1293861 九、發明說明： 【發明所屬之技術領域】 本發明係關於-種散熱ϋ ’彳糊係關於_種安裝於電子元件上進行散熱 — 之散熱器。 【先前技術】 ‘ 、隨著電子產業之飛速發展，電子元件（如中央處理器）運行速度不斷提 升’，運行時產生大餘量’使其本身及純溫度升高，繼而嚴重威脅其系統 之穩疋性。為雜電子70魏j£常運行，通常在其上安裝散熱㈣，排出其所 產生之熱量。 • 傳統之散熱器―般包括與電子元件接觸之-底板、設於絲上之複數矩 形之平面散熱片，以及安裝於散熱片頂部或一側一風扇。電子元件運行產生 之熱置被底板吸收後，再通過散熱片散發到周圍環境中以冷卻電子元件，風 扇運行產生之強制氣流吹向散熱片以加速熱量之散失。傳統之散熱器為了盡 可能增加散熱面積以增大散熱片與氣流間之熱交換面積從而提升散熱性 旎，通常會通過單純增加散熱片尺寸或排列密度來加大散熱器之總散熱面 積。唯，在增加散熱片尺寸或排列密度來達到增加散熱器之熱交換面積之同 時必將加大了散熱片表面之空氣滯留程度及氣流通道之空氣阻力，導致氣流 吹不進鰭片組或者流速緩慢，嚴重影響散熱片與氣流間之熱交換效率，致使 鲁·熱量不能及時被帶走致使周圍環境溫度升高，進而限制散熱器之散熱效率。 【發明内容】 有鑒於此，有必要提供一種散熱器與氣流之換熱率高、散熱性能好之散 熱器。 一種散熱器’包括一底板及平行排列於底板上之複數散熱鰭片，每一散1293861 IX. Description of the Invention: [Technical Field] The present invention relates to a heat sink which is mounted on an electronic component for heat dissipation. [Prior Art] 'With the rapid development of the electronics industry, electronic components (such as central processing units) continue to increase in speed, and generate a large margin during operation to increase their own and pure temperature, which in turn threatens their systems. Steady. It is usually operated for the miscellaneous electrons, usually with heat dissipation (4) installed on it, and the heat generated by it is discharged. • Conventional heat sinks—generally include a bottom plate that contacts the electronic components, a plurality of rectangular planar heat sinks that are placed on the wire, and a fan mounted on the top or side of the heat sink. The heat generated by the operation of the electronic components is absorbed by the bottom plate, and then radiated to the surrounding environment through the heat sink to cool the electronic components, and the forced air flow generated by the fan blows toward the heat sink to accelerate the heat loss. In order to increase the heat exchange area of the heat sink to increase the heat exchange area between the heat sink and the air flow, the conventional heat sink generally increases the total heat dissipation area of the heat sink by simply increasing the heat sink size or the arrangement density. However, increasing the size or arrangement density of the heat sink to increase the heat exchange area of the heat sink must increase the air retention on the surface of the heat sink and the air resistance of the air flow passage, resulting in the air flow not blowing into the fin group or the flow rate. Slow, seriously affecting the heat exchange efficiency between the heat sink and the airflow, so that the heat can not be taken away in time to cause the ambient temperature to rise, thereby limiting the heat dissipation efficiency of the heat sink. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a heat sink having a high heat exchange rate between a heat sink and a gas stream and good heat dissipation performance. A heat sink 'includes a bottom plate and a plurality of heat radiating fins arranged in parallel on the bottom plate, each of which is scattered
熱鰭片上設置有相互間隔排列之凸部及開口，相鄰兩散熱鰭片間形成一氣漭 通道。 〃 L 相較于現有技術，上述散熱器採用設置有凸部及開口之散熱籍片排列於 底板上並形成氣流通道。當氣流進入流道後打在凸部上或者穿過開口，氣流 方向都發生變化形成方向不規則之湍流，氣流在開口處相通之各通道内沿^ 樣化路線流動，這樣不僅避免氣流在鰭片之表面上形成滯留，同時增加 6 1293861 器之從而提升氣流錄_#之熱交換鱗，進而提高散熱 【實施方式】 中央處理器（，示）等電子元件進概熱。 10上之複數$埶L Η X明政熱器之第—實施例包括—底板1Q、設於底板 冤千件（圖未不）接觸以吸收電子元件所產生之埶量。 成摺邊t t片2〇具有一矩形本體21，矩形本體21 一長邊彎折延伸形 H 散熱則20之本體21上設置有複數錢台狀凸部25和 21 H u i其中凸部25係在本體21上衝壓成型之，所以凸部25在本體 門口 ’於本體21另一表面之相對位置上凹陷。該等凸部Μ和 25盘太二·！ 之中部，在橫向上相互平行等距間隔排列，並且凸部 ，、本體21相父處之形狀大小與開口 25相同。 上述鰭片20等距平行排列於底板1〇上，全部鰭片 一 =(圖未示），此平面可焊接或祕等方朗定魏板每 目部之兩.H片2〇間形成—氣流通道Μ，在靠近這些通道Μ之進出口兩端 都=置凸部25及開口 27，以便空氣或風扇（圖未示）產生之強制氣流進 机出通道29。當氣流進入流道29後打在凸部25上或者穿過開口 27， 氣，方向都會發生變化，形成方向不規則之湍流。氣流在相通之各通道29 内沿多，化路線流動，這樣不僅避免氣流在鰭片20之表面上形成滞留，同 時增加氣流通過散熱器之路程，從而提升氣流與散熱鰭片2〇之熱交換效 率，進而提高散熱器之冷卻性能。 …、 ，第二圖為本發明散熱器之第二實施例，該散熱器除散熱鰭片20,之凸部 25’及開口 27’與第一實施例中之散熱鰭片2〇不同以外，其他部件及鰭片2〇, ，排列方式均與第一實施例一致。較第一實施例之散熱鰭片2〇而言，上述 散熱鰭片20’之凸部25’由散熱鰭片20’之本體21，一矩形部份彎折至與本體 21’平行，從而形成與凸部25效用一樣之凸部25,，同時對應該本體21，上之 彎折之部位形成開口 27,。 由上述兩個實施例可見，空氣或由風扇產生之強制氣流進入氣流通道 29、29’將沿通道延伸之方向流動，在凸部25、25,阻擋下，氣流原本單一之 行進方向變得多樣化，通過開口 27、27’環繞在各鰭片20、20,間，與散熱韓 片充分接觸，從而迅速帶走散熱器上之熱量，實現有效冷卻電子元件之目的。 7 1293861 【圖式簡單說明】 第一圖係本發明散熱器第一實施例之部分分解圖。 第二圖係本發明散熱器第二實施例之部分分解圖。 【主要元件符號說明】 底板 10 散熱鰭片 20、 20’ 本體 21、 21， 摺邊 23 凸部 25、 25’ 開口 27、 27, 氣流通道 29、 29，The heat fins are provided with protrusions and openings arranged at intervals, and a gas passage is formed between the adjacent heat dissipation fins. 〃 L Compared with the prior art, the heat sink is arranged on the bottom plate by a heat dissipating piece provided with a convex portion and an opening to form an air flow passage. When the airflow enters the flow channel and hits the convex portion or passes through the opening, the airflow direction changes to form an irregular turbulent flow, and the airflow flows along the path in each channel communicating with the opening, so that not only the airflow is prevented in the fin The surface is formed with a stagnation, and the 6 1293861 device is added to enhance the heat exchange scale of the airflow recording _#, thereby improving the heat dissipation. [Embodiment] The electronic components such as the central processing unit (showing) are heated. The plural number of 10 埶L Η X Mingzheng heat exchanger - the embodiment includes - the bottom plate 1Q, which is disposed on the bottom plate and thousands of pieces (not shown) to absorb the amount of electrons generated by the electronic components. The folded edge tt piece 2 has a rectangular body 21, and the rectangular body 21 has a long side bent and extended. H. The heat dissipation 20 body 20 is provided with a plurality of money-like convex portions 25 and 21H ui, wherein the convex portion 25 is attached thereto. The body 21 is stamped and formed, so that the convex portion 25 is recessed at the relative position of the body door opening 'on the other surface of the body 21. These convex parts and 25 plates are too two! The middle portion is arranged at equal intervals in parallel in the lateral direction, and the convex portion and the body of the body 21 are the same in size and shape as the opening 25. The fins 20 are equidistantly arranged on the bottom plate 1〇, and all the fins are== (not shown), and the plane can be welded or secretly formed by two squares of each of the two parts of the Wei plate. The air flow passages Μ, at both ends of the inlet and outlet of the passages, are provided with convex portions 25 and openings 27 so that air or a fan (not shown) generates a forced air flow into the passage passage 29. When the airflow enters the flow passage 29 and hits the convex portion 25 or passes through the opening 27, the direction of the gas changes, forming an irregular turbulence. The airflow flows in the intersecting channels 29, and the flow path flows, so as not only to prevent the airflow from forming on the surface of the fin 20, but also to increase the flow of the airflow through the heat sink, thereby improving the heat exchange between the airflow and the heat sink fins. Efficiency, which in turn increases the cooling performance of the radiator. The second figure is a second embodiment of the heat sink of the present invention. The heat sink has a convex portion 25' and an opening 27' different from the heat radiating fin 2' in the first embodiment except for the heat radiating fin 20. Other components and fins 2, are arranged in a manner consistent with the first embodiment. The convex portion 25' of the heat dissipation fin 20' is bent by the body 21 of the heat dissipation fin 20', and a rectangular portion is bent parallel to the body 21' to form a heat dissipation fin 2'. The convex portion 25, which has the same function as the convex portion 25, simultaneously forms an opening 27 corresponding to the portion of the main body 21 which is bent. It can be seen from the above two embodiments that the air or the forced airflow generated by the fan enters the airflow passages 29, 29' to flow in the direction in which the passage extends, and under the blocking of the convex portions 25, 25, the original traveling direction of the airflow becomes diverse. The opening 27, 27' surrounds each of the fins 20, 20, and is in full contact with the heat sinking film, thereby quickly taking away the heat on the heat sink, thereby achieving the purpose of effectively cooling the electronic components. 7 1293861 [Simple description of the drawings] The first figure is a partially exploded view of the first embodiment of the heat sink of the present invention. The second drawing is a partially exploded view of a second embodiment of the heat sink of the present invention. [Description of main component symbols] Base plate 10 Heat sink fins 20, 20' Body 21, 21, Folding 23 Projections 25, 25' Openings 27, 27, air flow passages 29, 29,