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TWI288963B - Holder device for plated substance in physical vapor deposition sputtering machine - Google Patents

Holder device for plated substance in physical vapor deposition sputtering machine Download PDF

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Publication number
TWI288963B
TWI288963B TW94124273A TW94124273A TWI288963B TW I288963 B TWI288963 B TW I288963B TW 94124273 A TW94124273 A TW 94124273A TW 94124273 A TW94124273 A TW 94124273A TW I288963 B TWI288963 B TW I288963B
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Taiwan
Prior art keywords
vapor deposition
chassis
plated
fixed
rotating
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TW94124273A
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Chinese (zh)
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TW200705598A (en
Inventor
De-Kuen Lin
Original Assignee
Lin Hung Ching
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Priority to TW94124273A priority Critical patent/TWI288963B/en
Publication of TW200705598A publication Critical patent/TW200705598A/en
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Publication of TWI288963B publication Critical patent/TWI288963B/en

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Abstract

The invention provides a holder device for plated substance in physical vapor deposition sputtering machine. The holder device is installed in the interior of a sputtering machine for holding the plated substance. It comprises a transmission mechanism and a fastening mechanism. The transmission mechanism has a stationary shaft and a transmission component connected with the stationary shaft. The fastening mechanism has a revolving spindle non-parallelly installed with the stationary shaft of transmission mechanism, a supporting arm for holding the revolving spindle, and a turntable component to drive the revolving spindle and the supporting arm to perform the rotating motion around the transmission mechanism. Both ends of the revolving spindle are connected with a rotating component and a fixed stand separately. It can produce slanted rotation for the fixed stand by rotating the transmission component and the rotating component cooperatively. It can sputter the nano-ions uniformly and continuously onto the surface of plated substance. It can increase the surface hardness and the mechanical properties such as wear-resistance of the plated substance and extend the service life.

Description

12889631288963

【發明所屬之技術領域】 本發明是有關於一種物理氣相 持裝置,尤指一種裝設於蒸鍍機 持者。 沉積蒸鍍機之被鍍物固 部用以供被鍍物置設固 【先前技術】 目前在裝 等表面處理上 vapor deposi 覆,藉以增加 壽命,然如何 鍍物之表面上 已成為從事該 習知物理 民國專利公告 要包括有一固 轉軸,於各該 座係用以供被 _作公轉運動外 (Sputtering) 然而,習 在實際使用上 直立狀旋轉, 米離子,且此 飾品、餐具、刀 ’已大量利用物 tion,PVD)來對 被鐘物的耐熱、 將此等奈米離子 ’以大幅增加其 項行業之相關人 氣相沉積蒸錢機 第5 1 2 1 81號揭示 定軸及多數平行 旋轉軸之上方連 鍍物插設固持, ’本身亦作自轉 的奈米離子得以 知物理氣相沉積 仍存在有下述之 使該被鍍物的披 種物理氣相沉積 具、工具、模具半導 理氣相沉積(physica 被鍍物表面進行奈米 耐餘、表面硬度及延 以連續性均勻方式坡 機械性質及延長使用 士所研究之重要課題 之被鍍物固持裝置, ’其中該被鍍物固持 於固定軸且設於其上 接有一錐形固接座, 各該固接座除了繞著 運動,以令濺鍍靶所 披覆於被鍍物之表面 蒸鑛機之被鑛物固持 問題點,由於該固接 覆過程以不連續方式 之蒸鍍溫度低,並不 體元件 1 離子坡 長使用 覆在被 如中華 裝置主 方之旋 該固接 固定軸 賤擊 上。 裝置, 座係呈 覆蓋奈 具有擴BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a physical gas holding device, and more particularly to a vapor deposition machine. The solid part of the deposition of the deposition vaporizer is used for solidifying the object to be plated. [Prior Art] At present, the vapor deposi coating is applied on the surface treatment to increase the life, and how the surface of the plating has become the conventional one. The physical public country patent announcement shall include a fixed shaft, which is used for the slewing movement (Sputtering). However, it is used in the actual use of upright rotation, rice ions, and this jewelry, tableware, knife 'has A large number of use of the material, PVD) to the heat of the object, such nano-Ion to significantly increase the industry's related people vapor deposition vaporizer 5 1 2 1 81 revealed the fixed axis and most parallel rotation Above the shaft, the plating is inserted and held, and the nano ions that are also self-rotating are known to have physical vapor deposition. The following physical vapor deposition tools, tools, and molds are used to make the substrate. Vapor deposition (physica-coated surface for nano-resistance, surface hardness, and continuous uniformity of slope mechanical properties and prolonged use of the object to be studied Positioning, 'where the object to be plated is fixed on the fixed shaft and is provided with a tapered fixing seat thereon, and the fixing seat is moved around, so that the sputtering target is covered on the surface of the object to be plated. The mineralizer is held by the minerals. Because the vapor deposition temperature of the fixed coating process is low in a discontinuous manner, the ion length of the element 1 is not covered by the main axis of the Chinese device. Hit. The device, the pedestal is covered with expansion

第5頁 1288963 五、發明說明(2)Page 5 1288963 V. Description of invention (2)

散結合之作用,導致該被鍍物之鍍膜厚度不均勻及結合性 差,另’對於細長形或體積稍大之被鍍物,該等被鍍物將 產生相互間之遮蔽現象,而使離子顆粒產生附著不均勻等 不良現象;又,由於該奈米離子係呈拋物線方式向下掉 落’使付被鍵物上方之區域吸附(A d s 0 r p t i 〇 n)較多的離 子,而下方則僅吸附微量離子,而形成被鍍物之披覆層厚 度嚴重不平均;再者,由於該固接座除了繞著固定軸作公 轉運動外,本身亦作自轉運動,因此使得固持裝置之結構 相當複雜’而令製造成本無法有效獲得降低。 於是,本發明人有感於上述問題點及從事該行業多年 之經驗,並針對可進行改善之問題點,乃潛心研究配合實 際之運用,本著精益求精之精神,終於提出一種設計合理 且有效改善上述問題點之本發明。 【發明内容】 本發明之主要目的,在於裎根 ^ ^ m ^ ^ 他 ^ ^ u 牡%故供一種物理氣相沉積蒗鍍 機之被鍍物固持裝置,盆捭剎田m〜I 貝…敕 # 、,入^ 八係利用固定軸與旋轉軸呈非平行 5又置’並々該固接座產生傾斜你# p 、由成A U政 斜狀疑轉運動,可將奈米離子 連、,、只均勻披覆於被鑛物之表面上, ^ ^ , ^ ^ , 上 以增加被鍵物之表面硬 度、耐磨性等機械性質及延長使用壽命。 更 為達上述之目的,本發明你 鍍機之被鍍物固持裝置,該固持置$ ^ :虱巧’儿積瘵 部,用以對被鑛物置設固持,=. 备鑛機内 -傳動機構,具有一固定轴及.一連接於固定轴之傳動The effect of the combination of the dispersion causes the coating thickness of the object to be plated to be uneven and the bonding property is poor. In addition, for the elongated or slightly larger objects to be plated, the objects to be plated will be shielded from each other, and the ionic particles are caused. It causes undesirable phenomena such as uneven adhesion; in addition, since the nano-ion is dropped downward in a parabolic manner, the ions in the upper region of the bonded object are adsorbed (A ds 0 rpti 〇n), while the lower portion is only The thickness of the coating layer is very uneven, and the thickness of the coating layer forming the object to be plated is seriously uneven. Moreover, since the fixing base rotates around the fixed axis, it also rotates by itself, thus making the structure of the holding device quite complicated. 'And the manufacturing costs can not be effectively reduced. Therefore, the inventor has felt the above problems and years of experience in the industry, and focused on the problems that can be improved. He is concentrating on research and practical application. In the spirit of excellence, he finally proposes a reasonable and effective design. The present invention is the above problem. SUMMARY OF THE INVENTION The main object of the present invention is to provide a physical vapor deposition deposition apparatus for a substrate holding device, a pothole brake field m~I shell...敕#,, into ^ Eight series use the fixed axis and the rotating axis are non-parallel 5 and set 'and 々 々 固 固 # # # # # # # # # # # # # # # # # # # AU AU AU AU AU AU AU AU AU AU AU AU AU AU AU AU AU AU It is evenly coated on the surface of the mineral, ^ ^ , ^ ^ , to increase the mechanical properties such as surface hardness and wear resistance of the material and prolong the service life. For the above purpose, the present invention is a plating object holding device of the plating machine, and the holding device is placed at a position of a metal for holding the mineral, and the inside of the machine is equipped with a transmission mechanism. , having a fixed shaft and a transmission connected to the fixed shaft

1288963 五、發明說明(3) 元件;以及 行設構,具有—與傳動機構之固定站 ϊ:ίί擇臂繞著傳動機構進行ίϊϋ!Γ及—帶動旋 動之二端分別連接-轉動件及-固接:盤構件,於 轉連勳進而達成上述之目的。 压產生傾斜狀旋 Φ 【實施方式】 有關本發明之特徵及技術内容, 附圖,而所附圖示僅提供;七下之詳細說 發明加以限制者。 可〜°兄明,亚非用來對本 明苓閱第一、二及三圖所示 施例應用於蒸鑛機之組合示意圖、;;第-實 沉積蒸鑛機之被鑛物固持裝置,該固;種乂理氣相 蒸鍍機内部,用以根、士你仏班 、衣置1係衣δ又於一 機槿η另, ㈣物置設固持’主要包括有一傳動 機構11及至少一固接機構1 2,其中: 人右:2機構11係固設於蒸鍍機之内部頂面上,且其包 二固定m11。1及一連接於固定軸111之傳動元件112, Γ ^ ^ 糸主縱向鉛直狀設置,而該傳動元件1 1 2則可 為斜齒輪或斜錐輪等具有提供轉動之元件或裝置。 該固接機構12包含有一與傳動機構u之固定軸lu呈 非平行設置之旋轉軸121、一用以固持旋轉軸121之支撐臂1288963 V. INSTRUCTIONS (3) Components; and row configuration, with - fixed station with the transmission mechanism: ί 择 择 择 绕 绕 绕 绕 绕 绕 绕 绕 绕 绕 绕 绕 绕 绕 绕 绕 绕 绕 绕 绕 绕 绕 绕 绕 绕 — — — — — — — — — — — — - Fixed: The disc member is used in the transfer to achieve the above purpose. The pressure produces a slanting Φ [Embodiment] The features and technical contents of the present invention are shown in the accompanying drawings, and the accompanying drawings are only provided; ~ ° Brother, the use of the examples shown in the first, second and third diagrams of the Ming and Qing dynasty to apply to the combination of the steamer,; the mineral holding device of the first-deposited steamer, Solid; kind of 乂 气相 气相 内部 内部 , , , , 根 根 根 根 根 根 根 根 根 根 根 根 根 根 根 根 根 根 根 根 根 根 根 根 根 根 根 根 根 根 根 根 根 根 根 内部 内部 内部 内部 内部 内部 内部 内部The mechanism 1 2, wherein: the person right: 2 mechanism 11 is fixed on the inner top surface of the vapor deposition machine, and the package 2 is fixed by m11. 1 and a transmission element 112 connected to the fixed shaft 111, Γ ^ ^ 糸The longitudinal direction is vertically disposed, and the transmission element 112 can be a component or device that provides rotation, such as a helical gear or a tapered cone. The fixing mechanism 12 includes a rotating shaft 121 disposed non-parallel to the fixed shaft lu of the transmission mechanism u, and a supporting arm for holding the rotating shaft 121.

第7頁 1288963 五、發明說明(4) 一 "—-—— 122及一帶動旋轉軸121與支樓臂122繞著傳動機構丨丨進行 ,轉運動之轉盤構件123 ;該旋轉軸121與固定軸ηι之内 ^角係介於5。〜90。之間,其中該内失角在15。〜“。; 二佳,於忒旋轉軸1 2 1之二端分別供一轉動件1 2 4及一固接 座125^連接,該轉動件124係與傳動元件112相互配合轉 動藉以使该固接座1 2 5得以產生傾斜狀旋轉運動,該轉 動件1 24亦係可為斜齒輪或斜錐輪等具有提供轉動之元件 或裝置。 ^ 該固接座丨25(如第三圖所示)包含有一底盤1251、一 第一插盤1252、一第二插盤1253及一環體1254,該底盤 1 2 5之中心係與旋轉軸1 2 1相互鎖固連接,且於其上方處分 別設有第一插盤丨252及第二插盤1 2 53,而該環體1 2 54則係 %繞於底盤1251、第一插盤1252及第二插盤1253之外部周 圍,並於底盤1251與第一插盤1252及第一插盤1252與第二 插盤1 2 5 3間分別形成有間隔空間丨2 5 5。另者,於該第一插 盤1 2 5 2及第二插盤1 2 5 3上分別開設有多數插接孔1 2 5 6、 1256 ’且各該插盤1252、1253之插接孔1256、1256,係為 對應。又置’以使被鑛物得以穩固插設連接於固接座1 2 5之' •插接孔1256、1256’中。再者,於該底盤1251及環體1254 上分別開設有多數穿孔1 2 57,、1 2 5 7,令被鍍物於製作過 程中,可達成熱量散逸之效果,以提昇被鍍物之製程品 質。 ^ 而該轉盤構件123係由一圓形轉盤1231及一連接於轉 盤1231底部之轉軸1 232所構成,於該轉盤1231之外周緣處Page 7 1288963 V. Description of the Invention (4) A "--- 122 and a rotating rotating shaft 121 and the branch arm 122 are rotated around the transmission mechanism ,, the rotating rotating plate member 123; the rotating shaft 121 and The angle within the fixed axis ηι is between 5. ~90. Between, where the inner corner is at 15. ~ ";; two good, the two ends of the rotating shaft 1 2 1 are respectively connected to a rotating member 1 2 4 and a fixed seat 125 ^, the rotating member 124 is coupled with the transmission member 112 to rotate the solid The socket 1 2 5 is capable of producing a tilting rotational motion, and the rotating member 14 can also be a component or device that provides rotation, such as a helical gear or a tapered cone. ^ The fixed seat 25 (as shown in the third figure) The chassis 1251 includes a chassis 1251, a first insertion tray 1252, a second insertion tray 1253, and a ring body 1254. The center of the chassis 1 2 5 is interlocked with the rotating shaft 1 2 1 and is respectively disposed above the chassis There is a first insert 丨252 and a second insert 1 2 53, and the ring body 1 2 54 is around the outer periphery of the chassis 1251, the first insert 1252 and the second insert 1253, and is mounted on the chassis 1251. A space 丨 2 5 5 is formed between the first platter 1252 and the first platter 1252 and the second platter 1 2 5 3 . The first platter 1 2 5 2 and the second platter are respectively formed. 1 2 5 3 is respectively provided with a plurality of insertion holes 1 2 5 6 and 1256 ' and the insertion holes 1256 and 1256 of the insertion holes 1252 and 1253 are correspondingly arranged. It can be firmly inserted into the 'plug holes 1256, 1256' of the fixed socket 1 2 5 . Further, a plurality of perforations 1 2 57 , 1 2 5 7 are respectively opened on the chassis 1251 and the ring body 1254. In order to improve the process quality of the object to be plated, the plate member 123 is composed of a circular turntable 1231 and a rotating shaft 1 232 connected to the bottom of the turntable 1231. Constructed at the periphery of the turntable 1231

第8頁 Ϊ288963Page 8 Ϊ288963

:接有支樓臂i22,而轉轴1 232則係連接 薏(圖未示^,並電連接於一偏壓電源供應、^寺驅動裝 友、發明說明(5) 使用時係可將銑刀、鑽頭(針)或1他:插 尺寸之刀工具等被鍍物插設固持於固接;種不同形狀、 具有電弧電源供應器3、濺物上,而該g 鳗入口 6及氣體抽出裝置7,該電弧 :衣置5、軋 電弧搶31 ,而該離子裝置5传為—’j'、心'态3連接有一 裝置7係為-幫浦,將二二m另該氣體抽出 …之間,利用離子裝置5打出離=洗 =以,弧搶31將奈米離子自濺錢革巴4以拋 擊 離:/置一5:輔助,將電弧運作後 #順芸太^ :做_人更小的細化,而該固接座1 2 5則 掉落之方向作傾斜狀旋轉運動,以令 ,4不未離子得以均勻且連續披覆於被鍍物之表面上,最 ^ ’再從氣體入口6處通入含氮、碳氣體,並施 業即可完成鍍層之製作。 杳請參閱第四及五圖所示,係分別為本發明之固接座另 一貫施例及又一實施例組合剖視圖,本發明之固接座丨2 5 除可為上述實施例之型態外,該固接座丨25可由一底盤 1251、一没於底盤1251上方之第一插盤1252及一設於底盤 1251及第一插盤1 252之外部周圍之環體1 254所構成,於該 底i 1 2 5 1、弟一插盤1 2 5 2及環體1 2 5 4間係形成有一間隔空 間1 255,於該第一插盤1 252上設有多數插接孔1 2 56,而該: There is a support arm i22, and the rotating shaft 1 232 is connected to the 薏 (not shown in the figure, and is electrically connected to a bias power supply, ^ Temple drive installer, invention instructions (5) can be used when milling Knife, drill bit (needle) or 1 he: inserting size knife tool and other objects are inserted and fixed in the fixed; different shapes, with arc power supply 3, splash, and the g 鳗 inlet 6 and gas extraction Device 7, the arc: clothing 5, rolling arc grab 31, and the ion device 5 is transmitted as - 'j', heart 'state 3 connected with a device 7 is a - pump, two or two m other gas is extracted... Between the use of the ion device 5 to shoot out = wash = to, the arc grab 31 to the nano-ion from the splash money 4 to throw away: / set a 5: auxiliary, after the arc operation #顺芸太^: do _ The smaller the refinement of the person, and the fixed seat 1 2 5 is tilted and rotated in the direction of the drop so that the 4 non-ion ions are evenly and continuously coated on the surface of the object to be plated, the most Then, the nitrogen and carbon gases are introduced from the gas inlet 6, and the plating can be completed by the application. 杳 Please refer to the fourth and fifth figures, respectively, which are the fixed seats of the present invention. The fixed embodiment and the further embodiment of the combination of the cross-sectional view, in addition to the type of the above embodiment, the fixed seat 25 can be a chassis 1251, a topless than the chassis 1251 a plug 1252 and a ring body 1 254 disposed around the outer periphery of the chassis 1251 and the first insert 1 252, at the bottom i 1 2 5 1 , the first insert 1 2 5 2 and the ring body 1 2 5 4 is formed with a space 1 255, and a plurality of insertion holes 1 2 56 are disposed on the first tray 1 252, and the

第9頁 1288963 五、發明說明(6) 底盤1251上則設有多數穿孔1 257,及多數凹槽1 2 58,該等 凹槽1 2 5 8係分別與各該插接孔1 2 5 6對應設置,藉以供被鍍 物插設固定(如第四圖所示)。另針對各種不同形狀或尺寸 之被鍍物,亦可在該底盤1 2 5 1上直接延伸設有多數凸柱 1 259及開設有穿孔1 257,,該等凸柱1 259係供具有孔洞之 被錢物插設連接(如第五圖所示)。Page 9 1288963 V. Description of the Invention (6) The chassis 1251 is provided with a plurality of perforations 1 257, and a plurality of grooves 1 2 58 are respectively associated with the respective insertion holes 1 2 5 6 Corresponding settings, so that the object to be plated is fixed (as shown in the fourth figure). Further, for various objects of different shapes or sizes, a plurality of protrusions 1 259 and a perforation 1 257 may be directly extended on the chassis 1 251, and the protrusions 1 259 are provided with holes. Connected by money object (as shown in the fifth figure).

睛參閱第六圖所示,係 鍵機之組合示意圖,本發明 例單組設置外,亦可由複數 固接機構1 2係為等間隔對應 行旋轉運動,並令各該固接 成運轉過程中之受力平衡及 本發明物理氣相沉積蒸 可改善習用之種種缺點,並 座係呈傾斜狀旋轉,得以順 掉落’並在被鍍物之表面以 令被鍍物之鍍膜厚度均勻及 裝置結構簡單,製造成本低 者,本發明之固持裝置不受 被鐵物,更增使用之廣泛性 綜上所述,當知本發明 物固持裝置已具有產業利用 月之構造亦不曾見於同類產 於諸類刊物上,完全符合發 為本發明第二實施例應用於蒸 之固接機構12除可為上述實施 組固接機構12所構成,且各該 設置’且係繞著傳動機構Π進 座125產生旋轉運動,藉以達 增加生產速度。 鍍機之被鍍物固持裝置,不僅 具有下述之優點:由於該固定 向承接奈米離子拋物線方式之 連續性方式覆蓋奈米離子,以 、结合性佳;另,本發明之固持 廉及維修方面亦相當容易;再 限於不同形狀、構造、尺寸之 及適用範圍。 之物理氣相沉積蒸鍍機之被鍍 性、新穎性與進步性,又本發 品及公開使用,申請前更未見 明專利申請要件。Referring to the sixth figure, the combination diagram of the keying machine, in addition to the single-group setting of the present invention, may also be rotated by the plurality of fixing mechanisms 12 at equal intervals, and each of the fixings is in operation. The force balance and the physical vapor deposition steaming of the present invention can improve various disadvantages of the conventional use, and the seat system rotates in a slanting manner, and can be smoothly dropped and placed on the surface of the object to be coated to make the coating thickness of the object to be plated uniform and the device The structure is simple, and the manufacturing cost is low. The holding device of the present invention is not affected by the extensive use of the iron material, and the use of the present invention has not been seen in the same kind of production. In the various publications, the second embodiment of the present invention is fully applicable to the steaming fastening mechanism 12, which may be constituted by the above-mentioned implementation group fixing mechanism 12, and each of the installations 'is entangled around the transmission mechanism. 125 produces a rotational motion to increase production speed. The object holding device of the plating machine not only has the following advantages: the nanometer ion is covered in a continuous manner to support the nano-ion parabolic method, and the bonding property is good; in addition, the invention is inexpensive and maintenance The aspect is also quite easy; it is limited to different shapes, configurations, dimensions and scope of application. The physical properties of the physical vapor deposition vapor deposition machine, the novelty and the advancement of the product, and the public use of the product, the patent application requirements are not seen before the application.

第10頁 1288963 五、發明說明(7) 惟以上所述者,僅為本發明之較佳實施例而已,當不 能以此限定本發明實施之範圍;故,凡依本發明申請專利 範圍及發明說明書内容所作之簡單的等效變化與修飾,皆 應仍屬本發明專利涵蓋之範圍内。 ►Page 10 129896. V. OBJECTS OF THE INVENTION (7) The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto; therefore, the scope and invention of the invention according to the present invention The simple equivalent changes and modifications made to the contents of the specification are still within the scope of the invention. ►

第11頁 1288963 圖式簡單說明 【圖式簡單說明】 第一圖係本發明第一實施例應用於蒸鍍機之組合示意 圖。 第二圖係本發明第一實施例應用於蒸鍍機之使用狀態 圖。 第三圖係第二圖之固接座與被鍍物組合剖視圖。 第四圖係本發明之固接座另一實施例組合剖視圖。 第五圖係本發明之固接座又一實施例組合剖視圖。 第六圖係本發明第二實施例應用於蒸鍍機之組合示意 圖。 主要元件符號說明】 本發明】 固定軸111 固接機構12 支撐臂122 轉盤1231 轉動件1 2 4 底盤1251 第二插盤1 2 5 3 間隔空間1 2 5 5 穿孔 1 2 5 7,1 2 5 7 ’ 凸柱1 2 5 9 固持裝置1 傳動機構11 傳動元件11 2 旋轉軸1 21 轉盤構件1 2 3 轉軸1 2 3 2 固定座1 2 5 第一插盤1 2 5 2 環體1254 插接孔 1 2 5 6,1 2 5 6 ’ 凹槽1258Page 11 1288963 Brief Description of the Drawings [Simple Description of the Drawings] The first drawing is a schematic diagram of the combination of the first embodiment of the present invention applied to an evaporation machine. The second drawing is a diagram showing the state of use of the first embodiment of the present invention applied to an evaporation machine. The third figure is a sectional view of the combination of the fixed seat and the object to be plated in the second figure. Figure 4 is a cross-sectional view showing another embodiment of the fixing base of the present invention. Figure 5 is a cross-sectional view showing another embodiment of the fixing base of the present invention. Fig. 6 is a schematic view showing the combination of the second embodiment of the present invention applied to an evaporation machine. DESCRIPTION OF KEY SYMBOLS] The present invention] Fixed shaft 111 Fixing mechanism 12 Support arm 122 Turntable 1231 Rotating member 1 2 4 Chassis 1251 Second insert 1 2 5 3 Space 1 2 5 5 Perforation 1 2 5 7,1 2 5 7 'Column 1 2 5 9 Holding device 1 Transmission mechanism 11 Transmission element 11 2 Rotary shaft 1 21 Turntable member 1 2 3 Rotary shaft 1 2 3 2 Mounting bracket 1 2 5 First insert 1 2 5 2 Ring body 1254 Plug Hole 1 2 5 6,1 2 5 6 ' groove 1258

第12頁 1288963 圖式簡單說明 偏壓電源供應器2 電弧電源供應器3 電弧槍31 濺鍍靶4 離子裝置5 氣體入口 6 氣體抽出裝置7Page 12 1288963 Brief description of the diagram Bias power supply 2 Arc power supply 3 Arc gun 31 Sputter target 4 Ion device 5 Gas inlet 6 Gas extraction device 7

第13頁Page 13

Claims (1)

1288963 六、申請專利範圍 1. '一種物理氣相 持裝置係裝設於一蒸 包括: 元件; 至 非平行 動旋轉 件,於 轉動件 斜狀旋 2· 之被鍍 直狀設 3. 之被鍍 之旋轉 4. 之被 之旋轉 5· 之被鍍 之任一 傳動機 以及 少/固 設置之 軸與支 該旋轉 係與傳 轉運動 依申請 物固持 置。 依申請 物固持 軸的内 依申請 物固持 轴的 依申請 物固持 種。 依申請 構,具 接機構 旋轉轴 撐臂繞 軸之二 動元件 〇 專利範 裝置, 專利範 裝置, 夹角係 專利範 裝置, 爽角係 專利範 裝置, 專 利範 /儿積瘵鍍機之被鍍物固持裝置,該固 鍍機内部,用以供被鍍物置設固持, 有一固定軸及一連接於固定轴之傳動 ’具有一舆所述傳動機構之固定輛呈 三一用以固持旋轉軸之支撐臂及—帶 t傳動機構進行旋轉運動之轉盤構 端分別連接一轉動件及一固接座,該 相互配合轉動,以使該固接座產生傾 圍第L項所述之物理氣相沉積蒸鍍機 其中該傳動機構之固定軸係呈縱向鉛 圍第1項所述之物理氣相沉積蒸鍍 其中該傳動機構之固定軸與固接 介於5。〜90。之間。 成構 圍第3項所述之物理氣相沉積蒸鍍 其中該傳動機構之固定軸與固接機構 介於15。〜45。之間。 稱 圍第1項所述之物理氣相沉積蒸鍍機 其中該傳動元件係為斜齒輪或斜錐輪 圍第1項所述之物理氣相沉積蒸鍍機1288963 VI. Patent Application Range 1. 'A physical gas phase holding device is installed in a steaming comprising: an element; a non-flat moving rotating member, which is plated in a straight shape on the rotating member. Rotating 4. Rotating any of the conveyors that are rotated 5· and the shafts that are less/solidally set and the rotating system and the transfer motion are held by the application. Depending on the application holding axis, the application holds the shaft depending on the application. According to the application structure, the two-acting component of the rotating shaft arm of the connecting mechanism, the patented device, the patented device, the angled patent device, the refreshing patent device, the patent fan/child 瘵 plating machine a plating holding device, the inside of the plating machine is used for holding the object to be plated, and has a fixed shaft and a transmission connected to the fixed shaft. The fixed vehicle having the transmission mechanism is three-one for holding the rotating shaft. The support arm and the turntable end of the rotary motion of the t-transmission mechanism are respectively connected to a rotating member and a fixed seat, and the mutual cooperation rotates, so that the fixed seat generates the physical gas phase as described in item L. In the deposition vapor deposition machine, the fixed shaft of the transmission mechanism is in the form of a longitudinal lead. The physical vapor deposition evaporation described in item 1 wherein the fixed axis of the transmission mechanism is fixed to 5. ~90. between. Forming the physical vapor deposition evaporation described in item 3, wherein the fixed shaft and the fixing mechanism of the transmission mechanism are between 15. ~45. between. The physical vapor deposition vapor deposition machine according to Item 1, wherein the transmission component is a helical vapor or a tapered cone wheel, and the physical vapor deposition vapor deposition machine described in item 1 is used. 9.依申 之被鍍物固 數穿孔。 I 〇·依申 之被鍍物固 該第二插盤 插盤間分別 II ·依申 之被鑛物固 而該第一插 對應設置。 12·依申 之被鍍物固 1288963 六、申請專利範圍 ^一^ 之被鐘物固持裝置,其中兮固接機構之固接座係包含有一 底盤、一設於底盤上方並與底盤間形成有間隔空間之第一 插盤及一環設於底盤與第一插盤之環體。 7 ·依申請專利範圍苐6項所述之物理氣相沉積蒸鍍機 之被鍍物固持裝置,其中該第/插盤上設有多數插接孔, 而該底盤上則設有多數凹該凹槽係與插接孔對應設 置。 " 8 ·依申請專利範圍第6項所述之物理氣相沉積蒸鍍機 之被鐘物固持裝置,其中該第〆插盤上設有多數插接孔, 而该底盤上則設有多數凸柱,該凸柱係與插接孔對應設 置。 請專利範圍第6項所述之物理氣相沉積蒸鍍機 持裝置,其中於該底盤及環體上分別開設有多 請專利範圍第6項所述之物理氣相沉積蒸鍍機 持裝置,其中該固接座更包含有一第二插盤, 係介於第一插盤與底盤之間,並與底盤及第一 形成有間隔空間。 請專利範圍第1〇項所述之物理氣相 ;裝置…該第二插盤上設有多數插接: 盤上亦設有多婁t插接孔’各該插Μ之插接孔係 請專利範圍第1項所述之物¥ # -^ ^ i + β m β虱相沉積蒸鍍機 持衣置,…固接機構係為複數組設置,各9. According to the application of the plated material solid perforation. I 〇·依申 The object to be plated is fixed. The second insert is inserted between the two discs. II. The mineral is solid and the first plug is set accordingly. 12·Ishen's object to be plated solid 12896963 6. The patented scope ^1^ is a clock holding device, wherein the fixed seat of the tamping mechanism comprises a chassis, a set above the chassis and formed between the chassis and the chassis The first insert of the space and a ring are disposed on the ring body of the chassis and the first insert. 7. The substrate holding device of the physical vapor deposition vapor deposition machine according to claim 6, wherein the first/plug is provided with a plurality of insertion holes, and the chassis is provided with a plurality of concave portions. The groove system is corresponding to the insertion hole. < 8 The clock object holding device of the physical vapor deposition vapor deposition machine according to claim 6, wherein the third insertion hole is provided with a plurality of insertion holes, and the chassis is provided with a majority A stud is disposed corresponding to the insertion hole. The physical vapor deposition vapor deposition device according to the sixth aspect of the invention, wherein the physical vapor deposition vapor deposition device according to item 6 of the patent scope is separately provided on the chassis and the ring body. The fixing base further includes a second insert between the first insert and the chassis, and is formed with a space between the chassis and the first. Please refer to the physical gas phase described in the first paragraph of the patent; the device has a plurality of plugs on the second plug: a plurality of plug holes are also provided on the disc. The object described in item 1 of the patent scope is ¥ # -^ ^ i + β m β虱 phase deposition vapor deposition machine holding device, ... the fixing mechanism is a complex array setting, each 第15頁Page 15 12889631288963 第16頁Page 16
TW94124273A 2005-07-19 2005-07-19 Holder device for plated substance in physical vapor deposition sputtering machine TWI288963B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7985296B2 (en) 2008-11-06 2011-07-26 Ching-Ching Chen Sample fixing device of evaporation machine

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7985296B2 (en) 2008-11-06 2011-07-26 Ching-Ching Chen Sample fixing device of evaporation machine

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