201042236 ^、發明說明： 【發明所屬之技術領域】 本發明涉及-種三維形貌檢測方法。更為具體地，利 ，弦波干涉條紋的相位差，檢測配置在基板上的焊錫球 的兩度。 【先前技術】 通常，利用莫爾干涉條紋的三維形貌檢測裝置通過重 疊在所要檢測的被檢測體的表面照射—定形狀的光線而頻 2的格子敎和作為鲜的格子敝來形絲_干涉條紋 後’檢，及分析所述干涉條紋，以檢騎於基準面的檢測 對象的高度。這種三維形貌檢測裝置能夠簡單快速地獲得 被檢測體的三維形貌，因此在醫學、工 的應用。 ^ 利用莫爾干涉條紋檢測三維形貌的方式大致可分為投 影ίΐΓ式。影子式測定是指，不使用透鏡，而採用顯 ft測體表面上的格子的影子所生成的莫爾干涉條紋 松測被檢測體表面形貌的方法。投影式測定是指，利用通 過透鏡投f彡職制體上的格子_所 紋檢測被檢種表面形貌的方法。 ㈣卞V條 t了檢測突設在基板上的檢測對象的高度，而採用莫 使用的是由相位差計算檢測對象高度 百ί 相同厚度的基準板上面形成正弦 波圖、、文H取投影了正錢圖紋的 之後，在絲於基板上的檢嶋h二板上的相位值 獲取投影了《波象正弦波圖7並 β上， 7豕上的相位值。之後，利 用兩個相位值的相位差算出對於基準㈣檢測對象的高 4/16 201042236 度。 測對象的基板之外:另一 1準板際= 弦波圖紋，操作較為復雜=在= =差=二包含由基準被厚度和基板厚度之 【發明内容】201042236 ^, invention description: [Technical field to which the invention pertains] The present invention relates to a three-dimensional topography detection method. More specifically, the phase difference of the sine wave interference fringes detects two degrees of the solder balls disposed on the substrate. [Prior Art] In general, a three-dimensional shape detecting device using a moire fringe is irradiated with a fixed-shaped light beam on a surface of a subject to be detected, and a lattice of frequency 2 and a lattice of a fresh grid are used. After the interference fringes, the interference fringes are analyzed and analyzed to check the height of the object to be detected on the reference plane. The three-dimensional shape detecting device can obtain the three-dimensional shape of the object to be detected simply and quickly, and thus is used in medical and industrial applications. ^ The method of detecting the three-dimensional shape by using the Moir interference fringe can be roughly divided into a projection type. The shadow type measurement refers to a method of loosely measuring the surface topography of a sample by using a moire interference fringe generated by a shadow of a lattice on the surface of the body without using a lens. The projection type measurement is a method of detecting the surface topography of a sample by using a lattice on the lens. (4) 卞V strips t detect the height of the detected object protruding on the substrate, and the use of the phase difference calculation to detect the height of the object is the same as the thickness of the reference plate to form a sine wave map, the text H is projected After the positive money pattern, the phase value on the second board of the inspection on the substrate is obtained by projecting the phase value of the wave sine wave diagram 7 and β, 7豕. Then, the phase difference between the two phase values is used to calculate the height of the reference (4) detection object by 4/16 201042236 degrees. Outside the substrate of the measuring object: the other 1 quasi-plate = chord pattern, the operation is more complicated = in = = difference = two includes the thickness of the reference and the thickness of the substrate [Summary of the Invention]
G Ο 述㈣，本發明提供1三維雜檢測方 正弦、不在和基板具有相同厚度的另一基準板上形成 成bI、’而在基板和配置在基板上的焊錫球上同時形 t立=,圖紋’並同時獲取投影了正弦波圖纹的基板上的 了正弦波圖紋的焊锡球上的相位值後，將其 用於4錫球尚度的檢測上。 測且述目的，本發明的三維形貌檢測方法用於檢 二;/二配置在所述基板上的焊錫球的被檢測體。其 括：中心部破定階段’獲得所述焊锡球的圖像 :則體：：：返焊錫球中心部；圖像獲得階段，在所述被檢 知所、十 =弦波圖紋後，獲得同時包括所述基板的上面 錫球的整合圖像；相位值確定階段，在所述整合 ，像中敎通過所述焊鍚球中心部的虛擬直線—基準線， 斤述基準線上的焊錫球的中心部上，獲取投影了正 波^文部分的相位值，並將其作為焊锡球中心部的相位 邱八^立於所速基準線上的基板上獲取投影了正弦波圖紋 in·刀+目位值’並將其定為基板的相位值；及高度計算階 、，所+述^锡球中心部的相位值和所述基板的相位值之 、差汁异仗所述基板上面到所述焊錫球中心部的高度。 201042236 而且’本發明的二維形貌檢測方法中所述中心部確定 最好如下.在所述焊錫球的上側圍設有環形照明單 兀，並由舰明裝置照射光線的條件下獲得職焊錫球的 圖像。 而且’本發明的二維形貌檢測方法巾所述圖像獲得階 段最好如下.對配置在所述基板和所述焊錫球的上側並具 有複數個格子®f的格子單元上投射光線，從而在所述被 檢測體上形成正弦波圖紋，並以N等分所述格子單元週期 的間隔，將所述格子單元反覆相位移動的同時獲得N個整 合圖像。其中所述;N是大於或等於三的整數。 而且，本發明的三維形貌檢測方法中所述相位值確定 階段最好如下：在位於所述基準線上的基板上獲取投影了 正弦波圖紋的複數個位置的相位值，並求出其平均值後將 其結果作為所述基板的平均相位值。所述高度計算階段最 好如下：由所述焊錫球中心部的相位值和所述基板的平均 相位值之間的差，計算從所述基板上面到所述焊錫球中心 部的尚度。 而且’本發明的三維形貌檢測方法中所述相位值確定 階段最好如下：在位於所述基準線上的焊錫球的中心部上 獲取投影了正弦波圖紋的複數個位置的相位值後，將其分 別作為焊錫球中心部相位值，在位於所述基準線上的基板 上獲取投影了正弦波圖紋的複數個位置的相位值並求平均 值後’將其作為所述基板的平均相位值。所述高度計算階 段最好如下：求出每個焊錫球中心部的相位值和所述基板 的平均相位值的差，並由該些相位值差的平均值計算從所 述基板上面到所述焊錫球中心部的高度。 6/16 201042236 本發明所涉及的三維形貌檢測方法，在美 基板上的焊錫球上同時形成正弦波，並取投影 了正弦波圖_基板上的她值和投影了轉波^紋的焊 錫球上的相位值後，將其用於焊錫球高度的檢測上。這樣 無需檢測另-基準面’而利赌測對象焊锡球的周圍基準 面，就能簡單、正確、可靠地算出焊錫球高度資料。土 Ο Ο 而且’本發明的三維形貌檢測方法首先確定焊锡球的 中心部之後，只獲取焊錫球中心部的相位值，並將其應用 於焊錫球高度檢測上，以此減少處理焊錫球周邊上的相位 值等不必要的資料所需要的時間及記憶體等。 而且，本發明的三維形貌檢測方法，在提高相位值的 精確度時，不是彻單-位置的相位值，而是獲取複數個 位置的相位值後求其平均值，以此提高焊錫球高度的精確 度。 而且，本發明的三維形貌檢測方法，在圍設在焊錫球 周邊的環形照明裝置照射光線的狀態下獲得焊錫球的圖 像，因此能夠精確地確定焊錫球的中心部。 【實施方式】 下面，參照附圖詳細說明本發明三維形貌檢測方法的 一實施例。 圖1是在本發明三維形貌檢測方法中使用的三維形貌 檢測裝置的概略圖。 如圖1所示，三維形貌檢測裝置（100)包括控制單元 (10)、工作站（2〇)、投影單元（3〇)及成像單元（40)。 所述控制單元（10 )全面控制三維形貌檢測裝置 (i00)，利用成像單元（40)所拍攝的反射圖像檢測被檢 7/16 201042236 二維9形貌。此時，被檢測體⑴包括基板⑵ 上的焊錫球（1)。為了檢測突出地配置 在基板⑺上的焊錫球⑴的貌 送到檢測位置上。 土极u)牙夕 所速工作站（20)用於將被檢測體（3)移送至檢測位 =其錢支撐板⑻和馬達⑼。續板 支樓被^繼（3)，而所駐作站（2Q)利 移送支撐板⑵），使其位於檢·置上。 所述Ϊ影單元（3°)包括光源（31)、格子單元（32)、 格子移运早το (35)、透鏡（33)和滤光器（34)。南光源 (31)產生的白光通過格子單元⑼、透鏡（33)和滤光 益' (34)投影到基板⑺和珲錫球⑴上形成正弦波圖 紋0 所述私子單元（32)由複數個格子圖案按一定距離平 行=置而成。投射到格子單元（32)上的光，在基板⑺ 和焊錫球⑴上形成正弦波圖紋。所述格子移送單元⑶） 在控制單το (10)的控制下，使格子單元（32)進行直線 往復運動，而格子單元⑶）在格子移送單元（35)的作 用下進行錄往復縣㈣時在絲⑺和焊錫球⑴ 上形成的正錢®紋上產生相位移(phase shift)。 、所述成像單70 (40)用於拍攝形成在基板（20)和焊 錫球（1)上的正弦波圖紋的的圖像，其由成像透鏡（4丨）、 照相機（42)和環形照明裝置（43)構成。若採用的是在 球栅，列(BGA)上應用的焊錫球⑴，由於其形狀接近於球 形，最好在整個焊錫球（〇的周圍照射光線獲得圖像。只 有在整個焊錫球⑴的周圍照射光線的情況下，才能使被 8/16 201042236 焊錫球（1)反射的光線的強度均勻地分佈在圓形戴面上， 而通過均勻分佈的光線強度可以精確地確定焊錫 中心部。 w的 下面’參照圖1至圖3詳細說明應用上述三維 測裝置（100)的本發明三維形貌檢測方法的一實施例。欢 ^2疋本發明的二維形貌檢測方法—實施例的順序圖， 圖3疋用於表示正弦波圖紋在被檢測體（焊鍚球和美 上的投影狀態圖。 土 —如圖1至圖3所示，本發明的三維形貌檢測方法同時 獲取投影了正弦波圖紋的基板上的相位值和投影了正弦波 圖紋的焊錫球上的相位值，以檢測焊錫球的高度。該方法 包括中心部確定階段(S11G)、圖像獲得階段(Sl2())、相位值 確定階段(S130)和高度計算階段(sl4〇)。 在所述中心部確定階段(sll〇)中，通過獲得焊锡球⑴ 的圖像來確輯錫球⑴的中心.下面以適麟球桃陣G Ο (4), the present invention provides a three-dimensional heterogeneous detection square sine, not formed on another reference plate having the same thickness as the substrate, and is formed on the substrate and the solder ball disposed on the substrate simultaneously. The pattern is obtained by simultaneously obtaining the phase value on the solder ball of the sine wave pattern on the substrate on which the sine wave pattern is projected, and then applying it to the detection of the 4 tin ball. For the purpose of measurement and description, the three-dimensional topography detecting method of the present invention is used for detecting the object of the solder ball disposed on the substrate. The method includes: obtaining an image of the solder ball in the breaking stage of the center portion: a body::: a center portion of the solder ball; and an image obtaining stage, after the detected position, the ten=sine wave pattern, Obtaining an integrated image of the upper solder ball including the substrate; a phase value determining stage, in the integration, the virtual line passing through the center of the solder ball, the reference line, and the solder ball on the reference line At the center of the center, the phase value of the portion of the positive wave is extracted, and the phase of the center of the solder ball is obtained on the substrate on the speed reference line. The sine wave pattern in the knife is obtained. The target value 'is set as the phase value of the substrate; and the height calculation step, the phase value of the center portion of the tin ball and the phase value of the substrate are different from each other on the substrate The height of the center of the solder ball. 201042236 Moreover, the center portion of the two-dimensional topography detecting method of the present invention is preferably determined as follows: a ring-shaped illumination unit is arranged on the upper side of the solder ball, and the solder is obtained under the condition that the light is irradiated by the ship device. The image of the ball. Further, the image obtaining stage of the two-dimensional topography detecting method of the present invention is preferably as follows: a light is projected on a lattice unit disposed on the upper side of the substrate and the solder ball and having a plurality of lattices®f, thereby A sinusoidal pattern is formed on the object to be detected, and N integrated images are obtained while the lattice cells are repeatedly phase-shifted by N equally dividing the intervals of the lattice unit periods. Wherein; N is an integer greater than or equal to three. Moreover, in the three-dimensional topography detecting method of the present invention, the phase value determining stage is preferably as follows: a phase value of a plurality of positions at which a sine wave pattern is projected is acquired on a substrate located on the reference line, and an average value thereof is obtained. After the value, the result is taken as the average phase value of the substrate. The height calculation phase is preferably as follows: the degree of the difference from the upper surface of the substrate to the center of the solder ball is calculated from the difference between the phase value of the center portion of the solder ball and the average phase value of the substrate. Further, the phase value determining phase in the three-dimensional topography detecting method of the present invention is preferably as follows: after acquiring the phase values of the plurality of positions at which the sine wave pattern is projected on the center portion of the solder ball located on the reference line, Taking the phase value of the center portion of the solder ball as a center value, the phase values of a plurality of positions on which the sine wave pattern is projected are obtained on the substrate on the reference line and averaged, and then used as the average phase value of the substrate. . Preferably, the height calculation phase is as follows: determining a difference between a phase value of a center portion of each solder ball and an average phase value of the substrate, and calculating an average value of the phase value differences from the substrate to the The height of the center of the solder ball. 6/16 201042236 The three-dimensional shape detecting method according to the present invention simultaneously forms a sine wave on a solder ball on a US substrate, and takes a projection of a sinusoidal image on the substrate and a projection of the solder on the substrate. After the phase value on the ball, it is used for the detection of the height of the solder ball. In this way, it is possible to calculate the solder ball height data simply, correctly, and reliably without having to detect the other reference plane and profitably measure the surrounding reference surface of the solder ball. Ο Ο and 'The three-dimensional shape detection method of the present invention first determines the center of the solder ball, and only obtains the phase value of the center portion of the solder ball, and applies it to the solder ball height detection, thereby reducing the processing of the solder ball periphery. The time and memory required for unnecessary data such as the phase value. Moreover, the three-dimensional topography detecting method of the present invention, when improving the accuracy of the phase value, is not a single-position phase value, but obtains a phase value of a plurality of positions and then obtains an average value thereof, thereby increasing the solder ball height. The accuracy. Further, in the three-dimensional topography detecting method of the present invention, the image of the solder ball is obtained in a state where the ring illuminating device surrounding the solder ball is irradiated with light, so that the center portion of the solder ball can be accurately determined. [Embodiment] Hereinafter, an embodiment of a three-dimensional topography detecting method of the present invention will be described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a three-dimensional topography detecting apparatus used in the three-dimensional topography detecting method of the present invention. As shown in Fig. 1, the three-dimensional topography detecting device (100) includes a control unit (10), a workstation (2), a projection unit (3), and an imaging unit (40). The control unit (10) comprehensively controls the three-dimensional topography detecting device (i00), and detects the two-dimensional nine-dimensional appearance of the detected 7/16 201042236 by using the reflected image captured by the imaging unit (40). At this time, the object to be detected (1) includes the solder ball (1) on the substrate (2). In order to detect the appearance of the solder ball (1) which is prominently disposed on the substrate (7), it is sent to the detection position. Earth u u) 牙 夕 The speed workstation (20) is used to transfer the object (3) to the detection position = its money support plate (8) and motor (9). The slab is spliced (3), and the station (2Q) is moved to the support plate (2) to be placed on the inspection. The photographic unit (3°) includes a light source (31), a lattice unit (32), a lattice transport early το (35), a lens (33), and a filter (34). The white light generated by the south light source (31) is projected onto the substrate (7) and the tin ball (1) through the grid unit (9), the lens (33), and the filter beam (33) to form a sine wave pattern 0. The private subunit (32) is composed of A plurality of lattice patterns are formed by paralleling a certain distance. The light projected onto the lattice unit (32) forms a sinusoidal pattern on the substrate (7) and the solder ball (1). The lattice transfer unit (3) performs linear reciprocation of the lattice unit (32) under the control of the control unit το (10), and the grid unit (3) is recorded by the lattice transfer unit (35) when recording the reciprocating county (four) A phase shift occurs on the positive money® pattern formed on the wire (7) and the solder ball (1). The imaging sheet 70 (40) is used to capture an image of a sine wave pattern formed on the substrate (20) and the solder ball (1), which is composed of an imaging lens (4 丨), a camera (42), and a ring shape. The lighting device (43) is constructed. If the solder ball (1) applied on the ball grid or column (BGA) is used, since the shape is close to a spherical shape, it is preferable to obtain an image of the entire solder ball (the surrounding light is irradiated with light. Only around the entire solder ball (1)) In the case of illuminating light, the intensity of the light reflected by the 8/16 201042236 solder ball (1) can be evenly distributed on the circular surface, and the center of the solder can be accurately determined by the uniform distribution of the light intensity. Hereinafter, an embodiment of the three-dimensional topography detecting method of the present invention to which the above-described three-dimensional measuring device (100) is applied will be described in detail with reference to FIGS. 1 to 3. A two-dimensional topographical detecting method of the present invention - a sequence diagram of an embodiment Figure 3疋 is used to represent the sine wave pattern on the object to be inspected (the projection state of the welding ball and the beauty. Earth – as shown in Figures 1 to 3, the three-dimensional topography detection method of the present invention simultaneously acquires the projected sine The phase value on the patterned substrate and the phase value on the solder ball on which the sine wave pattern is projected to detect the height of the solder ball. The method includes a center determining stage (S11G) and an image obtaining stage (S12 () ), phase a value determining stage (S130) and a height calculating stage (sl4〇). In the center determining stage (sll〇), the center of the solder ball (1) is confirmed by obtaining an image of the solder ball (1). Peach array
歹】(BGA)中的焊錫球為例說明本實施例。為了獲得從基板 ⑵的上面到ge«置在基板⑵上的焊錫球⑴的高度， 首先要尋找焊錫球⑴的表面上的諸多位置中最高的位 置，即焊錫球（1)的中心部。為了尋找焊鍚球⑴的中 〜部’在焊錫球（1)的上側圍設有環形照明褒置⑷）， 並在該照师置（43)照射光線的狀態下獲得焊錫球⑴ 的圖像。本實施例通過辉錫球⑴的周圍全域照射的光線， 可以精確地獲得焊錫球⑴關形截面形狀。細所獲得 的焊錫球（1)關像和周邊圖像之間的亮度差，確定焊錫 球（1)的中心部。 在所述圖像獲得階段(S120)中，於被檢測體⑴即基 9/16 201042236 板（2)和知錫球（1)上同時形成正弦波圖紋，並獲得投 影了正弦波圖紋的基板（2)和焊錫球（1)整合圖像❶整 合圖像中-同顯示投影了正弦波圖紋的基板⑺和焊錫球 (1)的圖像。在本實施例中，為了獲取將在後面敘述的正 弦波圖紋的相位值，可應用以下公式1，因此至少可以獲得 三張整合圖像。 [公式1]This example is illustrated by taking a solder ball in (BGA) as an example. In order to obtain the height of the solder ball (1) placed on the substrate (2) from the upper surface of the substrate (2), it is first necessary to find the highest position among the positions on the surface of the solder ball (1), that is, the center portion of the solder ball (1). In order to find the middle portion of the solder ball (1), an annular illumination device (4) is placed on the upper side of the solder ball (1), and an image of the solder ball (1) is obtained in the state where the light is placed (43). . In the present embodiment, the contact shape of the solder ball (1) can be accurately obtained by the light irradiated around the entire area of the solder ball (1). Determine the difference in brightness between the solder ball (1) image and the surrounding image, and determine the center of the solder ball (1). In the image obtaining stage (S120), a sine wave pattern is simultaneously formed on the object (1), that is, the base 9/16 201042236 board (2) and the knowing solder ball (1), and a sine wave pattern is projected. The substrate (2) and the solder ball (1) are integrated into the image and integrated into the image - the same image showing the substrate (7) and the solder ball (1) on which the sine wave pattern is projected. In the present embodiment, in order to obtain the phase value of the sine wave pattern which will be described later, the following formula 1 can be applied, so that at least three integrated images can be obtained. [Formula 1]
In Ur^ = aH- h cos [(>(.r, ) + n-] 其中In是光強，a、b是未知數，φ是投影了正弦波圖 紋的位置上的像素相位值，α是袼子單元（32)的相位移 動值。 首先，將設有複數個格子圖案的格子單元（32)配置 在基板（2)和焊錫球（1)的上側後，向格子單元（32) 投射光線以在基板⑺和焊絲⑴±形成正弦波圖纹， 並獲得基板（2)和焊錫球（丨）的第—整合圖像。之後把 格子單元（32)的週期(2π)三等分後，將格子單元（32) 移動相當於-個間隔的2;τ/3的相位，然後在基板⑺和 焊錫球（1)上形成正弦波圖紋，並獲得基板（2)和焊錫 球（1)的第二整合圖像。接著，再一次把格子單元（二） 移動2ΤΓ/3相位之後，在基板（2)和焊錫球（丨）上形成正 弦波圖紋，並獲得基板⑺和焊錫球⑴的第三整 像。 、另外，也可以把格子單元（32)的週期(2TZ·) n (等於 或大於4的整數）等分後，將格子單元⑶）依次移動相 當於週期/N的相位，從而獲得N個整合圖像。 10/16 201042236 在所述相位值確定階段(S130)中，首先如圖3所示，在 整合圖像帽定通過焊錫球⑴巾叫的虛擬直線—基 線（"°。在位於基準線（4)上的焊錫球（1)的中心部獲 取投影了正弦波圖紋部分的像素的相位值，在位於基準線 ⑷上的基板⑵的上面，獲取投影了正弦波圖紋部 的像素的相位值。 Ο Ο 之後’在焊錫球中心部確定階段(sn〇)中確定的焊锡球 ⑴的中心部上，獲取投影了正弦波圖紋部分的像素的相 位值。在整合圖像巾位於基準線⑷上的焊錫球⑴ 中心部上’獲取投影了正弦波圖紋部分的像素的相位值 後’將其作為焊錫球⑴中心部的相位值。然後，將 相位移動所獲得的三個整合圖像中每個圖元的光 格子單元（32)的相位移動值⑷—Q、27r/3、4；r/3 : 代入[公式1]中，就能求出在焊錫球（1)的中心部上 了正弦波®紋部分的像素的相位值（^ )。 又如 本實施例中為了提高相位值的精讀性，取複數個位 上的相位值而不取單_位置上的相位值。為此，在 的中心部中位於基準線⑷上的複數個位置⑽獲取 投影了正弦波圖紋的複數個像素_位值作為焊錫又 的中心部的複數個相位值。 之後’從整合圖像獲取基板⑵+投影了正 科的像素_麵。從整合圖像獲取位於基準線Θ、、、 了正弦波圖紋部分的像素的相位值，並 、二為土板的相位值。相同地，若將通過相位ρ叙 ，得的三個整合圖像中每個像素的光強 ‘― ⑽的相位移純⑷―。七/3七/3、)二= 11/16 201042236 式1]中’就能求出一基板⑵上投影了正弦波圖紋的像素相 位值。為了提高相位值的精確性，獲取複數個位置上 相位值後«平均後。輕，在絲⑴的複數個位 置（p2)场取投影了正弦波圖紋的像素相位值後，求出 平均值並將其結果作為基板的平均相位值。 ^如圖3所不，若在被檢測體（3)上設置χγ垂直座標 系’則位於基準線⑷上的基板⑴巾複數個位置（p2) 上的像素的X座標相同，而γ座標隨著位置的變化而變動。 在所述高度計算階段(S140)中，由焊錫球〇)的中心 部和基板⑵的相位值差，計算紐⑵的上面到焊錫 球（1)的中心部的高度。 下面，用公式2表示相位差和被檢測體高度之間的關 係。 [公式2] h (x,y)~ 其中h(x，y)是從基板（2)的上面到焊錫球（〗）的中心 部的高度’P是格子單元（32)的週期，Θ是光線的投射角， ”是焊鍚球（1)中心部的相位值，是基板⑺的相 位值。 在公式2中分別代入焊錫球（丨）中心部的相位值和基 板（2)的相位值，就能求出從基板（2)的上面到焊錫^ (1)中心部的高度(h)。 ' 一從基板（2)的上面到焊錫球（1)中心部的高度的計 异過程如下：首先，將所備置的複數個焊錫球（1)中心部 的相位值代入公式2中焊錫球〇)中心部的相位值（p〇)， 12/16 201042236 •將基板⑵的平均相位值代入公式2中基板（2)的相位 i (㈣。之後算出由公式2獲得的複數個高度⑻資料的 " 平均後將其結果作為從基板⑺的上面到賴球⑴中 心部的高度。 具有如上結構的本發明三維形貌檢測方法的一實施 例:在基板和配置在基板上的焊錫球上同時形成正弦波圖 $後’同時獲取投影了正弦波圖纹的基板上的相位值和投 衫了正弦波圖紋的焊錫球上的相位值，並將其用於焊锡球 〇 冑度的檢測上。這樣’本發明不檢測另-基準面，而採 檢測對象焊錫球的周邊基準面，從而能夠簡單、精確、可 靠地計算焊錫球的高度資料。 而且，首先確定焊錫球的中心部之後，僅僅獲取焊錫 球中心部的相位值，並將其用於焊錫球高度的檢測上，由 此能夠即錢理焊錫球周邊部的相純等 要的時間和記憶體等。 斗所而 而且，為了提高相位值的精確性，不採用單一位置上 〇 _位值’而是提取複數條置上的相位值後將其平均後 使用，由此可以提高焊錫球高度的精確性。 而且由圍设在谭錫球周圍上的環形照明裝置照 射光線的狀態下獲得焊錫球的圖像，可以精確地確雜、 球的中心部。 踢 本發明並不僅限於上述實施例及變形例，而是在所 的申請專利範圍中所記載的範圍内，可實現為多種形 實施例。在不脫離本發明精神的範圍内，本領域技蚊 所能做到的變形範圍’毋庸置疑也應屬於本發明的保護範 圍0 13/16 201042236 【圖式簡單說明】 圖1是本發明的三維形貌檢測方法所應用的三維形貌 檢測裝置的概略圖。 圖2是本發明三維形貌檢測方法的一實施例的順序圖。 圖3是用於表示正弦波圖紋在被檢測體（焊錫球和基 板）上的投影狀態圖。 【主要元件符號說明】 1 焊錫球 2 基板 31 被檢測體 32 格子單元 35 格子移送單元 43 環形照明裝置 100三維形貌檢測裝置 14/16In Ur^ = aH- h cos [(>(.r, ) + n-] where In is the light intensity, a, b are unknowns, φ is the pixel phase value at the position where the sine wave pattern is projected, α It is a phase shift value of the die unit (32). First, a lattice unit (32) provided with a plurality of lattice patterns is disposed on the upper side of the substrate (2) and the solder ball (1), and is projected onto the lattice unit (32). The light forms a sinusoidal pattern on the substrate (7) and the wire (1), and obtains a first integrated image of the substrate (2) and the solder ball (丨). After that, the period (2π) of the lattice unit (32) is equally divided into three parts. , the lattice unit (32) is moved by a phase corresponding to 2 intervals of τ/3, and then a sine wave pattern is formed on the substrate (7) and the solder ball (1), and the substrate (2) and the solder ball are obtained (1). The second integrated image. Then, after moving the lattice unit (2) again by 2ΤΓ/3 phase, a sine wave pattern is formed on the substrate (2) and the solder ball (丨), and the substrate (7) and the solder ball are obtained. (1) The third whole image. In addition, the period (2TZ·) n (an integer equal to or greater than 4) of the lattice unit (32) may be equally divided. ⑶ unit) sequentially moved to a period when the phase of the phase / N, thus obtaining the N integrated image. 10/16 201042236 In the phase value determining phase (S130), first, as shown in FIG. 3, in the integrated image cap, the virtual line called the solder ball (1) is called the baseline ("°. at the baseline ( 4) The center portion of the upper solder ball (1) acquires the phase value of the pixel on which the sine wave pattern portion is projected, and acquires the phase of the pixel on which the sine wave pattern portion is projected on the upper surface of the substrate (2) on the reference line (4) Value 。 Ο Then, at the center of the solder ball (1) determined in the center of the solder ball center (sn〇), the phase value of the pixel on which the sine wave pattern is projected is obtained. The integrated image towel is located at the reference line. (4) Solder ball on the upper part (1) On the center portion, 'take the phase value of the pixel in which the sine wave pattern is projected, and then use it as the phase value of the center portion of the solder ball (1). Then, the three integrated images obtained by shifting the phase are obtained. The phase shift value (4) - Q, 27r / 3, 4; r / 3 of each of the light grid cells (32) of each primitive is substituted into [Formula 1], and can be found at the center of the solder ball (1) The phase value (^) of the pixel of the sine wave pattern portion is added. In the embodiment, in order to improve the readability of the phase value, the phase value on the plurality of bits is taken instead of the phase value at the single_ position. For this purpose, a plurality of positions (10) located on the reference line (4) in the center portion are obtained. The plurality of pixel_bit values of the sinusoidal pattern are used as a plurality of phase values of the center portion of the solder. Then, the substrate is obtained from the integrated image (2) + the pixel_surface of the normal image is projected. The integrated image is obtained from the reference. The line Θ, , and the phase value of the pixel of the sine wave pattern portion, and the second is the phase value of the earth plate. Similarly, if the phase ρ is used, the light of each pixel in the three integrated images is obtained. Strong '- (10) phase shift pure (4) -. 7 / 3 7 / 3,) 2 = 11/16 201042236 In the formula 1], the pixel phase value of the sine wave pattern projected on a substrate (2) can be obtained. In order to improve the accuracy of the phase value, the phase values of a plurality of positions are obtained after the «average. Lightly, after the pixel phase values of the sine wave pattern are projected in the plurality of positions (p2) of the wire (1), the average value is obtained and the result is taken as the average phase value of the substrate. ^ As shown in Fig. 3, if the χγ vertical coordinate system is set on the object (3), the X coordinates of the pixels on the substrate (1) at the plurality of positions (p2) on the reference line (4) are the same, and the γ coordinates are Change in position. In the height calculation phase (S140), the height of the center portion of the solder ball (1) to the center portion of the solder ball (1) is calculated from the difference in phase value between the center portion of the solder ball and the substrate (2). Next, the relationship between the phase difference and the height of the detected object is expressed by Formula 2. [Formula 2] h (x, y)~ where h(x, y) is the height from the upper surface of the substrate (2) to the center portion of the solder ball (〗), which is the period of the lattice unit (32), The projection angle of the light, "is the phase value of the center portion of the solder ball (1), and is the phase value of the substrate (7). In Equation 2, the phase value of the center portion of the solder ball (丨) and the phase value of the substrate (2) are respectively substituted. The height (h) from the upper surface of the substrate (2) to the center of the solder (1) can be obtained. 'The process of calculating the height from the upper surface of the substrate (2) to the center of the solder ball (1) is as follows : First, substitute the phase value of the center of the plurality of solder balls (1) to the phase value (p〇) of the center of the solder ball in Equation 2, 12/16 201042236 • Substitute the average phase value of the substrate (2) The phase i of the substrate (2) in Equation 2 ((4). Then calculate the sum of the heights (8) of the data obtained by Equation 2, and then average the result as the height from the upper surface of the substrate (7) to the center of the Lai ball (1). An embodiment of the three-dimensional topography detecting method of the present invention is: simultaneously forming a substrate and a solder ball disposed on the substrate The sine wave diagram $after' simultaneously acquires the phase value on the substrate on which the sine wave pattern is projected and the phase value on the solder ball that has the sinusoidal pattern cast, and uses it for the detection of the solder ball twist. Thus, the present invention does not detect the other reference surface, but uses the peripheral reference surface of the solder ball to be detected, so that the height information of the solder ball can be calculated simply, accurately, and reliably. Moreover, after the center portion of the solder ball is first determined, only the center portion of the solder ball is obtained. The phase value of the center of the solder ball is used for the detection of the height of the solder ball, so that it is possible to charge the time and memory of the phase of the solder ball in the peripheral portion of the solder ball, etc. The accuracy of the value, instead of using the 〇_bit value in a single position', is to extract the phase values of the plurality of bars and then average them for use, thereby improving the accuracy of the height of the solder balls. The image of the solder ball is obtained in the state where the upper ring illumination device is irradiated with light, and the center portion of the ball can be accurately confirmed. The invention is not limited to the above embodiments and modifications. It is possible to realize various embodiments within the scope of the scope of the patent application, and the scope of deformation that can be achieved by the mosquitoes of the art in the scope of the spirit of the present invention is undoubtedly also belongs to the present invention. Scope of the invention 0 13/16 201042236 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic diagram of a three-dimensional topography detecting apparatus applied to a three-dimensional topography detecting method of the present invention. Fig. 2 is a view showing a three-dimensional topography detecting method of the present invention. Fig. 3 is a view showing a state of projection of a sinusoidal pattern on a subject (solder ball and substrate). [Description of main components] 1 solder ball 2 substrate 31 object 32 lattice unit 35 lattice transfer unit 43 ring illumination device 100 three-dimensional shape detecting device 14/16