.1286189.1286189
V 九、發明說明： 【發明所屬之技術領域】 本發明係有關一種發光二極體之光源模組，特別指一種 應用於以南功率、局冗度發光一極體作為光源所設計的結 : 構及所製成的燈具。 【先前技術】 發光二極體最早得到應用是在上世紀60年代，那時它 們被用來指示收音機的開/關狀態。近些年來，工程師們將 它們逐漸應用到了各種領域，信號燈、汽車尾燈、顯示器螢 幕，到處都能看到它們的身影。與傳統的燈泡相比，發光二 極體燈所消耗的能量很小，而且沒有閃爍。最令人不可思議 的是，它的壽命可達數十年之久。這是_它們是通獅用 的半導體傳遞f流’而不是像傳統的燈_樣，依靠脆弱、 向熱且很快就會損壞的燈絲。但發光二極體供照明使用時， 有-個相當大的障礙需要解決，所須之亮度愈高時，就須採 用功率愈高的發光二極體，而所產生的熱源愈大，例如作為 路燈使用時，須採用魏發光二極體卿成的_，所產生 的熱源極高’如果没有-個良好的散熱結構，將使該發光二 極體壽命大幅縮短，並影響整個產品的可靠度。 5 .1286189 請參照第―圖’先前技術中發光二極體路燈1G使用的 印：電路板1為-般泛用之FR4印刷電路板或是以散熱為 考1之金屬如喊解散熱型f路板。在考量—般路燈造型 或其他如視奴計上之需求時’通常會將燈座外殼4作成弧 形或其他曲面的職。但由於高功率發光二極齡燈ι〇之 熱效應會使魏二極_壽命雜而且錢級率亦會隨 此熱效應而劣化’故-般發光二極齡燈1()的設計為了使 燈座外殼4與印刷電路板1可緊密貼合，以提升散熱效率， 必須額外設計-平面金屬基座3，其兩端分別與印刷電路板 1及燈座外殼4貼合，發光二極體陣列2即透過此金屬基座 3將熱傳導至燈座外殼4，再散到域巾。但此型態之設計 仍無法將印刷電路上發光二極體陣列2所產生的熱有效 率的傳導至大氣。 【發明内容】 因此’本發明之目的係在提供一種使用厚度小於彻以 m，較佳小於200//m之印刷電路板的高散型發光二極體光 源模組，並可將之應用於燈具中，針對不同幾何形狀之燈座， 將印刷電職紐斜殼輪料能合，使㈣料殼直接成 為-散熱裝置’並透過燈座外殼與域作熱循環，以達到大面 積之散熱絲。同時’由於此_電路板為目歧用的技術， 成本、設備以及製織術上無需做大幅度修改，同時將此印刷 6 •1286189 % . 電路板的厚度製作小於伽/m，較佳小於200//m，故如此薄 的印刷電路板，一方面在撓性彎曲更能貼合於燈座外殼殼，另 一方面更能加速熱的傳遞，以獲得極佳的散熱效果。 為了達上述目的，本發明提供一種高散熱型發光二極體光 源模組，其包括一印刷電路板，厚度係小於4〇〇#m ;發光二 _ 極體陣列，由複數個發光二極體所形成，其為高功率、高亮度 之發光二極體，設置於印刷電路板處，並以導線與該印刷電板 電性連接。 另外運用本發明之高散熱型發光二極體光源模組亦可製 成一燈具’其包括：一燈座外殼；一印刷電路板，係安裝於該 燈座外喊之内部，厚度小於4〇〇//m，具有適當撓曲性·，一發 光二極體陣列，作為光源，係安裝於印刷電路板上面，並以導 線與該印刷電路板電性連接；以及一燈罩，係與該燈座外殼相 密合，其中，該印刷電路板之相對於連接該發光二極體陣列的 另一面與該燈座外殼之内侧係緊密結合。 由於本發明之印刷電路板的厚度小於4〇〇//m，較佳小於 200 // m故本發明之印刷電路板能任意彎折而使其與燈座外 殼輪廓緊能合。HI此，該發光二極體燈源不但可廣泛地應用 7 • 1286189 到現有各種燈座内及其他非平面幾何外型之產品上，並且可利 用燈座外殼直接成為一散熱裝置，而不需另外設計先前技術所 用的平面金屬散熱基座。同時，本發明印刷電路板的厚度小於 400//m，較佳小於200//m，藉此縮短熱傳遞路徑，進而提昇 熱傳遞至燈座外殼之速率。因此，本發明之高散熱型發光二極 體光源模具所製成的燈具不但能提升本身散熱效率，而且使燈 具成本額降低及燈座變小。 由本發明下述之實施方式及所附之圖式，本發明的前述 及其他目的、特徵、觀點及優點將會更加明瞭。 【實施方式】 如第二圖所示，為本發明之高散熱型發光二極體光源模組 之立體圖及剖視圖，其主要包括一印刷電路板6及複數個發光 二極體70所形的發光二極體陣列，該印刷電路板6厚度係小 ;400//m ’較佳小於，使其具有可挽性胃曲的特性， 而發光一極體70為高功率、高亮之發光二極體，設置於印刷 電路板6處’並以導線71與該印刷電板電性連接。而該發光 極體70的叹置位置、㈣及所產生的光源顏色則依使用者 H求而S ’可自由變化’以獲得所須之光源顏色、亮度及色 •1286189 為了使發光-極體70的散熱效果更佳，如第三圖所示， 於该發光二極體70與印刷電路板6之間設有一導熱層a，其 材質為散熱膏、導熱片，或其他能使發光二極體本身熱源快速 傳遞至印刷電路板的材料與方法。而於印刷電路板6上設有金 屬區塊b，供發光二極體7〇設置其上，材質可為金或銅··等 等’此處的金屬區塊b僅為導熱之用，不同於與印刷電路板6 上作為電性連通的金屬電路61，也不與之相通。藉此本發明 之發光二極體70在使用時所產生的熱源可經導熱層a、及金 屬區塊b快速傳遞至印刷電路板6處，而本發明利用其極薄厚 度的特性能使熱快速傳遞於其另一側，而達到快速散熱之目 的，另外如果配合其他構件的輔助（如後段所述之燈座外殼）， 能使整體的散熱效果更佳。再者較薄的印刷電路板6更具有可 彎曲的撓性，能廣泛地應用到現有各種燈座及其他非平面幾何 外型之產品上，在使用上更為方便。 如第四圖所示，運用本發明之結構所設計的之發光二極 體燈具的截面圖。本發明之發光二極體燈具2〇係將複數個發 光二極體以陣列方式形成發光二極體陣列7安裝於印刷電路 板6的上面，並以導線與該印刷電路板6電性連接，其中，該 印刷電路板6之厚度係小於400“η，較佳小於2〇〇//m，使其 具有適當的撓性，可任意彎曲，而該發光二極體陣列7可根據 9 .1286189 燈罩9及發光均勻度採特殊排列，例如由數個同一顏色之發 光二極體串並聯為一組陣列，每組發光二極體陣列集為一個 電路’結合紅(R)、綠(G)、藍⑻三組發光二極體陣列形成發 光二極體麟，峨㈣H (MPU)貞責控觸树光二極 體陣列集結而成的電路，利用脈寬調變（pu〗se Width Modulation，PWM )方式以丨000次/秒以上的頻率快速切換 發光二極體的亮與暗以控制每組發光二極體陣列的光輸出 強度，呈現出使用者所需的光色效果。接著，將該印刷電路 板6及其上之發光二極體陣列7安裝於該燈座外殼8之内部， 並利用該印刷電路板6的可撓性使其背面貼合於非平面幾何 外型燈座外殼8，在本實施例中燈座外殼8其為波浪型、亦可 為任何的圓弧曲面狀’由於該印刷電路板6可彎曲而與該燈座 外殼8之内侧輪廓緊密結合，讓該燈座外殼8直接成為一散熱 裝置，因此該燈座外殼8最好以散熱效果佳的材料製成，例如 為鋁、銅等之金屬。該印刷電路板6與該燈座外殼8之間可形 成-導熱層c，其材質為-散熱膏、導熱片，或其他能將印刷 電路板熱量快速傳遞至燈座外殼的材料與方法，以確保彼此緊 擒結合，並具有良好的散熱效果。然後將透光用燈罩9與該 燈座外殼8相密合。該燈罩可採用厚度為2mm以上之塗覆有 紫外線吸收劑的聚碳酸酯透明燈罩。 .1286189 本發明之印刷電路板6具有可撓性彎曲，利於其與燈座外 殼8的緊密貼合而使該燈座外殼8直接成為一散熱裝置，因此 擴大了散熱面積，同時，本發明印刷電路板6的厚度小於4〇〇 ，較佳小於200，使得熱的傳遞更為加速，進而提升 發光二極體燈具之散熱效率。 對所有熟習此技藝者而言，本發額顯地可以作出多種 修改及變化而不脫離本發明的精神和範圍。因此，本發=包 括該些修改及變化，且其紐包括在下附之”專利範^ 其均等者中。 【圖式簡單說明】 第一圖係習知使用傳統印刷電路板之發光二極體路燈的 截面圖； 第二圖為本發明之立體圖； 第三圖為本發明之剖面示意圖； 第四圖為本發明運用於發光二極體燈具的截面圖。 【主要元件符號說明】 1 傳統印刷電路板 2 發光—極體陣列 3 金屬基座 11 •1286189 4 燈座外殼 5 燈罩 6 印刷電路板 61 金屬電路 7 發光二極體陣列 70 發光二極體 71 導線 8 燈座外殼 9 燈罩 10 發光二極體路燈 20 發光二極體燈具 a 導熱層 b 金屬區塊 c 導熱層 12V IX. Description of the Invention: [Technical Field] The present invention relates to a light source module for a light-emitting diode, and more particularly to a junction designed for use as a light source with a south power and a local redundancy light emitter: Construct the finished lamp. [Prior Art] Light-emitting diodes were first used in the 1960s, when they were used to indicate the on/off state of the radio. In recent years, engineers have gradually applied them to various fields, such as signal lights, car taillights, and monitor screens, which can be seen everywhere. Compared to conventional light bulbs, light-emitting diode lamps consume very little energy and are not flickering. The most incredible thing is that it can last for decades. This is _ they are the semiconductors that pass through the lion's flow, rather than the traditional light, like a filament that is fragile, hot and will soon be damaged. However, when a light-emitting diode is used for lighting, there is a considerable obstacle to be solved. The higher the brightness required, the higher the power of the light-emitting diode is, and the larger the heat source is generated, for example, as When the street lamp is used, it must be made of Wei-light diodes, and the generated heat source is extremely high. If there is no good heat dissipation structure, the life of the LED will be greatly shortened and the reliability of the whole product will be affected. . 5 .1286189 Please refer to the picture in the previous figure for the use of the LED lamp 1G in the prior art: the circuit board 1 is a general-purpose FR4 printed circuit board or a metal with heat dissipation as the test heat dissipation type f Road board. When considering the style of streetlights or other requirements, such as the need for slavery, the lampholder housing 4 is usually shaped as an arc or other curved surface. However, due to the thermal effect of the high-power light-emitting two-lamp lamp, the Wei Erji _ life-time and the money-grade rate will also deteriorate with the thermal effect. Therefore, the design of the light-emitting diode lamp 1 () is designed to make the lamp holder The outer casing 4 and the printed circuit board 1 can be closely adhered to improve the heat dissipation efficiency, and must be additionally designed - a flat metal base 3, the two ends of which are respectively attached to the printed circuit board 1 and the lamp housing 4, and the LED array 2 is That is, heat is transmitted to the socket housing 4 through the metal base 3, and then dispersed to the domain towel. However, this type of design still does not transfer the heat efficiency generated by the LED array 2 on the printed circuit to the atmosphere. SUMMARY OF THE INVENTION Therefore, the object of the present invention is to provide a high-dispersion light-emitting diode light source module using a printed circuit board having a thickness less than m, preferably less than 200//m, and can be applied to In the luminaire, for the lamp holders of different geometric shapes, the printed electric power slanting shell wheel material can be combined, so that (4) the material shell directly becomes a heat sink device and is thermally circulated through the lamp holder shell and the domain to achieve large-area heat dissipation. wire. At the same time, because of the technology used for this board, there is no need to make major changes in cost, equipment and weaving. At the same time, this printing is 6 • 1286189 %. The thickness of the board is less than gamma/m, preferably less than 200. //m, so such a thin printed circuit board, on the one hand, can be more closely attached to the lamp housing shell in flexible bending, on the other hand, it can accelerate the heat transfer to obtain excellent heat dissipation effect. In order to achieve the above object, the present invention provides a high heat dissipation type light emitting diode light source module, which comprises a printed circuit board having a thickness of less than 4 〇〇 #m, and an illuminating two-pole array, which is composed of a plurality of light-emitting diodes. Formed as a high-power, high-brightness light-emitting diode, disposed at the printed circuit board and electrically connected to the printed circuit board by wires. In addition, the high-heat-dissipating light-emitting diode light source module of the present invention can also be used to manufacture a lamp, which comprises: a lamp holder housing; a printed circuit board, which is installed inside the lamp holder and has a thickness of less than 4 inches. 〇 / / m, with appropriate flexibility ·, a light-emitting diode array, as a light source, is mounted on the printed circuit board, and is electrically connected to the printed circuit board by wires; and a lamp cover is connected to the lamp The housing is closely spaced, wherein the printed circuit board is tightly coupled to the inner side of the socket housing relative to the other side of the LED array. Since the thickness of the printed circuit board of the present invention is less than 4 Å/m, preferably less than 200 // m, the printed circuit board of the present invention can be bent at will to be tightly fitted to the outline of the lamp housing. HI, the LED light source can be widely used not only in the existing lamp holders but also in other non-planar geometric shapes, and can be directly used as a heat sink by the lamp holder housing without In addition, the planar metal heat sink used in the prior art is designed. At the same time, the printed circuit board of the present invention has a thickness of less than 400/m, preferably less than 200/m, thereby shortening the heat transfer path and thereby increasing the rate of heat transfer to the lamp housing. Therefore, the lamp made by the high heat radiation type LED light source mold of the present invention not only can improve the heat dissipation efficiency of the lamp, but also reduces the cost of the lamp and the lamp holder becomes smaller. The above and other objects, features, aspects and advantages of the present invention will become more < [Embodiment] As shown in the second figure, a perspective view and a cross-sectional view of a high heat radiation type light emitting diode light source module of the present invention mainly includes a printed circuit board 6 and a plurality of light emitting diodes 70. In the diode array, the thickness of the printed circuit board 6 is small; 400//m' is preferably smaller than that, so that it has the property of being malleable, and the light-emitting body 70 is a high-power, high-brightness light-emitting diode. The body is disposed at the printed circuit board 6 and electrically connected to the printed circuit board by wires 71. The slant position of the illuminating body 70, (4), and the color of the generated light source are determined by the user H and S 'can be freely changed' to obtain the required color, brightness and color of the light source. 1286189 In order to make the illuminating body The heat dissipation effect of 70 is better. As shown in the third figure, a heat conducting layer a is disposed between the light emitting diode 70 and the printed circuit board 6, and the material is a heat dissipating paste, a heat conducting sheet, or other light emitting diode. The material and method by which the heat source of the body itself is quickly transferred to the printed circuit board. The printed circuit board 6 is provided with a metal block b for the light-emitting diode 7 to be disposed thereon, and the material may be gold or copper, etc. 'The metal block b here is only for heat conduction, different The metal circuit 61, which is in electrical communication with the printed circuit board 6, is also not in communication therewith. Thereby, the heat source generated by the light-emitting diode 70 of the present invention can be quickly transferred to the printed circuit board 6 via the heat conductive layer a and the metal block b, and the present invention can utilize the characteristics of its extremely thin thickness to enable heat. Quickly transfer to the other side for fast heat dissipation, and if combined with the aid of other components (such as the lampholder housing described in the following paragraph), the overall heat dissipation effect can be better. Moreover, the thinner printed circuit board 6 is more flexible and can be widely applied to various existing lamp holders and other non-planar geometric products, and is more convenient to use. As shown in the fourth figure, a cross-sectional view of a light-emitting diode lamp designed using the structure of the present invention. The light-emitting diode lamp 2 of the present invention is configured to form a plurality of light-emitting diodes in an array, and the light-emitting diode array 7 is mounted on the printed circuit board 6 and electrically connected to the printed circuit board 6 by wires. Wherein, the thickness of the printed circuit board 6 is less than 400"η, preferably less than 2〇〇//m, so that it has appropriate flexibility and can be bent freely, and the LED array 7 can be according to 9.18286189. The lampshade 9 and the uniformity of illumination are arranged in a special arrangement. For example, a plurality of LEDs of the same color are connected in series and in parallel as a group, and each group of LED arrays is a circuit 'in combination with red (R) and green (G). , blue (8) three sets of light-emitting diode arrays form a light-emitting diode, and the circuit is assembled by the 树 (tetra) H (MPU) 控 control tree light diode array, using pulse width modulation (pu 〖Se Width Modulation, PWM The method quickly switches the brightness and darkness of the light-emitting diode at a frequency of more than 10,000 times/second to control the light output intensity of each group of light-emitting diodes, and exhibits a light color effect desired by the user. Printed circuit board 6 and its array of light-emitting diodes 7 Inside the socket housing 8 and utilizing the flexibility of the printed circuit board 6, the back surface is attached to the non-planar geometric outer socket housing 8. In the present embodiment, the socket housing 8 is wave-shaped, It can also be any arc-shaped shape. Because the printed circuit board 6 is bendable and closely integrated with the inner contour of the socket housing 8, the socket housing 8 directly becomes a heat sink, so the socket housing 8 is the most It is made of a material with good heat dissipation effect, for example, a metal such as aluminum or copper. The printed circuit board 6 and the socket housing 8 can be formed with a heat conducting layer c, which is made of a heat dissipating paste, a thermal conductive sheet, or Other materials and methods that can quickly transfer the heat of the printed circuit board to the lamp holder casing to ensure that they are tightly coupled to each other and have a good heat dissipation effect. Then, the light-transmitting lamp cover 9 is closely adhered to the lamp holder casing 8. The lampshade can be a polycarbonate transparent lampshade coated with a UV absorber having a thickness of 2 mm or more. 1286189 The printed circuit board 6 of the present invention has flexible bending, which facilitates its close fitting with the lamp housing 8 Lamp holder housing 8 directly becomes The heat dissipating device thus enlarges the heat dissipating area, and at the same time, the thickness of the printed circuit board 6 of the present invention is less than 4 〇〇, preferably less than 200, so that the heat transfer is further accelerated, thereby improving the heat dissipating efficiency of the illuminating diode lamp. It will be apparent to those skilled in the art that various modifications and changes can be made without departing from the spirit and scope of the invention. Therefore, the present invention includes the modifications and variations, and ^ Among its equals. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a cross-sectional view of a conventional LED street lamp using a conventional printed circuit board; the second drawing is a perspective view of the present invention; the third drawing is a schematic cross-sectional view of the present invention; The invention is applied to a cross-sectional view of a light-emitting diode lamp. [Explanation of main component symbols] 1 Conventional printed circuit board 2 Light-emitting body array 3 Metal base 11 • 1286189 4 Lamp holder housing 5 Lamp cover 6 Printed circuit board 61 Metal circuit 7 Light-emitting diode array 70 Light-emitting diode 71 Conductor 8 lamp holder housing 9 lampshade 10 LED street light 20 LED lamp a Thermal layer b Metal block c Thermal layer 12