TWI268184B - Recycling method for waste printed circuit board brominated epoxy resin and glass fiber in the resin are recycled and converted into raw material for industry - Google Patents
Recycling method for waste printed circuit board brominated epoxy resin and glass fiber in the resin are recycled and converted into raw material for industryInfo
- Publication number
- TWI268184B TWI268184B TW095102342A TW95102342A TWI268184B TW I268184 B TWI268184 B TW I268184B TW 095102342 A TW095102342 A TW 095102342A TW 95102342 A TW95102342 A TW 95102342A TW I268184 B TWI268184 B TW I268184B
- Authority
- TW
- Taiwan
- Prior art keywords
- printed circuit
- resin
- recycled
- industry
- converted
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 3
- 239000002699 waste material Substances 0.000 title abstract 3
- 239000003822 epoxy resin Substances 0.000 title abstract 2
- 239000003365 glass fiber Substances 0.000 title abstract 2
- 229920000647 polyepoxide Polymers 0.000 title abstract 2
- 239000002994 raw material Substances 0.000 title abstract 2
- 238000004064 recycling Methods 0.000 title abstract 2
- 229920005989 resin Polymers 0.000 title abstract 2
- 239000011347 resin Substances 0.000 title abstract 2
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Landscapes
- Processing Of Solid Wastes (AREA)
- Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
- Manufacture And Refinement Of Metals (AREA)
Abstract
This invention relates to a recycling method for waste printed circuit boards. By use of the characters of the printed circuit board, various metals which remain on the circuit boards are separated stepwise in multi-steps with various processes. By this way, brominated epoxy resin and glass fiber in the resin are recycled and converted into raw material for industry, thereby the nature environment is prevented from damage after the waste printed circuit broads.
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW095102342A TWI268184B (en) | 2006-01-20 | 2006-01-20 | Recycling method for waste printed circuit board brominated epoxy resin and glass fiber in the resin are recycled and converted into raw material for industry |
| CN200610002019A CN100592939C (en) | 2006-01-20 | 2006-01-23 | Method for recycling waste printed circuit board |
| US11/592,974 US20070169330A1 (en) | 2006-01-20 | 2006-11-06 | Method of recycling wasted printed-circuit-board |
| EP20060125409 EP1811821B1 (en) | 2006-01-20 | 2006-12-05 | Method of recycling waste printed circuit boards |
| SG200700330-4A SG134269A1 (en) | 2006-01-20 | 2007-01-17 | The method of recycling wasted printed-circuit-board |
| JP2007009172A JP4791978B2 (en) | 2006-01-20 | 2007-01-18 | Waste PCB recovery method |
| KR1020070006022A KR100821792B1 (en) | 2006-01-20 | 2007-01-19 | Waste Printed Circuit Board Recycling Method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW095102342A TWI268184B (en) | 2006-01-20 | 2006-01-20 | Recycling method for waste printed circuit board brominated epoxy resin and glass fiber in the resin are recycled and converted into raw material for industry |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI268184B true TWI268184B (en) | 2006-12-11 |
| TW200727998A TW200727998A (en) | 2007-08-01 |
Family
ID=57912825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095102342A TWI268184B (en) | 2006-01-20 | 2006-01-20 | Recycling method for waste printed circuit board brominated epoxy resin and glass fiber in the resin are recycled and converted into raw material for industry |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI268184B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI450773B (en) * | 2009-05-27 | 2014-09-01 | ||
| TWI688731B (en) * | 2018-07-24 | 2020-03-21 | 陳宣榮 | Waste electronic product processing method and processing device |
| CN111001642A (en) * | 2019-10-17 | 2020-04-14 | 佛山市南海保达建筑机械设备有限公司 | Treatment method of glass fiber waste board |
| TWI748797B (en) * | 2020-12-14 | 2021-12-01 | 迅得機械股份有限公司 | Pcb scrap prevention system and method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106944452A (en) | 2011-12-15 | 2017-07-14 | 恩特格里斯公司 | For the apparatus and method for recycling period stripping solder metal in discarded Electrical and Electronic equipment |
-
2006
- 2006-01-20 TW TW095102342A patent/TWI268184B/en not_active IP Right Cessation
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI450773B (en) * | 2009-05-27 | 2014-09-01 | ||
| TWI688731B (en) * | 2018-07-24 | 2020-03-21 | 陳宣榮 | Waste electronic product processing method and processing device |
| US11059020B2 (en) | 2018-07-24 | 2021-07-13 | Hsuan-Jung Chen | Electronic waste processing method and apparatus thereof |
| CN111001642A (en) * | 2019-10-17 | 2020-04-14 | 佛山市南海保达建筑机械设备有限公司 | Treatment method of glass fiber waste board |
| TWI748797B (en) * | 2020-12-14 | 2021-12-01 | 迅得機械股份有限公司 | Pcb scrap prevention system and method |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200727998A (en) | 2007-08-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |