[go: up one dir, main page]

TWI268749B - Method for manufacturing flex-rigid printed circuit board - Google Patents

Method for manufacturing flex-rigid printed circuit board

Info

Publication number
TWI268749B
TWI268749B TW094103271A TW94103271A TWI268749B TW I268749 B TWI268749 B TW I268749B TW 094103271 A TW094103271 A TW 094103271A TW 94103271 A TW94103271 A TW 94103271A TW I268749 B TWI268749 B TW I268749B
Authority
TW
Taiwan
Prior art keywords
double
prepreg
circuit board
sided ccl
sided
Prior art date
Application number
TW094103271A
Other languages
Chinese (zh)
Other versions
TW200630006A (en
Inventor
jun-yi Wang
Chao-Ting Lee
Chia-Hua Pai
Chun-Hsien Lu
Original Assignee
Compeq Mfg Company Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Compeq Mfg Company Limited filed Critical Compeq Mfg Company Limited
Priority to TW094103271A priority Critical patent/TWI268749B/en
Publication of TW200630006A publication Critical patent/TW200630006A/en
Application granted granted Critical
Publication of TWI268749B publication Critical patent/TWI268749B/en

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

This invention relates to a method for manufacturing a flex-rigid printed circuit board. The method comprises the steps of: first, laminating a second prepreg and a double-sided copper clad laminate (double-sided CCL) to a face or both faces of a flexible circuit board in certain order. The flexible circuit board has a section expecting to be exposed. In addition, the second prepreg has an opening and the double-sided CCL has a copper lid. The opening of the prepreg and the copper lid of the double-sided CCL are facing to the section of the flexible circuit board. Then, a circuit pattern is formed onto an outer copper foil of the double-sided CCL and the circuit pattern has a hollow section facing to the copper lid of the double-sided CCL for exposing a first prepreg of the double-sided CCL. Subsequently, apply a laser trimming to the first prepreg along the periphery of the hollow section so as to form a groove with a designated depth on the first prepreg. Last, perform an opening. treatment to the double-sided CCL for removing the trimmed first prepreg and the copper lid from the double-sided CCL; therefore, the section of the flexible circuit board is exposed. The method of the invention prevents the first prepreg from crush during the double-sided CCL and the flexible circuit board lamination.
TW094103271A 2005-02-02 2005-02-02 Method for manufacturing flex-rigid printed circuit board TWI268749B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094103271A TWI268749B (en) 2005-02-02 2005-02-02 Method for manufacturing flex-rigid printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094103271A TWI268749B (en) 2005-02-02 2005-02-02 Method for manufacturing flex-rigid printed circuit board

Publications (2)

Publication Number Publication Date
TW200630006A TW200630006A (en) 2006-08-16
TWI268749B true TWI268749B (en) 2006-12-11

Family

ID=57809010

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094103271A TWI268749B (en) 2005-02-02 2005-02-02 Method for manufacturing flex-rigid printed circuit board

Country Status (1)

Country Link
TW (1) TWI268749B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI669036B (en) * 2017-05-24 2019-08-11 大陸商慶鼎精密電子（淮安）有限公司 Method for manufacturing rigid-flex printed circuit board

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102458055B (en) 2010-10-20 2014-06-25 富葵精密组件(深圳)有限公司 Manufacturing method for rigid-flexible circuit board
TWI420999B (en) * 2010-11-04 2013-12-21 Zhen Ding Technology Co Ltd Method for manufacturing rigid-flexible printed circuit board
TWI477212B (en) * 2013-01-24 2015-03-11 Unimicron Technology Corp Rigid and flexible composite circuit board and manufacturing metodh thereof
CN103987207B (en) * 2013-02-07 2017-03-01 欣兴电子股份有限公司 Rigid-flex composite circuit board and manufacturing method thereof
CN104470250A (en) * 2013-09-25 2015-03-25 富葵精密组件(深圳)有限公司 Rigid-flex circuit board manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI669036B (en) * 2017-05-24 2019-08-11 大陸商慶鼎精密電子（淮安）有限公司 Method for manufacturing rigid-flex printed circuit board

Also Published As

Publication number Publication date
TW200630006A (en) 2006-08-16

Similar Documents

Publication Publication Date Title
FI982568A0 (en) A method of manufacturing a multilayer printed circuit board
TW200708222A (en) Manufacturing method of printed wiring board as well as copper-clad laminate and treatment solutions used therefor
ATE222046T1 (en) METHOD FOR PRODUCING A MULTI-LAYER PRINTED CIRCUIT BOARD AND COMPOSITE FILM FOR USE THEREIN
WO2003074268A1 (en) Metal foil with resin and metal-clad laminate, and printed wiring board using the same and method for production thereof
CN104582309A (en) Rigid-flex circuit board and manufacturing method thereof
LU90804B1 (en) Process for manufacturing a composite foil suitable for manufacturing multi-layer printed circuit boards
CN106535510A (en) Method for producing rigid-flex PCB lid
CN114302577A (en) Manufacturing method of soft and hard combined circuit board cover uncovering area
CN100435606C (en) Method for manufacturing soft-hard composite circuit board
ATE464777T1 (en) CIRCUIT BOARD WITH AT LEAST ONE RIGID AND AT LEAST ONE FLEXIBLE AREA AND METHOD FOR PRODUCING RIGID-FLEXIBLE CIRCUIT BOARDS
TW200740335A (en) Manufacturing method of multilayer wiring board having cable section
CN105163503A (en) Method for fabricating hollowed-out board of flexible printed circuit (FPC) by laser windowing
JP2009164557A (en) Printed circuit board and method of manufacturing the same
TWI268749B (en) Method for manufacturing flex-rigid printed circuit board
JP2006049660A (en) Method for manufacturing printed wiring board
SG153797A1 (en) Circuit board
TW200744417A (en) Method for manufacturing stack via of HDI printed circuit board
CN101742822B (en) The method of stripping the hard board in the soft board area of the soft board
JP2015026654A5 (en) Copper foil with carrier, method for producing copper-clad laminate and method for producing printed wiring board
EP1392092A4 (en) COPPER LAMINATE SHEET WITH COPPER CIRCUIT LAYER AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD USING THE SAME
TW200744424A (en) Method for manufacturing via holes used in printed circuit boards
EP3800970A3 (en) A flexible printed circuit board (fpcb) using a pct film as an insulating layer, and its manufacturing method thereof
CN110572944A (en) Method and device for manufacturing exposed area of rigid-flex printed circuit board
TW200420211A (en) Laser processing method
TW200618687A (en) Method for manufacturing rigid-flex printed wiring board

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees