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TWI268749B - Method for manufacturing flex-rigid printed circuit board - Google Patents

Method for manufacturing flex-rigid printed circuit board

Info

Publication number
TWI268749B
TWI268749B TW094103271A TW94103271A TWI268749B TW I268749 B TWI268749 B TW I268749B TW 094103271 A TW094103271 A TW 094103271A TW 94103271 A TW94103271 A TW 94103271A TW I268749 B TWI268749 B TW I268749B
Authority
TW
Taiwan
Prior art keywords
double
prepreg
circuit board
sided ccl
sided
Prior art date
Application number
TW094103271A
Other languages
English (en)
Other versions
TW200630006A (en
Inventor
jun-yi Wang
Chao-Ting Lee
Chia-Hua Pai
Chun-Hsien Lu
Original Assignee
Compeq Mfg Company Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Compeq Mfg Company Limited filed Critical Compeq Mfg Company Limited
Priority to TW094103271A priority Critical patent/TWI268749B/zh
Publication of TW200630006A publication Critical patent/TW200630006A/zh
Application granted granted Critical
Publication of TWI268749B publication Critical patent/TWI268749B/zh

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
TW094103271A 2005-02-02 2005-02-02 Method for manufacturing flex-rigid printed circuit board TWI268749B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094103271A TWI268749B (en) 2005-02-02 2005-02-02 Method for manufacturing flex-rigid printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094103271A TWI268749B (en) 2005-02-02 2005-02-02 Method for manufacturing flex-rigid printed circuit board

Publications (2)

Publication Number Publication Date
TW200630006A TW200630006A (en) 2006-08-16
TWI268749B true TWI268749B (en) 2006-12-11

Family

ID=57809010

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094103271A TWI268749B (en) 2005-02-02 2005-02-02 Method for manufacturing flex-rigid printed circuit board

Country Status (1)

Country Link
TW (1) TWI268749B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI669036B (zh) * 2017-05-24 2019-08-11 大陸商慶鼎精密電子（淮安）有限公司 軟硬結合電路板的製造方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102458055B (zh) 2010-10-20 2014-06-25 富葵精密组件(深圳)有限公司 软硬结合电路板的制作方法
TWI420999B (zh) * 2010-11-04 2013-12-21 Zhen Ding Technology Co Ltd 軟硬結合電路板之製作方法
TWI477212B (zh) * 2013-01-24 2015-03-11 Unimicron Technology Corp 軟硬複合線路板及其製造方法
CN103987207B (zh) * 2013-02-07 2017-03-01 欣兴电子股份有限公司 软硬复合线路板及其制造方法
CN104470250A (zh) * 2013-09-25 2015-03-25 富葵精密组件(深圳)有限公司 软硬结合电路板的制作方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI669036B (zh) * 2017-05-24 2019-08-11 大陸商慶鼎精密電子（淮安）有限公司 軟硬結合電路板的製造方法

Also Published As

Publication number Publication date
TW200630006A (en) 2006-08-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees