸縮水甘油 h-環氧丙氧基丙基三甲氧基石"完、r—環氧丙氧基 丙基三乙氧基矽烷、r一環氧丙氧基丙基甲基二7氧基矽 烧、7 —環氧丙氧基丙基二乙氧基矽烷、万一（3,4環氧 10 313294 1230191 92 j). 26 年月日修正 氧基#，A型環氧樹脂、雙❹ 甲紛…乳樹脂、龄搭清漆型環氧樹脂、 鉍清漆型環氧樹脂、雙酚A酚醛1 雙紛F龄路清漆型環氧樹脂 ；：广乳樹脂、 西匕刑供-此 衣式％ ^樹脂、縮水甘油 二：、乳：脂、縮水甘油胺型環氧樹脂、乙内醯脲環氧樹 广曰:歧8旨型環氧樹脂、脂肪族鏈狀環氧樹脂等，此等 :::脂也可犧，也可以添加氫。也可以併 上此等環氧化合物。 本發明之異向性導電電路連接用黏著劑中使用之自 由：聚合性化合物，係具有由自由基誘發聚:：=之 物’有（甲基）丙烯酸s旨樹脂、馬來酸酐縮亞胺樹脂、 等康酸亞胺樹脂、萘酉分二亞胺樹脂等，也可以使用2種類 以上之混合物。又自由基聚合性化合物也可以使用單體、 募聚合物中之任—種狀態，也可以使用單體與募聚合物之 混合物，纟此『（甲基）丙稀酸酷』是指丙稀酸醋及其相對 應之曱基丙稀酸|旨。 做為（曱基）丙稀酸酿樹脂者，是使（甲基）丙烤酸 酯進行自由基聚合而得者’做為（曱基）丙烯酸酯者，可 列舉如（曱基）丙烯酸曱酯、（甲基）丙烯酸乙酯、（曱基） 丙烯酸異丙酯、（曱基）丙烯酸異丁酯、二（曱基）丙烯酸 乙二醇酯、二（曱基）丙烯酸二乙二醇酯、三（曱基）丙 烯酸二曱醇丙烷酯、四（曱基）丙烯酸四曱基乙二醇酯、2 罗工基1 5 0 一二丙烯醯丙烷、2，2 —雙[4 一（丙烯醯曱氧 基）苯基]丙烷、2, 2 —雙[4 一（丙烯醯乙氧基）笨基]丙烷、 η 313294 1230191 921 9· 2ϋ 年月 日修正 (甲基）丙稀酸二環戊稀酯、（曱基）丙稀酸三環癸烧、異 氰酸二（丙烯醯乙基）酯、（甲基）丙烯酸胺酯、異氰酸環 乙从改貝一氰酸專，可單獨使用也可以使用兩種以上混合 者又，由於必要，在不損及硬化性範圍下也可以使用氫 酉昆、曱基醚氫I昆等之自由基聚合禁止劑。 再者，使用磷酸酯化合物做為自由基聚合性化合物之 場合’針對金屬等無機物可以提高接著力。此磷酸酯化合 物之使用量是相對於接著劑成分1 〇 〇重量份的〇 . 1至1 〇重 量份’較佳為0.5至5重量份。磷酸酯化合物是由無水磷 酸和（曱基）丙烯酸2 —羥基乙酯之反應生成物而得。具 體的有單（曱基丙烯醯乙基）酸磷酸、二（曱基丙稀醯乙 基）酸磷酸等，可單獨或混合使用。 做為馬來酸針細亞胺樹脂者，是分子中至少含有1個 馬來酸酐縮亞胺者，例如苯基馬來酸酐縮亞胺、1 一曱基_ 2，4 —馬來酸酐縮亞胺隻苯、n，N ’ 一 m —笨基雙馬來酸酐縮 亞胺、Ν，Ν’ 一 p —苯基雙馬來酸酐縮亞胺、N，N，— 4, 4 一 雙苯基雙馬來酸針縮亞胺、N，N ’ 一 4，4 一（ 3，3 —二曱基 二苯基）雙馬來酸酐縮亞胺、N，N，一 4，4 一（3，3—二甲 基二苯基曱烷）雙馬來酸酐縮亞胺、N，N，一 4, 4_ ( 3, 3 一二乙基雙苯基曱烷）雙馬來酸酐縮亞胺、N，N，一 4，4 一 二苯基乙烷雙馬來酸酐縮亞胺、Ν，Ν’一 4, 4 —二苯基丙烷 雙馬來酸酐縮亞胺、Ν，Ν’一 4，4 —雙苯基乙醚雙馬來酸酐 縮亞胺、Ν，Ν ’ 一 4，4 —雙苯基項基雙馬來酸酐縮亞胺、2，2 一雙（4 一（ 4 一馬來酸酐縮亞胺苯氧基）苯基）丙嫁、2，2 12 3]3294 1230191 9, 2G 月 ^修此广欠，*=^t7trv匕 92. 年 一雙（3— s — 丁基一 3, 4一（4一馬來酸酐縮亞胺苯氧基） 笨基）丙烷、1，1 一雙（4一（4_馬來酸酐縮亞胺苯氧基） 苯基）癸烧、4, 4一環亞己基一雙（丨_ ( 4—馬來酸酐縮 亞胺苯氧基）苯氧基）一 2—環己基苯、2, 2—雙（4 一（4 一馬來酸酐縮亞胺苯氧基）笨基）六氟丙烷等，可單獨使 用也可以使用兩種以上混合。 做為寧康醯亞胺樹脂者，是將分子中至少含有丨個寧 康醯亞胺基之寧康醯亞胺化合物聚合而成者，做為寧康醯 亞胺化合物者，例如有苯基寧康醯亞胺、1 一曱基—2, 4 — 雙寧康醯亞胺苯、N，N，一 m—苯基雙寧康醯亞胺苯、n，n， 一 P—苯基雙寧康醯亞胺苯、N，N，— 4,4 一雙苯基雙寧康醯 亞胺N，N 4,4— (3，3—二甲基二笨基）雙寧康醯亞 胺Ν’Ν 4, 4 一（3,3—二曱基二苯基曱烷）雙寧康醯 亞胺、Ν，Ν’一 4, 4一（3, 3 -二乙基二笨基曱烷）雙寧康 醯亞胺、Ν，Ν，一 4, 4一二笨基曱烷雙寧康醯亞胺、Ν， 一 4, 4 一二苯基丙烷雙寧康醯亞胺、Ν，Ν，一 4, 二苯美 乙醚雙寧康酸亞胺、Ν，Ν，— 4, 4_雙笨基磺基雙寧康：亞 胺、雙（4一（4—寧康醯亞胺苯氧基）笨基）丙烷、 =2一雙（3一卜丁基一 3,4一（4一寧康醯亞胺苯氧基） 苯基）丙烧、1J —雙（4— (4 一寧康總亞胺苯氧基）笨 基）癸^4,4—環亞己基—雙（卜寧康酿亞胺笨 氧基）笨氧基）一2一環己基苯、2,2-雙（4一（4 — 使 酿亞胺笨氧基）苯基）$氟丙烧等，可單獨使用也可以乂 用兩種以上混合。 13 3)3294 12 曰修正/更域无 做為萘酚二亞胺樹脂者，是將分子中至少含有丨個萘 醅一亞胺基之萘酚二亞胺化合物聚合者，做為萘酚二亞胺 化合物者，例如有萘酚二亞胺、2 —甲基一 2,4一雙萘酚二 亞胺 N，N’ ~ m -苯基雙萘酚二亞胺、N，一 p_苯基雙 奈酚一亞胺苯、N，N，一 4, 4一雙苯基雙萘酚二亞胺、N，N， 一 4, ( 3, 3一二甲基二苯基）雙萘g分二亞胺、N，N，— 4, 4 ( 3, 3 一二甲基二苯基甲烷）雙萘S分二亞胺、N，一 4, 4 ( 3, ° —二乙基二苯基甲烷）雙萘酚二亞胺、N，N，一 4, 一笨基曱纟元雙奈酚二亞胺、N，N，一 4, 4〜二苯基丙烷雙 奈酚—亞胺、N，N，-4, 4-二苯基乙醚雙萘酚二亞胺、N， Ν’一 4, 4一雙苯基磺基雙萘酚二亞胺、2, 2〜雙（4一（4， 一萘酚二亞胺苯氧基）苯基）丙烷、—餡又 —1 ， 又 Q3~s—丁 土 °，—（4 一萘酚二亞胺苯氧基）苯基）丙烷、1]L — 二，萘紛二亞：苯氧基）笨基）癸燒、4,4:環 —環（1—上4-奈酚二亞胺苯氧基）笨氧基）-2 其：土本、2, 2—雙（4~ (4一萘酚二亞胺苯氧基）笨 ㈣等，可單獨使用也可以使用兩種以上混合。 用上述自由基聚合性化合物之場合， 劑作為由加埶式杏吝注y %甘 疋便用來合起始 巧由加熱或先產生游雔基之硬化劑 者’只要能由加熱或光產生自由基之化合物即；：= 限制。有過氧化物、偶氮化合物等，可隨接著溫卜^別 間、保存安定性等目的適當選擇又妾者時 定柯+ “ 处南反應性和保在亡 之硯點來看，以半衰期為丨〇小時 ’、女 +哀』為1分鐘之溫度為18(rc 上， 有機過氧化物為 】4 313294 1230 砭 u 日修正 年月 佳。半衰期為1〇 鐘之溫度為17〇。才之/皿度為40 C以上，半衰期為1分 10秒之場合，A 了之有機過氧化物尤佳。接著時間為 量，相對於接著劑之總量，以U 始劑的配合 1 5重量％為特佳。 重里％為佳，以2至 選自二酿過氧化物為t體使用之有機過氧化物者，可以 化物嗣縮醇酸過氧化物、過氧化物酿、過氧 氧化物等化物'氫過氧化物、甲#基過 疋過乳化物酯、二烷基過氣仆铷 _ A"儿 物、甲錢基過氧化物# U 乳化 酸在5_ppm以下，八二 劑中之氯離子或有機 制+路Μ # 刀解後產生之有機酸很少，可以抑 ==接著端子，，所以特佳。由可得高反應 過乳化物_定更佳，此等可以適當混合使用。 做备二酿過氧化物類者，可列舉如異丁基過氧化物、 去)氯苯醯過氧化物、3, 5,5一三甲基己酿過氧化物、 S:過氧化物、十二基醯過氧化物、硬脂醯過氧化物、琥 Μ過氧化物、過氧化物、苯_氧化物甲苯2G Matsushita Correction / Responsibility 1230191 (2) Free-radically polymerizable substances, (3) Hardeners that generate free radicals by heating or light, and (4) Phosphate ester compounds The present invention also relates to the aforementioned anisotropic conductive circuits Intervening between the substrates with the opposite circuit #lapse MA 4 user agent Dingmeneru hair pole, pressurizing the substrate of the electrode, at the same time, depending on the relative electric power of the human being ^% different, irradiating light (active in, The method of connecting the I breast to the circuit board between the electrode in the pressurizing direction and the electric source). The present invention also relates to conducting the above anisotropic conduction ... Intervening between substrates having a circuit electrode that is opposite to the circuit and having 4 θ to use a stationer agent, after pressing the substrate of the electrode, the circuit is pressurized. body. The electrodes in the direction of the earth are electrically connected to form the anisotropic conductive circuit of the present invention. At room temperature and high humidity, in remote technology, * even when placed in: ^ Initial humidity test, reliability test After 7 ..., various kinds of Ding owing connection system & the connection of electric power & rise and fall ^, showing excellent connection reliability. Anisotropic conductive circuit connection adhesive for secondary connection strength · Anisotropic conductive resin formed on the surface. Body film, broken body The present invention has 又 λ Β, ρ 〆, and there is opposite circuit thunder; "After pressing the substrate with the opposite circuit electrode, the" Z "is electrically connected to the anisotropic conductive circuit, and the direction is There are at least one of the group consisting of a compound and at least Γ :: / polymerizable compound ... chemical compound ...: oxy group between the electrodes. Adhesive for connection of guides after surface treatment. The above-mentioned anisotropic conductive electrical adhesives for electrical circuit connection are based on 7 3J3294 123019? 9 2nd correction / end of the year and year The compounds containing free radicals or phosphate compounds generated by light or heat are preferred. Furthermore, the anisotropic conductive circuit connection adhesive 1 of the present invention is preferably one in which the test compound used in the surface treatment is an amine compound. Use, another form of Ming 'is to connect the anisotropic conductive circuit between the substrates with opposing circuit electrodes, press the substrate with the opposing circuit electrodes, and then connect the electrodes in the direction of electrical compression with electrical connection = Structures, adhesives for connection of anisotropic conductive circuits. There is a surface selected from the group consisting of ⑴ radical polymerizable compounds, compounds and compounds with at least one epoxy group w: at least one circuit in the group Connect the structure. Anisotropic conductivity of the adhesive of the shirt. The anisotropic conductive circuit of the present invention does not expose the surface of the electric particles, but the four agents are used for the connection, and are used in the conduction + silver, gold, and other ... electric particles. Λ7. The most complete surface of the transition metal of Bu Zhi Suo Si | y + θ., ,, shelf life, and connection credibility, the genus of silver must be the noble of the silver, gold, and platinum group in the present invention. Anisotropically conductive, but gold is preferred. The conductive particles are particularly limited to those used in #agents. ^ It is only necessary to obtain the electrical conductivity of the electrical connection, and the benefits are limited. However, examples include gold,…, particle gas chambers, ..., copper, Cobalt and tin, etc., can be made of non-conductive broken glass, ceramics, and the thickness of the Meng conductive material, so as to be plastic, etc. At this time, the metal layer is coated. When ", zinc,: =: conductive: 'The above is appropriate. The defect of the metal layer is caused by the lack of noble heart 彳 Λ or the conductive particles of eight D knife. Precious metals 8 313294 1230191 Pine 9 2e Year, month and day correction layer defects, etc. & g, dian & 虱 虱 化 遂 遂 遂 遂 遂 遂 遂 遂 遂 遂 遂 遂 遂 遂 遂 遂 遂 遂 遂 遂 遂 遂 遂 遂 遂 遂 遂 遂 遂 遂 遂 遂 遂 遂 遂 遂 遂 遂 遂 虱 虱 遂 虱 虱 虱 虱 虱 游离 游离 游离 游离 游离 游离 游离 游离 保存 保存 保存 保存 保存 保存 保存 保存 保存 保存 保存 保存 保存 保存 保存 保存 保存 保存 保存 保存 所 所 』』 乂 乂V electro-particles are surface-treated. The range of conductive particles is from 0.1 to vol.%, Which is equivalent to the component of the adhesive for the I-way, I-4 connection, and is preferably used in the range of vol.%. "Surface-treated compounds, compounds that are reactive to acidic substances - ^ is electrically anisotropic conductive and 'so can significantly improve the handling of the circuit connecting the storage stability of the adhesive. As conductive particles on the surface, less! An epoxy ... Γ "Do n’t use a basic compound or an amine-based compound as follows: °° is suitable, especially if it is a basic compound as an amine-based compound, and it can be dissolved in organic solvents or water, etc. ~ Guangdu is all right, solids need to be dissolved to dissolve in: and then used. In addition, liquid compounds are also dissolved in organic solvents, etc., and then used to be able to dissolve stupid systems as organic solvents, only The test compounds are not limited, but those who respond with formazan, ... mouthpieces, no special. After treatment with toluene, etc. " ... isopropanol, methyl ethyl ^, ethyl acetate, liyue moon drying Conductive particles are better.… &Amp; Management>% of amines in the night is suitable, and the righteousness / tempo, when 0.05 to 20 weight is less than 0.05% by weight, not 20% by weight. # 初 & gt I 仃 surface treatment, the resistance will become higher. The amount of random π compounds will increase, and the connection can be made with at least 丨 rings, solid occasions + ”soil 5 things, liquid and solid, and liquid compounds also: : Organic solvent or water and so on. should. As an organic solvent, you can use organic solvents, etc., and use to dissolve them to Φ mesh dry king / 9 with 1 epoxy group. The basic compound is not limited, but methanol, ethanol, esters, methyl poor # main two, propanol, acetophenone, gf acid ethyl I can dry conductive particles after the surface treatment. The concentration of the compound in the treatment solution is at least ancient 0 005 5 ππ and less than one epoxy group, υ · 5 to 20% by weight is suitable, and the husband and the daughter are treated with noodles again, M 2 0 ^. When the weight% is not effective, when the surface weight exceeds 20 weight 0 / 〇, the amount of the compound having at least a tick base covering the surface of one Lu Yugan V hair particle is increased, and the far-seasonal contact resistance becomes high. The temperature and time during surface treatment are not particularly limited, but the treatment temperature is from room temperature (25.… to, C) to loot, and the treatment time is from 10 seconds to 1 hour. The range is suitable. 疋 Also, the treated conductive particles are fine, wind, various names, and then filtered and dried before use. The organic solvent used for bismuth parts Ik is selected as the appropriate one. However, it is carried out in the loot: 3, the test compound used in the surface treatment of the present invention, the injection compound, especially as ammonia ammonium compounds can be listed, for example, triethylamine,-monoethylamine , Butylamine, ethylenediamine, /, methyldiamine, aniline, aminopropyltributyllactone , Glutamate, 2-ethyl-4-methylimidazole, 2-phenyl- 丨 ~ Λ-ethylethyl, wow, phenethyl. M. Sitting, phenethylpyridine, etc., can be listed in the amine series It is possible to use two or more types of amines, including two or more types of amines. The compound used in the surface treatment of the present invention has at least one compound having one epoxy group, and phenyl shrinkage may be used. Glyceryl ether, (methyl methacrylate) glycidyl acrylic acid h-glycidoxypropyltrimethoxy stone " final, r-glycidoxypropyltriethoxysilane, r-glycidoxy Propylmethyldi 7 oxysilane, 7-glycidoxypropyl diethoxy silane, in case (3,4 epoxy 10 313294 1230191 92 j). 26 month date modified oxy #, A-type epoxy resin, stilbene, methylphenol… Emulsion resin, age-varying varnish-type epoxy resin, bismuth varnish-type epoxy resin, bisphenol A phenolic aldehyde 1 bisphenol F-age varnish-type epoxy resin; Western dagger offering-this clothing style% ^ resin, glycidyl di :, milk: fat, glycidyl amine type epoxy resin, hydantoin epoxy resin tree wide said: Qi 8 purpose type epoxy tree , Aliphatic chain-shaped epoxy resin, etc. ::: lipids can be sacrificed, and hydrogen can also be added. These epoxy compounds can also be combined. Used in the adhesive for anisotropic conductive circuit connection of the present invention Free: Polymerizable compound, which has free radical-induced poly :: = 's. There are (meth) acrylic acid resins, maleic anhydride imine resins, isoconic acid resins, naphthalene diimines Resins and the like may be used as a mixture of two or more types. The radically polymerizable compound may be used in any one of a monomer and a polymer, and a mixture of a monomer and a polymer may also be used. "Methyl) acrylic acid" refers to acrylic acid and its corresponding fluorenyl acrylic acid | purpose. As the (fluorenyl) acrylic acid resin, those obtained by radical polymerization of (meth) acrylic acid esters are used as the (fluorenyl) acrylic acid, and examples include (fluorenyl) acrylic acid. Esters, ethyl (meth) acrylate, isopropyl (fluorenyl) acrylate, isobutyl (fluorenyl) acrylate, ethylene glycol di (fluorenyl) acrylate, diethylene glycol di (fluorenyl) acrylate Dipropanol tris (fluorenyl) acrylate, tetramethylene glycol tetra (fluorenyl) acrylate, 2 rotyl 1 50 0 dipropylene propane, 2, 2-bis [4 mono (propylene (Methoxy) phenyl] propane, 2, 2-bis [4-mono (propenylethoxy) benzyl] propane, η 313294 1230191 921 9 · 2ϋ Revised (meth) acrylic acid bicyclic Pentyl ester, (fluorenyl) acrylic acid tricyclodecane, di (propylene ethyl methacrylate) isocyanate, amine (meth) acrylate, cycloethyl isocyanate It can also be used alone or as a mixture of two or more. As necessary, it can also be used without compromising hardenability. Radical polymerization prohibition agent. When a phosphate compound is used as the radically polymerizable compound, the adhesion to inorganic substances such as metals can be improved. The amount of this phosphate compound to be used is from 0.1 to 10 parts by weight based on 1,000 parts by weight of the adhesive component, preferably from 0.5 to 5 parts by weight. The phosphate compound is obtained from the reaction product of anhydrous phosphoric acid and 2-hydroxyethyl (fluorenyl) acrylate. Specific examples include mono (fluorenyl acryl ethyl) acid phosphoric acid and bis (fluorenyl acryl ethyl) acid phosphoric acid, which can be used alone or in combination. As the maleic acid imine resin, those who contain at least one maleic anhydride imine in the molecule, such as phenylmaleic anhydride imine, 1-fluorenyl-2,4-maleic anhydride Imine only benzene, n, N'-m-benzylbismaleic anhydride imine, N, N'-p-phenylbismaleic anhydride imine, N, N,-4, 4-diphenyl Bismaleic acid needle imine, N, N'-4,4 one (3,3-difluorenyldiphenyl) bismaleic anhydride imine, N, N, one 4,4 one (3 , 3-Dimethyldiphenylmethane) bismaleic anhydride imine, N, N, 4,4- (3,3-diethylbisphenylmethane) bismaleic anhydride imine, N, N, -4,4-diphenylethanebismaleic anhydride imine, N, N'-4,4-diphenylpropanebismaleic anhydride imine, N, N'-4, 4-bisphenyl ether bismaleic anhydride imine, Ν, Ν '-4,4-bis-phenyl-phenyl bismaleic anhydride imine, 2, 2-bis (4-one (4-one-maleic anhydride) Imide phenoxy) phenyl) propionate, 2, 2 12 3] 3294 1230191 9, 2G month ^ repair this owed, * = ^ t7trv 92. Annual one pair (3-s-butyl-3, 4-one (4-one maleic anhydride imide phenoxy) benzyl) propane, 1, 1, one pair (4- one (4_maleic anhydride) Imide phenoxy) phenyl) decane, 4, 4-cyclohexylene-bis (丨 _ (4-maleic anhydride iminophenoxy) phenoxy) 2-cyclohexylbenzene, 2, 2-bis (4-mono (4-monomaleic anhydride imine phenoxy) benzyl) hexafluoropropane can be used alone or in combination of two or more. As a Ningkang amimine resin, it is a polymer of a Ningkang amimine compound containing at least one Ningkang amimine group in the molecule. As a Ningkang amimine compound, for example, a phenyl group Ningkang stilbene imine, 1-pyridyl-2, 4 — saccharin stilbene benzene, N, N, one m-phenyl scopolamine stilbene benzene, n, n, p-phenyl bis Ningkang imine benzene, N, N, — 4,4 monobisphenyl bisamthionimine N, N 4,4 -— (3,3-dimethyldibenzyl) sammonimide Ν'Ν 4, 4 mono (3,3-difluorenyldiphenylphosphorane) bisconamidine imine, Ν, Ν'-4, 4-((3, 3 -diethyldibenzypane) ) Succinimidine, N, N, 4, 4, 2-dibenzyl stilbene succinimide, N, 4, 4, diphenylpropane succinimide, N, N , 4, 4, dibenzyl ether bisinconate imine, Ν, Ν, — 4, 4_ bis-benzyl sulfonyl bis-n-conazole: imine, bis (4-((4- (Ningkang) imine phenoxy) (Yl) benzyl) propane, = 2 bis (3-butylbutyl-3,4-((4-Ningsangimine phenoxy) phenyl) phenyl) propane, 1J-bis (4— (4-yining Total imine phenoxy) benzyl) dec ^ 4,4-cyclohexylene—bis (Buningkang imine phenyloxy) benzyloxy) -2 2-cyclohexylbenzene, 2,2-bis (4-a (4 — make imine phenyloxy) phenyl) fluoropropane, etc., can be used alone or in combination of two or more. 13 3) 3294 12 Means that those who are not modified as naphthol diimide resins are those who polymerize naphthol diimine compounds containing at least one naphthalene-imino group in the molecule as naphthol di Examples of imine compounds include naphthol diimide, 2-methyl-2,4-bisnaphthol diimine N, N '~ m-phenylbinaphthol diimide, N, p-benzene Bisnaphthol monoimide benzene, N, N, 4,4 bisphenylnaphthol diimide, N, N, 4, 4, (3,3-dimethyldiphenyl) bisnaphthalene g Di-diimine, N, N, — 4, 4 (3, 3-dimethyldiphenylmethane) perylene di-dinaphthalene, N, 4-, 4 (3, ° —diethyldiphenyl Methane) dinaphthol diimide, N, N, one, one, one benzyl fluorene bisnaphthol diimide, N, N, one, 4, 4 ~ diphenylpropane bisnaphthol-imine, N, N, -4,4-Diphenyl ether dinaphthol diimide, N, N'-4, 4-diphenylsulfonaphthol diimide, 2, 2 to bis (4 1 ( 4, mononaphthol diimide phenoxy) phenyl) propane, — stuffing and -1, and Q3 ~ s —butyro °, — (4-naphthol diimide phenoxy) phenyl) propane, 1] L — dinaphthalene: phenoxy) benzyl) decyl, 4,4: ring-ring (1-on 4-naphtholdiimidephenoxy) benzyloxy) -2 its: earth Benzobin, 2, 2-bis (4-naphthol diimidephenoxy) benzamidine, etc., can be used alone or in combination of two or more. When using the above radical polymerizable compounds, the agent is used as the reason Adding apricot-type apricots with y% glutamate is used to match the initial hardening agent that is generated by heating or first, as long as the compound can generate free radicals by heating or light; = = restricted. There are peroxides, Azo compounds, etc., can be appropriately selected for subsequent purposes such as warming up, preservation, and stability. "In terms of reactivity and preservation, the half-life is 丨 0 hours." ", Female + sad" is 1 minute, the temperature is 18 (on rc, organic peroxides) is 4 313294 1230 砭 u day correction year is good. The half-life is 10 minutes, the temperature is 17. When the temperature is above 40 C and the half-life is 1 minute and 10 seconds, the organic peroxide of A is more preferred. The time is the amount, relative to the total amount of the adhesive. 15% by weight of the U starter is particularly preferred.% By weight is preferred, and 2 to 2 is selected from organic peroxides in which the second peroxide is used as the t-form, which can be compounded with alkyd peroxide and peroxide. Oxygen compounds, peroxides and other compounds' hydroperoxides, methyl peroxide radical emulsifier esters, dialkyl peroxides_ A " children, methyl peroxide peroxide # U emulsified acid in Below 5 ppm, the chloride ion in the eighty-two dose may have a mechanism + road M # after the decomposition of the organic acid is very small, can be suppressed = = then the terminal, so it is particularly good. Since a highly reactive superemulsion is obtained, it is more preferable, and these can be appropriately mixed and used. Those who prepare secondary peroxides can include, for example, isobutyl peroxide, de) chlorophenylhydrazone peroxide, 3,5,5-trimethylhexanone peroxide, S: peroxide, Dodecyl hydrazone peroxide, stearyl hydrazone peroxide, succinate peroxide, peroxide, benzene oxide toluene
化物等。 A 碳酸鹽 m % JOLL· -ΤΓ 一 做為二碳酸過氧化物類者，可列舉如二一 η 一丙基過 =化物二碳酸鹽、二異丙基二碳酸鹽過氧化物二碳酸鹽、 (4二級一 丁基環己基）過氧化物二碳酸鹽、二一 $ 一 乙氧基甲氧基過氧化物二碳酸鹽、二（2 一乙基已基過氧化 物）二碳酸鹽、二甲氧基丁基二碳酸過氧化物 曱基—3 —乙氧基丁基過氧化物）二碳酸 做為過氧化物酯者，可列舉如丙基過氧化物新癸酸 15 313294 12301¾ 9. 2υ 年月日修正/終去六!«Γ 酉旨、3, 3—四甲基丁基過氧化物新癸酸能、環己基 一 1-曱基乙基過氧化物新癸酸醋、三級—己基過氧化物新 癸酸酯、三級~ 丁基過氧化物新癸酸 上，丄，—·四甲 基丁基過氧化物一2—乙基己酸酯、2,5 —二曱基—2 $〜 二（2-乙基己醯基過氧化物）己烷、卜環己基—卜甲基 乙基過氧化-2-乙基己酸酯、三級—己基過氧化物—2: 乙基己酸酿、三級-丁基過氧化物—2—乙基己酸酷、三級 :丁基過氧化物異丁酸酿、！，卜（三級過氧化物）環己 烷、二級一己基過氧化物異丙單碳酸鹽、三級—丁基過氧 化物一 3, 5, 5—三曱基己酸酯、三級—丁基過氧化物月^ 酸酯、2, 5 —二甲一 2, 5 _:(m—曱笨醯過氧化物）己烷、 三級一丁基過氧化物異丙烷單碳酸酯、三級—丁基過氧化 物一 2—乙基己基單碳酸酯、三級—己基過氧化物苯酸酯、 二級—丁基過氧化物乙酸SI等。 做為過氧化酮縮醇類者，可列舉如丨，丨—（三級〜 已 基過氧化物）一 3, 3, 5—三曱基環己烷、1? 1 一（三級〜已 基過氧化物）環己烷、1，1 一（三級一 丁基過氧化物）〜3 3,5—三曱基環己烷、15]一（三級一丁基過氧化物）環2 烧、2，2 —雙（三級一丁基過氧化物）癸烷等。 做為二烷基過氧化物類者可列舉如，α，α—雙（二 級一丁基過氧化物）二異丙苯、二異苯丙基過氧化物、 基一 —二（三級一丁基過氧化物）已烧、 ^ 5 〇 曱 級 丁基異苯丙基過氧化物等。 做為氫過氧化物類者可列舉如，二異丙基苯氫過氧々 16 313294 12301资 月 9修正 物、兴笨丙烷氫過氧化物等。 做為甲石夕烧基過氧化物類者可列舉如，三級_ 丁基三 美土錢基過氧化物、雙（三級-丁基）二甲基甲石夕炫 基過氣化物、三級一丁美二 f二 土一乙烯基曱矽烷基過氧化物、雙 丁：級：丁基）二乙烯基甲石夕燒基過氧化物、彡（三級- ^ 6稀基甲切烧基過氧化物、三級-丁基三丙烯基 =基過氧化物、雙（三級-丁基）二丙稀基霞基 過氧化物、三（二纫—甘 、 一、” 丁基）丙烯基曱矽烷基過氧化物等。 j ’為了抑制電路構材之連接端子之腐姓，游離基發 生劑（硬化劑）中所合夕备私 以 斤s之虱離子或有機酸是以在5000 ppm 又，二宜」再者’加熱分解後產生之有機酸以少者為佳。 在k南製成電路遠接好粗 — 材枓之女疋性上，以室溫（25 °C )、 吊&下開放放置24小時後 持率者為宜p m 2〇重1%以上之重量保 手者為且，此％可適當混合使用。 此專游離基發生劑可 解促進劑、抑制劑等二:獨或“使用’也可以與分 物質等，：：：離基發生劑以聚胺酷系、聚s旨系之高分子 門 …吏使之微躍囊化之產物，因能延長可使用時 間，所以較佳。 了 腊之二合性化合物以外，也可以配入做為熱硬化性樹 心=:。吻4樹脂者，有雙紛A型環氧樹脂、雙 、心“曰、雙酚s型環氧樹脂、酚醛清漆型環氧 月曰、甲酚酚醛清涑刑浐^此 土衣乳Μ 孓衣虱树脂、雙酚Α酚醛清漆型環氧抖 月曰、雙酚F酚醛渣、、夫刑卢〆丄 土衣乳树 /月a J壤氣樹脂、脂環式環氧樹脂、縮水 3]3294 17 1230191物 等。 And so on. A carbonate m% JOLL · -ΤΓ As a dicarbonate peroxide, examples include di-n-propyl-peroxide dicarbonate, diisopropyl dicarbonate peroxide dicarbonate, (4-secondary monobutylcyclohexyl) peroxide dicarbonate, di-$-ethoxymethoxy peroxide dicarbonate, di (2-ethylhexyl peroxide) dicarbonate, Dimethoxybutyldicarbonate peroxide fluorenyl-3 -ethoxybutylperoxide) Dicarbonate as the peroxide ester, for example, propyl peroxide neodecanoic acid 15 313294 12301¾ 9 . Correction / finalization of 2υ year, month and day! «Γ 酉 酉, 3, 3-tetramethylbutyl peroxide neodecanoate, cyclohexyl-1-fluorenylethyl peroxide neodecanoate, Tertiary—hexyl peroxide neodecanoate, tertiary ~ butyl peroxide neodecanoate, 丄, — · tetramethylbutylperoxide—2-ethylhexanoate, 2,5 — Difluorenyl-2 $ ~ Di (2-ethylhexyl peroxide) hexane, bucyclohexyl-bumethylethyl peroxide-2-ethylhexanoate, tertiary-hexyl peroxide-2 : Ethyl Acid stuffed, three - butylperoxide-2-ethylhexanoate cool, three: stuffed isobutyric acid butyl peroxide,! (Tertiary peroxide) cyclohexane, secondary mono-hexyl peroxide isopropyl monocarbonate, tertiary-butyl peroxide-3, 5, 5-trimethylhexanoate, tertiary —Butyl peroxide month esters, 2, 5 —Dimethyl-2, 5 _: (m—Hydroxybenzyl peroxide) hexane, tertiary monobutyl peroxide isopropane monocarbonate, Tertiary-butyl peroxide-2-ethylhexyl monocarbonate, tertiary-hexyl peroxide benzoate, secondary-butyl peroxide acetic acid SI, and the like. As ketal peroxides, examples include 丨, 丨 — (tertiary ~ hexyl peroxide)-3, 3, 5-trimethylcyclohexane, 1? 1 (tertiary ~ ~ Base peroxide) cyclohexane, 1,1 (tertiary monobutyl peroxide) ~ 3 3,5-trimethylcyclohexane, 15] mono (tertiary monobutyl peroxide) ring 2 burning, 2,2-bis (tertiary monobutyl peroxide) decane, etc. As the dialkyl peroxides, for example, α, α-bis (secondary monobutyl peroxide) dicumene, diisophenylpropyl peroxide, radical 1-2 (tertiary Monobutyl peroxide) has been burned, ^ 50 butyl isobutylpropyl peroxide and the like. As the hydroperoxides, for example, diisopropylbenzene hydroperoxolium 16 313294 12301 month 9 modifiers, and propane hydroperoxide. Examples of methylperylene sulfanyl peroxides include, for example, tertiary butyl butyl trimethanyl peroxide, bis (tertiary-butyl) dimethylmethanyl sulfonyl peroxide, Tertiary monobutadiene, di-tert-monovinyl fluorinated silyl peroxide, dibutyl: gradation: butyl) divinyl methionite, perylene, terbium (tertiary-^ 6 dilute methane Carbyl peroxide, tertiary-butyltripropenyl = peroxide, bis (tertiary-butyl) dipropenylsalyl peroxide, tris (di-glycan, mono, butyl) ) Acryl, silyl peroxide, etc. j 'In order to suppress the rotten name of the connection terminal of the circuit structure, the free radical generator (hardener) is used to prepare lice ions or organic acids. At 5000 ppm, Eryi's "more" is less organic acids produced after thermal decomposition. It is better to make the circuit from the south to the rough-the female nature of the material, at room temperature (25 ° C) ), Hanging & open for 24 hours, the holding rate is preferably pm 2 0 weight of 1% or more, and the hand protector is, and this% can be properly mixed and used. This free radical generator Decomposition accelerators, inhibitors, etc. 2: The "single" or "use" can also be separated with substances, etc. ::: The radical generators are polymerized with polyamines and polys ... The product can be used for a longer period of time, so it is better. In addition to the waxy compound, it can also be formulated as a thermosetting tree core. ", Bis, heart", bisphenol s-type epoxy resin, novolac-type epoxy resin, cresol novolac 涑 涑 此 This soil coating milk 孓 clothes lice resin, bisphenol A novolac-type epoxy shake Yue Yue, Bisphenol F, Novolac Residue, Fu Xing, Lu Yi Tu Yi Shea / Ya J Blogas Resin, Alicyclic Epoxy Resin, Shrinkage 3] 3294 17 1230191
肐 S，‘G 年月日修正/更 甘油δθ型裱氧樹脂、縮甘 4樹脂、s ％虱树脂、乙内醯脲環 此寺％虱樹脂也可以鹵素化、 也可以併用2種以上。 L加鼠。此等環氧樹脂 又做為上述環氧樹脂之硬化劑者，可使用 酚類、酸酐類、味崎％ . 』使用如月女類、 硬化南i者I·/、 一見二酿胺等通常做為環氧樹脂 …。再者’做為硬化促進劑者，通常可以適當使用 3級胺、有機磷系化合物。 、田使用 做為使環氧樹脂反應之方 劑以外，A叮、 力凌者，在使用上述硬化 也可以使用四價硫（sulf丨 鹽等，使陽離子聚合也可以。 m，石 4)鹽、峨鐵 在本叙明之電路接著用黏著劑或 膜狀生成物中，盔7 d 宁电树月曰厚 庫力緩”, 職與薄膜形成性、黏著性、硬化時之SS, ‘G year, month, day correction / more Glycerin δθ-type oxygen resin, glycan 4 resin, s% lice resin, hydantoin ring This lice resin may be halogenated, or two or more types may be used in combination. L plus rat. These epoxy resins can also be used as hardeners for the above-mentioned epoxy resins. Phenols, acid anhydrides, and odorous% can be used. "Using such as moon women, hardened nan I · /, seeing second brew amine, etc. For epoxy ... In addition, as a hardening accelerator, a tertiary amine or an organic phosphorus-based compound can usually be appropriately used. In addition to the prescriptions used by epoxy resins to react epoxy resins, those who use A and Li Ling can also use tetravalent sulfur (sulf 丨 salts, etc.) for cationic polymerization in the above-mentioned hardening. M, stone 4) salts, E ferrite was used in the circuit of this description to use adhesive or film-like products, the helmet 7 d Ning Dian Shu Yue Yue said the thick coke force is slow, "and the film formation, adhesion, hardening time
性，一般要使用聚乙稀丁_脂、聚乙… :月曰、聚酷樹脂、聚酿胺樹脂、聚亞 S :脂：聚胺㈣脂、尿素樹脂等高分子成分二本 成分疋以分子量為1〇,〇〇〇 刀子 等樹脂，也可以是自士甘 考马且。又，此 合耐埶性裎冥。*去 ^ 在此％ + 也可以是用自由基聚合性之官能美 或環氧基，幾基等所變成M 性之吕月匕基 义成，在此％合耐熱性會提冥。古八 子成分之配合量為2至阿刀 以至8〇重置％’以5至7〇重量％為宜， 以10至60重量％悬杯 _ ^ 。不滿2重量％時，應力緩和或黏 者力不足，超過80重量％時流動性下降。 戈』 本發明之異向性導電電路連接用黏著劑中，也可以添 ]8 3)3294 1230^,26 年月日修正 加適當之充填劑、敕化劑、 難燃劑、偶合劑。 老化防止劑、著色劑、 含有充填劑之場合， 較好，填充材之最大粒#口要=提高黏著可信度等，所以 以使用，…6〇體積二：超過導電粒子之粒徑就可 可信度提高效果1I 〇巳圍為宜，超過60體積％時， 基、丙稀基、胺基、環氧Α巧 以含有乙烯 以提高黏著性所以較佳。…4基及異氰酸基者，因可 化時之τ , ^ ¥兒包路連接用黏著劑做為硬 化日守之Tg (玻璃轉移度），也 勹更 層所成之多層構造。 ^為不同之2種類以上之 使用本發明之異向性導 φ 基板，只要有形成必要之電氣：：=则， 别昨心 矾占接电極者就可以，而無牲 破璃二’例如有在液晶顯示器中使用之ΙΤΟ等形成電極之 H塑膠基板、PDP平板、EL平板等畫像顯示基板 曰/·泉板、陶究配線板、可撓配線板、半導體晶片、申阻 :杜生電容器晶片等晶月組件、磁帶包褒、COF等之電路 令半導體矽晶片等，必要時可以組合使用。 點著時之條件並無特別限制，但黏接溫度為9〇 ^黏著時間為】秒鐘至1()分鐘之間，使用之用途可^ ‘著劑、基板之不同而作適當選擇，視需要也、 以外夕处、、κ , . ^ 义用熱 月b源，例如光、起音波、電磁波等。 以下，以實施例來具體說明本發明，但本發明之棄 ]9 3)3294 i2^dyfi 修正 並不限定於該等實施例。 (實施例1) 將5Og之笨氧樹脂（Union carbide公司製，商品名 PKHC’平均分子量45,〇〇〇)溶解於]VIEK (曱乙酮，；;弗點 79·6 c )，成為固形分50重量％之溶液。 自由基聚合性物質使用異氰酸環氧乙烷改質之二丙 稀酸酿（東亞合成公司製，商品名M 一 2丨5 )及磷酸酯型 丙稀酸(共榮社油脂株式公司製、商品名p 一 2M )。 加4或光產生游離基之硬化劑，使用2，5 —二甲基一 2, 5 一雙（2—乙基己醯基過氧化物）己烷之5〇重量％碳化 氮溶液（曰本油脂公司製，品名perhexa 25〇)。 導電粒子係使用在以聚苯乙烯當作核心的粒子（壓縮 $ 率4 80 kg/mm2)表面上，設置厚度為GG9 v瓜之銀 層而成之平均粒子徑5 # m之導電粒子。 固形重量比係以笨氧基樹脂5〇g，異氰酸環氧乙烷 質：二丙烯酸醋50g，她旨型丙烯酸_ 2，L二 基2’ 5一雙（2一乙基己醯基過氧化物）己烷$ 配入，再將導電粒子3m 右 也知配入分散，再以塗抹裝置： 7 ^子度的PET(聚對笨一甲 乙S曰）湾膜，經7〇r、1() 一甲 戸痄盘κ 熱風乾燥，可得黏著劑Properties, generally use polyethylene butadiene resin, polyethylene ...: Yue Yue, polyurethane resin, polyurethane resin, polyurethane S: fat: polymer ingredients such as polyurethane resin, urea resin, etc. A resin having a molecular weight of 10,000, such as a knife, may also be obtained from Skagoma. In addition, this combination of resistance to crickets. * Go ^ Here %% can also be a radically polymerizable functional beauty or epoxy group, several groups, etc., which becomes M-type luyueji group, where the heat resistance will improve. The compounding amount of the ancient eight sub-components is 2 to Adao to 80% of reset% ', preferably 5 to 70% by weight, and 10 to 60% by weight of the suspended cup. When the content is less than 2% by weight, the stress relaxation or the adhesive force is insufficient, and when the content exceeds 80% by weight, the fluidity decreases. Ge "The adhesive for connection of anisotropic conductive circuits of the present invention may also be added] 8 3) 3294 1230 ^, modified on 26th, 26th, day. Add appropriate fillers, halogenating agents, flame retardants, coupling agents. In the case of anti-aging agent, colorant, and filler, it is better. The largest particle of the filler ## = improve the adhesion credibility, etc., so to use, ... 60 vol. 2: It is only necessary to exceed the particle size of the conductive particles. The reliability improvement effect 1I 〇 巳 is more suitable, and when it exceeds 60% by volume, it is preferable that the group, acrylic group, amine group, and epoxy group contain ethylene to improve adhesion. … 4 groups and isocyanate groups, because of the τ, ^ ¥ when the package is connected, the adhesive is used as the Tg (glass transition degree) of the hardened sun protection, and it also has a multilayer structure formed by layers. ^ For two or more different types of anisotropic conductive φ substrates using the present invention, as long as necessary electrical formation is formed: ==, do n’t worry about those who take the electrode yesterday without breaking the glass. For example, Image display substrates such as H plastic substrates that form electrodes such as ΙΟΟ used in liquid crystal displays, PDP flat panels, EL flat panels, etc ... Crystal moon modules such as wafers, magnetic tape packages, and COF circuits allow semiconductor silicon wafers, etc., to be used in combination if necessary. There are no particular restrictions on the conditions at the time of ignition, but the adhesion temperature is 90 °. The adhesion time is between】 seconds and 1 () minutes. The application can be appropriately selected depending on the difference between the coating agent and the substrate. It is also necessary, outside, κ,. ^ To define the source of thermal moon b, such as light, attack wave, electromagnetic wave and so on. Hereinafter, the present invention will be described in detail with examples, but the present invention is abandoned] 9 3) 3294 i2 ^ dyfi correction is not limited to these examples. (Example 1) 5Og of stupid epoxy resin (manufactured by Union carbide, trade name PKHC ', average molecular weight 45,000) was dissolved in] VIEK (methyl ethyl ketone ;; Epoxy point 79.6 c) to be solid 50% by weight solution. The radically polymerizable substance uses diisocyanate modified by ethylene isocyanate (manufactured by Toa Kosei Co., Ltd., trade name M-2 丨 5) and phosphate type acrylic acid (manufactured by Kyoeisha Oil Co., Ltd.) , Trade name p-2M). Add 4 or light-generating hardener, use a 50% by weight solution of 2,5-dimethyl-2,5-bis (2-ethylhexyl peroxide) hexane in nitrogen carbide Manufactured by Oils and Fats Co., Ltd., perhexa 25〇). Conductive particles are conductive particles with an average particle diameter of 5 # m formed on the surface of particles with a core of polystyrene (compression rate of 4 80 kg / mm2) and a silver layer with a thickness of GG9 v melon. The solid weight ratio is 50 g of stupid oxy resin, 50% of isocyanate ethylene oxide: 50 g of diacrylic acid vinegar, her purpose acrylic _ 2, L diyl 2 '5-bis (2-ethylhexyl) Peroxide) hexane, and then the conductive particles were dispersed at 3m, and then applied with a coating device: a 7-degree-degree PET film 1 () A formazan plate κ hot air drying, adhesive can be obtained
厗度為35 “ m之異向性導 者J (實施例2) 〜路連接用黏著劑。 導電粒子係使用在以擊 彈性…上"作核心的粒子“ 置尽度0 · ] “ m之銀^ 20 313294 I230fi)i2〇 年月 日修正 成之平均粒子徑6 · 1 5 // m之導雨抑工 ,,^ ^ y , 理他 M V电拉子，與貫施例1相同處 —吏可得異向性導電電路連接用黏著劑。 (貫施例3 ) ‘電粒子係使用在以聚！ 檢Λ 來本乙烯§作核心的粒子（壓縮 ^率480 w2)表面上，設置厚度〇.^之銀層， ^銀層之外側’設置厚度㈣㈣之金層而成之平均粒 釭5"m之導電粒子’經與實施例1相同處理後可得異 向性導電電路連接用黏著劑。 /、 (實施例4 ) 導電粒子係使用在以聚！ 岳 ♦本乙却*作核心的粒子（壓縮 弹性率480 kg/mm2 )表面上，嗖詈 工 °又置^子度0 · 1 # m之錦；， 在此錄層之外側，設置厚度0 05 μηι之銀層而成之平:粒 子控之導電粒子，經與實施例i相同處理後可得異 向性導電電路連接用黏著劑。 (比較例1 ) 導電粒子係使用在以聚芏 木 〇 本乙烯當作核心的粒子（壓縮 彈性率480 kg/ mm2 )表面上，机罟 、 上 a又置厗度0.2// m之鎳層而 成之平均粒子徑5 // η]之導命& j V兒粒子，經與實施例1相同處 理後可得異向性導電電路連接用黏著劑。 (比較例2) 導電粒子係使用在以聚笨乙稀當作核心的粒子（壓縮 彈性率480 kg/麵2 )表面上，設置厚度0.2从m之錄層， 在此鎳層之外側，設置厚唐 又〇. 0 4 // m之金層而成之平均粒 子徑5…導電粒子，經與實施例"目同處理後可得異 21 313294 1230191 日修正'更正/褚充 年月< 向性導電連接用黏著劑。 (電路之連接） 使用上述里向十生莫+ 4士本 # 佟结办，I” 〇性¥屯橱脂潯膜狀形成物，對具有50 套細 "m間距30 " m、厚度1 8 // m之銅電路的磁帶 2〇至广和IT〇玻璃（D_erteck公司製，表面電阻 3MP 〇歐姆，每平方米⑴麟厚度1.1_)以1贼， 〇MPa加熱加壓1 5秒鐘， 此 了付連接兌2mm之連接構造體。 此日寸’預先在IT〇玻璃 叫之、鱼# 將異向性導電電路連接用黏著 J之連接面貼付後，在 連 ，〇.5MPa加熱加壓3秒鐘使 後’冑PET薄膜剝離即與TCP完成連接。 (連接電阻之測定） 將製成之異向性導電電路連接用黏著劑 存及在 3CTC、85%RH4 20c 保 蚌德u + 丨―皿氐冶槽中，分別保存10〇小Anisotropic Conductor J with a degree of 35 "m (Example 2) ~ Adhesive for road connection. Conductive particles are used as the core particles for elasticity ..." Exhaustion Degree 0 ·] "m Silver ^ 20 313294 I230fi) i2 The average particle diameter modified on the month of day 6 · 1 5 // m guide rain suppression,, ^ ^ y, Lethal MV electric puller, the same as the implementation example 1 -An adhesive for connection of anisotropic conductive circuits can be obtained. (Exemplary Example 3) 'Electric particles are used on the surface of particles (compression rate 480 w2), which is the core of polyethene. A silver layer with a thickness of 0.1, and an average grain size of 5 " m conductive particles' provided on the outer side of the silver layer with a thickness of a gold layer, can be used to connect anisotropic conductive circuits after the same treatment as in Example 1. Adhesive. / (Example 4) Conductive particles are used on the surface of the particles (yield of compression elasticity 480 kg / mm2) with the core as the core. The workmanship is set at 0 °. · 1 # m brocade; On the outer side of this recording layer, a flat layer made of a silver layer with a thickness of 0 05 μηι is formed: the particle-controlled conductive particles are in phase with the embodiment i An adhesive for connection of anisotropic conductive circuits can be obtained after treatment. (Comparative Example 1) Conductive particles are used on the surface of particles (compressive modulus of elasticity: 480 kg / mm2) with poly (Hydroxystyrolum) benzyl as the core. An anisotropic conductive circuit can be obtained after the same treatment as in Example 1 with the average particle diameter 5 // η] of the nickel layer formed by placing a nickel layer with a thickness of 0.2 // m on the top a. Adhesive for connection (Comparative Example 2) Conductive particles are used on the surface of particles (compressive modulus of elasticity: 480 kg / surface 2) with polyethylene as the core, and a thickness of 0.2 m is provided. Here, nickel is used. On the outer side of the layer, an average particle diameter of 5… 0 4 // m gold layer is set. The conductive particles can be treated differently from the examples " for the same purpose as 21 313294 1230191. Chu Chongnian < Adhesive for tropic conductive connection. (Circuit connection) Use the above mentioned Li Xiang Shi Sheng Mo + 4 士 本 # 佟 Settlement, I "○ sex ¥ tunzhi lipid film-shaped formation, with 50 Set of thin " m pitch 30 " m copper tapes with copper circuit thickness of 1 8 // m 20 to Guanghe IT 0 glass (D_erteck Division Ltd., surface resistance 3MP billion ohms per square thickness 1.1_ ⑴ Lin) to a thief, a heating and pressing 〇MPa 5 seconds, the pay for this connection against the connecting structure of 2mm. On this day, 'IT glass is called in advance, and the ## is an anisotropic conductive circuit connection with an adhesive J connection surface attached, and then 0.5 MPa heat and pressure for 3 seconds to make the' 胄 PET film peel off Complete the connection with TCP. (Measurement of connection resistance) Store the prepared anisotropic conductive circuit connection adhesive in 3CTC, 85% RH4 20c, Bunde u + 丨 氐 氐 smelting tank, save 10 Hours
Brr•後’進仃上述之電路遠姐 、 接’ δ上述連接部之T c p>沾部4立 電路間之诖桩帝ίΐ日伯 匕Ρ的⑼接 祕門之連接*阻值，α多功能測試器測定， 是指鄰接電路間之電阻之]< Λ 包阻值 电紛门之电阻之15〇點平均值， 所示。 夂、，、。果如表ΪBrr • After 'entering the above circuit remote sister, connect' δ T c p of the above connection part> The connection between the four emeralds of the dip circuit and the connection of the door to the secret door * resistance value, α Multi-function tester measurement refers to the average value of the resistance of the electrical circuit between the adjacent circuits.夂 ,,,. As table
213294 22 ti修正/奴·織尤 I230JS1 ： 手月 實施例1所得之連接構造體，於—2〇<t保存及在30 c ' 85%RH之恒溫恒濟'槽中保存者，任一者都顯示在2 5 Ω以下之良好連接可信度。又，實施例2、3之連接構造體 中’也同樣顯示於-2(TC保存及在3〇。〇、85%rh之恒溫 恒濕槽中保存者，任一者都得到12·5Ω以下之良好連接可 信度。 相對於此，比較例1及2，Hc保存之連接構造 體中、’雖可得良好連接可信度’但在3Gt、85爾之恒 温恒濕槽中保存者，連接電阻大幅上昇到ι〇ω以上。 (連接強度之測定） 在貫施例1至3中，於一 2 Ω ""Ρ -V > q。 " T ~ 2()C 或在 30°C、85%RH 之 ::::槽中保存者，任-者個都可得物/m左右之 ==另一：面’比較例1及2中，連接強度於 5 C 85 /°RH之恒溫恒濕槽中佯存者, 者都得到1000 N/m左太τ保存者’任一 / Π1左右之良好連接強度。 (絕緣性之評估） 使用所得之異向性I電電 互交又配置250料甯5〇 妾用^者齊i，將具有相 l卞、'果見5 0 // m、間距1 Ω 之銅電路的揭形電 “ m、厚度1 8 // in wI兒路印刷電路基板 間距_“】Ώ、厚产18 具有500條線寬50 (TCP)，以崎居度…m之銅電路的磁帶套組 c，3MPa加熱加壓〗5秒鐘， 2mm。此連接體 、·連接幅覓 85刪之卜“即^路外加1(^之電麼，在85。(：、 阿皿呵相下試驗500小時後 任一去卸叮a j义、吧緣電阻值。 者^可得到…“上之良好值 良好、吧緣性，觀察不出 313294 23 1230191 rp ί 年ίγ ’日修正/更正m充 有絕緣性下降現象。 (流動性之評估） 使用厚度35"m、5mm χ 5_之異向 :=，將其夹持於厚度。·7_15i—_之連: HOC ’ 3MPa下進行加熱加壓15秒鐘 期之面積⑷和加熱加壓後面積⑻， /(A)值時’實施例……至2.〇之範圍内，= 方面，比較例1及2則為18及19。 (硬化後之彈性率） 測定實施例i之異向性導電電路連接用黏著劑在硬化 後40 C之彈性率，為1.5GPa。 一由上述之連接強度、絕緣性、流動性、硬化後之彈性 率等觀之，本發明之實施例之值和比較例之值，雖顯示幾 乎相同=值，但如表i所示般，連接電阻值有很大之差 異。由實施例和比較例之連接強度、絕緣性、流動性等顯 :有相同之特性觀之，導電粒子表面之覆蓋層被認為極 :’但對連接電阻有明顯之影響。如本發明，在表面並不 路出銀、金鉑以外之過渡金屬的導電粒子中，於導電粒子 表面亚無促進自由基聚合性物質之聚合現象’顯示連接電 阻極低之良好數值。如實施例4使用錄等過渡金屬時，只 :在其：側覆蓋5。〇“上之銀、金、鉑等使内側之過渡 :f不路出’則雖經溫度或溫濕度處理均具有優異之保存 安定性，連接電阻不會增加。 (表面處理粒子A之製作） 24 313294 12¾)¾¾¾ 年月 日修正 三乙胺之i重量％甲醇溶液中，放入在以聚苯乙稀為 核心之粒子表面上，設置Up厚度之_層，在此㈣ 外側，°又置〇·04心厚度之金層而成之平均粒徑4/zm之 導電粒子，於饥攪拌Μ分鐘，過濾、出導電粒子，在50 t：下乾燥1 5分鐘，得到表面處理粒子a。 (表面處理粒子B之製作） —胺基丙基三矽烷之3重量％甲醇溶液中，放入在以聚 本乙烯為核心之粒子表面上’設置〇2 # m厚度之鎳層， 在此錄層外側，設置〇.04”厚度之金層而成之平均粒徑 。之導電粒子，於5〇它攪拌$分鐘，過濾出導電粒子， 在 ◦下乾餘5分鐘，得到表面處理粒子b。 (表面處理粒子C之製作） γ — %氧丙氧基丙基甲基二甲氧基矽烷之丨重量％甲 醇溶液中，放入在以聚苯乙烯為核心之粒子表面上，設置 =2 a m厚度之錄層，在此鎳層外側，設置〇 〇4〆m厚度之 金層而成之平均粒徑4" m之導電粒子，於25艺攪拌1〇 刀4里，過戚出導電粒子’在5〇。〇下乾燥i 5分鐘，得到表 面處理粒子c。 (表面處理粒子D之製作） 划#雙酚A型環氧樹脂之3重量％曱醇溶液中，放入在以 承本乙烯為核心之粒子表面上，設置〇·2 #⑴厚度之鎳層， 在此錄層外側，設置0.04/^厚度之金層而成之平均粒經 5 "⑺。之導電粒子，於50T：攪拌5分鐘，過濾出導電粒子， 在80°C下乾燥5分鐘，得到表面處理粒子d。 25 313294 1230191 迫丨i. 26 年 η 日修正觉«it 使用此等導電粒子A、B、C及D，分別配入下面一 叫尸々示 之配合，以簡易之塗工機（丁ESTER產業公司製），在表面 處理過之PET (聚對苯二甲酸乙酯）薄膜單面上塗佈5〇 m厚度，在7〇r、經} 〇分鐘之熱風乾燥，製成電路連接 用黏著劑。 (實施例5) 將苯氧基樹脂（PKHC，Union carbide公司製商品名、 平均分子量45,000 ) 50g，做為自由基聚合性化合物之甲 基丙烯酸二環己酯48g，磷酸酯丙烯酸酯，2, 5 —二曱 基-2, 5-雙（2_乙基己醯過氧化物）己院^，溶解在做為 溶劑之曱乙，中，#將3體積％之表面處理粒子A配入二 散，在表面處理過之聚對苯二甲酸乙酷薄膜單面上，以； 佈50”厚度’在听、…。分鐘之熱風： 燥衣仔厚度為3 〇 # m之異、^ ^ (實施例6) ^導^路連接用黏著劑。 將笨氧基樹脂（PKHC，Un;η 1 · η χ ,,,. θ Uni〇n carblde 公司製商品名' +均刀…5，_)50g，異氛酸環氧己酿改 酯46g，磷酸酯丙烯酸酯 烯酉文 甘 之5 一二曱基—2,5—雜h —乙基己醯過氧化物）己焓 又、z 己诜3g，溶解配入做為溶 酮中，再將3體積％之妾；+ ^之甲乙 、 表面處理粒子B配入分散，乂 處理過之聚對苯二曱酸乙 在表面 ^ r # ^早面上以簡易塗工擤冷从 50 " m厚度，在7〇〇c、妳 ·-工機皇佈 ._ 、、·工 分鐘之熱風乾燥，f得厚$ 為*m之異向性導電電路連接用黏著劑。 度 (實施例7) 313294 26 I230_ 年月 曰修正/更 將苯氧基樹脂（PKHC，Union carbide公司製商品名、 :均分子量45,〇〇〇 ) 25g，聚胺酯樹脂25g，甲基丙烯酸二 裱已酯48g，磷酸酯丙烯酸酯2g，2,5一二甲基一2,5〜雙 (2〜乙基己醯過氧化物）己烷，溶解配入做為溶劑之 曱乙酮中，再將3體積％之表面處理粒子B配入分散，在 2面處理過之聚對苯二曱酸乙酯薄膜單面上以簡易塗工機 二佈50# m厚度，在7〇t：、經1〇分鐘之熱風乾燥，製得 厚^度為30#m之異向性導電電路連接用黏著劑。 (實施例8 ) 、·將苯氧基树脂（PKHC，⑶bide公司製商品名、 :均分子量45,000 ) 5〇g，做為自由基聚合性物之甲基丙 ^酸二環己酯48§，磷酸酯丙烯酸酯2g，2, 5 —二甲基一 2 雙（2一乙基已醯過氧化物）已烷3g，溶解配入做為这 =之甲乙_中，再將3體積％之表面處理粒子C配入分散， 機^處理過之聚對苯二^酸乙S旨薄膜單面上以簡易塗二 械塗佈50 # m厚度，在7〇。 妳 猎 ，工 刀4里之熱風乾燥，条 子又”、、〇〇 V m之異向性導電電路連接用黏 (實施例9) ^ 平均：C脂(PKHc，uni〇n carbide公司製商品名、 t刀I 5,000 ) 50g’異氰酸環氧己能改質二丙稀酸 酯46g，磷酸酯丙烯酸 ） _ ' 5 一 T暴ς 一摊 乙基已I過氧化物）已坑3g，溶解配入做 酮中，再將3體 為洛背j之甲乙 處理過之，對Γ二 理粒子0配八分散，在表s 、 乙sl㈣單面上以簡易塗工機塗β 313294 27 1230191 92： 9, 26 年月日修正/是士片^ 5〇心厚度’在70°c、經10分鐘之熱風乾燥，製得厚度 為30 /Z m之異向性導電電路連接用黏著劑。 (實施例10) ,將寒氧基樹脂（PKHC，unioncarbide公司製商品名、 :均分子量45，_) 25g，聚胺酯樹脂25g，曱基丙烯酸二 衣己酯48g ,磷酸酯丙烯酸酯& ’ 2, $ —二曱基—2, $ —雙 :2乙基己過氧化物）己烷^，溶解配入做為溶劑之 甲乙嗣中，再將3體積％之表面處理粒子D配入分散，在 處理過之聚對苯二f酸乙醋薄膜單面上以簡易塗工機 主佈50" m厚唐，尤 7η。/^ c、，經10分鐘之熱風乾燥，製得 子又..，、# m之異向性導電電路連接用黏著劑。 (比較例3 ) ^了將：施例5之表面處理粒子八改為未處理粒子以 、餘與實施例5同樣處理，製得異向 用黏著劑。 电电峪逑接 (電路連接構造體之製作） 將上述異向性導電電路達接 巾一士 $包路運接用部占者劑，縱割成1.5mm 巾田見’在已形成⑽電極之玻璃基板上，於啊、$种、 1 MPa之條件下暫時連接，剝離ρΕτ 雪 > 办 叉符基材，將此對齊 .兔0/^m、間距50//m之丁⑶電極位置，在 = ::4MPa之條件下’製成本連接電路連接構造體。 (々寸性砰估方法） 連接電阻：使用ADVANT£ST公司f TR6S4s J衣夕功能測試儀 ，之定電流測定電路間之電阻。連接電阻 313294 28 I23W9l2〇 年月 日修正/更龙/τ^ 疋測疋連接後之初期與30°C、60%RH、放置100小時後之 值。其結果在表2中表示。213294 22 ti correction / slave weaving I230JS1: The connection structure obtained in Example 1 of the month and month, which is stored in -20 < t and stored in a 30 c '85% RH constant temperature Hengji' tank, any Both have shown good connection reliability below 25 Ω. Also, in the connection structures of Examples 2 and 3, the same is also shown in -2 (TC stored and stored in a constant temperature and humidity tank at 30%, 85% rh, and any of them obtained 12.5Ω or less On the other hand, in Comparative Examples 1 and 2, in the connection structure stored by Hc, "Although good connection reliability can be obtained", it is stored in a constant temperature and humidity tank of 3 Gt and 85 Å. The connection resistance rises to above ωω. (Measurement of the connection strength) In the examples 1 to 3, at 2 Ω " " P -V > q. &Quot; T ~ 2 () C or at 30 ° C, 85% RH :::: Preserved in the tank, any-anyone can get something / m == another: surface 'Comparative Examples 1 and 2, the connection strength is 5 C 85 / Those who are stored in the constant temperature and humidity bath at ° RH will get a good connection strength of about 1000 N / m left too τ saver's / Π1. (Evaluation of insulation) The anisotropy I obtained using the electrical A configuration of 250 materials and 50 ohms is used, and the following is used, and a copper circuit with a phase of 卞, 'see 5 0 // m, and a pitch of 1 Ω will be “m, thickness 1 8 // in wI Pitch of printed circuit boards for children __】 Ώ, Production 18 Tape set c with 500 line widths of 50 (TCP), copper circuit with a thickness of… m, 3 MPa heating and pressing for 5 seconds, 2 mm. This connector, · connection width is 85 to delete "That is ^ road plus 1 (^ of the electric power, at 85. (:, A ware under the test 500 hours after the test to remove the Ding Ai meaning, the resistance value of the edge. ^ Can get ..." Good value on the good The reason is that no observation can be made. 313294 23 1230191 rp yr yr 'day correction / correction m is filled with a decrease in insulation. (Evaluation of fluidity) Use thickness 35 " m, 5mm χ 5_ anisotropy: =, Hold it in thickness. · 7_15i—_ Link: HOC 'area under heating and pressurization for 15 seconds at 3 MPa 加热 and area after heat and pressurization 时, / (A) value at' Examples ... to 2 In the range of .0, =, Comparative Examples 1 and 2 are 18 and 19. (Elasticity after hardening) The elasticity of the adhesive for anisotropic conductive circuit connection of Example i after curing at 40 C is measured. It is 1.5 GPa. In view of the above-mentioned connection strength, insulation, fluidity, elasticity after hardening, etc., the values of the examples of the present invention and the values of the comparative examples, The display is almost the same = value, but as shown in Table i, the connection resistance values are greatly different. From the connection strength, insulation, and fluidity of the examples and comparative examples, it is obvious that the conductive particles have the same characteristics. The coating on the surface is considered to be extremely polar: 'But it has a significant effect on the connection resistance. According to the present invention, among conductive particles that do not allow transition metals other than silver and gold and platinum on the surface, there is no radical promotion on the surface of the conductive particles. The polymerization phenomenon of the polymerizable substance 'shows a very good value of extremely low connection resistance. When a transition metal is used as in Example 4, only 5 is covered on its side. 〇 “The transition of the inside with silver, gold, platinum, etc .: f does not come out.” Although it has excellent storage stability after temperature or temperature and humidity treatment, the connection resistance will not increase. (Production of surface-treated particles A) 24 313294 12¾) ¾¾¾ Revised Triethylamine in i% by weight methanol solution, put it on the surface of particles with polystyrene as the core, and set up a layer of Up thickness. On the outside of this ㈣, ° The conductive particles having an average particle diameter of 4 / zm formed by a gold layer with a thickness of 0.04 were stirred for MU for 15 minutes, filtered, and the conductive particles were dried out at 50 t: 15 minutes to obtain surface-treated particles a. Production of surface-treated particles B) —Into a 3% by weight methanol solution of aminopropyltrisilane, put on the surface of particles with polyethylene as the core, and set a nickel layer with a thickness of 0 2 m, and record here On the outside, an average particle diameter of a 0.04 "gold layer is set. The conductive particles were stirred for 50 minutes at 50 ° C, the conductive particles were filtered, and dried for 5 minutes under the conditions to obtain surface-treated particles b. (Production of surface-treated particles C) γ-% oxypropoxypropylmethyldimethoxysilane in a wt% methanol solution, put on the surface of particles with polystyrene as the core, set = 2 am The thickness of the recording layer, on the outer side of this nickel layer, a conductive layer with an average particle size of 4 " m formed by a gold layer having a thickness of 0.004 m is stirred in a 10-knife 4 in 25 process to produce conductive particles. At 50. Drying was performed at 0 ° C for 5 minutes to obtain surface-treated particles c. (Production of surface-treated particles D) A 3% by weight methanol solution of bisphenol A epoxy resin was placed on the surface of particles with ethylene as the core, and a nickel layer with a thickness of 0.2 mm was set. On the outside of this recording layer, an average grain diameter of 5 " ⑺ is set by setting a gold layer with a thickness of 0.04 / ^. The conductive particles were stirred at 50T for 5 minutes, the conductive particles were filtered, and dried at 80 ° C. for 5 minutes to obtain surface-treated particles d. 25 313294 1230191 Force i. Corrected consciousness on 26th η day «it uses these conductive particles A, B, C, and D, respectively, and mixes them with the following one called corpse indication, using a simple coating machine (Ding Ester Industry (Manufactured by the company), coated with a thickness of 50 m on one surface of a surface-treated PET (polyethylene terephthalate) film, and dried in hot air for 70 minutes for 70 minutes to prepare an adhesive for circuit connection . (Example 5) 50 g of a phenoxy resin (PKHC, trade name of Union carbide Co., Ltd., average molecular weight: 45,000) was used as a radical polymerizable compound, 48 g of dicyclohexyl methacrylate, and phosphate acrylate, 2, 5 —Difluorenyl-2, 5-bis (2-ethylhexamethane peroxide), dissolved in ethyl acetate, which is a solvent, # 3% by volume of surface-treated particles A are mixed into two On the single side of the surface-treated polyethylene terephthalate film, the thickness of the cloth is 50 ", and the hot air of the minute is: The thickness of the dried clothes is 3 〇 # m, ^ ^ ( Example 6) Adhesive for the connection of the pilot circuit. A styrenic resin (PKHC, Un; η 1 · η χ ,,,. Θ UniOn carblde company product name '+ uniform knife ... 5, _) 50g, 46g of hexadecanoic acid epoxy modified ester, 5 bis-methyl-2,5-hetero-h-ethyl hexamethylene peroxide, phosphate acrylate, pentamidine, hexane enthalpy, z hexane 3g, dissolved in ketones, and then 3% by volume of 体积; + ^ A, B, surface-treated particles B are mixed and dispersed, 乂 -treated poly (terephthalate) on the surface ^ r # ^ early A simple coater is used to cool from 50 " m thickness, dried in hot air at 700 ° C, you-worker imperial cloth. _ ,, ·· minutes of f, the thickness of f is anisotropic conductive of * m Adhesive for circuit connection Degree (Example 7) 313294 26 I230_ Modified / revised 25 g of phenoxy resin (PKHC, trade name of Union carbide Co., Ltd .: average molecular weight 45,000), 25 g of polyurethane resin , 48 g of dihexyl methacrylate, 2 g of phosphate acrylate, 2,5 dimethyl-2,5 to bis (2 to ethyl hexane peroxide) hexane, dissolved and formulated as a solvent In acetophenone, 3% by volume of surface-treated particles B were blended and dispersed. On one side of the two-sidedly treated polyethylene terephthalate film, a simple coater was used with a thickness of 50 # m. 70t: The adhesive for anisotropic conductive circuit connection having a thickness of 30 # m was prepared by hot air drying for 10 minutes. (Example 8) · Phenoxy resin (PKHC, CDbide Corporation) Product name, average molecular weight: 45,000) 50 g, 48 § dicyclohexyl methylpropionate as a radical polymerizable substance, 2 g of phosphate acrylate, 2, 5-dimethylformate 3 g of 2 bis (2-ethyl ethyl peroxide) hexane, dissolved and formulated as this = of methyl ethyl, and then 3% by volume of the surface-treated particles C are dispersed, and the polymer is treated. Ethyl terephthalate film is coated on one side with a simple coating machine with a thickness of 50 # m, at 70. You hunt, the hot air in the knife 4 is dried, and the sliver is different. Adhesive for connection of directional conductive circuits (Example 9) ^ Average: C grease (PKHc, trade name of Union Carbide Corporation, t-knife I 5,000) 50 g of 'isocyanate epoxy can be modified with diacrylate 46g, phosphate ester acrylic acid) _ '5 one T violent one stall of ethyl peroxide (3 peroxide) has been pitted 3g, dissolved and formulated into ketone, and then the 3 body is treated with the methyl ethyl of Luobei j. Two particles of 0 and 8 are dispersed, and coated on one side of the table s and sl㈣ with a simple applicator β 313294 27 1230191 92: 9, 26 month / day correction / Shishi ^ 50 center thickness' at 70 ° c After drying in hot air for 10 minutes, an anisotropic conductive circuit connection adhesive with a thickness of 30 / Z m was prepared. (Example 10) 25 g of cold oxy resin (PKHC, trade name of Unioncarbide, average molecular weight 45, _), 25 g of polyurethane resin, 48 g of diisohexyl methacrylate, phosphate acrylate & '2 , $ —Difluorenyl —2, $ —Bis: 2 ethylhexyl peroxide) hexane ^, dissolved in methyl ethylacetamate as a solvent, and then 3% by volume of surface-treated particles D are dispersed in, On the single side of the treated polyethylene terephthalate film, a simple coater main cloth 50 " m thick Tang, especially 7η. / ^ c. After drying in hot air for 10 minutes, the adhesives for anisotropic conductive circuit connection #. (Comparative Example 3) ^ The surface-treated particles of Example 5 were changed to untreated particles and the rest were treated in the same manner as in Example 5 to prepare an anisotropic adhesive. Electrical connection (production of circuit connection structure) The above anisotropic conductive circuit is connected to a towel for $ 1, including a occupant agent for road transport, and is cut into 1.5mm vertically. On the glass substrate, temporarily connect under the conditions of ah, $, 1 MPa, peel off the ρΕτ snow, and align the fork substrate, and align this. Rabbit 0 / ^ m, pitch 50 // m, the electrode position, = :: 4MPa conditions, the connection structure of the connection circuit is completed. (Embedding method) Connection resistance: Use ADVANT £ ST company f TR6S4s J Yixi functional tester to measure the resistance between circuits with a constant current. Connection resistance 313294 28 I23W9l20 Month / Day correction / Guanglong / τ ^ Measure the initial value after connection and 30 ° C, 60% RH, after 100 hours of storage. The results are shown in Table 2.
本發明之實“π至—1。中―後亦 :::好’但不使用表面處理粒子之比較例3，Comparative Example 3 of the invention "π to -1. Medium-after also ::: OK" but without using surface-treated particles,
Si阻=上广又’異向性導電一^ 構造體，結果含二實施例同樣製成電路連接 面處理過之導♦抑& 物次&乳基之化合物表 實施例…。之配合下，連接電阻（：:二一 Ω ’表示有良好之保存安定性。然而 至3.8 經具有鹼性化合物或環氧基之化合物表面用未 的連接構造體之連接電阻為20 ^粒子 很差。 u ’表示保存安定性 彦業上之可利用 依本發明，可以製得於製成異向性導^ 著劑之後’放置保存安性（黏^路連接用點 用功）良好之異向性 313294 29Si resistance = Shangguang and ’anisotropic conductive one ^ structure, the result contains two examples also made of circuit connection surface treated surface ♦ & material times & milk-based compound table Examples ... With the cooperation, the connection resistance (:: 21 Ω 'indicates good storage stability. However, the connection resistance of the connection structure through the surface of the compound with a basic compound or epoxy group is 20 ^ Poor u 'indicates that the storage stability can be used in the industry. According to the present invention, an anisotropy can be prepared after the preparation of the anisotropy. The placement of the storage stability (the work of connecting points for the sticky road) is good. Sex 313 294 29
I23019F 年月 日修正/更士 導電電路連接用黏著劑。此外，亦可製得相對於熱硬化性 異向性導電電路連接用黏著劑之連接溫度1 70°c，可以在 更低溫之1 50°C連接，黏著劑保存後的連接電阻差異小之 良好連接構造體。 30 3]3294I23019F YYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYMMYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYMMYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYYY Grand Grand There Modern Of Of The Time I have to have. In addition, the connection temperature of the adhesive for thermosetting anisotropic conductive circuit connection is 1 70 ° C, and it can be connected at a lower temperature of 1 50 ° C. The difference in connection resistance after the adhesive is saved is good. Connect the structure. 30 3] 3294