1299890 七、指定代表圖： (一） 本案指定代表圖為：第（三）圖。 (二） 本代表圖之元件符號簡單說明： 31 :架構； 32 :發光元件； 33 :感測器； 34 ·控制极組， 35 ·待測加工物，以及 36 :光束。 八、本案若有化學式時，請揭示最能顯示發明特徵的化學式:1299890 VII. Designated representative map: (1) The representative representative of the case is: (3). (b) A brief description of the symbol of the representative figure: 31: architecture; 32: illuminating element; 33: sensor; 34 • control group, 35 • workpiece to be tested, and 36: beam. 8. If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention:
九、發明說明： 【發明所屬之技術領域】 本發明係為提供一種檢測系統及方法，其應用光線反射 之特性，拍攝一二維影像，用以判定線塌瑕疵。 1299890 【先前技術】 目前，在晶圓封裝的製程中’接腳之金線可 ;其=:發岡生*線局部下墜的現象，-般稱為線塌瑕 U閱弟-圖及第二圖，第1係顯示正常金線之示意 圖，第二圖係顯不金線發生線塌瑕窥之示意圖，其中晶片 11係於邊緣連結金線12’兩圖對照可看出第二圖之金線12 Ϊ 一下墜率為27度之線段)，此即為線義。線 塌瑕疯可能導致金線、晶_導線”發生短路，同時也會 使得產品的f定性不足。然而，線塌瑕蘇 由於疋金線向下方塌陷’因此由上视角的影像中益法直接判 定是否有線塌贼存在，龍肖巾晶4同—邊緣上的金線 在影像中會發生重疊’造成無法對個别金線進行檢測。 習知方法使用三次元非接觸式I 連續數點的高度，以找出線塌瑕範，Μ _能測量金線上 在生產線上，且金線直徑科，三次ϋ;4度料足以應用 難。因此，目前大多由操作員以目视::機設定上相當困 疵，準確率十分不穩定。 、方式來檢測線塌瑕 為滿足上述所提出的提高晶圓封壯击 需求。本發明人基於多年從事研究與衣夕衣^程之檢測效率的 研究設計與專題探討，遂於本發明提出二貫務經驗，經多方 以作為前述期望一實現方式與依據。種檢測系統及方法 1299890 【發明内容】 有鑑於上述課題’本發明之目的為提供重 方法’其應用光線反射之特性，將發光系統及 制在特定方向及入射角範圍内，使^線後 ^ ^光線控 =視角一二維影像中，二定 構、一感測益、複數個發光元件及一押制^、至夕包3 —架 狀結構環繞待測加工物，感測哭用:」杈組。架構係以弧 係配置於架構上，控制模組用3^於制一影像，發光元件 元件之開啟或關閉，以產生光束^予^^—發光 至感測器，以產生影像。 、’、】加工物’並反射 、、承上所述，因依本發明之檢測系統及 、 透過電腦程式調整發光元件水平面入、去，以控制模組 角度，形成可控制環繞在晶片四 位及垂直面入射 光源，即可將金線之線塌瑕窥凸顯於^動辦著金線照明之 要大量的後續計算。 ^ ' 一、、隹影像中，而不再需 茲為使貴審查委員對本發明之 功效有更進一步之瞭解與認識，下文罐^術特徵及所達成之 相關圖式以為輔佐之用，並以詳細ϋ 供較佳之實施例及 後。 U —田之說明文字配合說明如 1299890 【實施方式】 系統残相關圖式’說明依本發明較佳實施例之檢測 明、。'，其中相同的元件將以相同的參照符號加以說 用以二ίΐί三圖’係顯示本發明之檢測系統之方塊圖，其 里之—待測加工物35，此檢測系統至少包 組34 ^、；^測器犯、複數個發光元件32及一控制模 〇〇 ιν ^ , 係以弧狀結構環繞待測加工物35，感測器 制模址了影像，發光元件32係配置於架構31上，控 關閉，以違二控制—角度及一方位之發光元件32之開啟或 55 3S w #光束36照射予待測加工物35，並反射至感測 -W，以產生影像。 腳所ίΐ，ΐ述待測加工物35之紋理可為一積體電路之接 之開孔ΐ 二印刷電路板（Printed Circuit Board，PCB) 測加工Μ或螺絲之螺紋所產生。此檢測系統可根據待 二理形狀，計算出開敌某-特定角度及某- 此若反射至感測器-。因 腳塌陷或是螺纟〇總 出I、他狀況，如積體電路之接 33，則i測器33有瑕含庇’使光束無法反射至感測器 狀正常：則：腳邱㈢旦產生尚^11之影像。例如若接腳形 .h 邛伤之影像為較亮之影像，若接腳形狀把 二2腳部份之影像為較暗之影像。藉此，以降低進-二 衫像處理所需之複雜度及提高影像判斷之準確度。步 上述控制模纟讀佳的是—微控制器，用以執行 之開啟或關閉’上述發光元件較佳‘是 體（Light Emitting Diodes，LED)，上述架構 7 1299890 較佳的是由一印刷電路板所建構。 請參閱第四圖，係顯—士 之方塊圖，其包含待训:不5 4檢測系統之較佳實施例 板《、-微控二數片45、_印刷電路 43’印刷電路板41係為 二 ^ 42及—攝像裝置 攝像裝置43用以拍摄巧你二，積體電路晶片45, 刷電路板41上，微抑制~哭^一極體42係配置於弧狀印 止？工制裔44用以控制一备谇这 _ -極體42之開啟或關閉，以產生光位之發 片45，並反射至攝像裝置^，以產生影像、。、予積體電路晶 請參閱第五圖，係_ 士 包括於晶片11東西南=、二叙月之檢測系統之側視圖，其 上建置有働㈣ 之金線提供照明，每11四個邊緣上 之晶片u金線置:二 當的工作距離’每一組】:=件32與金線適 :亮的範園，提供水平面東西:北 所有晶>i η金、料時供能涵蓋 影像被=，特徵即可在感測器33所攝得之I: 之側==== =系統之另-實施例 11時，能調整其弧狀架構之^ &卿狀較長之晶片 之晶片31檢測，解H ϋ長度，以因應各種不同長度 照明光源，使感測II 月bk供所有晶片11金線之 如此檢測金線瑕疵之存在。IX. INSTRUCTIONS: [Technical Field] The present invention provides a detection system and method that utilizes the characteristics of light reflection to capture a two-dimensional image for determining line collapse. 1299890 [Prior Art] At present, in the process of wafer packaging, the gold wire of the pin can be used; its =: the phenomenon of local falling of the 发冈生* line, commonly referred to as the line collapse 瑕U read the brother-picture and the second Fig. 1 shows the schematic diagram of the normal gold line, and the second figure shows the schematic diagram of the line collapse of the gold line. The wafer 11 is tied to the edge connecting gold line 12'. Line 12 一下 The line rate is 27 degrees. This is the line meaning. The collapse of the line may cause a short circuit in the gold wire and the crystal wire. At the same time, the product may not be characterized. However, the wire collapses due to the collapse of the sheet metal line. Determine whether the wired thief exists, and the dragon gold towel crystal 4 is the same as the gold line on the edge will overlap in the image. It is impossible to detect the individual gold wire. The conventional method uses the three-dimensional non-contact I continuous number of points. Height, to find the line collapse, Μ _ can measure the gold line on the production line, and the gold line diameter section, three times ϋ; 4 degrees of material is enough to apply difficult. Therefore, most of the current operator by visual:: machine settings It is quite embarrassing, and the accuracy rate is very unstable. The method to detect the line collapse is to meet the above-mentioned requirements for improving the wafer sealing and slamming. The inventor based on the research of the detection efficiency of Yi Xiyi Design and topical discussion, the present invention proposes two-way experience, which is used as the implementation and basis of the above-mentioned expectation. The detection system and method 1299890 [Invention content] In view of the above problem The purpose of Ming is to provide a heavy method of 'the application of light reflection characteristics, the illumination system and the system in a specific direction and angle of incidence, so that ^ ^ light control = viewing angle - a two-dimensional image, two stereotypes, a sense The measurement, the plurality of illuminating elements and the arranging ^, the eve package 3 - the frame structure surrounds the workpiece to be tested, and senses the crying: "杈 group. The architecture is arranged in an arc system, and the control module uses an image to create an image, and the light-emitting component is turned on or off to generate a beam of light to the sensor to generate an image. , ', 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工And the vertical surface incident light source, the line of the gold wire can be collapsed and highlighted, and a large number of subsequent calculations for the gold wire illumination are required. ^ '1, 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The preferred embodiments and the following are provided. U-Tian's description of the text, such as 1299890 [Embodiment] The system residual correlation diagram' illustrates the detection according to the preferred embodiment of the present invention. ', wherein the same elements will be referred to by the same reference numerals for the two drawings. The block diagram showing the detection system of the present invention, in which the workpiece 35 to be tested, the detection system is at least 34 ^ The detector, the plurality of light-emitting elements 32, and a control module 〇〇ιν ^ surround the workpiece 35 to be tested in an arc structure, the sensor molds the image, and the light-emitting element 32 is disposed in the structure 31. The control is turned off, and the light-emitting element 32 is turned on or the 55 3S w #beam 36 is irradiated to the workpiece 35 to be tested, and is reflected to the sensing-W to generate an image. According to the foot, the texture of the workpiece 35 to be tested can be an opening of an integrated circuit. The printed circuit board (PCB) is produced by measuring the thread of a saw or a screw. The detection system can calculate the enemy-specific angle and some - if reflected to the sensor - according to the shape to be determined. Because the foot collapses or the snail always shows I, his condition, such as the connection of the integrated circuit 33, then the i-detector 33 has a flaw to contain the beam so that the beam cannot be reflected to the sensor. Normal: then: foot Qiu (three) Produce an image of still #11. For example, if the pin shape of the pin is a brighter image, if the shape of the pin is used, the image of the two legs is a darker image. Thereby, the complexity required for the processing of the in-and-two shirts is reduced and the accuracy of the image judgment is improved. Preferably, the above-mentioned control module is a microcontroller for performing the opening or closing of the above-mentioned light-emitting elements (Light Emitting Diodes, LEDs), and the above structure 7 1299890 is preferably a printed circuit. The board is constructed. Please refer to the fourth figure, which is a block diagram of the display, which includes training: no preferred embodiment of the detection system, "micro-control two-piece 45, _ printed circuit 43" printed circuit board 41 For the camera 24, the camera device 43 is used to capture the camera circuit 45, and the circuit board 41 is mounted on the circuit board 41. The micro-suppression-cry|one-pole body 42 is arranged in an arc-shaped printing. The worker 44 is used to control the opening or closing of the _-pole 42 to generate the light-emitting sheet 45 and reflect it to the camera unit to generate an image. Please refer to the fifth figure for the integrated circuit crystal. The system is included in the side view of the wafer 11 east-west = two-month detection system. The gold wire on the 働 (4) is provided to provide illumination, for every 11 edges. On the wafer u gold line: the working distance of the two 'each group】: = 32 and gold line suitable: bright Fan Park, providing water level things: North all crystals > i η gold, material when the energy coverage The image is =, the feature can be adjusted on the side of I: where the sensor 33 is taken =====the other part of the system - the eleventh embodiment can adjust the curved structure of the ^ & The wafer 31 detects and resolves the length of the H ϋ to illuminate the light source in response to various lengths, so that the sensing of the II bk is provided for the gold wire of all the wafers 11 to detect the presence of the gold wire.
請參閱第七圖，係顯+ 士& Q 颂不本發明之檢測系統之示意圖，其 1299890 顯示本系統之微控制器可透過電腦程式役刺饪— 二1位之發光元件32之開啟或關閉，且此^冓3! m 11邊緣的四個角度，可提供晶月U無死角的昭=曰曰片 提供感測器檢測金線瑕疵。 、九束，以 請參閱第八圖，係顯示本發明之檢法牛 步驟S81:建置-架構，以弧狀結構環繞—_加工物； 步驟S82 ··配置複數個發光元件於此架構，·以及 步驟S83 ··透過一控制模組，控制一 元件之開啟或_，以產生—光束照射 X ^方位之發光 -感測器，以產生-影像。 于相加工物，並反射至 其中，上述待測加工物之紋理一拉 產生、—印刷電路板之祕所產電路之接腳所 上述控制模組較佳的是—微控制器-彳」、、’、=紋所產生。 體，上述轉較佳岐由—印職路^^^的是—發光二極 發明之精神與範ί::其者。任何未脫離本 含於後附之申請專利範财。4轉改或變更’均應包 【圖式簡單說明】 第一圖係顯示正常金線之示意圖； 第二圖係顯示金線發生線塌瑕範之示音圖 1299890 第三圖係顯示本發明之檢測系統之方塊圖； 第四圖係顯示本發明之檢測系統之較佳實施例之示意圖； 第五圖係顯示本發明之檢測系統之側視圖； 第六圖係顯示本發明之檢測系統之另一實施例之側視圖； 第七圖係顯示本發明之檢測系統之示意圖；以及 第八圖係顯示本發明之檢測方法之步驟流程圖。Please refer to the seventh figure, which shows the schematic diagram of the detection system of the present invention. The 1299890 shows that the microcontroller of the system can be operated by computer programming - the opening of the two-position light-emitting component 32 or Closed, and the four angles of the edge of this ^3! m 11 can provide the sensor to detect the gold wire 瑕疵. , the nine bundles, please refer to the eighth figure, showing the test method of the invention step S81: building-architecture, surrounded by an arc structure - processing; step S82 · · configuring a plurality of light-emitting elements in this structure, And step S83 · controlling the opening or _ of a component through a control module to generate a light-irradiation sensor that emits a beam of light to generate an image. In the phase processed object, and reflected therein, the texture of the workpiece to be tested is pulled, and the control module of the circuit of the printed circuit board is preferably a microcontroller-彳, , ', = pattern produced. Body, the above-mentioned turn is better by - Yin Road ^ ^ ^ is - the light of the two poles of the invention and Fan ί:: its. Any patent application that is not included in this attachment is attached. 4Transformation or change 'all should be packaged 【Simple description of the figure】 The first picture shows the schematic diagram of the normal gold line; The second picture shows the sound line diagram of the gold line occurrence line collapse diagram 1299890 The third picture shows the invention A block diagram of a detection system; a fourth diagram showing a preferred embodiment of the detection system of the present invention; a fifth diagram showing a side view of the detection system of the present invention; and a sixth diagram showing another detection system of the present invention. A side view of an embodiment; a seventh diagram showing a schematic diagram of the detection system of the present invention; and an eighth diagram showing a flow chart of the steps of the detection method of the present invention.
【主要元件符號說明】 11 ·晶片， 12 :金線； 31 :架構； 32 :發光元件； 33 :感測器； 34 :控制模組； 35 :待測加工物； 36 :光束； 41 :印刷電路板； 42 :發光二極體； 43 :攝像裝置； 44 :微控制器； 45 ·積體電路晶片；以及 S81〜S83 :步驟流程。[Main component symbol description] 11 · Wafer, 12: Gold wire; 31: Architecture; 32: Light-emitting element; 33: Sensor; 34: Control module; 35: Workpiece to be tested; 36: Light beam; 41: Printing Circuit board; 42: light-emitting diode; 43: camera device; 44: microcontroller; 45; integrated circuit chip; and S81~S83: step flow.