[go: up one dir, main page]

TWI298500B - - Google Patents

Download PDF

Info

Publication number
TWI298500B
TWI298500B TW91132688A TW91132688A TWI298500B TW I298500 B TWI298500 B TW I298500B TW 91132688 A TW91132688 A TW 91132688A TW 91132688 A TW91132688 A TW 91132688A TW I298500 B TWI298500 B TW I298500B
Authority
TW
Taiwan
Prior art keywords
coupled
circuit
transistor
mentioned
source
Prior art date
Application number
TW91132688A
Other languages
Chinese (zh)
Other versions
TW200407909A (en
Inventor
Chen Hsing-Yi
Ming Chi Lin
Original Assignee
Silicon Integrated Sys Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Silicon Integrated Sys Corp filed Critical Silicon Integrated Sys Corp
Priority to TW91132688A priority Critical patent/TW200407909A/en
Publication of TW200407909A publication Critical patent/TW200407909A/en
Application granted granted Critical
Publication of TWI298500B publication Critical patent/TWI298500B/zh

Links

Landscapes

  • Static Random-Access Memory (AREA)

Description

1298500 五、發明說明(1) 發明所屬之技術 本發明係有關於高速靜態隨機存取記憶體,特別是有 關於靜態隨機存取記憶體中單端高速感應放大器。 先前技術 由於各種視裝置接踵問世,欲入式(ejjjbeddecOSRAM 記憶體技術已經成為未來整合型顯示晶片不可或缺的一環 。為了使嵌入式SRAM記憶體能夠高速讀取資料,同時又能 夠穩定保存資料不受内部操作影響。 大部分的隨機存取記憶體係使用具有良好共模態斥拒 比(common mode rejection ratio)良好的差動感應放大 電路’但是在多重處理的架構中,需要多埠的記憶體,基 於晶片空間的考量,單端感應放大器的使用機會大為增加 第1圖表示習知單端感應放大電路。當輸入信號v in為 低電壓位準,NM0S電晶體1〇不導通,NM0S電晶體12將節點 A的電壓提升至某位準,在此位準,反相器16的㈣⑽電晶 體P1 6和NM0S電晶體N1 6都導通,使得B節點的電壓位準位 於Vdd和Vss之間。NM0S電晶體12形成負迴授,故無法將節 點A充電至Vdd。當輸入信號Vin高電壓位準時,nm〇S電晶 體1 0導通,使得上述節點A放電,節點A的電壓降到比反相 器16的臨界電壓值更低。此時,nm〇S電晶體1 2也將導通, 使得節點A的電壓介於V s s和反相器1 6的臨界電壓值之間, 如此節點A的電壓則限制在臨界電壓附近。1298500 V. DESCRIPTION OF THE INVENTION (1) Technology to which the Invention pertains The present invention relates to a high speed SRAM, and more particularly to a single-ended high speed sense amplifier in a SRAM. The prior art has been invented due to various visual devices. The ejjjbeddecOSRAM memory technology has become an indispensable part of the future integrated display chip. In order to enable the embedded SRAM memory to read data at high speed, it can stably save data. Affected by internal operations. Most random access memory systems use a differential inductive amplifying circuit with a good common mode rejection ratio' but in a multiprocessing architecture, multiple memories are required. Based on the consideration of the wafer space, the use of single-ended sense amplifiers is greatly increased. Figure 1 shows a conventional single-ended inductive amplifying circuit. When the input signal v in is a low voltage level, the NM0S transistor is not conducting, NM0S is The crystal 12 boosts the voltage of the node A to a certain level, at which the (four) (10) transistor P1 6 and the NM0S transistor N16 of the inverter 16 are both turned on, so that the voltage level of the node B is between Vdd and Vss. The NM0S transistor 12 forms a negative feedback, so the node A cannot be charged to Vdd. When the input signal Vin is at a high voltage level, the nm〇S transistor 10 is turned on. The above node A is discharged, and the voltage of the node A is lowered to be lower than the threshold voltage of the inverter 16. At this time, the nm〇S transistor 12 will also be turned on, so that the voltage of the node A is between V ss and inverted. Between the threshold voltage values of the device 16, the voltage of the node A is thus limited to the vicinity of the threshold voltage.

當輸入信號Vin為局電壓位準,NM0S電晶體N12和NM0SWhen the input signal Vin is the local voltage level, the NM0S transistors N12 and NM0S

0702-7362TWF(nl);90P104;Rliu.ptd0702-7362TWF(nl);90P104;Rliu.ptd

1298500 五、發明說明(2) 電晶體N1 〇同時導通,形成一 率之外,NM0S電晶體N12阻礙節=放除了消耗靜態功 以*位準的時間,其不利於=作増加節-拉 路麵接於複數讀取位元線和一低電壓源中之複上 所選擇的記憶單元是低邏輯為準時,讀 電路導通使得耦接於記憶單元的讀取貝取子7^ 位,複數讀取位元線藉由一多工器麵接二减^ =低電 間,壓源和複數讀取位元線之 :帛充電仏號致能時’將複數讀取線和資料線充電 應放大電路’其輸入端輕接於讀取資料 =,端電壓低於一臨界位準並且預充電信號非致能 時,導通一加速電路使得輸入端加速放電;一開關,其一 端耦接於感應放大電路的輸出端;以及一栓鎖電路,耦接 於開,的另一端,當預充電信號致能時,開關斷路,當預 充電仏號非致能時’開關導通,栓鎖感應放大電路的輸出 資料。 以下,就圖式說明本發明之。 實施方式 第2圖表示本發明實施例中靜態隨機存取記憶體(SRAM )的架構圖。如第1圖所示,本發明之SRAM具有複數記憶陣 列A 0〜A 7,配置成陣列之形態,其讀取位元線分別是 I圓1298500 V. INSTRUCTIONS (2) The transistor N1 〇 is turned on at the same time, forming a rate. The NM0S transistor N12 blocks the node = the time for consuming the static work to be *level, which is not conducive to = 増 addition - pulling the road surface When the selected memory cell connected to the plurality of read bit lines and a low voltage source is low logic, the read circuit is turned on so that the read cell is coupled to the memory cell, and the complex read bit is The power line is connected by a multiplexer and the second is reduced by ^ = low power, the voltage source and the complex read bit line: when the charging nickname is enabled, 'multiple reading lines and data lines should be charged to amplify the circuit' The input terminal is lightly connected to the reading data=, when the terminal voltage is lower than a critical level and the pre-charging signal is disabled, the accelerating circuit is turned on to accelerate the discharge of the input terminal; and one switch is coupled to the inductive amplifying circuit at one end thereof. The output end; and a latching circuit coupled to the other end of the open, when the pre-charge signal is enabled, the switch is open, when the pre-charged nickname is not enabled, the switch is turned on, and the output data of the latch-sensing amplifying circuit is . Hereinafter, the present invention will be described with reference to the drawings. Embodiment Fig. 2 is a view showing the architecture of a static random access memory (SRAM) in an embodiment of the present invention. As shown in Fig. 1, the SRAM of the present invention has a plurality of memory arrays A 0 to A 7 arranged in an array, and the read bit lines are respectively I circles.

0702-7362TW(nl);90P104;RIiu.ptd 第6買 1298500 五、發明說明(3) 〇〜RBL7,II由多卫器110選擇其中之一陣列的讀取位 疋線作資料讀取。多工器110的輸出端耦接到一讀取資料 線RDAT,其耦接到感應放大電路2〇〇,用以加速讀取記憶 單元的資料。 記憶陣列Α0〜Α7可接收預充電信號RPC,PM〇s電晶體15〇 源極耦接到一高電壓源VDD,汲極耦接到讀取資料線⑽八丁 ’閘極耦接到預充電信號RPC。0702-7362TW(nl); 90P104; RIiu.ptd No. 6 Buy 1298500 V. Invention Description (3) 〇~RBL7, II is selected by the multi-guard 110 to read the position of one of the arrays. The output of the multiplexer 110 is coupled to a read data line RDAT coupled to the inductive amplifying circuit 2A for accelerating the reading of the data of the memory unit. The memory arrays Α0~Α7 can receive the precharge signal RPC, the PM〇s transistor 15〇 source is coupled to a high voltage source VDD, and the drain is coupled to the read data line (10) and the gate is coupled to the precharge signal. RPC.

一NM0S電晶體1 〇5,其用作開關,一端耦接到感應放大 電路的輸出端SAOUT,其閘極辆接到預充電信號Rpc,令一 端耦接到栓鎖電路130,其包含反相器1131,反相器1132 ,以正迴授的連接方式組成一栓鎖電路,用以栓鎖感應放 大電路200的資料。 D型正反器120,其資料輸入端耦接於栓鎖電路13〇,藉 由時鐘信號RCLK同步栓鎖記憶單元的邏輯資料。An NM0S transistor 1 〇5, which is used as a switch, one end is coupled to the output terminal SAOUT of the inductive amplifying circuit, and the gate is connected to the precharge signal Rpc, and one end is coupled to the latch circuit 130, which includes the inversion The inverter 1131 and the inverter 1132 form a latch circuit for latching the data of the inductive amplifying circuit 200 in a positive feedback manner. The D-type flip-flop 120 has a data input end coupled to the latch circuit 13A, and the logic data of the memory unit is latched by the clock signal RCLK.

第3圖表示本發明實施例中記憶陣列A〇的架構圖,其他 的s己憶陣列也有相同的架構。記憶陣列a 〇包括記憶單元 C0〜C7,字元讀取信號RWL〇〜RWL7分別耦接到C0〜C7的讀取 控制端RWL,C0〜C7的讀取端RBL全部耦接到讀取位元線 RBL0,PMOS電晶體151源極耦接到高電壓源VDD,汲極耦接 到讀取位元線RBL0,閘極耦接到預充電信號RPC。PMOS電 晶體152的電氣連接狀態和PMOS電晶體151相似,其汲極耦 接到讀取位元線RBL0的另一端,以防止讀取位元線RBL0在 預充電的傳播延遲(propagation delay)。 第4圖表示本發明實施例中記憶陣列A0中記憶單元C0的Fig. 3 is a view showing the architecture of the memory array A in the embodiment of the present invention, and the other arrays have the same architecture. The memory array a includes memory cells C0 to C7, and the word read signals RWL〇 to RWL7 are respectively coupled to the read control terminals RWL of C0 to C7, and the read terminals RBL of C0 to C7 are all coupled to the read bits. The line RBL0, the PMOS transistor 151 source is coupled to the high voltage source VDD, the drain is coupled to the read bit line RBL0, and the gate is coupled to the precharge signal RPC. The PMOS transistor 152 has an electrical connection state similar to that of the PMOS transistor 151, and its drain is coupled to the other end of the read bit line RBL0 to prevent the propagation delay of the read bit line RBL0 at precharge. Figure 4 shows the memory cell C0 of the memory array A0 in the embodiment of the present invention.

〇702-7362TWF(nl);90P104;Rliu.ptd〇702-7362TWF(nl);90P104;Rliu.ptd

1298500 五、發明說明(4) ------- 電路圖。其他的記憶單元也有相同的電路架構。* * 耦接到讀取位元線RBL0,電晶體Ml和電晶體M2串聯^取= 體Ml耦接到讀取位元線RBL〇,電晶體M2耦接到低^广電晶 VSS ’電晶體Ml的閘極耦接到讀取字元線RWL〇,電曰^ 的閘極耦接到互補邏輯資料端])B。 阳-2 反相器1135和反相器1136以正迴授的連接方式組成一 吞己憶單元用以栓鎖邏輯資料,邏輯資料端D和互補邏輯資 料鈿DB分別儲存極性相反的邏輯資料,邏輯資料端〇 寫入電晶體M4耦接到寫入位元線WBL,互補邏輯資料^DB 藉由電晶體M3耦接到互補寫入位元線WBLB,當寫入作號 WWL致能時,電晶體“和電晶體^導通,互補邏輯資^斗"可P 以藉由寫入位元線WBL和互補寫入位元線WBLB儲存到邏輯 / 資料端D和互補邏輯資料端j) b。 第5圖表示本發明實施例中感應放大電路2〇〇的電路圖 ’其中,PM0S電晶體MP1和NM0S電晶體MN1串聯,pm〇s電晶 體MP1的源極耦接到高電壓源VDD,NMOS電晶體MN1的源極 麵接到低電壓源VSS,PM0S電晶體MP1的閘極以及NMOS電晶 體MN1的閘極都耦接到感應放大電路2〇〇的輸入端,pM〇s電 晶體MP1的沒極以及NM0S電晶體MN1的汲極都耦接到感應放 大電路200的輸出端,NMOS電晶體MN2的汲極耦接到感應放4 大電路2 00的輸入端,閘極耦接到感應放大電路2〇〇的輸出 端’源極和NMOS電晶體MN3的汲極耦接在一起,NMOS電晶 體MN3的源極耦接到低電壓源VSS,閘極耦接到預充電信號 RPC 〇1298500 V. Description of the invention (4) ------- Circuit diagram. Other memory units have the same circuit architecture. * * is coupled to the read bit line RBL0, the transistor M1 and the transistor M2 are connected in series. The body M1 is coupled to the read bit line RBL, and the transistor M2 is coupled to the low-level crystal VSS ' The gate of the crystal M1 is coupled to the read word line RWL〇, and the gate of the circuit is coupled to the complementary logic data terminal])B. The positron-2 inverter 1135 and the inverter 1136 form a sneak peek unit for latching logic data in a positive feedback manner, and the logic data terminal D and the complementary logic data 钿DB respectively store logic data of opposite polarities. The logic data terminal write transistor M4 is coupled to the write bit line WBL, and the complementary logic data ^DB is coupled to the complementary write bit line WBLB by the transistor M3. When the write signal WWL is enabled, The transistor "and the transistor ^ is turned on, and the complementary logic device" can be stored by the write bit line WBL and the complementary write bit line WBLB to the logic/data terminal D and the complementary logic data terminal j) b Fig. 5 is a circuit diagram showing an inductive amplifying circuit 2' in the embodiment of the present invention, wherein the PM0S transistor MP1 and the NM0S transistor MN1 are connected in series, and the source of the pm〇s transistor MP1 is coupled to the high voltage source VDD, NMOS. The source side of the transistor MN1 is connected to the low voltage source VSS, the gate of the PMOS transistor MP1 and the gate of the NMOS transistor MN1 are both coupled to the input terminal of the inductive amplifying circuit 2, pM〇s transistor MP1 The drain and the drain of the NM0S transistor MN1 are coupled to the output of the inductive amplifying circuit 200 The drain of the NMOS transistor MN2 is coupled to the input terminal of the inductive amplifier 4 circuit 200, and the gate is coupled to the output terminal of the inductive amplifying circuit 2〇〇 and the drain of the NMOS transistor MN3 is coupled to Together, the source of the NMOS transistor MN3 is coupled to the low voltage source VSS, and the gate is coupled to the precharge signal RPC.

0702-7362TW(nl);90P104;Rliu.ptd 第8頁 1298500 五 '發明說明(5) 第6圖表示第2圖各信號波形示意圖。接下來說明各時 相的信號的操作程序: 在時間11之前: 預充電信號RPC是在低位準,記憶陣列A0〜A7中的PM0S 電晶體151、PM0S電晶體152導通,對所有的讀取位元線 RBL0〜RBL7充電到高位準。 在同一時間内,PM0S電晶體150也導通,對讀取資料線 RDAT充電到高位準。預充電信號Rpc是在低位準,電 晶體105以及感應放大電路2〇〇 *NM0S電晶體MN3都是關閉 〇 多工器110在讀取字元線RWL〇〜RWL7打開之前,選擇 記憶陣列A0 ’也就是在時間tl之前,讀取位元線RBL〇已經 被選擇耦接到讀取資料線RDAT。 在時間11 : 讀取字元線RWL0升高到高位準,選到記憶單元㈢,假 設記憶單元C0的儲存資料是〇。預充電信號Rpc升高到高位 準’ PMOS電晶體150關閉,停止對讀取資料線RDAT充電, PMOS電晶體151、152關閉,停止對讀取位元線RBL〇充電。 因為預充電信號是在高位準,NM〇s電晶體1〇5導通,感 應放大器200中NMOS電晶體JJN3導通。 記憶單元C0的儲存資料為〇,節點^的邏輯位準是〇,節 點DB的邏輯位,1,NM〇s電晶體〇是在導通狀態,讀取位 7G線RBL0是在高位準,NM〇s電晶體M1是在導通狀態,NM〇s 電晶體M2、Ml形成一放電路徑,讀取位元線RBL〇開始放電 1298500 五、發明說明(6) ’讀取資料線RDAT開始放電。 在時間12 : 當讀取資料線RDAT的位準降低到感應放大器200的反轉 位準’ PM0S電晶體MP1開始導通,對感應放大器200的輸出 端SA0UT充電,NMOS電晶體MN1逐漸關閉。 當感應放大器2 00的輸出端的電壓升高到NMOS電晶體 MN2的臨界電壓時,NMOS電晶體MN2導通,與NMOS電晶體 MN3形成一第二條放電路徑,加速讀取資料線RDAT放電, 如圖所示,時間t2之後,讀取位元線RBL0、讀取資料線 RDAT的放電速率顯著提昇。 隨著讀取資料線RDAT放電,節點SAOUT逐漸升高到高位 準’藉由NMOS電晶體105,栓鎖電路130將節點OUT栓鎖在0 位準。 在時間13 : 讀取字元線RWL0降低到低位準,預充電信號rpc降低到 低位準。 記憶陣列A0〜A7中的PM0S電晶體151、152開始導通,對 讀取位元線RBL0〜RBL7充電,PM0S電晶體150導通對讀取資 料線RDAT充電。 ' 預充電信號RPC在低位準,NMOS電晶體105關閉,感應 放大器200中的NMOS電晶體MN3關閉,所以在預充電初期, 郎點S A 0 U T尚未拉回低位準之前,先消除讀取資料線⑽a τ 的放電路徑,提高充電效率。 在時間t4 :0702-7362TW(nl); 90P104; Rliu.ptd Page 8 1298500 V 'Invention Description (5) Fig. 6 shows a schematic diagram of each signal waveform in Fig. 2. Next, the operation procedure of the signals of the respective phases will be described: Before time 11: The precharge signal RPC is at the low level, and the PMOS transistor 151 and the PMOS transistor 152 in the memory arrays A0 to A7 are turned on, for all the read bits. The line RBL0 to RBL7 are charged to a high level. At the same time, the PM0S transistor 150 is also turned on, charging the read data line RDAT to a high level. The precharge signal Rpc is at a low level, and the transistor 105 and the inductive amplifying circuit 2〇〇*NM0S transistor MN3 are both turned off. The multiplexer 110 selects the memory array A0' before the read word lines RWL〇 to RWL7 are turned on. That is, before time t1, the read bit line RBL has been selectively coupled to the read data line RDAT. At time 11: The read word line RWL0 rises to a high level and is selected to the memory unit (3), assuming that the stored data of the memory unit C0 is 〇. The precharge signal Rpc rises to a high level. The PMOS transistor 150 is turned off, charging of the read data line RDAT is stopped, and the PMOS transistors 151, 152 are turned off to stop charging the read bit line RBL. Since the precharge signal is at a high level, the NM〇s transistor 1〇5 is turned on, and the NMOS transistor JJN3 in the sense amplifier 200 is turned on. The storage data of the memory unit C0 is 〇, the logical level of the node ^ is 〇, the logical position of the node DB, 1, NM〇s transistor 〇 is in the on state, and the read bit 7G line RBL0 is at the high level, NM〇 The s transistor M1 is in an on state, the NM〇s transistors M2, M1 form a discharge path, and the read bit line RBL 〇 starts to discharge 1298500. 5. Description of the invention (6) 'The read data line RDAT starts to discharge. At time 12: When the level of the read data line RDAT is lowered to the inverted level of the sense amplifier 200', the PM0S transistor MP1 starts to conduct, and the output terminal SA0OUT of the sense amplifier 200 is charged, and the NMOS transistor MN1 is gradually turned off. When the voltage at the output of the sense amplifier 200 rises to the threshold voltage of the NMOS transistor MN2, the NMOS transistor MN2 is turned on, forming a second discharge path with the NMOS transistor MN3, accelerating the reading of the data line RDAT, as shown in the figure. As shown, after the time t2, the discharge rate of the read bit line RBL0 and the read data line RDAT is significantly improved. As the read data line RDAT is discharged, the node SAOUT is gradually raised to a high level. With the NMOS transistor 105, the latch circuit 130 latches the node OUT to the 0 level. At time 13: the read word line RWL0 is lowered to the low level, and the precharge signal rpc is lowered to the low level. The PMOS transistors 151, 152 in the memory arrays A0 to A7 are turned on, and the read bit lines RBL0 to RBL7 are charged, and the PMOS transistor 150 is turned on to charge the read data line RDAT. ' The precharge signal RPC is at the low level, the NMOS transistor 105 is turned off, and the NMOS transistor MN3 in the sense amplifier 200 is turned off. Therefore, in the initial stage of precharge, the read point data line is eliminated before the RO 0 UT has been pulled back to the low level. (10) The discharge path of a τ improves the charging efficiency. At time t4:

0702-7362TW(nl);90P104;Rliu.ptd 第10頁 1298500 五、發明說明(7) 讀取資料線RDAT充電到感應放大器200的反轉位準,節 點SAOUT降低到0邏輯位準。 因為NMOS電晶體105關閉,所以預充電過程,節點 SAOUT並不影響栓鎖電路130的資料。 在時間15 : 開始另一次讀取動作,預充電信號RPC升高到高位準。 如果記憶單=C1儲存的資料是〇,則重複前述讀取〇的動作 二如果記憶單元C1儲存的資料是!,NM〇s電晶體们關閉, 讀取位το線RBL 0、讀取資料線RDAT維持在高位 SAOUT也維持在預充電時的低位準。 … 且由右明可知,本發明單端靜態隨機存取記憶體 縮短高位準資料的讀取時間,更單號不僅是 速低位準的讀取時間,二#编感應放大電路加 栓鎖電路的輸入,& h φ 5 &在讀取週期,能夠關閉 取的資料。 防止預充電週期的資料位準影響已經讀0702-7362TW(nl); 90P104; Rliu.ptd Page 10 1298500 V. Invention Description (7) The read data line RDAT is charged to the inversion level of the sense amplifier 200, and the node SAOUT is lowered to the 0 logic level. Since the NMOS transistor 105 is turned off, the node SAOUT does not affect the data of the latch circuit 130 during the precharge process. At time 15: another read action is initiated and the precharge signal RPC rises to a high level. If the memory list = C1 stored data is 〇, repeat the above action of reading 二 2. If the data stored in memory unit C1 is! The NM〇s transistors are turned off, the read bit το line RBL 0, and the read data line RDAT are maintained at the high level. SAOUT also maintains the low level at the time of precharge. ... and as can be seen from the right, the single-ended static random access memory of the present invention shortens the reading time of high-level data, and the single number is not only the reading time of the low-level level, but also the code-inducing circuit of the induction amplifier circuit. Input, & h φ 5 & In the read cycle, the data can be closed. Prevent data level impact of pre-charge cycle has been read

雖然本發明P W 以限定本發明,任何上1其並非用 神和範圍内,當可作此 "# 在不脫離本發明之精 護範圍當視後附之_ i15 2與潤飾,因此本發明之保 申印專利範圍所界定者為準。 〇702-7362TW(nl);9〇Pi〇4;Riiu>ptd 麵Although the present invention PW is intended to limit the present invention, any of the above is not intended to be used in the context of the present invention, and the present invention may be made without departing from the scope of the present invention. The scope defined by the scope of the patent application shall prevail. 〇702-7362TW(nl);9〇Pi〇4;Riiu>ptd face

第11 I 129850011th I 1298500

第1圖表示習知單端感應放大電路。 第2圖表示本發明實施例中靜態隨機存取記憶體的架構 圖0 第3圖表示本發明實施例中記憶陣列A〇的架構圖。 第4圖表示本發明實施例中記憶陣列A〇中記憶單元c〇的電 路圖。 第5圖表示本發明實施例中感應放大電路2 〇 〇的電路圖。 第6圖表示第2圖各信號波形示意圖。 [符號說明]Figure 1 shows a conventional single-ended inductive amplifying circuit. 2 is a block diagram showing the structure of a static random access memory in the embodiment of the present invention. FIG. 3 is a block diagram showing the memory array A in the embodiment of the present invention. Fig. 4 is a circuit diagram showing a memory cell c in the memory array A in the embodiment of the present invention. Fig. 5 is a circuit diagram showing an inductive amplifying circuit 2 in the embodiment of the present invention. Fig. 6 is a view showing the waveforms of the respective signals in Fig. 2. [Symbol Description]

A0_7〜記憶體陣列;C0-7〜記憶單元;105〜NM0S電晶體; 110〜多工器;120〜D型正反器;130〜栓鎖電路;200〜感應 放大電路;150, 151,152 〜PM0S 電晶體;Ml、M2、M4、 M3〜NMOS 電晶體;MP卜PMOS 電晶體;MN1、MN2、MN3 〜NMOS 電晶體。A0_7~memory array; C0-7~memory unit; 105~NM0S transistor; 110~multiplexer; 120~D type flip-flop; 130~ latch circuit; 200~inductive amplifier circuit; 150, 151,152 ~ PM0S transistor; Ml, M2, M4, M3 ~ NMOS transistor; MP PMOS transistor; MN1, MN2, MN3 ~ NMOS transistor.

0702-7362TWF(nl);90P104;R1i u.ptd 第12買0702-7362TWF(nl);90P104;R1i u.ptd 12th buy

Claims (1)

—9A5,QQ^_91132688_ 六、申請專利範圍 士 1 · 一種靜態隨機存 數讀取位元線,多工巧 ,藉由上述多工器耦接 單元具有第一端和第二 括· 複數讀取 應之頃取位元 述記憶單元的 字元電路並且 讀取字元電路 電; 複數第一 字元電路 矛口 j氏 第二端, 上述記憶 形成一通 預充電電 線,當 致能時 輸入端 元線之 元線充 數第二 之間, 到上述 單端感 輸入端 ,上述 加速放 開關,其一端耦 當一 一高 田 電; 兑车Η月 < 且 取記憶體,具有 ,讀取資料線, 到上述讀取資料 端,上述靜態隨 ,每一讀取字元 電壓源之間’並 當一讀取字兀k 單元的第二端為 路,使得對應之 路,耦接於一高 預充電信號致能 電壓; 路,耦接於一高 電信號致能時, 路’其輸入端耦 一臨界位準益且 放大電路導通一 修正夂 複數記憶單元,複 其中複數讀取位元 線’每一上述記憶 機存取記憶體其包 電路耦接於一相對 且有一端耦接到上 號選擇到上述讀取 高邏輯位準,上述 上述讀取位元線放 電壓源和上述複數 時’使得上述複數 電壓源和上述讀取 使传上述讀取資料 接於上述讀取資料 f,預充電信號非 加速電路使得上述 以及 接於上述感應放 一检鎖電路’麵接於上述開關的另 大電路的輪出 端; 一端,當上 述預充 ίΐη'ΐΙ 0702-7362-TWf1(4.2) ; 90pl04 ; yens.ptc 第13 1 六、申請專利範圍 電信號致能時,上述開關斷路,… 身 當上述預充電信號非致能時,上述检鎖電路保持資料, 大電路的輸出資料。 ’上述開關導通,栓鎖感應放 2·如申請專利範圍第1 少 ,其中上述感應放大電路包括斤·述之靜態隨機存取記憶體 第一 P型金氧半電晶體, 電路的輸出端,源極耦接到J、、/及^極耦接到上述感應放大 述感應放大電路的輸入端;a咼電壓源,閘極耦接到上 第一N型金氧半電晶體,1 一 電路的輸出端,源極耦接到上、/ 1述感應放大 述感應放大電路的輸人端;述低電壓源,閉㈣接到上 第二N型金氧半電晶體,其接 雷政的給人# b日1 > 六次往祸接到上述感應放大 ::的輸入"極麵接到上述感應放大電路的輸出端; 第一N型金氧半電晶體,其汲極耦接到第二n型金氧半 電晶體的源極,源極耦接到上述低電壓源,閘極接收上 預充電信號。 3·如申請專利範圍第1項所述之靜態隨機存取記憶體 ’其中上述複數第一預充電電路包括: 複數P型金氧半電晶體,其汲極耦接到上述讀取位元 線源極耦接到上述而電壓源,閘極接收上述預充電信號 4·如申請專利範圍第丨項所述之靜態隨機存取記憶體 ’八中上述複數第一預充電電路包括: 修正 曰 六、申請專利範圍 線,:金氧半電晶體,其沒極耦接到上述讀取資料 W接到上述高電屋源1極接收上_充電= ,其述之靜態隨機存取記憶體 ^ ^ t θ% ΝΛ1Λ/^ #/,J/ ^ ^ ^ n ^ ^ 源極耦接到上述低電壓源。 ^圮憶單70的第二端, 6·如申請專利範圍第丨項所述之 ’其中上述複數記憶單元中,每 機存取記憶體 第一寫入電晶體,為N刑^^ /隐早兀包括: 到第:位元線,間極接收一寫入信+號電晶體,其汲極轉接 源極第一反相器,其輸入端輕接到上^述第-寫入電晶體的 第二寫入電晶體,為Ν型金 到第二位元線,問極接收上述寫:電曰曰體,其沒極麵接 反相器的輸出端;以及 · 乜琥,源極耦接到第一 第二反相器,其輸入端耦接 端,輸出端耦接到上述第一反相哭从^弟一反相器的輪出 上述讀取字元電路。 β的輪入端,並且耦接到 ί 第15頁 〇702-7362-TlVfl(4.2);90pl〇4;yens.ptc—9A5,QQ^_91132688_ VI. Patent Application Scope 1 · A static random number read bit line, versatile, with the first multiplexer coupling unit having the first end and the second suffix The bit circuit is used to describe the character circuit of the memory unit and read the character circuit circuit; the first first character circuit is connected to the second end of the J, the memory forms a pre-charged wire, and when enabled, the input end line Between the second line and the second end, to the above-mentioned single-ended input terminal, the above-mentioned acceleration switch, one end of which is coupled to one high-field electric; the vehicle is charged with the moon< and the memory, with, reading the data line, to In the above-mentioned reading data end, the above static static, each reading word voltage source is 'and the second end of the reading word 兀k unit is a path, so that the corresponding path is coupled to a high pre-charging signal The enable voltage; when the circuit is coupled to a high-voltage signal, the input terminal is coupled to a critical bit and the amplifying circuit is turned on by a modified complex memory unit, wherein the complex read bit line 'each Above Recalling the memory access memory, the packet circuit is coupled to a relative one end and coupled to the upper surface to select the high logic level, and the above-mentioned read bit line discharges the voltage source and the complex number The voltage source and the reading enable the read data to be connected to the read data f, and the precharge signal non-acceleration circuit causes the above-mentioned wheel connected to the inductive discharge check circuit to be connected to the other circuit of the switch One end, when the above pre-charged ΐΙ ΐΙ 'ΐΙ 0702-7362-TWf1 (4.2); 90pl04 ; yens.ptc 13 1 6 , when the application of the patent range electrical signal enable, the above switch is broken, ... as the above pre-charge When the signal is not enabled, the above-mentioned lock-up circuit holds the data and the output data of the large circuit. 'The above switch is turned on, and the latch is inductively placed. 2. As claimed in the patent application, the above-mentioned inductive amplifying circuit includes the first P-type MOS transistor of the static random access memory, and the output end of the circuit. The source is coupled to the J, , and ^ poles to be coupled to the input terminal of the inductive amplification inductive amplifying circuit; a voltage source, the gate is coupled to the first N-type gold oxide semi-transistor, 1 circuit The output terminal is coupled to the input terminal of the inductive amplifying circuit, and the low voltage source is closed (four) connected to the upper second N-type metal oxide semi-transistor, which is connected to the thunder Give #b日1 > Six times to the above-mentioned induction amplification:: The input " pole face is connected to the output of the above-mentioned inductive amplifier circuit; the first N-type gold-oxygen semi-transistor, its pole-coupled To the source of the second n-type MOS transistor, the source is coupled to the low voltage source, and the gate receives the precharge signal. 3. The static random access memory according to claim 1, wherein the plurality of first precharge circuits comprise: a plurality of P-type MOS transistors, the drain of which is coupled to the read bit line The source is coupled to the voltage source, and the gate receives the precharge signal. The static pre-charge memory of the eighth aspect of the invention is as follows: Patent application line: Gold-oxide semi-transistor, which is not coupled to the above-mentioned reading data W to the above-mentioned high-voltage housing source 1 pole receiving _ charging = , the description of the static random access memory ^ ^ t θ% ΝΛ1Λ/^ #/, J/ ^ ^ ^ n ^ ^ The source is coupled to the above low voltage source. ^ The second end of the memory 70, 6 · as described in the scope of the patent application, in which the above-mentioned plurality of memory cells, each machine access memory first write transistor, for N penalty ^ ^ / hidden As early as possible: to the first: bit line, the interpole receives a write letter + transistor, its drain is switched to the source first inverter, and its input is lightly connected to the first write-write The second write transistor of the crystal is a Ν type gold to a second bit line, and the terminal receives the above write: the electric 曰曰 body, which has no pole face connected to the output end of the inverter; and · 乜 ,, source The first second inverter is coupled to the input end of the first end of the inverter, and the output end is coupled to the first inverting crying device to rotate the read word circuit. The turn-in end of β and is coupled to ί page 15 〇702-7362-TlVfl(4.2); 90pl〇4; yens.ptc
TW91132688A 2002-11-06 2002-11-06 Single-port static random access memory cell TW200407909A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW91132688A TW200407909A (en) 2002-11-06 2002-11-06 Single-port static random access memory cell

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW91132688A TW200407909A (en) 2002-11-06 2002-11-06 Single-port static random access memory cell

Publications (2)

Publication Number Publication Date
TW200407909A TW200407909A (en) 2004-05-16
TWI298500B true TWI298500B (en) 2008-07-01

Family

ID=45069413

Family Applications (1)

Application Number Title Priority Date Filing Date
TW91132688A TW200407909A (en) 2002-11-06 2002-11-06 Single-port static random access memory cell

Country Status (1)

Country Link
TW (1) TW200407909A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI419160B (en) * 2009-01-07 2013-12-11 Univ Nat Chiao Tung Sram cell apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI419160B (en) * 2009-01-07 2013-12-11 Univ Nat Chiao Tung Sram cell apparatus

Also Published As

Publication number Publication date
TW200407909A (en) 2004-05-16

Similar Documents

Publication Publication Date Title
CN100555451C (en) A kind of self-timing SRAM access control circuit
CN111164691B (en) Area-efficient write data path circuit for SRAM yield enhancement
US7986571B2 (en) Low power, single-ended sensing in a multi-port SRAM using pre-discharged bit lines
JP4994135B2 (en) Sense amplification circuit and sense amplification method
JP6308218B2 (en) Semiconductor memory device
US5850359A (en) Asynchronous high speed zero DC-current SRAM system
JPH06103781A (en) Memory cell circuit
CN102265396A (en) Capacitively isolated mismatch compensated sense amplifier
JPH0660672A (en) Sense amplifier for sram and latching circuit
JPH09231767A (en) Static semiconductor memory device
US7630273B2 (en) Semiconductor integrated circuit
CN117789779B (en) Self-controlled SRAM sense amplifier circuit and module based on latch cross coupling
US6292418B1 (en) Semiconductor memory device
JP3188634B2 (en) Data holding circuit
US6642749B1 (en) Latching sense amplifier with tri-state output
US20040085842A1 (en) High speed sense amplifier data-hold circuit for single-ended sram
US6222787B1 (en) Integrated circuit memory devices having improved sense and restore operation reliability
JPH07312092A (en) Sense amplifier with hysteresis
US11217301B2 (en) High speed memory device implementing a plurality of supply voltages
JP4965844B2 (en) Semiconductor memory device
TWI298500B (en)
US6522189B1 (en) High-speed bank select multiplexer latch
TW434549B (en) Read-out amplifier circuit
JPH1011968A (en) Semiconductor memory device
CN100334651C (en) Static Random Access Memory with Single-Ended Sense Amplifier

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees