[go: up one dir, main page]

TWI220171B - Lift type probe card reverse-side probe adjustment tool - Google Patents

Lift type probe card reverse-side probe adjustment tool Download PDF

Info

Publication number
TWI220171B
TWI220171B TW92117625A TW92117625A TWI220171B TW I220171 B TWI220171 B TW I220171B TW 92117625 A TW92117625 A TW 92117625A TW 92117625 A TW92117625 A TW 92117625A TW I220171 B TWI220171 B TW I220171B
Authority
TW
Taiwan
Prior art keywords
needle
probe
probe card
glass
card
Prior art date
Application number
TW92117625A
Other languages
Chinese (zh)
Other versions
TW200500616A (en
Inventor
Lin-Pao Lin
Original Assignee
Macronix Int Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Macronix Int Co Ltd filed Critical Macronix Int Co Ltd
Priority to TW92117625A priority Critical patent/TWI220171B/en
Application granted granted Critical
Publication of TWI220171B publication Critical patent/TWI220171B/en
Publication of TW200500616A publication Critical patent/TW200500616A/en

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

There is provided a lift type probe card reverse-side probe adjustment tool. A probe adjuster platen is used under a replaceable glass with a mask film to adjust the probe position of the probe card. The mask film has a plurality of aligning points. The probe adjustment tool includes a base with a rotating device, which is fixed to the probe adjuster platen; a glass base with a flipping device; a horizontal co-plane connected to the rotating device to flip and adjust the glass base, wherein the glass base is provided for receiving the replaceable glass to adjust the probe position of the probe card to align with the aligning points; and a buffer for buffering the glass substrate to flip to a horizontal position speed to prevent the probe of the probe card from being damaged.

Description

發明所屬之技術領域 本發明係有關_ 式探針卡反面調“r:針卡調針治具,特別是關於可掀 先前技術 體電路(IC)的製 :為達到尚密度化,元件的尺 程發展進步快请,; 史少択迷,也必須測試 、。在製作晶圓完成後,必須 好壞以維持1C的出貨品質在一 針卡(probe card )、針測機 (t e s t e r )是測試階段的三個 有百項微型彈簣專利的卡片, 判定晶圓上的晶粒好壞;針測 準的移動到探針卡的正確位置 到承載板,將電子訊號傳到測 驗出積體電路的功能、參數與 第一圖係探針卡1 〇測試晶 針卡1 0係測試晶粒1 4,一般而 層,在測試晶圓1 2中的晶粒1 4 置需要量測的晶粒1 4上以確認 的種類繁多,在使用探針卡1 〇 卡1 0的針位以對準需要量測的 探針卡調針治具調整探針卡1 0 程發展進步快速,I c中的元 寸不斷地縮小,然而,I c製 [C電路以保證I C的出貨品 量測晶圓中的I c以確認」C的 標準值之上,一般而t,探 (prober ) 與測試機 關鍵設備,探針卡是一片擁 上頭有許多微細的針,負責 機負責把一片片的晶圓,精 ’使探針卡上的針尖接觸 試機上;最後再由測試機測 特性。 圓1 2中晶粒1 4的示意圖,探 言’探針卡10的針層數為七 ,,係以探針卡10的探針放 每一晶粒1 4的好壞。然而J c 測試晶圓前就必須調整探 晶粒位置.,因此,需要使 的針位以對準需要量測的晶FIELD OF THE INVENTION The present invention relates to _-style probe card reverse adjustment "r: needle card adjustment needle fixture, in particular, to the production of the prior art body circuit (IC): to achieve high density, the scale of the component Please make progress in the development of the process quickly; Shi Shaomin is also obsessed with testing. After the wafer is manufactured, it must be good or bad to maintain the 1C shipment quality. The probe card and tester are During the test phase, three cards with hundreds of micro-impeachment patents were used to determine the quality of the crystals on the wafer; the needle measurement was moved to the correct position of the probe card to the carrier board, and the electronic signal was transmitted to the test body. The function and parameters of the circuit and the first picture are the probe card 10, the test pin card 10, and the test die 14, which are generally layered. The die 14 in the test wafer 12 needs to be measured. There are many types of confirmation on the granules 14. The needle position of the probe card 10 and the card 10 is used to align the probe card to be measured. The needle adjustment jig is adjusted to adjust the probe card 10. The process is developing rapidly and I c The yuan size in the market continues to shrink. However, IC circuits [C circuits to ensure IC shipments measure wafers. I c is above the standard value of "C". Generally, t, probe (prober) and the key equipment of the test machine, the probe card is a piece of wafer with many fine needles on it. , Fine 'make the needle tip on the probe card contact the test machine; finally test the characteristics by the test machine. Schematic diagram of the crystal grains 14 in the circle 12, the number of needle layers of the probe card 10 is seven, and the quality of each crystal grain 14 is set by the probe of the probe card 10. However, J c must adjust the position of the die before testing the wafer. Therefore, the needle position needs to be aligned with the crystal to be measured.

1220171 五、發明說明(2) 粒位置。 第二圖係習 機平台1 8上依序 固定晶圓1 2及探 1 0 〇 2,並以鑷子 量測的晶粒1 4位 只能使用探針卡 針層數超過三層 卡,無法使用鑷 置。因此,一種 所冀。 知探針卡 放置晶圓 針卡1 0, 調整探針 置。由於 正面1 0 0 2 以上及在 子在探針 可完全調 調針治具1 6的 1 2及探針卡j 〇 以電子顯微鏡 卡1 〇的針位以 習知探針卡調 方式調針,因 製作時採用中 卡正面1 0 0 2調 整探針卡針位 示意圖,在一調針 且以一固 22觀看探 對準晶圓 針治具1 6 此,對於 心沒開窗 整針位到 的調針治 定裝置20 針卡正面 12中需要 調整針位 探針卡1 0 口的探針 正確、的位 具’乃為 發明内容 本發明 調針治具, 根據本 針治具,俾 針機平台調 點,該調針 機平台上, 以翻轉調整 可抽換式玻 器緩衝該玻 針損壞。 的主要目的,在 以完全調整探針 發明的一個實施 在一具有遮罩薄 整該探針卡針位 治具包括一具有 一具有翻轉裝置 該玻璃基座的水 璃以調整該探針 璃基座翻轉至水 於提出一 卡針位到 例,一種 膜的可抽 ,該遮罩 轉動裝置 的玻璃基 平共面, 卡針位對 平位置速 種可掀式 正確位置 可掀式探 換式玻璃 薄膜具有 的底座固 座,連接 該玻璃基 準該定位 度以防止 探針卡反面 針卡反面調 下使用一調 多個定位 定於該調針 該轉動裝置 座係放置該 ^ ’ 一緩衝 該探針卡探 第6頁 ^201711220171 V. Description of the invention (2) Grain position. The second picture shows that the wafer 12 and the probe 10 02 are sequentially fixed on the platform 18 of the machine, and the die 14 measured by the tweezers can only use the probe card. Place with tweezers. Therefore, a kind of hope. Know the probe card Place the wafer Pin card 10, and adjust the probe position. Since the front side is more than 100 2 and the probe can be fully adjusted, the needle fixture 16 and the probe card j 〇 can be adjusted by the conventional probe card adjustment method with the needle position of the electron microscope card 1 〇. Since the front of the card is used to adjust the needle position of the probe card, the schematic diagram of the needle position is adjusted. The needle position is adjusted with a fixed needle and a solid 22 view. The needle adjusting device 20 of the front face 12 of the needle card needs to adjust the needle position of the probe card 10 and the probe of port 10 is correct and the positioner is the content of the invention. According to the needle adjusting device of the present invention, the needle The machine platform adjusts the point on the needle machine platform to flip and adjust the removable glass to cushion the glass needle from damage. The main purpose of the invention is to fully adjust the probe according to an embodiment of the present invention. A probe card with a mask and a thin needle position fixture includes a water glass with a glass base with a flipping device to adjust the probe glass base. The seat is flipped to the water to propose a card pin position to the example, a film can be pumped, the glass base of the mask rotating device is flat, the card pin position is flat, the speed is correct, the position is correct, and the position can be changed. The glass film has a base fixed seat, which is connected to the glass reference to the positioning degree to prevent the probe card from being reversed. The needle card is reversed. Use one adjustment and multiple positioning. Pin stuck on page 6 ^ 20171

實施方式 第二圖係本發明可掀 圖,係在調針機平a丨8 μ、、十卡反 _位置,定裝置 :顯微鏡22觀看’;使用 :。反面調針治具24包括底座2= ^姑一轉動轴承30連接底座28,轉動 轴承,且翻轉誤差係〇. 1微米: ,動軸承3 0,玻璃基座32係放置可抽 j手36連接玻璃基座32以翻轉調整玻 Μ係緩衝翻轉至水平共面速度以防止 損壞,緩衝器38以支撐裝置4〇維持玻 面。探針卡反面調針治具24並包括一 針卡反面1004探針避免人為壓迫而損 半圓弧形的遮罩物。 、 第四圖係本發明玻璃基座3 2的水 璃基座32連接轉動軸承3〇,藉由翻轉 面調針治具2 4的示专 26固定探針卡£面。 抽換式玻璃3 4下以電 針卡反面1004的針 定在調針機平台18 軸承30係一高精密度 •一玻璃基座32連接 換式玻璃3 4 ’ 一翻轉 璃基座32,一緩衝器 探針卡反面1004探針 璃基座32的水平共 保護裝置4 0以保護探 壞,保護裝置40係一 平共面的示意圖,玻 把手36連接玻璃基座Embodiment 2 The second drawing is a tiltable drawing of the present invention, which is at the position of a needle adjusting machine, 8 μ, and 10 cards in reverse. The setting device is viewed by the microscope 22; The reverse needle adjusting fixture 24 includes a base 2 = ^ a single rotary bearing 30 connected to the base 28, the rotary bearing, and the turnover error is 0.1 micron:, the movable bearing 30, the glass base 32 can be placed with the hand 36 connected The glass base 32 is adjusted by flipping the glass buffer to a horizontal coplanar speed to prevent damage, and the buffer 38 maintains the glass surface with the supporting device 40. The back side of the probe card is provided with a needle adjusting jig 24 and includes a back side of the probe card 1004 to prevent artificial pressure from damaging the semi-circular cover. The fourth figure is the glass base 32 of the glass base 32 of the present invention connected to the rotary bearing 30, and the probe card surface is fixed by turning the indicator 26 of the surface adjustment needle 24. Under the replaceable glass 3, the needle on the reverse side of the electric card card 1004 is set on the needle adjuster platform. 18 The bearing 30 is a high precision. • A glass base 32 is connected to the replaceable glass 3 4 '. The reverse side of the buffer probe card 1004. The horizontal co-protection device 40 of the probe glass base 32 is used to protect against damage. The protection device 40 is a schematic plan view of the plane. The glass handle 36 is connected to the glass base.

第7頁 1220171 五、發明說明(4) 32 =翻轉調整玻璃基座32,玻璃基座“係放置可抽換式玻 ,,且以固定玻璃裝置44固定可抽換式玻璃34在玻璃基 j32上,緩衝器38係緩衝玻璃基座32翻轉至水平共面的速 止探針卡反面1 0 0 4探針損壞,且以支撐裝置40維持 的水平共面’一微調裝置46以調整玻璃基座以 的水平共面,且使水平共面的誤差係標準值的〇. 4密爾。 第五圖/糸本發明玻璃基座32的垂直共面的示意圖,玻 由翻轉把手36連接以上翻至垂直共面,玻璃 ίίΠϊ可抽換式玻璃34,且以固定玻璃裝置“固定 9 , Α 1 34在玻璃基座32上,緩衝器38及支撐裝置40 Ϊ ίϊ : Ϊ至水平共面時緩衝翻轉速度,且固定玻 水二jtLS ;孩脚八面上,微調裝置4 6係調整玻璃基座32的 ί!調裝置46調整微調裝置46及支撲裝置4。之 Κ距離’使玻璃基座32水平共面的誤差為標準值的0 4 第六圖係電子顯微鏡22下遮罩薄膜48的可 34示意圖,且對照第七圖的探針卡i。探針二】:璃 鏡22觀看可抽換式玻璃34上的遮罩薄, 並鑷子調正探針1 0 0 6,俾使探針1 0 0 6的針位對準摭置壤 膜4 8上的定位點,可抽換式玻璃3 4係 圓、^ 不同的遮罩薄膜48,遮罩薄膜48上的定位點 晶圓規格而製作,在使用探針卡測試;以: 測試”的可抽換式玻璃34放置於玻璃基座32士使::| 並固疋該探針卡反面1〇〇4在該調針機平台18上再安裝該Page 7 1220171 V. Description of the invention (4) 32 = flip and adjust the glass base 32, the glass base "places the replaceable glass, and the fixed glass device 44 fixes the replaceable glass 34 on the glass base j32 In the above, the buffer 38 is a buffer glass base 32 which is flipped to the horizontal coplanar side of the quick stop probe card. The probe is damaged and the horizontal coplanar surface maintained by the support device 40 is a fine adjustment device 46 to adjust the glass base. It is horizontally coplanar, and the error of the horizontal coplanarity is 0.4 mils of the standard value. Fifth figure / 糸 Schematic diagram of the vertical coplanarity of the glass base 32 of the present invention. To the vertical coplanar surface, the glass is replaceable glass 34, and the fixed glass device "fixed 9, Α 1 34 on the glass base 32, the buffer 38 and the support device 40 Ϊ ϊ: ϊ buffer to the horizontal coplanar Turn over the speed, and fix the glassy water jtLS; on all sides, the fine-tuning device 46 is the adjusting device 46 that adjusts the glass base 32 to adjust the fine-tuning device 46 and the flutter device 4. The distance κ ′ makes the error of the horizontal coplanarity of the glass base 32 to be a standard value of 0. The sixth diagram is a schematic diagram of the masking film 48 under the electron microscope 22, and the probe card i of the seventh diagram is compared. Probe 2]: The glass 22 looks at the thin mask on the replaceable glass 34, and adjusts the probe 1 0 6 with tweezers, so that the needle position of the probe 1 0 6 is aligned with the soil film 4 The positioning points on 8 are interchangeable glass 3 4 series round, ^ different mask films 48, the positioning points on the mask film 48 are made by wafer specifications, and are tested using a probe card; The replaceable glass 34 is placed on the glass base 32 and the driver :: | and fixes the reverse side of the probe card 104 on the needle adjuster platform 18 and installs the

m 第8頁 1220171 五、發明說明(5) 調針治具在該調針機平台上,且調整探針 遮罩薄膜4 8的定位點。由於本發明可精準 正確位置,因此,沒有習知技術所造成的 針卡的使用壽命,減少購買探針卡的費用 以上對於本發明之較佳實施例所作的 目的,而無意限定本發明精確地為所揭露 上的教導或從本發明的實施例學習而作修 的,實施例係為解說本發明的原理以及讓 以各種實施例利用本發明在實際應用上而 發明的技術思想企圖由以下的申請專利範 定0 卡1 0針位以對準 的移動探針卡到 問題,也延長探 〇 敘述係為闡明之 的形式,基於以 改或變化是可能 熟習該項技術者 選擇及敘述$,本 圍及其均等來決m page 8 1220171 V. Description of the invention (5) The needle adjustment jig is on the platform of the needle adjustment machine, and the positioning points of the probe mask film 4 8 are adjusted. Since the present invention can be accurately and accurately positioned, there is no need for the service life of the pin card caused by the conventional technology, reducing the cost of purchasing a probe card. The above purpose for the preferred embodiment of the present invention is not intended to limit the present invention to be precise Developed for the disclosed teaching or to learn from the embodiments of the present invention. The embodiments are intended to explain the principles of the present invention and to allow the various embodiments to utilize the technical ideas of the present invention in practical applications. Apply for patent norm 0 card 10 pin position to align the moving probe card to the problem, and also extend the probe. The description is in the form of clarification. Based on the possibility of modification or change, it is possible for those skilled in the technology to choose and describe $. Ben and its parity

1220171 圖式簡單說明 ,於熟習本技藝之人士而言,從以下所作的詳細敘述 配合伴隨的圖式,本發明將能夠更清楚地被瞭解,其上述 及其他目的及優點將會變得更明顯,其中·· 第一圖係探針卡測試晶圓中丨c的示意圖; ^ =圖係習知探針卡調針治具的示意圖; 第二圖係本發明可掀式探針卡反面調針治具的示意 圖 圖; 第四圖係本發明玻璃基座 匕圖係本發明玻璃基座= : = :示”: 第/、圖係電子顯微鏡下 思圖^ 以及 辱膜的可抽換式玻璃示意第七圖係探針卡探針的*意'目。· 圖號對照表: 10 探針卡 1 0 0 2探針卡正面 1 0 0 4探針卡反面 1 〇 〇 6 探針 1 2 晶圓 14 晶粒 16 習知探針卡 18 調針機平台 20 固定裝置 22 電子顯微鏡 調針治具1220171 Schematic description. For those skilled in the art, the present invention will be more clearly understood from the detailed descriptions and accompanying drawings made below. The above and other objects and advantages will become more obvious. Among them, the first diagram is a schematic diagram of c in a probe card test wafer; ^ = the diagram is a schematic diagram of a conventional probe card needle adjustment jig; the second diagram is a reverse adjustment of the tiltable probe card of the present invention Schematic diagram of a needle fixture; The fourth diagram is the glass base of the present invention. The diagram is the glass base of the present invention. The glass indicates the seventh meaning of the probe card probe in the seventh figure. · Drawing number comparison table: 10 Probe card 1 0 0 2 Probe card front 1 0 0 4 Probe card reverse 1 1 〇06 Probe 1 2 Wafer 14 Die 16 Known Probe Card 18 Needle Adjuster Platform 20 Fixing Device 22 Electron Microscope Needle Adjuster

第10頁 1220171Page 10 1220171

圖式簡單說明 24 可掀式探針卡反面調針治具 26 固定裝置 28 底座 30 轉動軸承 32 玻璃基座 34 可抽換式玻璃 36 翻轉把手 38 緩衝器 40 支撐裝置 42 保護裝置 44 固定玻璃裝置 46 微調裝置 48 遮罩薄膜 第11頁Brief description of drawings 24 Tiltable probe card reverse needle adjustment fixture 26 Fixing device 28 Base 30 Rotating bearing 32 Glass base 34 Removable glass 36 Flip handle 38 Buffer 40 Support device 42 Protective device 44 Fixing glass device 46 Fine-tuning device 48 Masking film 第 11 页

Claims (1)

1220171 六、申請專利範圍 i、一種可掀式探針卡反面調針治具,俾在一且 薄膜的玎抽換式玻璃下使用一調針機平台調整該探^卡 位,該遮罩薄膜具有多個定位點,該調針治具包括: 罩 ,,·π町俄干台調整該掇 該遮罩薄膜具有多個定位點,該調針治且包括. 具:轉動裝置的底座,該底座固定於該調針機平台 具有翻轉裝置的玻璃基座,連接 調整該玻璃基座的水平共:接;= J = ;轉 點;以及 ^正这仏針卡針位對準該定位 緩衡=,緩衝該玻璃基座翻轉至 止該探針卡探針損壞。 了,、面速度Μ防 、如申請專利範圍第1項之調針 轉動軸承。 巧针,口具,其中該轉動裝 、如申請專利範圍第丨項之調 翻轉把手。 T/口具其中該翻轉裝 如申μ專利範圍第i項之調針治呈, 裝置以避免重物壓損該探針卡 =,、更包括一保護 5、 如申請專利範圍第移動該探針。 裝置以細部調整該玻璃基座的水具,更包括—微調 6、 、如申請專利範圍第i項之二二=二 以固定該探針卡於該調針機i么了八’更包括一固定 在一具有避種星可节掀式探針卡反面調針°治且°調針的太土 整讀探If罩缚膜的可抽換式破璃下伟、田一:方法,俾 十卡針位,該遮罩薄膜且 二調針機平台調 、/、有多個探針定位點,該^ 針位 2 置係 置係 3 41220171 6. Scope of patent application i. A type of tilting probe card with a reverse needle adjustment device, which is adjusted under a thin-film and removable glass using a needle adjustment machine platform to adjust the detection card position and the mask film With a plurality of positioning points, the needle adjustment jig includes: a cover ,, π-chogan adjustment, the mask film has a plurality of positioning points, the needle adjustment and includes. With: the base of the rotating device, the The base is fixed to the glass base of the needle adjustment machine platform with a turning device, and the level of the glass base is adjusted to connect: = J =; turning point; and ^ is aligned with the positioning balance of the needle card =, Buffer the glass base until the probe card probe is damaged. In addition, the surface speed M is prevented, such as the needle adjustment rotary bearing in the first scope of the patent application. Smart needles and mouthpieces, in which the rotating device is turned as shown in item 丨 of the patent application. T / mouthpiece, where the reversing device is as described in the application of item i of the patent scope, the device is adjusted to prevent heavy objects from damaging the probe card, and a protection is included. needle. The device adjusts the water fixture of the glass base in detail, including-fine-tuning 6, if the patent application scope item ii = 2 to fix the probe card to the needle adjusting machine i. Fixed on a soil-removing probe with an anti-seismic adjustable tip probe card on the reverse side of the earth and the angle of the needle on the earth. Read if the cover of the cover is removable. Needle position, the mask film and two needle adjustment platforms have multiple probe positioning points, the ^ needle position 2 position system 3 4 1220171 六、申請專利範圍 法包括下列步驟: 放置並固定該探針卡反面在該調針機平台上; 安裝該調針治具在該調針機平台上;以及 調整該探針卡針位以對準該定位點。 8、 如申請專利範圍第7項之方法,更包括安裝一保護 裝置以避免重物壓損該探針卡探針及移動該探針。 9、 如申請專利範圍第7項之方法,更包括調整一微調 裝置使該可抽換式玻璃的水平共面誤差不超過正負(K4密1220171 VI. The scope of patent application method includes the following steps: placing and fixing the reverse side of the probe card on the needle adjustment machine platform; installing the needle adjustment jig on the needle adjustment machine platform; and adjusting the needle position of the probe card to Align the anchor point. 8. If the method according to item 7 of the patent application scope further includes installing a protection device to prevent heavy objects from damaging the probe card probe and moving the probe. 9. If the method of item 7 of the scope of patent application, further includes adjusting a fine adjustment device so that the horizontal coplanar error of the replaceable glass does not exceed positive and negative (K4 dense 第13頁Page 13
TW92117625A 2003-06-27 2003-06-27 Lift type probe card reverse-side probe adjustment tool TWI220171B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW92117625A TWI220171B (en) 2003-06-27 2003-06-27 Lift type probe card reverse-side probe adjustment tool

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW92117625A TWI220171B (en) 2003-06-27 2003-06-27 Lift type probe card reverse-side probe adjustment tool

Publications (2)

Publication Number Publication Date
TWI220171B true TWI220171B (en) 2004-08-11
TW200500616A TW200500616A (en) 2005-01-01

Family

ID=34076293

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92117625A TWI220171B (en) 2003-06-27 2003-06-27 Lift type probe card reverse-side probe adjustment tool

Country Status (1)

Country Link
TW (1) TWI220171B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI387030B (en) * 2004-12-20 2013-02-21 松下電器產業股份有限公司 Probe card, manufacturing method thereof, and alignment method
CN109870597A (en) * 2019-03-13 2019-06-11 长春光华微电子设备工程中心有限公司 A kind of heavy load wafer card overturning levelling mechanism

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017052591A1 (en) * 2015-09-25 2017-03-30 Intel Corporation Resistance reduction under transistor spacers

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI387030B (en) * 2004-12-20 2013-02-21 松下電器產業股份有限公司 Probe card, manufacturing method thereof, and alignment method
CN109870597A (en) * 2019-03-13 2019-06-11 长春光华微电子设备工程中心有限公司 A kind of heavy load wafer card overturning levelling mechanism

Also Published As

Publication number Publication date
TW200500616A (en) 2005-01-01

Similar Documents

Publication Publication Date Title
JP3163221B2 (en) Probe device
TWI269346B (en) Unified apparatus and method to assure probe card-to-wafer parallelism in semiconductor automatic wafer test, probe card measurement systems, and probe card manufacturing
TWI431705B (en) Method for detecting the position of the needle end of the probe, the alignment method, the needle end position detecting device, and the probe device
US20210366792A1 (en) Backside deposition tuning of stress to control wafer bow in semiconductor processing
US5172053A (en) Prober apparatus
US20110025344A1 (en) Holding member for use in test and method for manufacturing same
US7068056B1 (en) System and method for the probing of a wafer
TWI220171B (en) Lift type probe card reverse-side probe adjustment tool
JP3100842B2 (en) Semiconductor exposure apparatus and exposure method
US7012680B2 (en) Method and apparatus for quantitative quality inspection of substrate such as wafer
CN101726637A (en) Wafer probe card alignment method and device thereof
JPH09138256A (en) Inspection board alignment method
US4179110A (en) Method for opposing a sheet-like material to a standard plane with predetermined space therebetween
KR101477683B1 (en) integrated circuit probe card analyzer
CN1316253C (en) Needle-adjusting jig and needle-adjusting method on reverse side of flip-up probe card
CN118943039A (en) Wafer warpage detection method, device, electronic device and storage medium
US4669868A (en) Step and repeat exposure apparatus and method
GB2111695A (en) Parallel alignment of surfaces
EP0276900A2 (en) Apparatus and method for aligning two surfaces
KR20240178773A (en) Probe Card Alignment Method and Probe Station
JP2005332839A (en) Testing device
JPH0627252A (en) Device for aligning object to be treated
KR20040005089A (en) Apparatus and method for leveling chuck of wafer
TWI640409B (en) Micro resistance inspection device and inspection method thereof
JPS60120519A (en) Photomask automatic defect inspection device

Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent