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TW200726615A - Substrate trimming apparatus - Google Patents

Substrate trimming apparatus

Info

Publication number
TW200726615A
TW200726615A TW095101029A TW95101029A TW200726615A TW 200726615 A TW200726615 A TW 200726615A TW 095101029 A TW095101029 A TW 095101029A TW 95101029 A TW95101029 A TW 95101029A TW 200726615 A TW200726615 A TW 200726615A
Authority
TW
Taiwan
Prior art keywords
fixing element
elastic fixing
substrate
mold
trimming apparatus
Prior art date
Application number
TW095101029A
Other languages
Chinese (zh)
Other versions
TWI273959B (en
Inventor
Yun-Lung Chang
Ching-Tai Huang
Chin-Sung Lee
Ming-Wei Sun
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW95101029A priority Critical patent/TWI273959B/en
Application granted granted Critical
Publication of TWI273959B publication Critical patent/TWI273959B/en
Publication of TW200726615A publication Critical patent/TW200726615A/en

Links

Landscapes

  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

A substrate trimming apparatus for punching a substrate strip to form a plurality of substrates is provided. The substrate trimming apparatus comprises a mold, a trimming unit and an elastic fixing element. The trimming unit is connected to the mold. The elastic fixing element is arranged inside the mold and the maximum deformation of the elastic fixing element is 0.6mm during a punch process. After the elastic fixing element is compressed by the mold, the thickness of the elastic fixing element is identical with that of the substrate strip. There is no need to change the stoppers according to the thickness of the substrate strip in order to reduce the inconvenience during operation.
TW95101029A 2006-01-11 2006-01-11 Substrate trimming apparatus TWI273959B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95101029A TWI273959B (en) 2006-01-11 2006-01-11 Substrate trimming apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95101029A TWI273959B (en) 2006-01-11 2006-01-11 Substrate trimming apparatus

Publications (2)

Publication Number Publication Date
TWI273959B TWI273959B (en) 2007-02-21
TW200726615A true TW200726615A (en) 2007-07-16

Family

ID=38622971

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95101029A TWI273959B (en) 2006-01-11 2006-01-11 Substrate trimming apparatus

Country Status (1)

Country Link
TW (1) TWI273959B (en)

Also Published As

Publication number Publication date
TWI273959B (en) 2007-02-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees