TWI282431B - Test jig for daisy chain test board - Google Patents

Abstract

A test jig for daisy chain test board includes a plurality of probing components and a plurality of electric wires, which is used for examining a first daisy chain portion of a test board. Each probing component has a contact terminal at one end and a wire jack. The electric wires simulate a second daisy chain portion of a semiconductor package under test and discontinuously connect part of the wire jacks of the probing components. The contact terminals contact the corresponding connecting pads on the test board so as to check if a loop is formed by the electric wires, the probing component and the first daisy chain portion of the test board. The test board can be rapidly tested before usage.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a test device for reliability in a semiconductor package structure. In particular, it relates to a daisy chain test plate: jig. [Prior Art] In order to confirm the product performance and durability of a semiconductor package structure, various appropriate detection operations such as electrical test, test, open/break test, reliability test (reliability tes, etc. Q reliability test system) are required. It includes high temperature testing, high temperature cycling testing, impact testing, etc., which places the semiconductor package structure under a predetermined condition to detect its reliability. Usually in a reliability test, the semiconductor package structure is surface bonded. To the printed circuit board to detect the solder joint of the semiconductor package structure or to detect the internal wiring of the semiconductor package structure. In a reliability test, a daisy chain test board is used for bonding to be tested. The semiconductor package structure forms a complete loop for detecting the resistance through the solder connection point and the substrate line in the reliability test. Referring to the figure, a daisy chain test board 1 includes a line pattern first. a first daisy chain portion and a plurality of pads 12 intermittently connected by the first daisy chain portion u Often the daisy chain test board 1 is a printed circuit board, and the pads 12 are suitably arranged for bonding a semiconductor package structure 20 as shown in Fig. 2. Some of the pads 1 2 are Connected to test 3, 丨 4. Referring to Figures 2 and 3, the semiconductor package structure 2 includes a substrate, the substrate 21 is provided with a plurality of solder balls 23, and a second daisy chain 2 2

Page 6 1282431 V. Description of the Invention (2) (4ernc! Aaisychain p〇rti〇n) intermittently connects the solder balls 23, ΐϊίίϊΐϊ, I is the internal circuit pattern of the substrate 21 or includes the road 'that is The substrate 21 can be a special line or a normal line connected to a general substrate to form the second 20 = U. Before performing a reliability test, the semiconductor package structure = the known ball 23 Reflow soldering is connected to the pads of the daisy chain test board 1'. And the first daisy chain portion ii and the second daisy chain portion 22 are electrically combined to form a yt road ▲, as shown in FIG. 3, the yoke can be guided by a resistance detecting instrument 30. 1 of the test pads 13, 14, the semiconductor package structure 20 = two / pass reliability test, for example, by the substrate 2 warp or rush 'to cause at least some of the fresh balls 23 - solder joints Or when the circuit pattern of the substrate 21 is broken, the circuit formed by the first daisy chain portion n and the second daisy s 22 is broken, and the resistance detecting device can detect that the excessive resistance change occurs. It is judged whether the semiconductor package structure can pass the reliability test. In addition, U.S. Patent No. 6, 564, 984 and U.S. Patent No. 6,788,092 each disclose a daisy-chain test board and its use. The product of the semiconductor package structure 2 is complicated, and the first daisy chain portion 11 of the daisy chain test f is required to make various corresponding changes, and the first 12 of the pads 12 are mistaken in manufacturing. The chain u is connected. The purpose is to prepare a daisy chain test board 1 缺乏 After the re-production, the lack of proper inspection fixtures, double check by manual, it seems laborious and time consuming, the external 'need to join the semiconductor package structure on the surface 2 After 〇, the resistance measurement by electricity can be used to further identify the daisy chain test board i 0

1282431

Qi Ju, Deng 11疋 No connection error, when a connection error occurs, the surface-bonded semiconductor package structure 20 must be lost, and the method can quickly find out the problem. SUMMARY OF THE INVENTION The main object of the present invention is to provide a test fixture for a daisy chain test board, comprising a plurality of detecting elements and a plurality of external wires for detecting a first daisy chain portion of a daisy chain test board, a detecting element has a wire contact hole at one of the thin ends and a wire lead at the other end, and the external wires simulate the second daisy chain of the semiconductor package structure to be tested to intermittently connect the detecting elements The wire jacks corresponding to the plurality of pads of the daisy chain test board for testing the external wires, the first detecting elements and the first daisy chain portion of the daisy chain test board Can it constitute a loop' to achieve rapid detection of the daisy chain test board before use. A second object of the present invention is to provide a method for forming a daisy chain of a test fixture, which provides a test fixture, each probe element having a contact end at one end and a wire jack at the other end, the probes are detected The component first detects the semiconductor package structure to determine a plurality of package external wires connecting the configuration positions of the detecting components, and then configuring a plurality of test board external wires to form a complete loop with the package external wires. After removing the external wires of the package, the detector elements can be intermittently connected. The external wires of the test boards are connected and probed to a daisy chain test board, which can quickly detect the daisy chain test board. A semiconductor package construction surface is prevented from being bonded to the wrong daisy chain test panel. The test fixture of the daisy chain test board according to the invention is used for detecting _

1282431 V. INSTRUCTIONS (4) ----- 2 Ϊ ^ d board ' 4 daisy chain test board has a $ daisy chain part and a plurality of suspected 1 1 for testing a semiconductor package structure to be tested, The semiconductor package 2 includes a second daisy chain portion and a plurality of solder balls, and the solder balls are soldered to the pads, such that the first daisy chain portion and the second daisy chain portion are in a loop, the inspection fixture The system comprises a plurality of detecting elements and a plurality of external connecting wires, each of the detecting elements having a contact end at one end and a wire insertion hole at the other end, the detecting elements being arranged in such a manner that the contact ends are correspondingly contacted In the pads of the daisy chain test board, the external wires simulate the second daisy chain portion of the semiconductor package structure to be tested to intermittently connect the wire insertion holes of the detecting elements. Preferably, the external leads are selectively replaceable to the lead pins of the detecting elements for immediate and fast daisy chain path correction. The present invention will be described with reference to the following embodiments. A daisy chain test board 1 之前 before surface bonding can prevent the wrong daisy chain test board 1 〇 from being used in a reliability test. Referring to Figures 4 and 5, a test fixture 1 includes a plurality of detector elements 11 0 and a plurality of external conductors 1 2 0. Each of the detecting elements 11 has a contact end 111 at one end and a wire insertion end 112 at the other end. In this embodiment, the detecting elements 10 0 include an electrical via 113 for guiding The contact end 111 and the wire insertion hole 112 are covered with an insulating sleeve 14 and are tubular. The detecting elements 11 are arranged in such a manner that the contact ends 111 correspond to the contacts of the daisy chain test board 1'

Page 9 1282431___ V. Description of the invention (5) Pad 1 2. In this embodiment, the detecting elements 11 are arranged in a grid array and coupled to a positioning plate 130. The external leads 120 simulate the second daisy chain portion 2 of the semiconductor package structure 2 to be tested and intermittently connect the lead wires 11 2 of the detecting elements 11 . Preferably, the external leads 12 are selectively replaceably connected to the lead jacks 11 of the detecting elements 11 for immediate and fast daisy chain path correction. The semiconductor package structure 2 includes a plurality of solder balls 23 or other external conductive elements on a substrate 21, and the solder balls 23 are electrically connected in sections by a second daisy chain portion 22, The second daisy chain portion 22 may be formed by a special circuit pattern of the substrate 21, or may be formed by a circuit pattern of a package substrate and a special inner bonding wire (inner-c〇nnecting bonding wire). Please refer to Figure 6 'When a daisy chain test plate is designed and completed, the test fixture is pressed against the daisy chain test plate 1 〇, and the test is cured, 1 0 0 The contact ends 111 are in contact with and electrically connected to the pads 1 2 of the daisy chain test board 1 to test that the first daisy chain portion of the daisy chain test board is accurately capable of The detecting elements 11 〇 and the wires 120 form a loop, which can be determined by measuring the resistance value, and the test fixture 1 〇 0 system can quickly detect the daisy chain before use. Ϊ Ϊ 二 避免 避免 避免 避免 避免 避免 避免 避免 避免 避免 避免 避免 避免 避免 避免 避免 避免 避免 避免 避免 避免 避免 避免 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体Typically, the 2-chain j-plate 10 comprises a plurality of first daisy-chain portions u, respectively: regions, in a semiconductor package structure 20 or a partial region thereof for forming a plurality of loops. In this embodiment, the daisy chain test ^ page 10 I282431, (6) ' " --------- board! The tether is a test board that conforms to the jEDEC standard JESD22-Bln. If the loop connection fails, it can be judged that the daisy chain portion 11 has an error. The wrong position of the first daisy chain portion of the daisy chain test panel 10 can be found by adding the number of the external wires 12 or changing the insertion position of the external wires 12 。. The use of the external wire 丨2 is the same color before the test, and is different from the horse that uses the T to find and analyze the daisy chain test board to change the external wire. Therefore, the above-mentioned inspection jig 100 of the present invention can adjust the insertion position of the external wires 120 according to products of different semiconductor package configurations; and 'can reduce the error rate of redesigning the test board 10; Prior to the sinful test, a semiconductor package structure to be tested was bonded to the wrong test board 1 , to reduce the loss of the semiconductor package structure. In order to enable the external lead wires 20 to correctly simulate the second daisy chain portion 2 of the semiconductor package structure 20 to be tested, and thereby detect the first daisy chain portion 1 of the daisy chain test panel 1 本, the present invention A daisy chain test method is described as follows. Referring to Figure 7, a standard semiconductor package structure 2 is required for proper reliability testing, such as JESD 22-Bill (Board Level Drop Test Method of Components for Handheld Electronic Products). And providing the test fixture 1 〇〇, the detector elements 1 1 〇 are arranged in such a manner that the contact ends 111 correspond to the solder balls 23 of the semiconductor package structure 20; When the contact terminals 11 of the detecting elements 110 sense the solder balls 23 of the semiconductor package structure 20, and can replace a plurality of package external wires

Page 11 1282431 V. Inventive Description (7) 140, the package external wires 140 are intermittently connected to the wire insertion holes 112 of the detecting elements 110, so that the package external wires 14〇, the detections το The first daisy chain portion of the semiconductor package structure 2" "forms a complete loop. Preferably, the package external wires i 40 further include a first test end 141 and a second test end 142. For measuring the resistance of the loop. When a complete loop is formed, the connection path representing the external conductors 140 of the package can correctly simulate the first daisy chain portion 11 of the daisy chain test board. Referring to FIG. 8, a test board sample 2〇0 is prepared according to the connection paths of the packaged external leads ,4〇, the test board sample 2〇Q system has the same daisy chain part 21 1 and a plurality of sample pads 21 2 . Next, as shown in FIG. 9, a test fixture 100 having the above-mentioned external lead 12 is provided (as shown in FIGS. 4, 5 and 6), and the external leads 12 are alternately arranged to the detecting element thereof. 11" wire jack 112, and the detection components 11 0 contact point 1 11 can detect the test plate sample 2 〇〇, to detect whether the sample daisy chain part 211 of the test plate sample 2 与 and the test fixture 100 (test board) The external wires 1 20 form a loop for mass production of the correct daisy chain test board 1 〇. The external wires 120 are formed in two ways. Please refer to Figures 1 and 11 for one of the formation methods. On the same inspection fixture 1 , in addition to the above-mentioned packaged external wires 14 , the different color external wires 120 are intermittently connected to the wire insertion holes 11 of the detection elements. 2 'It is easy to determine whether the external wires 120 and the package external wires 140 can form a complete circuit by simple measurement and visual inspection.

Page 12 1282431

(as shown in Fig. ίο) to simulate the second daisy chain portion 22 of the semiconductor package structure. Preferably, the package external wires 14 and the external wires 12 are in different colors. For example, the external wires 12 are red lines, and the package external wires 140 are blue lines. After the package external wires 140 are removed, the detecting elements 110 of the test fixtures 1 that have been configured with the external wires 12 are capable of detecting the sample pads 21 2 of the test plate samples 2, The sample daisy chain portion 211 is measured. When the sample daisy chain portion 211 is detected to pass, the above-described daisy chain test plate can be mass-produced.

Another forming method is to directly provide another inspection jig 1 having the external connecting wire 120, and the plugging arrangement of the external connecting wires 12 is replaceable according to the second daisy chain portion 22 of the semiconductor package structure 20. The test fixtures 100 are disposed such that the external leads 12 are intermittently connected to the lead wires 丨丨2 of the detecting elements 110. In addition, the connection path of the external leads 12 of the other test fixture 100 can be detected by using the test fixtures 已 which have been provided with the package external wires 如4 as shown in Fig. 7. Thereafter, the sample element 11 2 of the test piece sample 2 is probed by the detecting element 1 0 of the test jig 1 〇 which is provided with the external leads 1 2 to measure the sample daisy portion 211. Therefore, with various semiconductor package configurations, the present invention can provide test board external leads 正确2 正确 that are correctly and intermittently connected. In a test board resistance measurement step, the detection elements ii 0 The contact ends 111 are probed by the pads 12 of the daisy chain test board 1 to detect whether the designed daisy chain test board 1 has the correct first daisy chain 丨i. The scope of the present invention is defined by the scope of the appended claims, and anyone skilled in the art, without departing from the spirit and scope of the invention

1282431 V. INSTRUCTIONS (9) Any changes and modifications made within the scope of the invention are within the scope of protection of the present invention. i Page 14 II·· 1282431 Schematic description of the drawing [Figure 1st, 2nd, 3rd, 3rd, for reliable 4th, 5th, 6th, 6th, 6th, 3rd, 8th : Connect the wire plus Figure 9: Test plate sample Figure 10: Figure. Figure 11: Single Description] A partial top view of a conventional daisy chain test board. A bottom view of a conventional semiconductor package construction. A schematic cross-sectional view of a conventional semiconductor package construction after soldering to the daisy chain test panel. A schematic view of a test fixture according to the present invention. A top view of the test fixture in accordance with the present invention. The test fixture according to the present invention is inspected for detecting a daisy chain test panel. The test method according to the present invention has the intention of inserting a package external conductor. A schematic cross-sectional view of a test plate sample after preparation of the test fixture according to the present invention. A cross-sectional view of the test article of the present invention having the test lead external lead is tested. Cross-sectional view of the test fixture in accordance with the present invention in the loop state. View of the test fixture in the loop state in accordance with the present invention. m Element symbol simple description: 10 Daisy chain test board 11 First daisy chain part 13 Test pad 14 Test 塾 20 Semiconductor package structure 22 Second daisy chain part 23 Solder ball 12 Pad 21 Substrate

Page 15 1282431 Brief description of the diagram 30 Resistance detection instrument I 0 0 Inspection fixture 11 0 Detection element II 2 Wire jack 11 3 Electrical conduction hole 1 2 0 External wire 1 3 0 Positioning plate 140 Package external wire 141 A test end 200 test plate sample 211 sample daisy chain portion 111 contact point 11 4 insulating sleeve 1 4 2 second test end 21 2 sample pad

Page 16

Claims (1)

1282431 [Scope of Patent Application] 1. A test fixture for detecting a plate having a first daisy chain portion and a semiconductor package structure, the half daisy chain portion to be tested and a plurality of solder balls, wherein the first daisy chain portion And the second system comprises: a daisy chain test board, the daisy chain testing a plurality of pads for testing a conductor package structure to be tested, comprising a second solder ball system capable of soldering to the pads, The 轫 chain portion forms a loop, the test modulates a plurality of detecting elements, each detecting element having a contact end at one end and a wire insertion hole at the other end, the detecting elements being arranged in such a manner as to make the contacts The end corresponding to the pad of the daisy chain test board; and a plurality of external wires simulating the second daisy chain portion of the semiconductor package structure to be tested and intermittently connecting the detecting elements Some guide holes. 2. The test jig of claim 1, wherein the charge external wire is selectively replaceably connected to the wire jack of the detecting elements. A test fixture according to claim 1, wherein the flaw detection elements are arranged in a lattice array. 4. The test fixture of claim 1, wherein each z-test element comprises an electrical via. The test fixture of claim 1, wherein the differential detecting element is coated with an insulating sleeve and has a tubular shape. 6. If the inspection fixture described in item 1 of the patent application is applied, 1282431 VI. Scope of application for patents • The wires are of the same color. 7. The test fixture of claim 1, wherein the daisy chain test panel is tested in accordance with JEDEC standard JESD22-Bill. 88, a daisy chain testing method, comprising: providing a semiconductor package structure comprising a daisy chain portion and a plurality of solder balls; providing a test fixture comprising a plurality of detecting elements, each detecting element Having a contact end at one end and a wire jack at the other end, the detecting elements are arranged in such a manner that the contact ends correspond to the solder balls of the semiconductor package structure; detecting the probes The contact ends of the component and the solder balls of the semiconductor package structure, and a plurality of package external wires are replaceably disposed on the inspection fixture, and the wire insertion holes of the detection components are intermittently connected. Forming a complete loop of the package external wires, the detecting elements and the daisy chain portion of the semiconductor package structure; preparing a test board sample according to the connecting paths of the package external wires; the test board sample has the same The daisy chain portion and the plurality of samples are alternately arranged with a plurality of test board external wires for the test fixture, so that the test boards are outside The wires are intermittently connected to the wire insertion holes of the detecting elements, and the test board external wires can form a complete loop with the package external & wires to simulate the daisy chain of the rich conductor package structure And after removing the package external wires to configure the test boards Face Page 18 1282431 VI. Scope of Application = The detector element of the test fixture of the wire can probe the sample pad to determine the daisy chain of the sample. According to the sample of the board, the daisy-chain test f-package external lead wire and the external test lead wires of the test boards are respectively J;; Yan Hai, as described in claim 8 of the patent scope Chain test method, 3 test board = is to comply with the toilet C standard Cong 22_B111_ test board, 11, a chain test method, including · semiconductor package structure 'the semiconductor package structure includes a tough chain part and a plurality of solder balls ;丁丁三3,,丨提L: The first-inspection fixture containing a plurality of detecting elements, each-jack, the arrangement of the detecting elements ★ The wire touches the 嗲本逡_# ## & The _ mode is such that the contact ends are correspondingly contacted with the solder balls of the 5 Hz+conductor package structure; 兮 半:: the contact ends of the detecting elements of the test fixture and the mounting wires are connected to the first The test fixture is connected to the probes intermittently to obtain the package external wires, the first-test complete circuit; the daisy chain of the 仟/, 忒+conductor package structure is formed according to the connection of the external wires of the packages Lu Ben, the test board sample passed and the right receiver # 4 ~ martial arts Pad; as well as having the same daisy chain portion and a plurality of samples to provide another second inspection method including the above plurality of detecting elements. Page 19 1282431 VI. Patent application range, and can be replaced with a plurality of configurations The test board externally connects the wires to the second test fixture, so that the external wires of the test boards are intermittently connected to the lead wires of the detecting elements, and the external wires of the test boards can simulate the chrysanthemum of the semiconductor package structure a chain portion; and a probe member of the second test fixture configured with the external wires of the test boards to probe the sample pad of the test plate sample to determine the daisy chain portion of the sample, if the patent scope is The daisy chain test method described in item u, = the external lead of the package and the external lead wires of the test boards are respectively different in the U-measure range of the 11th ❸ 述 菊 菊 测试 test method, wherein ^ is a few 肫 0 Standard JESD22-B111 test board.