TWI228181B - A method for reducing glass substrate stress of a liquid crystal cell - Google Patents
A method for reducing glass substrate stress of a liquid crystal cell Download PDFInfo
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- TWI228181B TWI228181B TW89123963A TW89123963A TWI228181B TW I228181 B TWI228181 B TW I228181B TW 89123963 A TW89123963 A TW 89123963A TW 89123963 A TW89123963 A TW 89123963A TW I228181 B TWI228181 B TW I228181B
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- thermal expansion
- expansion coefficient
- glass substrate
- liquid crystal
- composite material
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- 239000011521 glass Substances 0.000 title claims abstract description 50
- 239000000758 substrate Substances 0.000 title claims abstract description 45
- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 27
- 238000000034 method Methods 0.000 title claims abstract description 20
- 210000002858 crystal cell Anatomy 0.000 title claims abstract description 17
- 239000002131 composite material Substances 0.000 claims abstract description 32
- 239000000835 fiber Substances 0.000 claims abstract description 13
- 238000003825 pressing Methods 0.000 claims abstract description 9
- 230000008569 process Effects 0.000 claims description 10
- 238000007731 hot pressing Methods 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- 239000010439 graphite Substances 0.000 claims description 7
- 229910002804 graphite Inorganic materials 0.000 claims description 7
- 239000002952 polymeric resin Substances 0.000 claims description 7
- 229920003002 synthetic resin Polymers 0.000 claims description 7
- 239000002356 single layer Substances 0.000 claims description 3
- 239000003365 glass fiber Substances 0.000 claims 1
- 239000004593 Epoxy Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 18
- 239000000463 material Substances 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 9
- 230000035882 stress Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 239000002657 fibrous material Substances 0.000 description 5
- 239000005022 packaging material Substances 0.000 description 5
- 210000004027 cell Anatomy 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000011946 reduction process Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
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- Laminated Bodies (AREA)
Abstract
Description
12281811228181
本發明係有關於一種減 應力的方法,特別有關於一 應力的方法。 少液晶晶胞(cell)之坡埤基板 種於熱壓製程中減少坡壤基板 液晶顯示器之主要構成要素包含有液晶晶胞、 板、光反射板以及擴散板等,其中液晶晶胞是由上、 Ϊ Ϊ板、上、、了透明電極、液晶材料等構成。一般製作液 晶晶胞的方式是先在玻璃基板上製作透明導電膜、^素/ (pixel electrode)電極、配向層、配相控制結構等,”然 後在玻璃基板之内侧週邊塗佈封裝材料。接著,在封裝^材 料所圍住之顯示區域中散佈間隙物(S P a C e r ),將兩基板之 間相互貼合,可以用來設定液晶層厚度。跟著,進$玻璃 基板之貼合製程’並利用適度之加熱、加壓,可以使封裝 材料硬化而形成液晶槽。後續則是將液晶注入液晶槽中之 後,將液晶注入口封閉,才繼續進行後續之偏光板=反射 板之貼合步驟。 習知熱壓製程是在一熱壓(hot press)機台之中進 行。請參考第1圖與第2圖,第1圖係顯示習知熱壓機台1 〇 之示意圖,第2圖係顯示第1圖所示之液晶晶胞2 〇的剖面示 意圖。習知熱壓機台10包含有一上、下加熱板12、14,以 及一上、下壓板16、18分別設置於上、下加熱板12、14 上,而一液晶晶胞2 0係放置於上、下壓板1 6、1 8之間,以 進行熱壓合製程。液晶晶胞2 0包含有一上、下玻璃基板 22、24,一透明電極26形成於玻璃基板22、24上,一上、 下配相膜28塗佈於透明電極26表面,複數個粒狀間隙物30The present invention relates to a method for reducing stress, and more particularly to a method for stress. Slope substrates with few liquid crystal cells (cells) are planted in the hot pressing process to reduce slope soil substrates. The main components of a liquid crystal display include a liquid crystal cell, a plate, a light reflecting plate, and a diffusion plate. , Ϊ Ϊ plate, upper, transparent electrodes, liquid crystal materials, etc. The general way to make a liquid crystal cell is to first make a transparent conductive film, a pixel electrode, an alignment layer, a phase control structure, etc. on a glass substrate, and then coat the packaging material around the inside of the glass substrate. Then The spacers (SP a Cer) are scattered in the display area surrounded by the packaging material, and the two substrates are bonded to each other, which can be used to set the thickness of the liquid crystal layer. Then, enter the glass substrate bonding process. And using moderate heating and pressure, the sealing material can be hardened to form a liquid crystal tank. After the liquid crystal is injected into the liquid crystal tank, the liquid crystal injection port is closed, and then the subsequent step of attaching the polarizing plate = the reflecting plate is continued. The conventional hot pressing process is performed in a hot press machine. Please refer to Fig. 1 and Fig. 2. Fig. 1 shows a schematic diagram of the conventional hot press machine 10, and Fig. 2 It is a schematic cross-sectional view of the liquid crystal cell 20 shown in Fig. 1. The conventional hot press machine 10 includes an upper and a lower heating plate 12, 14 and an upper and a lower pressing plate 16, 18 are respectively arranged on the upper and lower sides. On the heating plates 12, 14 A liquid crystal cell 20 is placed between the upper and lower pressure plates 16 and 18 to perform a thermocompression process. The liquid crystal cell 20 includes an upper and a lower glass substrate 22 and 24, and a transparent electrode 26 is formed on On the glass substrates 22 and 24, an upper and lower matching film 28 is coated on the surface of the transparent electrode 26, and a plurality of granular spacers 30
0611-5631TWFl.ptc 第5頁0611-5631TWFl.ptc Page 5
S於璃基板22、24之空隙β,可以將兩玻璃基 板2 24之間相互貼合並用來設定液晶層厚度,以及一 裝材料32塗佈於玻璃基板22、24之内側週邊。在曰 胞20進行熱壓製程時,制熱壓機台1()所提供之加熱= 壓條件二當液晶晶胞20表面之上、下玻璃基板22、24與 上下壓板1 6、1 8緊您壓合後,可以使封裝材料3 2硬化而 但是’習知技術使用金屬材質來製作上、下壓板丨6、 18,^ 熱膨脹係數(coefflclent 〇f thermal expansi〇n, C T E y运大於玻璃基板2 2、2 4之熱膨脹係數,因此經過熱壓 a衣私之後,熱膨脹係數之不相配現象會使玻璃基板u、 24產生應力,不但會影響到玻璃基板22、24的強度,還會 影響到液晶晶胞20的品質。有鑑於此,目前已發展出以陶 瓷^料或是聚合物來製作上、下壓板丨6、丨8,以縮減習知 熱膨脹係數之差距,但是其熱膨脹係數之差距仍過大,並 無法有效改善應力殘存於玻璃基板22、24的問題。 、本發明則提出一種於熱壓製程中減少玻璃基板應力的 方法’係利用不同種類之纖維材質搭配聚合樹脂材料來製 作上、下壓板’可以使上、下壓板之熱膨脹係數相近於一 般玻璃基板之熱膨脹係數。 圖式簡單說明 ▲ 為讓本發明之上述目的、特徵、和優點能更明顯易 懂’下文特舉一較佳實施例,並配合所附圖式,作詳細說 明如下:In the gap β between the glass substrates 22 and 24, the two glass substrates 2 and 24 can be attached to each other to set the thickness of the liquid crystal layer, and a packaging material 32 can be applied to the inner periphery of the glass substrates 22 and 24. When the cell 20 is subjected to the hot pressing process, the heating provided by the heating press table 1 () = the pressing condition. When the upper surface of the liquid crystal cell 20, the lower glass substrates 22 and 24 and the upper and lower pressing plates 16 and 18 are tightly connected. After you press, you can harden the packaging material 3.2, but 'the conventional technique uses metal materials to make the upper and lower pressure plates 丨 6, 18, ^ thermal expansion coefficient (coefflclent 〇f thermal expansi〇n, CTE y is greater than the glass substrate The coefficient of thermal expansion of 2 2, 2 4 so after the hot pressing a, the mismatch of the coefficients of thermal expansion will cause stress on the glass substrates u, 24, which will not only affect the strength of the glass substrates 22, 24 but also affect The quality of the liquid crystal cell 20. In view of this, at present, ceramic materials or polymers have been developed to make the upper and lower pressure plates 丨 6, 丨 8 to reduce the gap between the known thermal expansion coefficients, but the difference in the thermal expansion coefficient It is still too large and cannot effectively improve the problem of stress remaining on the glass substrates 22 and 24. The present invention proposes a method for reducing the stress of the glass substrate during the hot pressing process' is the use of different types of fiber materials with polymer trees The upper and lower pressure plates can be made of grease materials to 'make the thermal expansion coefficients of the upper and lower pressure plates close to those of ordinary glass substrates. The diagram is simply explained ▲ In order to make the above-mentioned objects, features, and advantages of the present invention more comprehensible' In the following, a preferred embodiment is given, and in conjunction with the accompanying drawings, the detailed description is as follows:
1228181 93· 7· - 7 案號89123963_年月日__ 五、發明說明(3) 第1圖係顯示習知熱壓機台之示意圖。 弟2圖係顯不弟1圖所不之液晶晶胞的剖面不意圖。 第3圖顯示本發明之熱壓機台之示意圖。 弟4圖顯不本發明之複合材料之弟一種結構的剖面不 意圖。 弟5圖顯不本發明之複合材料之弟二種結構的剖面不 意圖。 第6圖顯示本發明之複合材料之第三種結構的剖面示 意圖。 [符號說明] 40〜熱壓機台; 42〜上加熱板; 44〜下加熱板; 46〜上壓板; 48〜下壓板; 50〜液晶晶胞; 52〜聚合樹脂層; 54〜第一複合層; 5 6〜第二複合層。 實施例 請參閱第3圖,其顯示本發明之熱壓機台4 0之示意 圖。本發明熱壓機台40包含有一上、下加熱板42、44,以 及一上、下壓板46、48分別設置於上、下加熱板42、44 上,而一液晶晶胞5 0係放置於上、下壓板4 6、4 8之間,以 進行熱壓合製程。如同前述,液晶晶胞50包含有一上、下 玻璃基板,一上、下透明電極形成於玻璃基板上,一上、 下配相膜塗佈於上、下透明電極表面,複數個粒狀間隙物 散佈於上、下玻璃基板之空隙内,以及一封裝材料塗佈於1228181 93 · 7 ·-7 Case No. 89123963_ 年月 日 __ V. Description of the Invention (3) Figure 1 shows a schematic diagram of a conventional hot press machine. Figure 2 shows the cross section of the liquid crystal cell not shown in Figure 1. Fig. 3 shows a schematic view of a hot press machine according to the present invention. Figure 4 shows the cross section of a structure of the composite material of the present invention is not intended. Figure 5 shows that the cross section of the two structures of the composite material of the present invention is not intended. Fig. 6 is a schematic sectional view showing a third structure of the composite material of the present invention. [Symbol description] 40 ~ hot press table; 42 ~ upper heating plate; 44 ~ lower heating plate; 46 ~ upper platen; 48 ~ lower platen; 50 ~ liquid crystal cell; 52 ~ polymer resin layer; 54 ~ first compound Layer; 5 6 ~ the second composite layer. Example Please refer to Fig. 3, which shows a schematic view of a heat press machine 40 of the present invention. The hot press table 40 of the present invention includes an upper and lower heating plate 42, 44 and an upper and lower pressing plate 46, 48 respectively disposed on the upper and lower heating plates 42, 44. A liquid crystal cell 50 is placed on The upper and lower pressing plates 4 6 and 4 8 are used for the hot pressing process. As mentioned above, the liquid crystal cell 50 includes an upper and a lower glass substrate, an upper and a lower transparent electrode are formed on the glass substrate, an upper and lower matching film are coated on the upper and lower transparent electrode surfaces, and a plurality of granular spacers Scattered in the gaps of the upper and lower glass substrates, and a packaging material is coated on
0611-5631TWFl.ptc 第7頁 1228181 修正 θ ^1^89123963 五、發明說明(4) 玻璃基板之内侧週邊。 時,利用熱麗機對液日日日日胞5〇進行熱麼合製程 胞5〇表面之上;破:;:::熱與力;塵條件,當液晶晶 後,可以使封穿:+=板與上、下星板46、48緊密屢合 ^ q 衣材枓硬化而形成液晶槽。 主要是由聚L下壓板46、48的材質是一種複合材料, ,# M〇枒月日所構成,其内摻有複數種纖維材質,J: 膨脹係數係大於玻璃基板之。脹係 脹係數。將淹桌Ϊ:之熱膨脹係數係小於玻璃基板之熱膨 tX 、適*重量、體積比例的纖維材質摻雜於聚合樹 月曰:鱼:Γ使這個複合材料的熱膨脹係數近似於製程;需 板的熱膨嶋,以解決習知應力殘存於破。 _fi依據玻璃材質的不同,其熱膨脹係數範圍為〇.5χ U 為 1 : :C ’而一般使用的玻璃基板的熱膨脹係 數祀圍為3xl〇-/c〜5xl〇_6/t ’以下特舉結構玻璃材質 structure glass,簡稱s_gUss,其熱膨脹 X材為玻土璃㈣ =擇方式。本發明之上、下壓板46、48所使 材料=,採用電子玻璃(electr〇nic “Ms,簡稱£玻璃) 作為第一種纖維材質,並採用石墨(Graphit 纖維材質。 W示一種 請參閱第1表,其顯示;£玻璃與石墨的基本性質。 等方性材質而言,其各方向的熱膨脹係數均相同。、但β斛 於複合材料而言,其熱膨脹係數會隨著方向性改變 第8頁 〇611-5631TWFl.ptc0611-5631TWFl.ptc Page 7 1228181 Correction θ ^ 1 ^ 89123963 V. Description of the invention (4) The inner periphery of the glass substrate. At the time, the heat-reduction process is performed on the surface of the liquid cell 50 by using a thermal machine on the surface of the liquid cell 50; breaking:; ::: heat and force; dust conditions, when the liquid crystal is crystallized, the sealing can be made: + = The board is closely combined with the upper and lower star boards 46 and 48 ^ q The clothing material is hardened to form a liquid crystal tank. It is mainly composed of poly-L lower plate 46, 48, which is a composite material, # M〇 桠 月 日, which is doped with multiple fiber materials, J: The expansion coefficient is larger than that of the glass substrate. Expansion system Expansion coefficient. The fiber material whose thermal expansion coefficient is less than the thermal expansion coefficient tX of the glass substrate, suitable weight and volume ratio is doped in the polymer tree. Yue: Γ makes the thermal expansion coefficient of this composite material approximate the process; The thermal expansion swells in order to solve the conventional stress remaining in the broken. _fi depends on the glass material, its thermal expansion coefficient range is 0.5 × U is 1:: C ', and the thermal expansion coefficient range of the commonly used glass substrate is 3xl0- / c ~ 5xl0_6 / t' The following special mention Structural glass material structure glass, referred to as s_gUss, its thermal expansion X material is glass clay. According to the present invention, the materials used by the upper and lower pressing plates 46 and 48 are: electronic glass (electronic "Ms") is used as the first fiber material, and graphite (Graphit fiber material is used). Table 1 shows the basic properties of glass and graphite. For isotropic materials, the thermal expansion coefficients are the same in all directions. However, for β-composites, their thermal expansion coefficients change with directionality. 8 pages〇611-5631TWFl.ptc
一種是支配 1228181 ^Β__89123961 五、發明說明(5) 來說’複合材料具有兩種主要的熱膨,#、吵I, 強化纖維方向(d〇minant reinforcement fiber direction)的熱膨脹係數&,另一種是橫向(七 direchcnO熱膨脹係數ατ,而由於母材之機械= = :卜比:小。下表所列之數據’是以聚合樹 曰: 時,早向纖維之代表性的性質。 甘材One is to dominate 1228181 ^ Β__89123961 V. Description of the invention (5) In terms of 'composite materials, there are two main types of thermal expansion, #, Noise I, thermal expansion coefficient & in the reinforcement fiber direction, and the other It is transverse (seven direchcnO coefficient of thermal expansion ατ, and due to the mechanical properties of the base material = =: bubi: small. The data listed in the table below is based on the aggregation tree: the typical properties of early fibers.
纖維種類 ~ 性質 Ε破螭 J5墨 體積比例 46% 63% 密度 1.80 1.61 5·4χ 1 0·6 厂C 0.045x 10,^ Οί·Τ 36xl〇-6/°C 20.2xl〇-6/〇CFiber Type ~ Properties
。 為了要使上、下壓板的熱膨脹係數接近2. g χ 1〇〜6/. In order to make the thermal expansion coefficient of the upper and lower pressure plates close to 2. g χ 1〇 ~ 6 /
C丄可以依據上述之體積比例、熱膨脹係數、密度數值, 計算出複合材料中的聚合樹脂、Ε玻璃與石墨之體積比’ 關係、重量比例關係,便能夠製作出具有熱膨脹係數約歹1 2·\χ l(H/t的複合材料(其熱膨脹係數與玻璃基板之埶的 脹係數的容忍誤差範圍為丨〇%以下)。至於複合材料的^ = 設計丄可以製作成單層結構、雙層結構、多層結構。…冓 # μ參閱第4圖至第6圖。第4圖顯示本發明之複合材料 =第種結構的剖面示意圖,第5圖顯示本發明之複合材 料之第二種結構的剖面示意圖,第6圖顯示本發明之^人 材料之第三種結構的剖面示意圖。本發明之複合材料之第C 丄 can calculate the relationship between the volume ratio of polymer resin, E glass and graphite in the composite material, and the ratio by weight based on the above volume ratio, thermal expansion coefficient, and density values, and can produce a thermal expansion coefficient of about 歹 1 2 · \ χ l (H / t composite materials (tolerance error between thermal expansion coefficient and expansion coefficient of glass substrates is less than 丨 0%). As for the composite material's ^ = design, it can be made into a single-layer structure, double-layer Structure, multi-layer structure .... 冓 # μ Refer to Figures 4 to 6. Figure 4 shows a schematic cross-sectional view of the composite material of the present invention = the first structure, and Figure 5 shows the second structure of the composite material of the present invention. Sectional schematic diagram, FIG. 6 shows a schematic cross-sectional diagram of a third structure of the human material of the present invention.
0611-5631TWFl.ptc0611-5631TWFl.ptc
修正___ -種結構是-種單層結才冓,係於一聚合樹脂層52中加入特 定^之E玻璃與石墨’可以使其熱膨脹係數達到容忍誤 差靶圍内。本發明之複合材料之第二種結構是一種雙層結 構丄是ί 一第一複合層54以及一第二複合層56所組成,其 ^,一稷合層54包含有聚合樹脂與特定比例之£玻璃,第 二複合層56包含有聚合樹脂與特定比例之石墨,可以使其 熱膨脹係數達到容忍誤差範圍内。本發明之複合材料之第 二種結構是'^種多層έ士娃^ « 續、、、°構,是由上述之複數個第一複合層 54以及第一複合層5 6所組成,只要整體之聚合樹脂、Ε玻 璃與石墨具有定比例關係、,便能夠使其熱膨脹係數達到容 忍誤差範圍内。值得注意的是,第-複合層54以及第二複 合層56的堆疊方式必須呈上下對稱分布。 相較於習知技術採用金屬材質作為上、下壓板丨6、 18 ’本發明採用複合材料作為上、下壓板铛、48,利 入聚合樹財的不同熱膨脹係數的纖維可以使複合材料的 =脹係數接近玻璃基板之熱膨脹係冑,因此經過熱壓合 m會減少玻璃基板之應力’可以確保玻璃基板的: 質以及基板貼合製程的品質。 性 雖本發明已以一較佳實施例揭露如上 =限=發明’任何熟習此技藝者,…離本發明:: 當可作些許之更動與潤,,因此本發明之: 濩範圍§視後附之申請專利範圍所界定者為準。 ’、Modification ___-A kind of structure is a kind of single-layer junction. The addition of a specific ^ of E glass and graphite 'in a polymer resin layer 52 can make its coefficient of thermal expansion within the tolerance tolerance range. The second structure of the composite material of the present invention is a double-layer structure, which is composed of a first composite layer 54 and a second composite layer 56. A composite layer 54 includes a polymer resin and a specific proportion of Glass, the second composite layer 56 contains a polymer resin and a specific proportion of graphite, which can make its thermal expansion coefficient within a tolerance range. The second structure of the composite material of the present invention is a '^ multi-layered laminated structure', which is composed of the plurality of first composite layers 54 and the first composite layers 56 described above, as long as the whole The polymer resin, E glass and graphite have a proportional relationship, so that their thermal expansion coefficient can reach the tolerance range. It is worth noting that the stacking method of the first composite layer 54 and the second composite layer 56 must be symmetrically arranged up and down. Compared with the conventional technology using metal materials as the upper and lower pressure plates, 6, 18 'The present invention uses a composite material as the upper and lower pressure plates, 48, and the fibers with different thermal expansion coefficients that benefit the polymerization tree can make the composite material = The expansion coefficient is close to the thermal expansion of the glass substrate. Therefore, the thermal stress of the glass substrate will reduce the stress of the glass substrate, which can ensure the quality of the glass substrate and the quality of the substrate bonding process. Although the present invention has been disclosed in a preferred embodiment as above = Limit = Invention 'Anyone who is familiar with this skill, ... from the present invention: When a little change and embellishment can be made, so the present invention: The attached application patent shall prevail. ’,
0611-5631TWFl.ptc 第10頁0611-5631TWFl.ptc Page 10
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW89123963A TWI228181B (en) | 2000-11-13 | 2000-11-13 | A method for reducing glass substrate stress of a liquid crystal cell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW89123963A TWI228181B (en) | 2000-11-13 | 2000-11-13 | A method for reducing glass substrate stress of a liquid crystal cell |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWI228181B true TWI228181B (en) | 2005-02-21 |
Family
ID=35668093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW89123963A TWI228181B (en) | 2000-11-13 | 2000-11-13 | A method for reducing glass substrate stress of a liquid crystal cell |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI228181B (en) |
-
2000
- 2000-11-13 TW TW89123963A patent/TWI228181B/en not_active IP Right Cessation
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