[go: up one dir, main page]

TW200711543A - Reinforcing film for flexible printed circuit board - Google Patents

Reinforcing film for flexible printed circuit board

Info

Publication number
TW200711543A
TW200711543A TW095122996A TW95122996A TW200711543A TW 200711543 A TW200711543 A TW 200711543A TW 095122996 A TW095122996 A TW 095122996A TW 95122996 A TW95122996 A TW 95122996A TW 200711543 A TW200711543 A TW 200711543A
Authority
TW
Taiwan
Prior art keywords
circuit board
printed circuit
flexible printed
reinforcing film
reinforcing
Prior art date
Application number
TW095122996A
Other languages
Chinese (zh)
Other versions
TWI358972B (en
Inventor
Ayako Morita
Hiroyuki Sekine
Ryuichi Tsuruda
Hideaki Tanaka
Original Assignee
Nippon Mektron Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron Kk filed Critical Nippon Mektron Kk
Publication of TW200711543A publication Critical patent/TW200711543A/en
Application granted granted Critical
Publication of TWI358972B publication Critical patent/TWI358972B/zh

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The purpose of the present invention is to provide a reinforcing film for flexible printed circuit board for inhibiting interface peeling generated between the flexible printed circuit board and reinforcing film in the reflow process during mounting. The solution provided is to use a reinforcing film for flexible printed circuit board, which is formed of a heat-resistant resin of the layered structure including at least one bubble mixing layer.
TW095122996A 2005-07-15 2006-06-26 Reinforcing film for flexible printed circuit board TW200711543A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005206800A JP4744961B2 (en) 2005-07-15 2005-07-15 Reinforcing film for flexible printed wiring boards

Publications (2)

Publication Number Publication Date
TW200711543A true TW200711543A (en) 2007-03-16
TWI358972B TWI358972B (en) 2012-02-21

Family

ID=37610098

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095122996A TW200711543A (en) 2005-07-15 2006-06-26 Reinforcing film for flexible printed circuit board

Country Status (3)

Country Link
JP (1) JP4744961B2 (en)
CN (1) CN1897788B (en)
TW (1) TW200711543A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9585238B2 (en) 2012-10-30 2017-02-28 Fujikura Ltd. Printed circuit board

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101437358B (en) * 2007-11-14 2010-04-14 昆山雅森电子材料科技有限公司 Protection film for printed circuit board and procedure for processing circuit board using the protection film
JP5840131B2 (en) * 2010-09-13 2016-01-06 株式会社カネカ Reinforcing plate integrated flexible printed circuit board, and reinforcing plate integrated flexible printed circuit board
CN101986772B (en) * 2010-10-27 2012-06-06 淳华科技(昆山)有限公司 Method for manufacturing flexible circuit board
CN103542955B (en) * 2012-07-17 2016-08-03 昆山雅森电子材料科技有限公司 Lithium ion battery temperature inductor

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0363969A (en) * 1989-08-02 1991-03-19 Matsushita Electric Ind Co Ltd magnetic recording and reproducing device
JP3669782B2 (en) * 1996-08-14 2005-07-13 ジャパンゴアテックス株式会社 IC package bonding sheet and IC package
US5784782A (en) * 1996-09-06 1998-07-28 International Business Machines Corporation Method for fabricating printed circuit boards with cavities
JP3895125B2 (en) * 2001-04-12 2007-03-22 日東電工株式会社 Flexible printed circuit board with reinforcing plate
JP2003092458A (en) * 2001-09-18 2003-03-28 Canon Inc Flexible printed circuit board and its checking method
KR20040020218A (en) * 2002-08-30 2004-03-09 주식회사 어필텔레콤 The performance improvement SAR by grounding board in wireless phone
JP2005051177A (en) * 2003-07-31 2005-02-24 Sony Corp Flexible wiring board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9585238B2 (en) 2012-10-30 2017-02-28 Fujikura Ltd. Printed circuit board
TWI618470B (en) * 2012-10-30 2018-03-11 Fujikura Ltd Printed circuit board

Also Published As

Publication number Publication date
JP2007027374A (en) 2007-02-01
CN1897788B (en) 2010-06-16
TWI358972B (en) 2012-02-21
CN1897788A (en) 2007-01-17
JP4744961B2 (en) 2011-08-10

Similar Documents

Publication Publication Date Title
TW200642547A (en) A substantially continuous layer of embedded transient protection for printed circuit boards
TW200727744A (en) Multilayer wiring board
TWI370715B (en) Galvanic process for filling through-holes with metals, in particular of printed citcuit boards with copper
TWI365886B (en) Epoxy resin composition, prepreg, laminate, and printed wiring board
TWI367908B (en) Resin composite metal foil, laminate and process for the production of printed wiring board using the laminate
TW200735730A (en) Resin composite copper foil, printed wiring board, and production process thereof
EP1814372A4 (en) Multilayer printed wiring board
ATE557576T1 (en) CIRCUIT BOARD WITH ELECTRONIC COMPONENT
MY151361A (en) Copper foil for printed circuit board and copper clad laminate for printed circuit board
TW200704833A (en) Surface treated copper foil, process for producing surface treated copper foil, and surface treated copper foil with very thin primer resin layer
WO2009084839A3 (en) Copper foil attached to the carrier foil, a method for preparing the same and printed circuit board using the same
TWI351209B (en) Electronic apparatus and flexible printed circuit board thereof
TW200617205A (en) Solution, component for plating, insulating sheet, laminate, and printed circuit board
GB2422491B (en) Printed Circuit Board
TWI346127B (en) Halogen-free epoxy resin composition, coverlay film, bonding sheet, prepreg, and laminate for printed wiring board
WO2011013922A3 (en) Surface treating agent composition, method for preparing same, copper foil for a printed circuit board, and flexible copper clad laminate
EP1722018A4 (en) Double glass cloth, and prepreg and substrate for printed wiring board using the glass cloth
TW200718314A (en) Method of manufacturing rigid-flexible printed circuit board
TWI316174B (en) Heat-sink backing plate module, circuit board, and electronic apparatus having the same
TW200711543A (en) Reinforcing film for flexible printed circuit board
SG153797A1 (en) Circuit board
TWI318550B (en) Single or multi-layer printed circuit board with improved via design
JP2009117501A5 (en)
TW200635450A (en) Flexible printed circuit board and manufacture method thereof
TW200735310A (en) Package structure for electronic device

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees