1221635 五、發明說明（1) ~ (一） 、【發明所屬之技術領域】 本發明係關於一種模版形成方法，特別關於一種用於 數位影音光碟的模版形成方法。 (二） 、【先前技術】 在光碟片的生產過程中，首先必需將原始的數位資料 或訊號轉換為雷射刻版訊號，接著於無塵的環境中，經過 刻版與電錢4處理步驟’製造出用以量產光碟的母版 (master )。接下來，再利用母版製成模版（stamper)以 供後續製程使用。 如圖1A所示，習知的DVD-RW之模版1係於ReadaMe Embossed 區域（區域A )以及UnreadaMe Emb〇ssed 區域 (區域B )中形成有複數個相同深度的‘槽，其溝槽深度 H1約為2 5nm-3 0nm。接著，為了促進光碟片與光碟機的相 容性，並使一般的DVD-ROM能夠讀取DVD-RW格式的光碟 片，係於DVD-RW Ver 1.1 版本中，將Readable Emb〇ssed 區域（區域A )訊號作部分的修改，亦即丄e Embossed區域（區域A )的溝槽深度H2增加為l〇〇nm，如圖 1 B所示之模版1 ’，其係用以增加訊號讀取的模式。 承上所述，在目前的模版形成製程中，係直接利用不 同強度的雷射光來曝光模版1，之正光阻；舉例而言，在曝 光Readable Embossed區域（區域A )的正光阻時，必須使 用南能虿的雷射光束’以便將Readable Embossed區域 (區域A )的正光阻曝光至所需之溝槽深度（i00llm )，而1221635 V. Description of the invention (1) ~ (1), [Technical field to which the invention belongs] The present invention relates to a stencil forming method, and particularly to a stencil forming method for a digital video disc. (Two), [prior art] In the production process of optical discs, the original digital data or signals must first be converted into laser-engraved signals, and then in a dust-free environment, through the engraving and electric money 4 processing steps 'Make a master for mass production of optical discs. Next, the master is used to make a stamper for subsequent processes. As shown in FIG. 1A, a conventional DVD-RW template 1 is formed in the ReadaMe Embossed area (area A) and the UnreadaMe Emb0ssed area (area B). A plurality of 'grooves of the same depth are formed, and the groove depth H1 is It is about 2 5nm-3 0nm. Next, in order to promote compatibility between optical discs and optical disc drives, and enable ordinary DVD-ROMs to read DVD-RW format discs, the DVD-RW Ver 1.1 version was used to incorporate a Readable Emb〇ssed area (area A) The signal is partially modified, that is, the groove depth H2 of the Embe Embossed area (area A) is increased to 100 nm, as shown in the template 1 ′ shown in FIG. 1B, which is used to increase the signal read. mode. As mentioned above, in the current stencil forming process, the laser light of different intensity is used to directly expose the positive photoresist of the stencil 1. For example, when exposing the positive photoresist of the Readable Embossed area (area A), it is necessary to use Nanergy's laser beam 'in order to expose the positive photoresist in the Readable Embossed area (area A) to the required groove depth (i00llm), and
1221635 五、發明說明（2) ' 在曝光Unreadable Embossed區域（區域B)的正光阻時， 必須使用較低能量的雷射光束，以便將U n r e a d a b 1 e Embossed區域（區域B )的正光阻曝光至較淺的溝槽深度 (約 25nm-30nm ) 〇 然而，在上述製程中，不同能量之雷射光束通常來自 同一雷射光源，而透過調整雷射光源的方式來產生所需之 不同強度的雷射光束’結果，在調整雷射光源時，雷射光 束之強度會呈現不穩定的狀況，進而造成所形成之溝槽深 度不均勻的情形’特別是在調整雷射光源以產生較低能量 之雷射光束、並用以曝光Unreadable Embossed區域（區 域B )的正光阻時。 因此’如何提供一種能夠避免調整雷射光源所造成之 溝槽深度不均勻的模版形成方法，正是士前光碟製造技術 的重要課題之一。 (三）、【發明内容】 有鑑於上述課題，本發明之目的為提供一種能夠利用 相同強度之雷射光束來形成不同溝槽深度的模版形成方 法。 緣疋，為達上述目的，依本發明之模版形成方法包括 於-基版上塗佈-光阻層、&光阻層上形成一圖案化之半 遮蔽層（patterned semi-bl〇cked Uyer)、以一光束曝 :光：層、顯影光阻層、以及朝光阻層的方向錢一金屬 層。在本發明巾，半遮蔽層係用以削減光束之能量，以部 12216351221635 V. Description of the invention (2) 'When exposing the positive photoresist in the Unreadable Embossed area (area B), a laser beam with a lower energy must be used in order to expose the positive photoresist in the Unreadab 1 e Embossed area (area B) to Shallow trench depth (about 25nm-30nm) 〇 However, in the above process, laser beams of different energies usually come from the same laser light source, and the laser light source of different intensity is required to be adjusted by adjusting the method of the laser light source. As a result, when adjusting the laser light source, the intensity of the laser beam will appear unstable, which will cause the uneven depth of the groove formed. Especially when the laser light source is adjusted to generate a lower energy When a laser beam is used to expose the positive photoresist in the Unreadable Embossed area (area B). Therefore, how to provide a stencil forming method that can avoid the uneven groove depth caused by adjusting the laser light source is one of the important topics of Shiqian disc manufacturing technology. (3) [Summary of the Invention] In view of the above problems, an object of the present invention is to provide a stencil forming method capable of forming laser beams of the same intensity to form different groove depths. In order to achieve the above purpose, the method for forming a stencil according to the present invention includes coating a photoresist layer on a base plate and forming a patterned semi-blown layer on the photoresist layer. ), Exposure with a light beam: light: layer, developing photoresist layer, and a metal layer in the direction of the photoresist layer. In the towel of the present invention, the semi-shielding layer is used to reduce the energy of the light beam.
五、發明說明（3) 分遮蔽此光束 承上所述，因依本發明之模版形成方法係於光阻 形”用以削減光束之能量的半遮蔽層，戶斤以本發明^ 使用早一強度的光束來進行光阻層之曝光，並形成所兩: ,2溝槽深度（如前述之溝槽深度H1趟），故能夠ς 凋正雷射光源所造成之溝槽深度不均勻的情形。 (四）、【實施方式】 版开參關圖說明依本發明較佳實施例之模 =成方法中相同的元件將以相同的參照符號 明 0 請參照圖2所示，依本發明知社與 法包括下列步驟佳貝^例之模版形成方 #阻屏J工闰2 塗佈一光阻層（S01)、於 先阻層上形成一圖案化之半遮蔽居 光光阻層（S03 )、顯景彡光阻屛/ 以一光束* 方向廣鍍一金屬層（S〇5)。需、、t立本义爷丄 — ^ ^ μ ^ ^ ^ ^ ^ . 而，主思者，依本發明較佳實 施例之权版形成方法係用以釗V. Description of the invention (3) Shielding the light beam as described above, because the method for forming a template according to the present invention is in a photoresistive shape, "a semi-shielding layer used to reduce the energy of the light beam. Intensity of the light beam to expose the photoresist layer and form the following two: 2 groove depth (such as the groove depth H1 trip mentioned above), so the groove depth unevenness caused by the positive laser light source can be reduced (IV) [Embodiment] The version opening reference diagram illustrates the model according to the preferred embodiment of the present invention. The same elements in the forming method will be indicated with the same reference symbols. 0 Please refer to FIG. 2 according to the present invention. The company and the law include the following steps: A stencil forming method of the Jiabei ^ Example # Shield screen J 工 闰 2 Coated a photoresist layer (S01), forming a patterned semi-shielded residential photoresist layer on the first resist layer (S03 ), The photoresistance of the scene, and a metal layer (S〇5) in the direction of a beam *. You need to set up the original meaning — ^ ^ μ ^ ^ ^ ^ ^. The method for forming a copyright plate in the preferred embodiment of the present invention is used to
用以製造數位影音光碑（D :;二一”权版，特別係指-)的光碟模版。碟（Dlgltal D1SC，DVD 為使本發明之内容夢交 照圖3A至3F，以說明依=里：1下將舉-實例並參 的流程。 依本發明較佳實施例之模版形成方法 士口圖3 A戶斤不’方^井'臣取。八η . 阻；^2。右+，其中，係於基版3!上塗佈一光 曰 土 31係為一玻璃基版。在本實施例中， 1221635 五、發明說明（4) '一"" 於塗佈光阻層3 2之前，通常會先以一清洗劑清洗基版3丨表 面’接著再塗佈一底黏膠（p r i m e r )，藉以增強基版3 1與 光阻層3 2之間的黏著度。 其次，如圖3B所示，於步驟s〇2中，係於光阻層32上 幵v成 圖案化之半遮蔽層3 3。於本實施例中，半遮蔽層3 3 係先形成於光阻層3 2上，然後再進行半遮蔽層3 3之圖案 化’以便將半遮蔽層33形成於Unreadable Embossed區域 (區域B );此外，半遮蔽層3 3可以是一半反射層 (semi-refleeting layer )，例如是由銀金屬所形成之 半反射層，其係能夠反射部分的光束，並讓部分光束透 過。舄主思者，所欲形成之模版更包含一資料區域（d a七a area )，而半遮蔽層33係更形成於資料區域上。 接著，於步驟S03中，係以一光束4曝光光阻層32，其 中半遮蔽層3 3係削減光束4之能量以部分遮蔽光束4，如圖 3 C與3 D所示。在此，工作母帶中之數位資料係經由訊號介 面乐統（Mastering Interface System，MIS)轉換成高 頻訊號，並傳輸至一讀取器中；然後，驅動光束發射器 (未顯不於圖）發射出光束4於塗有光阻層32的基版31上 以進行轉錄。在本實施例中，當光束4照射在Readable Embossed區域（區域a)之光阻層32時，光束4可以將光阻 層32曝光至較深的距離，例如前述之溝槽深度H2 ( 1〇〇nm )’另外’當光束4照射在Unreadable Embossed區域（區 域B )之光阻層3 2時，光束4會被半遮蔽層3 3遮蔽、削減， 例如部分之光束4會被半遮蔽層3 3反射，因此被削減之光A disc template used to make a digital audio-visual stele (D :; Twenty-one "rights edition, especially refers to-). Discs (Dlgltal D1SC, DVD) In order to make the content of the present invention a dream, Figures 3A to 3F, to explain the follow = Here: 1 will show the process of taking examples and participating in the process. According to the preferred embodiment of the present invention, the template formation method is shown in Fig. 3. A household is not taken from the 'square ^ well'. Eight η. Resistance; ^ 2. Right + Among them, it is coated on the base plate 3! The light 31 is a glass base plate. In this embodiment, 1221635 V. Description of the invention (4) '一 " " Before 3 2, the surface of the base plate 3 丨 is usually cleaned with a cleaning agent, and then a primer is applied to enhance the adhesion between the base plate 3 1 and the photoresist layer 32. Second, As shown in FIG. 3B, in step s02, a patterned semi-shielding layer 33 is formed on the photoresist layer 32. In this embodiment, the semi-shielding layer 33 is first formed on the photoresist layer. 3 2 and then patterning the semi-shielding layer 33 in order to form the semi-shielding layer 33 in the Unreadable Embossed area (area B); in addition, the semi-shielding layer 33 can be semi-reflective (Semi-refleeting layer), for example, is a semi-reflective layer formed of silver metal, which can reflect part of the light beam and allow part of the light beam to pass through. The master thinks that the template to be formed further includes a data area (da 7a area), and the semi-shielding layer 33 is further formed on the data area. Next, in step S03, the photoresist layer 32 is exposed with a light beam 4, wherein the semi-shielding layer 33 reduces the energy of the light beam 4 to a part The shielding light beam 4 is shown in Figs. 3C and 3D. Here, the digital data in the working master tape is converted into a high-frequency signal by a signal interface (Mastering Interface System, MIS), and transmitted to a reader. Then, the beam transmitter (not shown) is driven to emit the light beam 4 on the substrate 31 coated with the photoresist layer 32 for transcription. In this embodiment, when the light beam 4 is irradiated on the Readable Embossed area ( When the photoresist layer 32 in the area a), the light beam 4 can expose the photoresist layer 32 to a deeper distance, for example, the aforementioned groove depth H2 (100 nm) is 'otherwise' when the light beam 4 is irradiated on the Unreadable Embossed area ( Area B) of the photoresist layer 3 2 and the light beam 4 Semi-shielding layer 33 is masked to reduce, for example, the beam portion 4 is semi-reflective masking layer 33, so light to be cut
‘，：叨說明（5) 束4雖然能夠穿透本 較淺的距離，：二遮蔽層33，但僅能將光阻層32曝光至 於本實施深度们（約25則—。 的標準。另外，達到刻錄高密度數位影音光碟 以確保成品的良率。in ?，通常需先測試平整度， 同光=斤發射出，且維持相同=例中之光束4係利用相 阻層32 ί除於：=〇4中_，,以-顯影液將經過曝光的* 驗性化學溶液：所；二本實施例中’顯影液可為一 者，太牛哪技门 風乳化釣、氫氧化鉀）。需邙立 者’本步驟係同時移除半遮蔽声Μ 7 /而左思 之前便先移除半遮蔽層3 3。曰 ^疋在頌影光阻層3 2 最後’於步驟S〇5中，# ά , < 1^34 ^ 〇 5係使曝光顯影後之凹凸部；呈&:屬性；鍍金屬層34的功 導電之電極一樣，用以在後病雪貝以使其成為可 本實施例中，金屬層34係^ ::電•成形步驟中使用。於 綜上所述，由於依本發明金（Nl—V AU〇y)。 上形成半遮蔽層，以便削減衩==成方法係於光阻層 之模版形成方法僅需使用單—^旎置，所以利用本發明 曝光，並且能夠同時形成所—:的光束來進行光阻層之 度H1及H2)，故能夠避免詞溝槽深度（如溝槽深 不均勻的情形，進而提高產σ二、…源所造成之溝槽深度 7 7芝σσ的良率。 以上所述僅為舉例性’而 Γ者任何未脫 1221635',: 叨 Note (5) Although the beam 4 can penetrate a relatively shallow distance: the two shielding layers 33, it can only expose the photoresist layer 32 to the depth of this implementation (about 25 standards.). In addition, In order to achieve high-density digital audio-visual discs to ensure the yield of the finished product. In?, Usually need to test the flatness first, the same light = kilograms emitted, and maintain the same = the beam in the example 4 is using a phase resistance layer 32 ί divided by : = 〇4 中 _ ，,-developer solution will be exposed * empirical chemical solution: So; in this embodiment, the 'developing solution can be one, too good to emulsify fishing, potassium hydroxide) . Need to stand ’This step is to remove the semi-shielding sound M 7 / at the same time, and Zuo Si removes the semi-shielding layer 3 3 before. In the last step of the photic shadow resist layer 3 2, in step S〇5, # ά, < 1 ^ 34 ^ 〇5 is the uneven portion after exposure and development; showing &:attributes; metal plating layer 34 The conductive electrode is the same as that used in the later stage to make it possible. In this embodiment, the metal layer 34 is used in the electroforming step. In summary, due to the gold (Nl-V AUOy) according to the present invention. A semi-shielding layer is formed on top of the photoresist layer in order to reduce the thickness of the photoresist layer. The method of forming a stencil requires only a single-setup, so the exposure of the present invention and the simultaneous formation of a beam of light to perform photoresist Layer height H1 and H2), so the word trench depth (such as the case of uneven trench depth) can be improved, and the yield of the trench depth caused by the production of σ2, ... source is 7 7 σσσ. For illustrative purposes only
第10頁 1221635 圖式簡單說明 (五）、【圖式簡單說明】 圖1 A為一示意圖，顯示習知DVD-RW之模版的示意圖； 圖1B為一示意圖，顯示DVD-RW Ver 1.1之模版的示意 圖； 圖2為一流程圖，顯示依本發明較佳實施例之模版形 成方法之流程；以及 圖3 A〜3 F為示意圖，顯示利用本發明較佳實施例之模 版形成方法製造DVD-RW Ver 1.1之模版的示意圖。 元件符號說明： 1 模版 Γ 模版 31 基版 32 光阻層 33 半遮蔽層 34 金屬層 4 光束 A Readable Embossed 區域 B Unreadable Embossed 區域 HI 溝槽深度 H2 溝槽深度 SO卜 S05 模版形成方法的流程Page 101221635 Brief description of the drawings (five), [Simplified description of the drawings] Figure 1A is a schematic diagram showing a conventional DVD-RW template; Figure 1B is a schematic diagram showing a DVD-RW Ver 1.1 template Figure 2 is a flowchart showing the flow of the template forming method according to the preferred embodiment of the present invention; and Figures 3 A to 3 F are schematic views showing the manufacturing of a DVD by using the template forming method of the preferred embodiment of the present invention- Schematic diagram of RW Ver 1.1 template. Element symbol description: 1 stencil Γ stencil 31 base plate 32 photoresist layer 33 semi-shielding layer 34 metal layer 4 beam A Readable Embossed area B Unreadable Embossed area HI groove depth H2 groove depth SO05 S05 template formation method flow