1269778 五、發明說明（1) 【發明所屬之技術領域】 本發明係關於一種模仁製造方法。 【先前技術】 模仁之用途十分廣泛，由其製得之產品可用於資訊、 電子、生物、酉療、光電等領域。隨著科技之發展，對機 械加工之精密度要求之提高，尤其*LIGA (Lith〇graphie Gal vanof oirmung Abf 〇rmung)技術之出現，使模仁之製造 從傳統之機械加工進入到微米及奈米時代。 精密度南之微結構模仁製造採用L丨GA技術中之電鑄製 程L目前，電鑄法製造模仁主要採用二種方式。一種是基 材採用非金屬材質，於顯影後之光阻與基材表面鍍一金屬 f j進行電鑄；另—種是基材採用金屬材f，顯影後於 基材表面鍍一金屬膜，再進行電鑄。 程圖請: ί一種先前技術之模仁製造方法之流 為矽曰供一基材（步驟101)，其中該基材 冷石夕日日0或玻璃材皙. !〇2);曝光、頭旦^；_於§亥基材表面塗覆一光阻層（步驟 於該光阻層及；=阻層以形成預定圖案(步驟1。3); 步驟形成-金二牛；金屬薄膜(步驟1〇4);進行電鑄 層及金屬薄膜v驟5)，將该光阻層及基材與金屬 然由 剝離，形成一模仁（步驟106)。 模仁厚ΪΪΪ方；材ί為ΐ材：經電鱗製得之 曝光之光阻表面同時析 ^, 於電鑄時基材與未 接合處難以均句的 尤之先阻與基材之 9的析出金屬，造成電鑄表面不平坦。1269778 V. INSTRUCTION DESCRIPTION OF THE INVENTION (1) Technical Field of the Invention The present invention relates to a method of manufacturing a mold core. [Prior Art] Molding is widely used, and its products can be used in information, electronics, biology, therapeutics, optoelectronics and other fields. With the development of technology, the demand for precision in machining has increased, especially the emergence of *LIGA (Lith〇graphie Gal vanof oirmung Abf 〇rmung) technology, which has enabled the manufacture of mold cores from traditional machining to the micron and nano era. . The precision microstructure of the South is based on the electroforming process in the L丨GA technology. Currently, the electroforming method uses two methods. One is that the substrate is made of a non-metal material, and the photoresist after development is electroformed with a metal fj on the surface of the substrate; the other is that the substrate is made of a metal material f, and a metal film is plated on the surface of the substrate after development. Perform electroforming. Process diagram: ί A prior art method of manufacturing a mold core is to supply a substrate (step 101), wherein the substrate is cold stone day 0 or glass material 〇. !〇2); exposure, first ^;_ Apply a photoresist layer on the surface of the substrate (step to the photoresist layer and = = resist layer to form a predetermined pattern (step 1.3); step formation - gold two cattle; metal film (step 1 〇4); performing electroforming layer and metal film v (5), stripping the photoresist layer and the substrate and the metal to form a mold (step 106). The mold is thick and thick; the material is the coffin: the surface of the exposed photoresist is obtained by electric scale. At the same time, the substrate and the unjoined part of the electroforming are difficult to be evenly resisted. The metal is precipitated, causing the electroformed surface to be uneven.
I 第5頁 1269778 - 五、發明說明（2) 請參閱第二圖，係2003年3 利公告第523487號所揭示之_ •么σ之中華民國專 括.提供一預成型金屬基材（步驟20ηΊ^法，其步驟包 基材表面覆蓋一焊接材料（步驟2〇 涂你2預成型金屬 該焊接材料上(步驟203); 鑄材：=阻材料於 其中該電鑄材料填入該光 电‘材科以進行電鑄， 鑄模仁（步驟2〇4);去除光圖案間隙以形成—微電 此種衣造方法採用金屬材 ， 度’並提高模仁硬度，且，接於^矣可增加模仁厚 提高金屬析.出均勾率，電鑄表面較jm:禱，可 小，模仁易折斷。 電為孟屬與基材之接觸面積 藉此’提供-種增大電鑄金屬與基材之接觸面 積，棱南模仁強度之模仁製造方法實為必要。面 【發明内容】 本^明之目的在於提供一種增大電禱 觸面積之模仁製造方法。 绮主屬與基材之接 ，發明提供之模仁製造方法包括以下步驟：提供一金 屬土板，於該金屬基板上塗佈一光阻層；利用一且 =之光罩對該金屬基板進行曝光、顯影步驟；進;;渴蝕: 步驟，使金屬基板產生底切現象；於上述已蝕刻之金屬基 板表面沈積一金屬薄膜層；進行電鑄步驟於該金屬薄膜$ ί形f—具一定厚度之金屬層；將該剩餘光阻層剝離，、开； 成一模仁。I Page 5 1269778 - V. INSTRUCTIONS (2) Please refer to the second figure, which is disclosed in 2003, 3 Li Announcement No. 523487. _ • σσ Republic of China. Provide a preformed metal substrate (steps) 20ηΊ^ method, the step of covering the surface of the substrate is covered with a solder material (step 2: coating the 2 pre-formed metal on the solder material (step 203); casting material: = resist material in which the electroforming material fills the photo- The material is used for electroforming, casting the mold kernel (step 2〇4); removing the gap of the light pattern to form - micro-electricity, the coating method adopts metal material, degree 'and improves the hardness of the mold core, and The thickness of the mold is increased to increase the metal extraction rate. The surface of the electroforming is more than jm: the prayer can be small, and the mold is easy to break. The electric contact area of the genus and the substrate is used to provide an increase in the electroforming metal and the base. The contact area of the material, the manufacturing method of the core of the ridge south mold strength is really necessary. [Explanation] The purpose of the present invention is to provide a method for manufacturing the mold core which increases the electric prayer area. The method for manufacturing a mold provided by the invention comprises the following steps: providing one a metal earth plate on which a photoresist layer is coated; a step of exposing and developing the metal substrate by using a photomask of the same; and; a thirst: step of causing undercutting of the metal substrate; Depositing a metal film layer on the surface of the etched metal substrate; performing an electroforming step on the metal film: a metal layer having a certain thickness; peeling off and opening the remaining photoresist layer; forming a mold.
1 第6頁 1269778 五、發明說明（3) 相較於先前技術，本發明之模仁製造方法 、 步驟，於基材表面產生底切，電鑄時增 :】濕蝕刻 之接觸面積，提高模仁強度。 金屬與基材 【實施方式】 請一併參閱第三圖至第八圖’係本發明模 之流程，其包括以下步驟： 衣k方法 提供-金屬基板51〇 ’其+ ’該金屬基板 以為鎳系合金、銅系合金及鉻系合金等，苴 貝可 於該金屬基板51〇上均勻塗佈—光阻層4()(/，、如第 不。其中，塗佈之光阻為有機光阻劑材料，可 ΐ二採用二光：劑。本實施方式係採用聚 甲曰^ y Methyl Meth Acrylate’ ΡΜΜΑ)。塗佈光阻之 方法採用旋塗方法，亦可採用喷塗方法。 利用預先設計圖案之光罩6〇〇進行曝光、顯影與蝕刻 步驟。將光罩6G0與金屬基板51G對準，進行曝光步驟。其 中，曝光之光源為紫外線，採用投影式曝光技術曝光， 即’該光罩60 0平行於金屬基板51〇。如第四圖所示，光源 电出之光線7 0 0經光學系統（圖未示）透過光罩6 〇 〇照射至塗 佈光阻，400之金屬基板51〇上，受到光線照射之光阻 發生光，反應’生成已曝光部份441及未曝光部份44〇。 請爹閱第五圖、。進行顯影步驟，得到圓柱狀之光阻圖案。 其中’顯衫液為甲基異丁基酮。於金屬基板5 i 〇上喷灑顯 影液，且基板處於靜止狀態3 〇秒_ β 〇秒，使已曝光部份 441之光阻充刀，谷於顯影液，即可將光罩6〇〇之圖案轉移於1 Page 6 1269778 V. Description of the Invention (3) Compared with the prior art, the method and the steps for manufacturing the mold core of the present invention generate undercut on the surface of the substrate, and increase the contact area of the wet etching when the electroforming is performed: Ren strength. Metal and Substrate [Embodiment] Please refer to the third to eighth drawings together with the flow of the mold of the present invention, which includes the following steps: The method of coating k provides - the metal substrate 51 〇 'the + 'the metal substrate is nickel An alloy, a copper alloy, a chromium alloy, or the like, and the mussels may be uniformly coated on the metal substrate 51—the photoresist layer 4 (/, as described above), wherein the applied photoresist is organic light. For the resist material, the second light: agent can be used. In the present embodiment, polymethyl hydrazine y Methyl Meth Acrylate' ΡΜΜΑ) is used. The method of applying the photoresist is a spin coating method or a spraying method. The exposure, development and etching steps are carried out using a pre-designed mask 6 。. The mask 6G0 is aligned with the metal substrate 51G to perform an exposure step. The light source for exposure is ultraviolet light and is exposed by a projection exposure technique, i.e., the mask 60 0 is parallel to the metal substrate 51. As shown in the fourth figure, the light from the light source is irradiated to the coated photoresist through the optical mask (not shown) through the optical mask 6 , and the light is blocked by the light. Light is generated and the reaction 'generates the exposed portion 441 and the unexposed portion 44〇. Please refer to the fifth picture. A developing step is performed to obtain a cylindrical photoresist pattern. Among them, the liquid is methyl isobutyl ketone. Spraying the developer on the metal substrate 5 i ,, and the substrate is in a static state for 3 _ _ β 〇 seconds, so that the exposed portion 441 of the photoresist is filled with the knives, and the viscous liquid can be used to cover the reticle 6 The pattern is transferred to
1269778 五、發明說明（4) 金屬基板51 0上。 進行滋#刻步驟。其中，蝕刻液為氫氟酸。由於濕钱 刻本質上為一種等向性蝕刻（Isotr〇pic Etching)，不僅 會產生縱向钱刻，還會產生橫向蝕刻，且縱向蝕刻之速率 與檢向#刻之速率幾乎相等。將蝕刻液喷灑至金屬基板 5 1 0表面’其與經顯影後曝露之金屬基板發生化學反應， 經過一段反應時間，由於產生等向性蝕刻，金屬基板51〇 形成如第五圖所示之結構，產生底切（undercut)53〇，使 所得圖案之直徑相對於未蝕刻前之直徑較大。 如第六圖所示，採用濺鍍方法在未曝光部份44〇與金 屬基板51 0之間隙沈積一金屬薄膜層52〇。其中，該金屬薄 膜層5 2 0可以為鎳、鎳鈷合金、銅及銅系合金等。將顯影 ，之金屬基板510放入濺鍍機（圖未示）腔體内，設定工作 壓力0·05 torr，將金屬基板51〇加熱到15(rc，通入電漿 反應氣體，控制势積時間，在金屬基板51〇表面沈積一層 厚度〜5〇〇6之金屬薄膜層520。此金屬薄膜層52〇; 可由蒸鐘專其他沈積方法獲得。 如第七圖所示，將金屬基板51 0置入電鑄液中，進杆 電鑄步驟以形成金屬層54()。其中，該金 鎳、鎳鈷合金、銅及銅夺人全笨。太與 Α馬 例。豆中，+植-广你/ 4。本貝轭方式以鎳金屬為 劑等乙曰人：Ϊ: 鎳離子之溶液、次磷酸鹽與促進 為氣化：：t鎳離子之溶液為硫酸鎳溶液，亦可以 可包括Μ糊、潤濕劑、光澤劑等來加強電卜鑄 第8頁 1269778 五、發明說明（5) 電縳液為酸性溶液，其中該溶液PH值為4. 2〜4. 8，亦可以 為驗性溶液。金屬基板5 1 0置於電鑄液之時間依所需之金 屬層540厚度而設置。通過電鑄，金屬層54〇形成於金屬基 板51 〇上。 520 520 型 ， 請一併參閱第八圖，將未曝光部份44〇與金屬薄膜層 金屬層540及金屬基板51 〇剝離，得到由金屬薄膜層 鎳金屬層540及金屬基板5 1〇整合之金屬立體結構模 此模型即為模仁5 〇 〇。 由於本發明於沈積金屬薄膜層之前進行濕蝕刻，使金 反底切，增大金屬層與金屬基板之接觸面積，提 南棋仁強度。 利申Ϊ t:述以：：：符合發明專利要件’爰依法提出專 凡熟悉本案技藝之人本發明之較佳實施方式，舉 修飾或變化，皆庫包人#杈依本案發明精神所作之等效 白愿包含於以下之申請專利範圍内。1269778 V. DESCRIPTION OF THE INVENTION (4) On the metal substrate 51 0. Carry out the cultivating step. Wherein, the etching solution is hydrofluoric acid. Since wet money is essentially an isotropic etching (Isotr〇pic Etching), not only longitudinal burns but also lateral etching are produced, and the rate of longitudinal etching is almost equal to the rate of the inspection. Spraying an etchant onto the surface of the metal substrate 510, which chemically reacts with the metal substrate exposed after development, and after a reaction time, the metal substrate 51 is formed as shown in FIG. The structure was undercut 53 〇 so that the diameter of the resulting pattern was larger relative to the diameter before unetching. As shown in the sixth figure, a metal thin film layer 52 is deposited by a sputtering method in the gap between the unexposed portion 44A and the metal substrate 51 0. The metal thin film layer 520 may be nickel, nickel-cobalt alloy, copper or a copper-based alloy. The developed metal substrate 510 is placed in a cavity of a sputtering machine (not shown), the working pressure is set to 0·05 torr, and the metal substrate 51 is heated to 15 (rc, the plasma reaction gas is introduced, and the potential product time is controlled. A metal thin film layer 520 having a thickness of 〜5〇〇6 is deposited on the surface of the metal substrate 51. The metal thin film layer 52 is obtained by a vapor deposition method. As shown in the seventh figure, the metal substrate 51 0 is placed. In the electroforming solution, the electroforming step is carried out to form a metal layer 54 (), wherein the gold nickel, nickel-cobalt alloy, copper and copper are all stupid. Too and the horse. In the bean, + plant-wide You / 4. This beyer yoke method uses nickel metal as the agent, etc.: Ϊ: nickel ion solution, hypophosphite and promotion to gasification: :t nickel ion solution is nickel sulfate solution, may also include Μ The paste, the wetting agent, the glossing agent, etc., to enhance the electroplating, the eighth embodiment of the invention, the second embodiment of the invention, the second embodiment of the invention a solution. The time at which the metal substrate 5 10 is placed in the electroforming solution is set according to the thickness of the desired metal layer 540. The metal layer 54 is formed on the metal substrate 51. For the 520 520 type, please refer to the eighth figure, and the unexposed portion 44A is peeled off from the metal thin film layer metal layer 540 and the metal substrate 51 to obtain a metal thin film layer. The nickel metal layer 540 and the metal substrate 5 1〇 integrated metal three-dimensional structure model is the mold core 5 〇〇. Since the present invention performs wet etching before depositing the metal film layer, the gold is counter-cut, the metal layer is increased The contact area of the metal substrate, the strength of the South China chess. Li ShenΪ t: Described::: In accordance with the invention patent requirements '爰 提出 提出 专 专 专 专 专 专 专 专 专 专 专 专 专 专 专 专 专 较佳 较佳 较佳皆库包人# The equivalent of the invention in the spirit of the invention is included in the scope of the following patent application.
第9頁 1269778 圖式簡單說明 第一圖係一種先前技術模仁製造方法流程圖。 第二圖係另一種先前技術模仁製造方法流程圖。 第三圖係本發明之模仁製造方法之光阻塗佈示意圖。 第四圖係本發明之模仁製造方法之曝光示意圖。 第五圖係本發明之模仁製造方法之顯影、蝕刻示意圖。 第六圖係本發明之模仁製造方法之沈積金屬薄膜層示意 圖。 第七圖係本發明之模仁製造方法之電鑄示意圖。Page 9 1269778 Brief Description of the Drawings The first figure is a flow chart of a prior art mold manufacturing method. The second figure is a flow chart of another prior art mold making method. The third figure is a schematic diagram of photoresist coating of the mold manufacturing method of the present invention. The fourth figure is an exposure diagram of the mold manufacturing method of the present invention. The fifth figure is a schematic diagram of development and etching of the mold manufacturing method of the present invention. Fig. 6 is a schematic view showing a deposited metal thin film layer of the mold manufacturing method of the present invention. The seventh drawing is a schematic view of electroforming of the mold manufacturing method of the present invention.
第八圖係本發明之模仁製造方法所得之模仁示意圖。 【元件符號說明】 光阻層 400 未曝光部份 440 已曝光部份 441 模仁 500 基板 510 金屬薄膜層 520 底切 530 金屬層 540 光罩 600 光線 700The eighth figure is a schematic view of the mold core obtained by the mold manufacturing method of the present invention. [Description of component symbols] Photoresist layer 400 Unexposed part 440 Exposed part 441 Molding 500 Substrate 510 Metal film layer 520 Undercut 530 Metal layer 540 Photomask 600 Light 700
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