TWI280095B - Water-cooled air cooler - Google Patents

Abstract

This invention discloses a water-cooled air cooler comprising a water-cooled base in which contains cooling liquid and the base is arranged on a heat-generating device, a cooling unit and a fan which are installed on top of the water-cooled base respectively, and one channel unit hollowly formed in the cooling unit. The cooling unit comprises a plurality of first and second cooling plates orderly piled at intervals over the water-cooled base from bottom to top. The fan can output air flows through the cooling plates. The hollow channel unit is curved in the cooling plate with two openings at the opposite terminals separately connected to the inner housing space of the water-cooled base, individually used for inletting and outletting cooling liquid into and out of the housing space. By circulating flow of cooling liquid between the housing space and the channel unit, and fan operation, heat generated from a heat-generating device can be quickly removed.

Description

1280095 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device. Water-cooled [Prior Art] ^ Dan's response to the development of electronic components has become a major development trend in the future

With the continuous miniaturization of sub-components and the improvement of processing speed, the number of electronic components that can be accommodated per unit volume of γ = wafer can also greatly improve the performance of the wafer. Among them, the most familiar ones are: The central processor that plays a central role in the computer, every other time: The high-frequency high-speed sub-products are launched. However, the central office of the towel judged that the heat generated by the volume of the unit was higher. In addition, many products produced by the above-mentioned high-speed high-frequency wafers have reduced the volume of products and reduced the space. In the case of an increase in the amount of heat generated per unit volume of blood per unit time, the problem of heat dissipation and cooling of electronic components has also become a subject of concern. Since high temperature directly affects the stability and life of electronic components and limits the application of high-frequency and high-speed electronic components, the development of high-efficiency products must be developed in parallel with high-frequency and high-speed electronic components. At present, the most common way is to directly attach a heat-conducting fin with a high thermal conductivity or a heat-dissipating fan to an electronic component that is prone to high temperature, and to cool down by natural heat convection or heat dissipation, but the above The heat dissipation effect achieved by the flow of only the airflow is poor, and the heat dissipation requirement of the 5 1280095 sub-component of the higher frequency and high speed is gradually unable to be met. SUMMARY OF THE INVENTION Therefore, the object of the present invention is to provide a water-cooling heat sink having high heat dissipation efficiency. Therefore, the water-cooling heat dissipating device of the present invention is suitable for use with a heating element, and comprises a water cooling seat assembled with the heating element, a heat dissipating unit and a fan respectively assembled above the water cooling seat, and a hollow formed on the a flow channel unit in the heat dissipation unit. The water-cooling base includes a horizontal 'hot plate' coupled to the heating element, and a pump assembled on the top surface of the heat-conducting plate and cooperating with the heat-conducting plate to define a receiving space for containing the cooling liquid. The heat dissipating unit comprises a first heat sink and a second heat sink which are stacked one on top of the top of the pump. The fan is assembled to the top end of the pump by generating an air flow through the heat sink. The hollow flow channel unit is formed in the heat dissipating plate in a bent manner, and the opposite end openings are respectively communicated with the accommodating space for respectively injecting and discharging the cooling liquid into the accommodating space. [Embodiment] The foregoing and other technical contents, features, and advantages of the present invention will be apparent from the detailed description of a preferred embodiment of the accompanying drawings. 811~3 7f, the preferred embodiment of the water-cooling heat dissipating device of the present invention is two-two: used with a heating element (not shown), i includes a hollow water-cooled seat 3 for assembly with two or two pieces, assembly At the top of the water-cooling base 3, the heat is 4%, the fan 5' which is assembled around the end of the water-cooling base 4 by the heat-dissipating unit 4, and the fan 61280095 which is hollowly bent and formed in the heat-dissipating unit 4 Unit 6. The water-cooling base 3 and the flow path unit 6 are filled with a flowable coolant (not shown). As shown in FIG. 2 and FIG. 4, the water-cooling base 3 includes a horizontal circular plate-shaped heat-conducting plate 31 for attaching to the surface of the heat-generating component, and a heat-conducting fin 32 protruding from the top surface of the heat-conducting plate 31, and a heat-dissipating fin 32. The pump 33 is assembled on the top surface of the heat conducting plate 31. The heat conducting plate 31 is made of a material having a high thermal conductivity and has a horizontal substrate portion 311 and a bottom surface of the substrate portion 311 and a heat generating element.

The assembly is connected to the board portion 312. The heat transfer fin 32 is formed on the top surface of the substrate portion 311 and is made of a material having a high thermal conductivity. The pump 33 includes a cover-shaped pump body 331 which is assembled on the top surface of the substrate portion 311 and covers the heat transfer fins 32, and a hollow drain pipe which is spaced apart from the outer peripheral surface of the pump body 331. 332 and a hollow water injection pipe 333. The pump body 331 cooperates with the 4 substrate portion 311 to define an accommodating space 30 for accommodating the cooling liquid. The heat dissipating unit 4 is assembled on the top surface of the pump body 331 and has an outer diameter larger than the pump. The main body 331 has a large upright ring column shape and is made of a material having a high thermal conductivity. The heat dissipation sheet $4 includes a plurality of bottom-up-up pairs, a horizontal first heat dissipation plate 41 and a horizontal second heat dissipation plate 42, and a bottom surface of the first heat dissipation plate 41 symmetrically overlapped with the bottom The third heat dissipation plate 43 between the top surfaces of the pump main body 331 and the fourth heat dissipation plate 44' symmetrically stacked on the top surface of the uppermost second heat dissipation plate 42 are assembled on the opposite faces of the diffusion plates 41 to 44, respectively. Heat sink fins 45. . . ', the plate heat sink 41 and the second heat sink 42. The heat sink 41 has two upper and lower pairs as shown in Figs. 2 and 5, and the structures of the first embodiment are vertically symmetrical. Each of the 7 1280095 is referred to as a ring-shaped plate-shaped plate body 4n, and a person is vertically symmetrically protruded from the cylindrical first abutment protrusions 412 on the back side of the first plate bodies 411, and two upper and lower symmetry The ground protrusion is disposed on the (four)-plate body 411 phase (four)_columnar __ bus bar 413. Each of the second heat dissipating plates 42 has two ring-shaped second plate bodies 421 which are vertically butt-joined, and a second abutting protrusions 422' and two respectively respectively symmetrical with the first abutting protrusions 412. a second bus bar 423 that is vertically symmetrical with the first bus bar 413. The first and second abutting studs 412 and 422 are symmetrically distributed along the inner circumference of the corresponding first plate 4U and the second plate 421, respectively, and define the inner circumference along the inner plates 4U and 421. Symmetrically spaced in a clockwise direction and respectively extending through the upper and lower symmetrical stages - and the second abutting studs 412, 422 - reference line 1 () 1, - reference line 1 () 2, _ reference line (8) and a reference line 104. The first and second bus bars 413 and 423 are respectively protruded from the portions Between the adjacent reference lines 1gi and the reference lines 104 of the plates 411 and 421 and define a vertical extension. Reference lines 105 of the bus bars 413, 423. The opposite side structure of the second heat dissipating plate 43 and the fourth heat dissipating plate 44 is the upper side: symmetry: wherein the third heat dissipating plate 43 has two slab-shaped third plate bodies 431 and four respectively a cylindrical third abutment protrusion 432 protruding from a top surface of the upper third plate body 々η, and an elliptical columnar third bus bar protrusion 433 protruding from a top surface of the upper third plate body 431 . The third abutments: the protrusions 432 are respectively distributed in the direction in which the reference lines 101 to 104 extend, and the second bus bar 433 is located in the direction in which the reference line 105 extends. The fourth heat dissipating plate 44 has two ring-shaped fourth plate-shaped states of the upper and lower butt joints; 28〇〇95 and four, respectively, and the third abutting convex portions 432 are vertically symmetrically protruded from the lower fourth plate. The fourth abutting stud 442 on the bottom surface of the body 441 and the four converging studs 443 protruding from the bottom surface of the lower fourth plate body 441 and symmetrically symmetrical with the third confluent portion 433. The heat-dissipating fins 45 are made of a material having a high thermal conductivity, and are fixedly bent up and down between the adjacent faces of the two adjacent heat-dissipating plates 41-44, and respectively, respectively = reference lines 101 and 102 (5), reference line 1 Between 2 and 103, and the area between the reference line 3 and 1 () 4, a plurality of gaps between the heat dissipation plates are formed between the heat dissipation plates. The fan 5 is connected to the top surface of the pump body 331 of the pump 33, and can flow through the heat dissipation plates 41 to 44 and the fresh heat dissipation fins 4

Airflow. As shown in FIGS. 3, 6, and 7, the flow path unit 6 is hollowly formed on the heat dissipation plates 41 to 44 of the Guhai, and is provided with a cooling liquid wire, and is horizontally symmetrical and has a c-shaped horizontal flute.胄 “ “ “ “ “ “ “ “ “ 少 上下 上下 上下 上下 上下 上下 上下 千 千 千 千 千 千 千 千 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 61 The connecting section 64, the upright confluence section 65 extending downward from the uppermost section ^^, and the majority of the spoiler section 66 respectively located on the upper and lower sides of the μ-guided k section 61, 62. Two = first diversion section 61 is formed in the first-heat-dissipating plate 41 body::: in the 夂 夂 ! !! 61 疋 from the corresponding heat sink 41, 44 证力 | test line 1 〇丨 〇 / 〇 日 日 延伸 延伸Extending to the position of the reference line 104 via the reference line 102, and having a first discharge end 611 at the position of the reference line 9 1280095 104, an end 612 and a position at the position of the reference line 101. The first guide g and the lower guide symmetry are respectively formed between the pair of &

Formed between the third plate bodies 431, and each of the second flow guiding sections 62 has a discharge end 621 that is symmetrical with the injection end 612 of the first flow guiding section 61, and - is discharged from the first flow guiding section 61 End 611 is symmetrically implanted at end 622. The injection end of the second flow guiding section 62 formed between the third plate bodies 431 seems to have an outward opening (four) which is formed on the lower surface of the second second plate body 43 i. The first engaging sections 63 extend upward from the discharge end 6U of the first flow guiding section 61 through the adjacent two abutting studs 412 and 422, respectively, and the first guiding flow of the upper/upper phase portions respectively The injection end 622 of the segment 6 i is in communication. The first connecting sections 64 extend upward from the discharge ends 621 of the second flow guiding sections 62, respectively, and extend through the adjacent third abutting protrusions 432 and the first abutting protrusions 412, respectively. The second abutting protrusion 422 and the first abutting protrusion 412, and the second abutting protrusion 422 and the fourth abutting protrusion 442 are respectively connected to the injection end 612 of the first adjacent first guiding section 61. . The cross section of the salty confluence section 65 has an elliptical shape, and the top end thereof is connected to the discharge end 611 of the first flow guiding section 61 located at the uppermost portion, and extends downwardly through the upper and lower abutting converging protrusions 443. 413, 423, 433 and having an outward opening 650 formed on the bottom surface of the lowermost third plate 431. The spoiler segments 66 are respectively formed in the abutting protrusions 412, 422, 432, and 442 in the extending direction of the reference lines ι 2 and 1 〇 3, and respectively correspond to the corresponding two plates 411 and 421, The guiding sections 61 and 62 between 431 and 441 are connected to 10 1280095 ' and the heights of the sections are higher than the corresponding guiding sections 61 and 62. As shown in FIG. 67, when the water-cooling heat dissipating device is assembled, the heat dissipating plates 41 to 44, the heat dissipating fins Μ and the fan 5 of the heat dissipating unit 4 are respectively fixed and fixed to the pump main body of the pump 33. 331 top surface, the lowermost third plate body 431 is assembled to cover the top ends of the water pipes 332, 333, and the opening (4) and the second flow guiding portion 62 of the confluence section 65 formed on the bottom surface of the third plate body 431 are formed. Open σ _, respectively, and the drain pipe said ^ mouth and should

The water injection pipe 333 is open and butted to form a closed loop for the flow of the coolant. When the field/cold cooling type heating device is used to lower the temperature of a heating element, the assembly plate portion 312 of the heat conducting plate 31 of the Uc cold seat 3 is directly attached and fixed to the outer surface of the heating element, and then the pump body is activated. 331 and fan 5. After the main pump It It 331 starts to operate, the cold liquid in the accommodating space 30 is continuously squeezed out through the drain f to be discharged into the communicating second guiding section 62, while The coolant contained in the confluence section 65 is sucked into the accommodating space 30 via the water injection pipe 333. The fan 5 constantly generates an air flow that flows outward through the heat radiating unit 4. Therefore, the heat generated by the heating element is directly transmitted to the heat-conducting fin 32 in the space 经由 30 through the heat-conducting plate 3, and the temperature of the coolant in the accommodating space 30 is indirectly increased. When the coolant is discharged into the flow channel unit 6, the second flow guiding section 62, the second connecting section 64, the first guiding section 61, the first connecting section 63 and the second guiding flow are sequentially passed from bottom to top. The section 62 flows in a manner of continuously transferring heat to the heat dissipation plates 41 to 44 of the heat dissipation unit 4 and is conducted to the heat dissipation 11 1280095 fins 45. The heat dissipation plates 41 to 44 and the heat dissipation fins 45 conduct heat to the surrounding air in a heat convection manner, and are generated by the fan 5 to be forcibly dissipated. Therefore, the temperature of the coolant discharged from the accommodating space 3 逐渐 gradually decreases during the flow, so that the temperature of the coolant flowing into the accommodating space 3 via the confluence section 65 is always lower than that originally contained in the vacant space. The coolant is lower than continuously passing away the heat conducted to the heat-conducting fins 32 with a lower temperature coolant, so that the temperature of the heat-conducting 32 can be quickly lowered, thereby rapidly reducing the temperature of the heat-generating component. It is worth mentioning that when the coolant circulates in the flow guiding sections 61, 62 and flows through the turbulent sections 66 where the space suddenly becomes large, the coolant will be disturbed in the turbulent sections 66. The flow (4) acts so that the temperature of the coolant in the perturbation section 66 is uniform, and then continues to flow to the next spoiler section, thereby improving the heat dissipation efficiency per unit time. During the application, the third and fourth heat dissipation plates 43 of the heat dissipation unit 4 are not necessary, and the first heat dissipation plate 41 located at the bottom may be directly attached to the pump body 331 and the flow path may be adjusted correspondingly. The structure of the unit 6 is such that the injection end 612 of the first flow guiding section 61 located in the first heat dissipation plate 42 is in communication with the opening of the discharge pipe 332, and the top end of the converging section 65 is the uppermost guiding segment 62. The discharge end 621 is connected, but in the implementation, the heat dissipation unit 4 and the number of the heat dissipation plates 41 to 44 and the assembly method are not limited to the above-mentioned types, and can be adjusted according to actual needs. The other "Hai' melon unit 6 may not provide the second connecting section 64, and the number of the first junction & 63 is only one, and extends from the bottom to the top to extend the discharge end of the first guiding section 61 611 and the injection end 622 12 1280095 ' of the second flow guiding section 62 allow the coolant to flow directly through the first-joining section 63 to the lower, upper spaced guiding sections 61, 62. The manifold 65 is collected and flows into the pump body 331. The spoiler segments 66 are not necessary, and the structure of the runner unit 6 can also be adjusted in accordance with the shape of the heat dissipating unit 4. In summary, the design of the assembly structure of the water cooling seat 3 and the heat dissipating unit 4, and the distribution structure design of the flow path unit 6 can be formed in the water cooling seat 3 and the heat dissipation unit it 4 - for the circulation of the cooling liquid Kidney folding closed circuit: the heat transferred to the heat conducting fin #32 can be continuously taken away by the lower temperature coolant in the receiving space 3Q, and the heat radiating plates 41 to 44 of the heat radiating unit 4 are cooled. The fins 45 are emitted to the surrounding environment. The airflow generated by the fan 5 can further accelerate the forced dissipation of the heat of the heat dissipation plates 41 to 44, thereby greatly improving the heat dissipation efficiency, thereby rapidly reducing the temperature of the heat generating component. Therefore, the object of the present invention can be achieved. However, the above is only a preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the simple equivalent change of the application (four) and the description of the invention according to the present invention is Modifications are still within the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a preferred embodiment of a water-cooling heat sink according to the present invention; FIG. 2 is an exploded perspective view of the preferred embodiment, and FIG. 3 is a flow path unit of the preferred embodiment. Schematic diagram showing the flow direction of the coolant in the flow path unit; Fig. 4 is a side view of the water-cooled seat of the preferred embodiment;

12 is a side view of a heat dissipating unit of the preferred embodiment; Fig. 6 is a side cross-sectional view of Fig. 5 taken along line VI-VI; and Fig. 7 is a side cross-sectional view of Fig. 5 taken along line W-ΥΠ. 14 1280095

[Description of main component symbols] 3 ............. Water-cooled seat 432.... Second abutting stud 30 ...··.. accommodating space 433.··· .. The second bus bar 31 ...···································· The assembly plate portion 442.······the fourth abutment stud 32 ........the heat transfer fin 443.....the fourth bus bar 33.··.. .... Pump 45 .···. ...heat fins 331.... •...the main body of the pump 5.......fan 332····....drain pipe 6.... ...flow channel unit 332...... water injection pipe 61 ..... ... first flow guiding section 4....... .... heat dissipation unit 611 .... ... The non-exit end 41 ........the first heat sink 612·...the injection end 411····.the first plate body 62.•...the second flow guiding section 412··.· —First abutment stud 620········································································ Heat sink 622····...injection end 421····..second plate body 63...·first joint segment 422····-second Connecting post 64 "...second connecting section 423····.. second bus bar 65 ...·· ... confluence section 43 .•..... = heat sink 650···· ··· Opening 431.... •...Second plate 66 ..... ... spoiler 15

Claims (1)

1280095 X. Patent application scope · A water-cooling heat sink is suitable for use with a heating element, and includes: the water-cooled seat includes a horizontal heat conducting plate connected to the heating element, and is flattened at the top of the heat conducting plate The surface cooperates with the heat conducting plate to define a pump in which the storage space of the cooling liquid is placed; and the heat releasing unit includes a plurality of upper and lower layers which are sequentially stacked above the 4 pumps from the bottom to the top and are respectively hollow rings. a first heat sink and a first heat sink; a fan 'surrounded by the heat sink and capable of generating airflow through the heat sink to be assembled on the top of the pump; and a hollow runner unit, bent The ground is formed in the heat dissipating plates and the opposite ends of the openings are respectively connected to the accommodating space, and matched with the accommodating space to form a closed loop for the coolant to flow. The water-cooling heat dissipating device according to claim 1, wherein each of the first heat dissipating plates has two first plates that are symmetrically joined to each other, and a plurality of first plates are respectively protruded from the back sides of the first plates. a first abutting stud, and two upper: symmetrically protruding from the converging studs on the back side of the first plate body, each second heat sink having two second plates that are butted up and down, and most of the protrusions a second abutting stud disposed on the f-plane of the plate body and opposite to the first abutting studs of the adjacent first heat sink, and two protrusions respectively on the second surface a second bus bar having a back surface of the plate body and respectively abutting the adjacent first bus bar. 3. The water-cooling heat dissipating device according to claim 2, wherein: 16 1280095, the flow channel unit comprises a plurality of c-shaped first diversion segments which are vertically symmetrically and respectively formed between the first plates, a plurality of c-shaped second diversion flows respectively formed between the second plate bodies symmetrically with the first flow guiding segments, and abutting the protruding columns abutting up and down Connecting the first and second flow guiding sections between the first and second guiding sections, and - extending from the uppermost first guiding section to the confluence of the upper and lower abutting converging studs The segment 'and the lowermost first-conducting section and the bottom end of the confluence section are respectively connected to the accommodating space and respectively available for discharging and injecting the cooling liquid into the accommodating space. 4. According to the water-cooling heat dissipating device of the third item of the patent scope, wherein: each of the first guiding section has an opposite discharge end and an injection end, and takes the injection end of the lower first-conduit section Is connected to the accommodating space, and each of the second guiding segments has an injection end and a discharge end respectively symmetrical with the discharge end and the injection end of the first flow guiding section, and the first connecting section That is, the communication phase extends upward from the discharge end of the first-conduit segment The second connecting sections of the adjacent second guiding sections are respectively extended from the discharging ends of the second guiding sections to the injection end of the adjacent first guiding sections. /;, ' 5. According to the towel, please refer to the water-cooled heat dissipation according to item 4 of the patent scope. In the basin, the discharge end and the injection end of the guide section are respectively separated from the two pairs: - symmetrical with the second abutting stud, the connecting segments are divided, and extend from the corresponding discharge end upwardly through the corresponding phase abutting first and the first abutting stud to respectively communicate with the corresponding injection end. 6. According to the water-cooling heat dissipating device of the fourth aspect of the patent application, wherein 17 1280095, the confluence section of the flow channel unit extends downward from the discharge end of the uppermost second diversion section and is connected at the bottom end. The space for the water cooling seat. 7_ The water-cooled type (four) S set according to item 3 of the ejector request range, wherein the flow path unit further comprises a plurality of guides formed in the abutting studs and respectively corresponding to the corresponding plates. The spoiler segment where the flow segments are connected. 8. The water-cooling heat dissipating device of claim 3, wherein the pump has an opening with the opening facing downwardly covering the top surface of the heat conducting plate and cooperating with the heat conducting plate to define the receiving portion. a pump main body of the space, and a hollow drain pipe and a hollow water injection pipe respectively protruding from the outer peripheral surface of the pump main body and respectively connected with the bottom surface of the first lower plate body, the opposite ends of the drain pipe are respectively And the accommodating space and the injection end of the lowermost _thracement section are in communication, and the opposite ends of the water injection f are respectively communicated with the bottom end of the merging section. 〃 9. According to the shot, please patent the scope! The water-cooled heat sink of the present invention, wherein the water-cooling base further comprises a heat-conducting tab assembled in the space of the guide. The water-cooling heat dissipating device according to the item i of the patent application scope, wherein the heat dissipating unit further comprises a plurality of components respectively disposed in the two phases respectively located at the fan The heat dissipation in the direction of the airflow produced by the Korean film month. ‘',, 0 18