[go: up one dir, main page]

TWI292208B - - Google Patents

Download PDF

Info

Publication number
TWI292208B
TWI292208B TW092115874A TW92115874A TWI292208B TW I292208 B TWI292208 B TW I292208B TW 092115874 A TW092115874 A TW 092115874A TW 92115874 A TW92115874 A TW 92115874A TW I292208 B TWI292208 B TW I292208B
Authority
TW
Taiwan
Prior art keywords
wire
conductive
circuit portion
wires
wiring
Prior art date
Application number
TW092115874A
Other languages
English (en)
Chinese (zh)
Other versions
TW200428614A (en
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of TW200428614A publication Critical patent/TW200428614A/zh
Application granted granted Critical
Publication of TWI292208B publication Critical patent/TWI292208B/zh

Links

Classifications

    • H10W42/20—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H10W44/20—
    • H10W70/424—
    • H10W74/019—
    • H10W74/111—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H10W44/206—
    • H10W70/60—
    • H10W72/073—
    • H10W72/07352—
    • H10W72/075—
    • H10W72/30—
    • H10W72/321—
    • H10W72/5449—
    • H10W72/5473—
    • H10W72/5522—
    • H10W72/59—
    • H10W72/884—
    • H10W72/932—
    • H10W72/952—
    • H10W74/127—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
TW092115874A 2003-02-14 2003-06-11 Electronic device and semiconductor device TW200428614A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2003/001526 WO2004073063A1 (fr) 2003-02-14 2003-02-14 Dispositif electronique et dispositif a semiconducteur

Publications (2)

Publication Number Publication Date
TW200428614A TW200428614A (en) 2004-12-16
TWI292208B true TWI292208B (fr) 2008-01-01

Family

ID=32866112

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092115874A TW200428614A (en) 2003-02-14 2003-06-11 Electronic device and semiconductor device

Country Status (3)

Country Link
JP (1) JP4137059B2 (fr)
TW (1) TW200428614A (fr)
WO (1) WO2004073063A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1746648A3 (fr) * 2005-07-22 2008-09-03 Marvell World Trade Ltd. Boîtier pour circuits à haute-fréquence
US20070018292A1 (en) 2005-07-22 2007-01-25 Sehat Sutardja Packaging for high speed integrated circuits
JP4770514B2 (ja) * 2006-02-27 2011-09-14 株式会社デンソー 電子装置
US9053950B2 (en) 2007-11-26 2015-06-09 Keio University Electronic circuit
US8571229B2 (en) * 2009-06-03 2013-10-29 Mediatek Inc. Semiconductor device
KR20120048875A (ko) * 2010-11-08 2012-05-16 삼성전자주식회사 노출 패들을 갖는 쿼드 플랫 패키지
JP2016174094A (ja) * 2015-03-17 2016-09-29 住友電工デバイス・イノベーション株式会社 半導体組立体
EP3088931B1 (fr) * 2015-04-30 2024-09-04 LG Innotek Co., Ltd. Appareil de déplacement de lentille, module de caméra et dispositif optique comprenant celui-ci
JP7684638B2 (ja) * 2022-03-29 2025-05-28 日電精密工業株式会社 半導体装置の製造方法及び半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0738011A (ja) * 1993-06-29 1995-02-07 Hitachi Ltd 半導体集積回路装置
KR100298692B1 (ko) * 1998-09-15 2001-10-27 마이클 디. 오브라이언 반도체패키지제조용리드프레임구조
JP3639505B2 (ja) * 2000-06-30 2005-04-20 インターナショナル・ビジネス・マシーンズ・コーポレーション プリント配線基板及び半導体装置
JP4319339B2 (ja) * 2000-08-30 2009-08-26 株式会社ルネサステクノロジ 半導体装置

Also Published As

Publication number Publication date
WO2004073063A1 (fr) 2004-08-26
JPWO2004073063A1 (ja) 2006-06-01
TW200428614A (en) 2004-12-16
JP4137059B2 (ja) 2008-08-20

Similar Documents

Publication Publication Date Title
US8126501B2 (en) Semiconductor device and electronic device
US11984423B2 (en) Radio frequency transmission line with finish plating on conductive layer
JP3874241B2 (ja) 電子部品および設計方法
US7149496B2 (en) High-frequency module and radio communication apparatus
JP5199307B2 (ja) 半導体装置
US7312511B2 (en) Semiconductor device with electrically isolated ground structures
TWI292208B (fr)
TWI283471B (en) Semiconductor device and electronic apparatus
CN100536123C (zh) 半导体器件和电子设备

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees