1289041 九、發明說明： 【發明所屬之技術領域】 晶片構件搭配數散熱 種筆記型電腦散熱裝 本發明係有關於以超導管和致冷 裝置’尤指係提供散熱效果極佳的一 置。 【先前技術】1289041 IX. Description of the Invention: [Technical Fields of the Invention] The heat dissipation of the wafer component and the heat dissipation type of the notebook computer The present invention relates to an excellent heat dissipation effect by the supercatheter and the cooling device. [Prior Art]
按，先行所知，筆記型電腦之構件遠比桌上型電腦之 ，件要小而精密’製造業者，危恐筆記型f腦在處敎作 時所產生的高溫會影響其巾t子料的壽命，尤其用於中 央處理糾上方裝置散熱片組和散熱風扇，必須要有效地 運轉及散熱’才能確鮮記型·正常之運作、然而，當 今全球電腦業者所推丨之筆記型電職品，在運算（轉） 速度上愈來躲，其巾央處理器賴算速度已導入超 2. 8Gf ’甚至將超越&霞的運算速度及&位元的中央 處理器，絲來的_勢，因此促使廠紅力投入散埶哭 的研發改良。㈣下業者所設計改㈣中央處理器散: ^都係針對散熱ϋ之散_片部料散熱風扇部份稱加 =良而已’各業者推出者都朗小異，基本上都並未在散 …效率上有大驗速的突破，影響筆記型電腦運作執 速度。 有鑑於此，杨發日狀乃基於上述弊端，仍積極努力 机、研究改良’並累積多年製造、生產經驗而终 一足以解決上述弊端之創作產生。 、、 【發明内容】 1289041 ^ 即，本發明一種筆記型電腦散熱裝置，其主要目的係 提供提高散熱效果，使筆記型電腦散熱速度快，而可維持 正常運作。 、、 本發明一種筆記型電腦散熱裝置，其主要目的係提供 可以凝聚水氣，並除冷凝水氣之冷凝吸附件，使水氣排除 於外，並供應冷源作有效對流。 緣是，本發明一種筆記型電腦散熱裝置，主要係包含 有· 、 • 一吸熱模塊，安裝於筆記型電腦之熱源散熱處； 傳熱模塊，上方搭接一橋模，橋模上方為一致冷晶 片及一冷源模塊； 一致冷晶片，一面為致冷面可產生冷源，另面為致熱 面可產生熱度，致冷面與冷源模塊貼合，致熱面與橋模貼 合; 一上方散熱杈組，具有複數之散熱片，以風扇吹走冷 氣，下方接設一下方散熱模組； ’ -τ謂賊組，具有複m邊#，以風扇吹走熱 氣； < 數支熱官，由吸熱模塊導入於傳熱模塊，再導入下方 散熱模組； 數支側管，由橋模導入於下方散熱模組； 數支冷官’由冷賴塊導人於上方散熱模組； 據此，由熱管將吸熱模塊與致冷晶片之致熱面之熱源 傳導至傳熱模塊與橋模，並至下方散熱模組作散熱動作， 1289041 再由致冷晶片以冷管傳導冷源至上方散熱模組，對下方散 熱模組、橋模、傳熱模塊、吸熱模塊降溫，以達到有效快 速地散熱。 為使貴審查委員，對本發明之内容、特徵及目的， 有者更進一步之瞭解與§忍同’兹舉一較佳實施例，並配合 圖式、圖號說明於后： 【實施方式】 茲就圖面詳述本發明之實施例如下： 首先，本發明一種筆記型電腦散熱裝置，如圖一至六 所示，主要係包含有一吸熱模塊i 〇、一傳熱模塊2 〇、 橋模3 0、一致冷晶片4 0、冷源模塊5 0、一上方散熱 模組6 0、一下方散熱模組7〇、數支熱管1 1、數支側 官31及數支冷管51，該吸熱模塊1〇安裝於筆記型電 腦之熱源散熱處，如本實施例為一筆記型電腦之中央處理 器（CPU) 1，吸熱模塊1 〇設有三個插孔i 2，該吸熱模塊 10鄰邊為一傳熱模塊2〇，傳熱模塊2〇亦設有三個插 孔21，該傳熱模塊2 0上方搭接一橋模3〇，該橋模3 0為拱橋形狀，橋模3〇上方為一致冷晶片4〇(如圖一 至五）及一冷源模塊5 〇，該致冷晶片4 〇另接電源，其 上面為致冷面41可產生冷源，下面為致熱面4 2相對產 生高溫熱能，致冷面41與冷源模塊5 〇貼合，致熱面4 2與橋模3 0貼合，由致冷晶片4 〇整體形成一具冷凍低 溫的塊體，俾可迅速降低冷源模塊5 〇溫度，迅速^到冷 卻、散熱的效果，橋模3 〇兩側各設有一插孔3 2，冷源 1289041 核塊5〇設有三個插孔52，冷源模塊5〇鄰邊為一上方 散熱模組6 〇 ; δ亥上方散熱模組具6〇有複數之散熱片（鰭片），上方 架設有風扇8 0，以風扇8 〇向下吹，吹走上方散熱模組 6 〇之冷氣，該上方散熱模組6 〇下方接設一下方散熱模 組7 0，該下方散_組7〇具有複數之散熱片（鰭片）， 羽8 〇可ρ人走熱氣，上方散熱模組6 〇設有三個插孔6 1下方放熱模組70設有五個插孔71，供熱管11、 側官31穿入，三支熱管11由吸熱模塊10導入於傳熱 2束2 〇 ’再導入下方散熱模組7 〇，兩支側管31由橋 ' 0;人於下方散熱模組7 〇，三支冷管51由冷源模 鬼5〇‘入於上方散熱模組60，該冷源模塊5〇上方外 罩一罩體9 0 (可為透明材質），該罩體9 0兩側内各形成 左流道91與右流道9 2 ; 其該熱管11與冷管51係以銅、銘或其他金屬製管之 體内植入可阿速傳熱的特殊金屬粉 :高溫熱管如:㈣等金屬粉末趣熱超 rf官如：钱），在其分子接受到熱量時，即會產生高度之 致官體冷凝段再回流，而使熱源以波動的方式快速 古專=料鲜舰_般金祕或散刻的熱傳速率 拾數倍以上；俾藉該熱管1 1 (冷管5 i )之具 (冷）的特性’能將位於該吸熱模塊1 〇上的 …、源,、、、此迅速傳遞至傳熱模塊2 〇上； 藉由上述之結構組合，本發明一種筆記型電腦散熱裝 1289041 置，使用本發明時，筆記型電腦之中央處理器（CPU) 1之熱 源，由吸熱模塊1〇將熱源傳導至三支熱管11，三支熱 管11再將熱源傳導至傳熱模塊2 0與橋模3〇，同時致 冷晶片4 0之致熱面4 2將熱源傳導至橋模3 〇與傳熱模 =2 0，由三支熱管i丄與兩側管3 i將熱源傳導至下方 散熱模組7 Q ’下方散熱模組7 0作散熱動作； 且致冷晶片4 0之致冷面41產生冷源至冷源模塊5 0冷源模塊5 0以三支冷管51傳導冷源至上方散熱模 組6 0，對下方散熱模組7〇、三支熱管1丄、兩側管3 1、橋模3 0、傳熱模塊2 〇及吸熱模塊丄〇，對中央處 理為1降溫’以達到有效快速地散熱； 由風扇80吹向上方散熱模組6〇，使冷氣向下至下 方散熱模組7 〇，作降溫散熱動作，且該罩體9 〇兩側内 成机道，使氣流由左側流道91進入，由右側流道9 2 流出； 本發明一種筆記型電腦散熱裝置，第二實施例係如圖 七所不，在該上方散熱模組6 〇兩側各設有一嵌入空間6 2 6 3，左側之嵌入空間6 2以入一左冷凝吸附件1〇 〇，該左冷凝吸附件1〇 0設有多層板塊1〇1，多層板 塊101外側設有一L型護壁1〇 2，護壁1〇 2下端設 =複數之立條1〇3，該下方散熱模組7 0右側設有一下 耿入空間（圖未示，位於嵌入空間6 3下方），上方散熱模 、、且6 〇右側之嵌入空間6 3與下方散熱模組之下嵌入空 間入一右冷凝吸附件11〇，該右冷凝吸附件1 1〇具 1289041 合於一立板1 i 3上/、1 板塊1 1 2，都結 ▲ 層之夕層板塊111外側有一筒體 蜗咖，相綱Π，該左冷凝吸附件i 〇 〇、 右冷凝吸料11Q都具有多層巍，有魏毛細孔可吸 附之，塊，為凝聚水氣，並除冷凝水氣之用； 當由風扇吹向上方散熱模組6 0，使冷氣向下至下方 政熱核組時7 〇，使氣流由左側之嵌入空間6 2進入，經 左冷凝吸附件10Q之多層板塊101，至罩體90左側 /’il道9 1，再至罩體9 〇右側流道9 2，入於右冷凝吸附 件1 10的開口i141，進入上層之多層板塊丄工工， 經通口115而排出，該下層之多脣板塊i i 2，則由下 方政熱模組7 0之氣流直接進入而排出，可以適當地予以 降溫，並凝聚水氣，加以排除水氣，避免水氣進入筆記型 電腦内； 本發明一種筆記型電腦散熱裝置，第三實施例係如圖 八所示，係改變第二實施例之左冷凝吸附件1 〇 〇與右冷 凝吸附件1 1〇，第三實施例之左冷凝吸附件1 2 〇之多 層板塊，分為内側之多層板塊121及外側之多層板塊1 2 2 ’中間以一L型護壁12 3結合，護壁12 3近後端 有一通口12 4，通口12 4貫通護壁12 3，外側之多 層板塊12 2外側有一筒體12 5，筒體12 5前端為開 ϋ12 51，後端為封閉，外側之多層板塊12 2下端設 1289041 、 有複數之立條126; 該右冷凝吸附件13 〇具有上層之多層板塊丄3丄、 下層之多層板塊1 3 2與外側之多·層板塊1 3 3，都結合 於一立板1 3 4，上層之多層板塊丄3 i有一筒體工3 5，筒體13 5前端為開口13 51，内面底部有一通口 136，通口136貫通立板13 4，該下層之多層板塊 13 2前端為封閉，後端為開口； §由風扇吹向上方散熱模組6 〇，使冷氣向下至下方 散熱模組7 0時，使氣流由左側之嵌入空間6 2進入，經 左冷凝吸附件12 0内側之多層板塊121經通口12 4 至外側之多層板塊12 2，至罩體9 0左側流道91，再 至罩體9 0右側流道9 2，入於右冷凝吸附件13 0的開 口13 51，進入上層之多層板塊131，經通口13 6 而至外側之多層板塊13 3排出，該下層之多層板塊13 2，則由下方散熱模組7〇之氣流直接進入而由後端排 出，可以適當地予以降溫，並凝聚水氣，加以排除水氣， 避免水氣進入筆記型電腦内； 綜上所述，本發明一種筆記蜇電腦散熱裝置，其新穎 性、實用性乃毋庸置疑，為此懇祈貴審查委員，一秉國 人努力創作初衷，賜准本案專利，則申請人是幸！ 1289041 【圖式簡單說明】 ΦAccording to the prior knowledge, the components of the notebook computer are far smaller than the desktop computer, and the parts are small and precise. The manufacturer’s high temperature will affect the temperature of the notebook. The longevity, especially for the central processing of the upper device heat sink and the cooling fan, must be effectively operated and dissipated to be able to accurately record the normal operation, however, today's global computer industry is pushing the notebook-type electric job Product, in the operation (transfer) speed is more and more hiding, its towel central processing speed has been introduced super 2. 8Gf 'will even surpass & Xia's computing speed and & bit of the central processor, silk _ potential, thus urging the factory to invest in research and development. (4) The design of the lower-level business is changed. (4) The central processing unit is scattered: ^There is a part of the heat-dissipating _ _ 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片...the efficiency has a breakthrough in speed, affecting the speed of notebook computer operation. In view of this, Yangfa Daily is based on the above-mentioned drawbacks, and is still actively working hard, researching and improving, and accumulating years of manufacturing and production experience, which is enough to solve the above-mentioned drawbacks. [Description of the Invention] 1289041 ^ That is, the notebook computer heat sink of the present invention mainly provides an improved heat dissipation effect, so that the notebook computer can dissipate heat quickly and maintain normal operation. The notebook computer heat dissipating device of the present invention mainly provides a condensing and adsorbing member which can condense water and gas and remove condensed water, so that the water gas is excluded, and the cold source is supplied for effective convection. The invention relates to a notebook computer heat sink device, which mainly comprises: a heat absorbing module installed in a heat sink of a notebook computer; a heat transfer module, a bridge module is overlapped above, and a uniform cold chip is above the bridge mold. And a cold source module; a uniform cold wafer, one side for the cooling surface can generate a cold source, the other side for the heating surface can generate heat, the cooling surface and the cold source module fit, the heating surface and the bridge mold fit; The upper heat-dissipating group has a plurality of heat sinks, and the fan blows away the cold air, and a lower heat-dissipating module is connected below; '-τ is a thief group, which has a complex m-side#, and blows away the hot air by the fan; < The official is introduced into the heat transfer module by the heat absorption module, and then introduced into the lower heat dissipation module; several side tubes are introduced into the lower heat dissipation module by the bridge mold; several cold officials are guided by the cold block to the upper heat dissipation module; According to this, the heat source of the heat absorbing module and the heating surface of the cooling chip is conducted to the heat transfer module and the bridge mold by the heat pipe, and the heat dissipation module is cooled to the lower heat dissipation module, and 1289041 is used to conduct the cold source to the cold tube by the cold tube. Square heat dissipation module The thermal module, the bridge module, the heat transfer module, and the heat absorption module are cooled to achieve effective and rapid heat dissipation. In order to enable the reviewing committee, the content, features and objects of the present invention are further understood and § 同 ' 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The following is a detailed description of the present invention. First, a notebook computer heat sink device, as shown in FIGS. 1 to 6, mainly includes a heat absorbing module i 〇, a heat transfer module 2 〇, and a bridge module 30. a uniform cold chip 40, a cold source module 50, an upper heat dissipation module 60, a lower heat dissipation module 7〇, a plurality of heat pipes 1 1 , a plurality of side officials 31 and a plurality of cold tubes 51, the heat absorption module 1〇 Installed in the heat sink of the notebook computer, as in this embodiment is a central processing unit (CPU) of a notebook computer, the heat absorbing module 1 is provided with three jacks i 2, and the adjacent side of the heat absorbing module 10 is The heat transfer module 2〇, the heat transfer module 2〇 is also provided with three jacks 21, and a heat transfer module 20 is overlapped with a bridge mold 3〇, the bridge mold 30 is in the shape of an arch bridge, and the bridge mold 3 is uniformly cold above. The wafer 4〇 (as shown in FIGS. 1 to 5) and a cold source module 5 〇, the cooled wafer 4 is connected The source, the cooling surface 41 thereon can generate a cold source, and the heating surface 42 2 generates high-temperature heat energy, the cooling surface 41 and the cold source module 5 〇 fit, the heating surface 4 2 and the bridge mold 3 0-fit, the cold-formed wafer 4 〇 integrally forms a block with freezing and low temperature, which can quickly reduce the temperature of the cold-source module 5 ,, and quickly achieve the cooling and heat-dissipating effect, and each side of the bridge mold 3 has a plug Hole 3 2, cold source 1289041 The core block 5〇 is provided with three jacks 52, the adjacent side of the cold source module 5 is an upper heat dissipation module 6 〇; the upper heat dissipation module has a plurality of fins (fin fins) The upper part is provided with a fan 80, and the fan 8 〇 is blown downward, blowing away the cold air of the upper heat dissipation module 6 ,, and the lower heat dissipation module 6 is connected with a lower heat dissipation module 70 below the lower heat dissipation module 6 _ group 7 〇 has a plurality of heat sinks (fins), feather 8 〇 can take hot air, upper heat dissipation module 6 〇 has three jacks 6 1 lower heat release module 70 has five jacks 71 for The heat pipe 11 and the side panel 31 are inserted, and the three heat pipes 11 are introduced into the heat transfer 2 bundle 2 〇' by the heat absorption module 10 and then introduced into the lower heat dissipation module 7 〇, the two sides The tube 31 is bridged by 0; the person is in the lower heat dissipation module 7 〇, and the three cold tubes 51 are inserted into the upper heat dissipation module 60 by the cold source mold 5, and the cold source module 5 is covered with a cover body 90 (can be a transparent material), the left side channel 91 and the right flow channel 9 2 are formed on both sides of the cover body 90; the heat pipe 11 and the cold pipe 51 are lined with copper, Ming or other metal tubes. Special metal powder that can be transferred to A-speed: high-temperature heat pipes such as: (4) Metal powders such as hot powder, such as: money), when the molecules receive heat, it will produce a high degree of condensation and recirculation of the body. And the heat source is quickly fluctuated in the way of the ancient special = fresh ship _ ordinary gold secret or scattered heat transfer rate is more than several times; 俾 by the heat pipe 1 1 (cold pipe 5 i ) with (cold) characteristics ' The ..., the source, and the ... on the heat absorbing module 1 can be quickly transferred to the heat transfer module 2 ;; by the above structural combination, the notebook computer heat sink 1289041 is set, when the invention is used The heat source of the central processing unit (CPU) 1 of the notebook computer, the heat source is transmitted from the heat absorbing module 1 to the three heat pipes 11 and the three heat pipes 11 The heat source is conducted to the heat transfer module 20 and the bridge mold 3, while the heat generating surface 4 of the cooled wafer 40 conducts the heat source to the bridge mold 3 传热 and the heat transfer mode = 20, which is composed of three heat pipes The two sides of the tube 3 i conduct heat to the lower heat dissipation module 7 Q 'lower heat dissipation module 70 for heat dissipation; and the cold surface 41 of the cooled wafer 40 generates a cold source to the cold source module 50 cold source module 5 0 conducts the cold source to the upper heat dissipation module 60 by three cold tubes 51, 7 〇, three heat pipes 1 丄, the side tubes 3 1 , the bridge mold 30, the heat transfer module 2 〇 and the heat absorption Module 丄〇, the central processing is 1 cooling to 'effectively and quickly dissipate heat; the fan 80 blows to the upper heat-dissipating module 6 〇, so that the cooling air is cooled down to the lower heat-dissipating module 7 〇, for cooling and cooling action, and the cover The body 9 is formed into a machine path on both sides, so that the airflow enters from the left flow channel 91 and flows out from the right flow channel 92. The notebook computer heat sink of the present invention, the second embodiment is as shown in FIG. The heat dissipation module 6 is provided with an embedding space 6 2 6 3 on both sides, and the left embedding space 6 2 is inserted into a left condensation adsorption member 1〇〇, the left The coagulation member 1〇0 is provided with a multi-layer plate 1〇1, and an outer layer of the multi-layer plate 101 is provided with an L-shaped protective wall 1〇2, and a lower end of the protective wall 1〇2 is provided with a plurality of vertical strips 1〇3, and the lower heat-dissipating module 7 0 is right. There is a space for intrusion (not shown, located below the embedded space 6.3), the upper heat-dissipating mold, and the embedded space 6 3 on the right side of the 6 与 and the space below the lower heat-dissipating module are embedded into the right condensing adsorption member 11〇 The right condensing adsorption member 1 1 cookware 1289041 is combined with a vertical plate 1 i 3 / 1 plate 1 1 2, and the outer layer of the layer ▲ layer has a cylindrical spiral coffee, the outline, the left The condensing adsorption member i 〇〇 and the right condensing suction material 11Q all have a plurality of layers of ruthenium, which are adsorbed by the pores of the Wei hair, and are used for condensing water and gas, and are used for removing the condensed water gas; when the fan is blown to the upper heat dissipation module 6 0, when the cold air is down to the lower thermal core group, 7 〇, so that the air flow enters from the embedded space 6 2 on the left side, through the multi-layer plate 101 of the left condensation adsorption member 10Q, to the left side of the cover 90 / 'il road 9 1 Then, the cover 9 〇 the right flow path 92, enters the opening i141 of the right condensing adsorption member 10, and enters the upper multi-layer plate. The worker is discharged through the port 115, and the lower lip block ii 2 is directly discharged by the airflow of the lower thermal module 70, and can be appropriately cooled, and the water is condensed to remove water. To prevent the moisture from entering the notebook computer; the notebook computer heat sink device of the present invention, the third embodiment is shown in Figure 8, which is to change the left condensation adsorption member 1 〇〇 and the right condensation adsorption member of the second embodiment. 1 1〇, the multi-layer plate of the left condensation adsorbing member 1 2 第三 of the third embodiment is divided into an inner multi-layer plate 121 and an outer multi-layer plate 1 2 2 'in the middle combined with an L-shaped retaining wall 12 3 , the retaining wall 12 3 is near The rear end has a port 12 4 , the port 12 4 extends through the retaining wall 12 3 , and the outer side of the multi-layer plate 12 2 has a tubular body 12 5 . The front end of the tubular body 12 5 is an opening 12 51 , and the rear end is closed, and the outer layer is 12 2, the lower end is provided with 1289041, and there are a plurality of vertical strips 126; the right condensation adsorbing member 13 has a multi-layered plate 丄3丄 of the upper layer, a multi-layered plate 133 of the lower layer, and a plurality of outer slabs 133 of the outer layer, all of which are combined Vertical plate 1 3 4, upper layer multi-layer plate 丄 3 i has a tube The front end of the cylinder 13 5 is an opening 13 51, the bottom of the inner surface has a through opening 136, and the opening 136 passes through the vertical plate 13 4 . The front end of the lower layer of the multi-layer plate 13 2 is closed, and the rear end is an opening; To the upper heat dissipation module 6 〇, when the cooling air is directed downward to the lower heat dissipation module 70, the air flow is entered from the left side embedded space 62, and the multi-layer plate 121 inside the left condensation adsorption member 120 is passed through the port 12 4 to The outer multi-layer plate 12 2, to the left side flow path 91 of the cover body 90, and then to the right side flow path 92 of the cover body 90, enters the opening 13 51 of the right condensation adsorption member 130, and enters the upper layer of the multi-layer plate 131. The opening 13 6 is discharged to the outer multi-layer plate 13 3 , and the lower layer multi-layer plate 13 2 is directly discharged by the airflow of the lower heat-dissipating module 7 , and is discharged from the rear end, and can be appropriately cooled and condensed. In order to eliminate water vapor, to prevent moisture from entering the notebook computer; in summary, the novelty and practicality of the notebook computer cooling device of the present invention are unquestionable, and therefore, the auditing committee member, Yi Bingguo Strive to create the original intention, grant the patent in this case, then apply Please be lucky! 1289041 [Simple description of the diagram] Φ
【圖式】 第一圖係本發明之立體示意圖。 第二圖係本發明之側視平面示意圖。 第三圖係本發明之風扇、冷源模塊水平向剖面示意圖。 第四圖係本發明之上方散熱模組、冷源模塊水平向剖面示 第五圖係本發明之冷源模塊 垂直向剖面示意圖。 、致冷晶片、橋模、傳熱模塊 第六圖係本發明之下方散熱模組、橋模、傳熱模塊水平向 剖面示意圖。 第七圖係本發明第二實施例之立體分解示意圖。 第八圖係本發明第三實施例之立體分解示意圖。 【主要元件符號說明】 1中央處理器 10吸熱模塊 1 1熱管 1 2插孔 2 0傳熱模塊 2 1插孔 3 0橋模 3 1側管 3 2插孔 4 0致冷晶片 4 1致冷面 4 2致熱面 5 0冷源模塊 5 1冷管 5 2插孔 6 0上方散熱模組 6 1插孔 6 2嵌入空間 1289041BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a perspective view of the present invention. The second drawing is a schematic side plan view of the present invention. The third figure is a horizontal cross-sectional view of the fan and cold source module of the present invention. The fourth figure is a horizontal cross-sectional view of the upper heat dissipation module and the cold source module of the present invention. The fifth figure is a vertical cross-sectional view of the cold source module of the present invention. Cooling wafer, bridge mold, heat transfer module The sixth figure is a horizontal cross-sectional view of the lower heat dissipation module, bridge mold and heat transfer module of the present invention. Figure 7 is a perspective exploded view of a second embodiment of the present invention. Figure 8 is a perspective exploded view of a third embodiment of the present invention. [Main component symbol description] 1 central processor 10 heat absorbing module 1 1 heat pipe 1 2 jack 2 0 heat transfer module 2 1 jack 3 0 bridge mode 3 1 side tube 3 2 jack 4 0 cold chip 4 1 refrigeration Face 4 2 heating surface 5 0 cold source module 5 1 cold tube 5 2 jack 6 0 above heat dissipation module 6 1 jack 6 2 embedded space 1289041
6 3嵌入空間 7 1插孔 9 0罩體 9 2右流道 1 0 1多層板塊 1 0 3立條 1 1 1多層板塊 1 1 3立板 1 1 4 1 開口 1 2 0左冷凝吸附件 1 2 2外側之多層板塊 1 2 4通口 1 2 5 1 開口 1 3 0右冷凝吸附件 1 3 2下層之多層板塊 1 3 4立板 1 3 5 1 開口 7 0下方散熱模組 8 0風扇 9 1左流道 1 0 0左冷凝吸附件 1 0 2護壁 1 10右冷凝吸附件 1 12下層之多層板塊 1 1 4筒體 1 1 5通口 1 2 1多層板塊 1 2 3護壁 1 2 5筒體 1 2 6立條 1 31上層之多層板塊 1 3 3外側之多層板塊 1 3 5筒體 1 3 6通口6 3 embedded space 7 1 jack 9 0 cover 9 2 right flow channel 1 0 1 multi-layer plate 1 0 3 vertical bar 1 1 1 multi-layer plate 1 1 3 vertical plate 1 1 4 1 opening 1 2 0 left condensation adsorption member 1 2 2 outer multi-layer plate 1 2 4 port 1 2 5 1 opening 1 3 0 right condensation adsorber 1 3 2 lower layer multi-layer plate 1 3 4 vertical plate 1 3 5 1 opening 7 0 lower heat dissipation module 8 0 fan 9 1 left flow channel 1 0 0 left condensation adsorption member 1 0 2 protection wall 1 10 right condensation adsorption member 1 12 lower layer multilayer plate 1 1 4 cylinder 1 1 5 port 1 2 1 multi-layer plate 1 2 3 wall 1 2 5 tube Body 1 2 6 vertical strip 1 31 upper layer multi-layer plate 1 3 3 outer multi-layer plate 1 3 5 cylinder 1 3 6 port