I2739^twf d〇c/r 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種修整裝置，且特別是有關於一種 的適用於沖切基板條之基板修整裝置。 【先前技術】 於iC/t件之外，且曝露出IC元件之接點，以保護Ic元件 免於受損且使其易於裝配使用。 目前半導體基板的去框製程，係利用一模具將長條狀 曰積體電路(1C)封裝是將加工完成的晶圓經過切割、黏 曰曰卜線··.專處理後’將封裝膠體(molding c〇mp〇und)包覆 於1C元杜夕々k，ο r甚愈山τπ ;从> & w .. 有數個對應於基板外型之刀具， 定待切割之基板條，且下模的ilI2739^twf d〇c/r IX. Description of the Invention: [Technical Field] The present invention relates to a dressing device, and more particularly to a substrate dressing device suitable for die-cutting a substrate strip. [Prior Art] The contacts of the IC components are exposed outside the iC/t device to protect the Ic components from damage and make them easy to assemble. At present, the de-frame process of the semiconductor substrate is to use a mold to package the long-length hoarding circuit (1C) by cutting and bonding the processed wafer to a special process. Molding c〇mp〇und) is coated on 1C Yuan Du Xi々k, ο rheshanshan τπ; from >& w .. has several tools corresponding to the substrate shape, the substrate strip to be cut, and Lower die
一個個獨立的基板。此模具 ^括上模及配置於其下方之下模兩個部份，此上模係配置A separate substrate. The mold includes two parts of the upper mold and the lower mold, and the upper mold system is configured.
下來，並組裝上具有與待切 才能進行不同厚度之基板條 5 $去祀:=¾。因此，若待切割之基板條具有不同的厚度時， 木作人員則需重覆上述拆裝擋塊的步驟，才能進行不同厚 度之基板條的切割，而此舉將增添操作上的麻煩。 因此，如何改善目前基板條之去框製程所使用的模 ’、使不爲因待切割之基板條厚度的不同，而拆裝更換、 具有不同厚度的擋塊，實為亟待解決之一大難題。 、 【發明内容】Down and assemble the substrate strips with different thicknesses to be cut to 5 祀 祀:=3⁄4. Therefore, if the substrate strips to be cut have different thicknesses, the woodworker needs to repeat the above steps of disassembling the stoppers to cut the strips of different thicknesses, which will increase the trouble of operation. Therefore, how to improve the mold used in the frame-cutting process of the current substrate strip, and to disassemble and replace the stoppers having different thicknesses due to the difference in the thickness of the substrate strip to be cut is a major problem to be solved. . [Content of the invention]
本發明的目的就是在提供一種基板修整裝置，適於將 :板條沖切成多個基板，此基板修整裝置在沖切具有不同 厚度之基板條時，不需因基板條厚度的不同， 不同厚度的擋塊。 /、有 基於上述或其他目的，本發明提出一種基板修整裝 置，適於將一基板條沖切成多個基板。此基板修整聿置^ 要包1模具、修整單元及彈性固定元件。其中，修整單元 係與，具連接，❿轉性岐元件伽置於財巾，且彈 ^生口疋元件係於沖切過程具有最大〇.6mm之形變量。The object of the present invention is to provide a substrate finishing device, which is suitable for: punching a slat into a plurality of substrates, and the substrate finishing device does not need to be different in thickness of the substrate strip when punching the substrate strips having different thicknesses. Thickness stop. Based on the above or other objects, the present invention provides a substrate finishing apparatus adapted to die-cut a substrate strip into a plurality of substrates. The substrate trimming device is provided with a mold, a dressing unit and an elastic fixing member. Wherein, the trimming unit is connected, the twisting element is placed on the financial napkin, and the elastic element is in the shape of a maximum of .6 mm in the punching process.
在本發明之一較佳實施例中，此模具包括上模與下 挺’而上模係配置於下_上方，且彈性固 配 於上模或是下模上。 Hi 〇〇在本發明之一較佳實施例中，此彈性固定元件具有一 彈丨生係數介於3kg/cm2至5xl04kg/cm2之間，且彈性固定元 件例如包括彈簧或彈性墊或彈簧及彈性墊之組合。 、在本發明之一較佳實施例中，此彈性固定元件於沖切 過程中之形變量介於〇 4mm至〇.6mm之間。 6 12739夠 twf.doc/r —由於本發明之基板修整裝置係於模具巾配置有彈性 件，當上模向下移細縣於基板條之表面時，此 舞性固定元件會因受到上模之讎形變，而使其具有盘基 之厚度’如此—來，操作人員即可不需因基板條 ^度的不同’而更換不同厚度之擂塊，以減少操作 煩。 為壤本發明之上述和其他目的、特徵和優點能更明顯 易反，下文特舉較佳實補，並配合所關式，作詳細說 明如下。 【實施方式】 “圖1繪不為本發明之基板修整裝置的立體分解圖。請 參照圖1所示，此基板修整裝置i⑻適用於將—基板條200 冲切成個個彼此獨立的基板21〇，其主要包括模具11〇、 ，整單元120及彈性固定元件13〇三個部分。其中，修整 f元120係與模具11〇連接，以沖切此基板條2⑻。而此 彈性固定讀130収配置於模具nQ中，且彈性固定元 件110於冲切過私具有最大0 6mm之形變量。此外，彈性 固定元件no之彈性係數是介於Skg/cm2至5χΐ〇ν·2 之間。 此杈具110可分為上模112與下模114兩個部分。上 模112^係配置於下模114的上方，且其配置有多個導軌 112a’每個導軌iua之位置及其形狀係對應於基板條2〇〇 中各基板210邊緣待切割的部份，以供修整單元12〇經由 此導執112a而沖切待切割之基板條200，進而修整(trim) 7 1273959 twf.doc/r 掉基板條200上不必要的部分，以形成一個個彼此獨立的 基板210。在此實施例中，此修整單元12〇例如是一對靡 於各基板210邊緣待切割部份的刀具12〇,。此下模114係 用以容置基板條200，並藉由一些固定裝置，例如抽真空 裝置，以吸附住基板條200，使其在沖切的過程中不致 生位移。 在本實施例中，下模114之邊緣上配置有彈性固定元 件130，當上模ι12向下移動以壓著於基板條2㈨之 時，此彈性固定元件130會因受到上模112的播壓起 k ’而使其具有與基板條2〇〇相同的厚度 200受到上模112的過度擠壓而使其内部的元件ft 毁。由於此彈性固定元件13〇係由具有彈性的材料或^元 ΞΓυ其受到外力擠壓時皆會產生相對應之形變， :不…寺切割之基板條200的厚度為何，此彈性固定 元件m受到上模之擠壓後皆會形變至與 200相同的厚产，加仏+ τ刀口J之暴板條 欲沖切不同厚ί之’即可避免掉習知技術中，當 造成之麻^基板條時，需要更料同厚度的擋塊所 變量=11’至彈:^ 可例如為彈簧、彈性墊ΐς 圖2緣示為彈性固定娜墊之組合。此外， 參考圖2所·^種貫施_—圖，請 勺甘不弹性固定元件130也可以是由主，132另 匕復。、外圍之彈性覆蓋物I34戶斤組成，當上模m向下 1273 移動以壓著於基板條200 樣會受到上模n2的_產絲；:==34: ΐί n?f = 吏其内部的元件受到損毀。而整個 ΓΓγ 料切過程具有最大恤m之形變量。In a preferred embodiment of the invention, the mold includes an upper mold and a lower mold, and the upper mold is disposed above the lower mold and elastically fitted to the upper mold or the lower mold. Hi 〇〇 In a preferred embodiment of the invention, the elastic fixing element has an elastic modulus of between 3 kg/cm 2 and 5 x 10 kg/cm 2 , and the elastic fixing member comprises, for example, a spring or an elastic pad or spring and elasticity A combination of pads. In a preferred embodiment of the invention, the elastic fixing member has a deformation amount between 〇 4 mm and 〇. 6 mm during the punching process. 6 12739 is sufficient for twf.doc/r - since the substrate finishing device of the present invention is provided with elastic members in the mold towel, when the upper mold is moved downward to the surface of the substrate strip, the dance fixing member is subjected to the upper mold. After the deformation, so that it has the thickness of the disc base - this way, the operator can replace the different thickness of the block without changing the thickness of the substrate to reduce the operation annoyance. The above and other objects, features and advantages of the present invention will become more apparent and <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; [Embodiment] FIG. 1 is an exploded perspective view of a substrate finishing apparatus not according to the present invention. Referring to FIG. 1, the substrate finishing apparatus i (8) is adapted to die-cut the substrate strip 200 into individual substrates 21 independently of each other. 〇, which mainly comprises a mold 11〇, an integral unit 120 and an elastic fixing member 13〇. The trimming unit 120 is connected to the mold 11〇 to punch the substrate strip 2 (8), and the elastic fixed reading 130 The elastic fixing member 110 is disposed in the mold nQ, and the elastic fixing member 110 has a shape variable of a maximum of 0.6 mm. In addition, the elastic modulus of the elastic fixing member no is between Skg/cm2 and 5χΐ〇ν·2. The cooker 110 can be divided into two parts, an upper die 112 and a lower die 114. The upper die 112 is disposed above the lower die 114, and is configured with a plurality of guide rails 112a'. The portion to be cut at the edge of each substrate 210 in the substrate strip 2 for the trimming unit 12 to punch the substrate strip 200 to be cut via the guide 112a, and then trim 3 7273959 twf.doc/r Unnecessary portions of the substrate strip 200 are removed to form one by one In this embodiment, the trimming unit 12 is, for example, a pair of cutters 12 靡 on the edge of each substrate 210 to be cut. The lower mold 114 is for accommodating the substrate strip 200. And a plurality of fixing devices, such as a vacuuming device, are used to adsorb the substrate strip 200 so as not to be displaced during the punching process. In the embodiment, the elastic mold fixing member 130 is disposed on the edge of the lower mold 114. When the upper mold ι12 is moved downward to be pressed against the substrate strip 2 (9), the elastic fixing member 130 is subjected to the same thickness as the substrate strip 2 by receiving the pressing of the upper mold 112. Excessive squeezing of the die 112 destroys the internal component ft. Since the elastic fixing component 13 is elastically deformed or pressed by an external force, the corresponding deformation occurs: The thickness of the cut substrate strip 200 is such that the elastic fixing member m is deformed to the same thickness as the 200 after being pressed by the upper mold, and the slats of the 仏+τ knife edge J are to be cut to different thicknesses. Can avoid the traditional technology, when caused by the ma For the substrate strip, it is necessary to change the variable of the same thickness to the variable of the block = 11' to the spring: ^ can be, for example, a spring or an elastic pad. The edge of the figure 2 is shown as a combination of the elastic fixed pad. In addition, referring to Fig. 2 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ 200 samples will be subjected to the _filament of the upper mold n2;:==34: ΐί n?f = 吏The internal components are damaged. The entire ΓΓγ cutting process has the largest shape of the shape of the m.
⑽⑽鄕輪㈣“至5X 取代=中:：係:二:性:=蚊元件 件受到上模：：= 雖然本發明已以較佳實施例揭露如上，秋 :艮ί，明’任何熟習此技藝者，在不脫離本發明之:二 當可作些許之更動與潤，’因此本發明之“ 摩巳圍當視後附之申請專利範圍所界定者為準。 保4 【圖式簡單說明】 … 圖1緣示為本發明之基板修整裳置的立體分 圖。圖2繪示為彈性固定元件之其中—種實施態樣^面 【主要元件符號說明】 100 .基板修整裳置 1273 9啊 twf.doc/r no:模具 112 :上模 112a :導執 114 :下模 120 :修整單元 120’ ：刀具 130 :彈性固定元件 132 :主體 134 :彈性覆蓋物 200 :基板條 210 :基板(10) (10) 鄕 wheel (four) "to 5X substitution = medium:: system: two: sex: = mosquito component is subjected to the upper die:: = Although the invention has been disclosed in the preferred embodiment as above, autumn: 艮ί, Ming 'any familiar with this The skilled artisan, without departing from the invention, may be made a little more versatile and versatile, and thus the "the scope of the patent application of the present invention is subject to the definition of the patent application scope. [Brief Description] Fig. 1 is a perspective view showing the substrate trimming of the present invention. 2 is a schematic view of one of the embodiments of the elastic fixing member. [Main component symbol description] 100. Substrate trimming skirt 1273 9 ah twf.doc/r no: Mold 112: Upper die 112a: Guide 114: Lower die 120: trimming unit 120': cutter 130: elastic fixing member 132: main body 134: elastic covering 200: substrate strip 210: substrate
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