I267^wf.doc/y 九、發明說明： 【發明所屬之技術領域】 本發明是有關於—彳 有關於一種晶片封裳_ ，、、、且與印刷裝置，且特別是 體固疋杈組與標記印刷裝置。 【先前技術】 在半導體產業中，積體電. 的生產主要可分為 cc_ts，1C ) design)、積體電路的擊二Λ體電路的設計（IC 裝（IC Package)。在:^ =咖）及積體電路的封 通常需要#由二述階段所形成之晶片封裝體 i ·置來印刷標記於其上，以顯示广敞 询坐就或出產日期等相關資訊。 凊參考圖1，盆緣千习习左 封f體的立卿干立二、…自知種標記印刷裝置與晶片 知標記印刷裝置刚適於在一晶 5標記。標記印婦置_括-托盤 110 —曰曰片封I體固定模組120蛊— 托盤no適於承載晶片封1體/，、^刷70件130。其中， 190 ill 體C而晶片封裝體固定模組 120則適㈣疋位於托# ! 1G上的日日日片封裝體c。 晶片封裝體固定模組120包括 ^ 封裝體壓著元件124。其中，罩篡179 Ht ”夕们日日片 /、T罩幕122具有一元件孔122a， „2,己置於托盤11〇上’而晶片封裝體 於配置於元件孔122a所暴露出的托盤m上。此外 晶片封裝體壓著元件m相對固定於元件孔心之上下邊 緣處，且這些晶片封裝體壓著元们Μ與罩幕⑵為一體 5 I2679M wf.doc/y it焊接方式而彼此固定接合。 標“，it曰印^裝置]00對於晶月封裝體c進行印刷 晶片封裝體托盤H。上，接著將 得晶片封裝體C 固定於托盤⑽上，以使 應的晶片封#π J f 2之元件孔I22a内以及讓對 後，使用印t f者70件124壓著住晶片封裝體C。最 注刷標記於晶片封裝體c上。值得 體C時，晶片封壯:件130印刷標記完成而離開晶片封裝 定於托盤11〇5體固，組120可以將晶片封裝體C固 盤110的位置偏移=使知曰曰片封I體c不會產生相對於托 設計需求而有tn體所需印刷標記的位置通常會因 到所需印刷標吃的^曰^片封裝體塵著元件常會麗著 利進行印刷。換言之， 。己位置，都必須 9 t衣體之不同印刷標 :裳體固定模組，如:將導;:成=刷標記㈣ 上迷可知，習知標記印刷裝置實有改降低。經由 【發明内容】 印刷裝置，晶片封裝體固定模組斑hI267^wf.doc/y IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a wafer sealing device, a printing device, and particularly a body-solid group With the marking printing device. [Prior Art] In the semiconductor industry, the production of integrated electricity can be mainly divided into cc_ts, 1C) design), the design of the IC circuit of the integrated circuit (IC package). In: ^ = coffee And the package of the integrated circuit usually needs to be printed on the chip package i formed by the two stages to display the relevant information such as the wide open inquiry or the date of production.凊 Referring to Fig. 1, the rim edge of the left-handed body of the left-handed body is a two-part, self-known type of marking printing device and a wafer. The marking printing device is just suitable for a crystal 5 mark. Marking printers - trays - trays 110 - sheet seals I body fixing module 120 蛊 - tray no is suitable for carrying wafer seal 1 body /, ^ brush 70 pieces 130. Among them, the 190 ill body C and the chip package fixing module 120 are suitable for (4) the day and day chip package c located on the tray #! 1G. The chip package fixing module 120 includes a package pressing member 124. Wherein, the cover 篡 篡 H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H m. In addition, the chip package pressing member m is relatively fixed to the lower edge of the element hole, and the chip package pressing members are integrally bonded to the mask (2) in a manner of being welded to each other. The label ", "printing device" 00 is used to print the wafer package tray H for the crystal moon package c. Then, the chip package C is fixed on the tray (10) to make the wafer seal #π J f 2 In the component hole I22a and after the pairing, the wafer package C is pressed against the 70 pieces 124 of the printed tf. The most inscription is marked on the chip package c. When the body C is worth, the wafer is sealed: the component 130 is printed and marked. The leaving chip package is fixed on the tray 11〇5 body, and the group 120 can shift the position of the chip package C to the fixed disk 110=so that the body plate c does not have a tn body relative to the design requirement of the carrier. The position of the required printed mark is usually printed because of the need to print the mark of the ^ ^ ^ package package dusty components. In other words, the position must be different prints of the 9 t body: Body fixing module, such as: will guide;: = = brush mark (four) It is known that the conventional marking printing device has been reduced. According to the [invention] printing device, chip package fixed module spot
固定楹έ日&次疋其他目的，本發明提出一插曰U 適於固定位於—托盤上 3=片封裳體 曰曰片封裝體。此晶 126Ί9Μ twf.doc/y 片封裝體固定模組包括_ ¥&/ 件。其中，罩幕具有1元件罩/、與多個曰I片縣體壓著元 適於配置於托盤上，且曰=多個第一組裝孔，罩幕 露出的托盤上。此外，適 幕之這些第-組裝孔。i^日衣脰£者兀件組裝於罩 幕拆卸，封裝财著元件適於由罩 在本發明二df，位置。 更包括-配置於罩幕上之 片封農體固定模，挺 定住這些晶片封裝體屋著元:。’頂蓋與罩幕係共同固 定住這些晶片封裝體麗著元;=頂盖與罩綦係共同固 嫌期定模组中=:料’上述包括頂蓋之晶 固於罩幕上。f t包括多個鎖固元件，以將頂蓋鎖 在本發明的一實施例中，上 更包括—配置於罩幕上之丁頁蓋，其中i曰蓋模組 定住，晶片封妓壓著元件。此外，、上述同: 片二體固定模組中’頂蓋例如具有多個第二組事：之I 这= 孔的位置係、對應於這些第—㈣孔的 本發明的-實施例中，上述之 固 ϊ包ί—配置於罩幕上之頂蓋，其中頂蓋與 疋住化些晶片封裝體壓著元件。此外，上述包^: ==模組中，罩幕例如具有-位於元件孔‘ I267%Qwfd0C/y 在本發明的一實施例中，上述每一晶片封裝體壓著元 件包括一組裝部與一晶片封裝體壓著部。其中，組裝部組 裝於對應之組裝孔中，而晶片封裝體壓著部與組裝部連 接，且晶片封裝體壓著部係從罩幕延伸至元件孔内，以壓 著住晶片封裝體。 為達上述或是其他目的，本發明提出一種標記印刷裝 置，適於在一晶片封裝體上印刷一標記。此標記印刷裝置 包括一托盤、一晶片封裝體固定模組與一印刷元件。其中， 托盤適於承載晶片封裝體。此外，晶片封裝體固定模組適 於固定位於托盤上之晶片封裝體，且晶片封裝體固定模組 包括一罩幕與多個晶片封裝體壓著元件。罩幕具有一元件 孔以及多個第一組裝孔，罩幕適於配置於托盤上，且晶片 封裝體適於配置於元件孔所暴露出的托盤上。這些晶片封 裝體壓著元件組裝於罩幕之這些第一組裝孔，且這些晶片 封裝體壓著元件適於由罩幕拆卸，以調整這些晶片封裝體 壓著元件的位置。另外，印刷元件配置於托盤上方。 在本發明的一實施例中，上述之晶片封裝體固定模組 更包括一配置於罩幕上之頂蓋，其中頂蓋與罩幕係共同固 定住這些晶片封裝體壓著元件。 在本發明的一實施例中，上述之晶片封裝體固定模組 更包括一配置於罩幕上之頂蓋，其中頂蓋與罩幕係共同固 定住這些晶片封裝體壓著元件。此外，上述包括頂蓋之晶 片封裝體固定模組中，更包括多個鎖固元件，以將頂蓋鎖 固於罩幕上。 1267糊 wf.d〇c/y 在本發明的一實施例中，上述之晶片封裝體 f包括：配置於罩幕上之頂蓋，其中頂蓋與罩幕係=固且 ，住^晶片封裝體㈣元件。此外，上述包括靜 這：if，頂蓋例如具有多個第二組裝：： 一ΪΓ/的置係對應於這些第—組裝孔的位置。 ^柄明的_實施财，上述之晶片封裝體固定模組 定;此iff罩幕上之頂蓋’其中頂蓋與罩幕係共同固 之頂蓋•且 件包:士η貝施例中’上述每-晶片封裝體壓著元 裝於對庫之t 口壯與―晶片封裝體塵著部。其中’組裝部組 接，且ίί^ΐ-中’而晶片封裝體麗著部與組裝部連 著住晶係從罩幕延伸至元件孔内，以壓 固定=二用發明之標記印刷裝置的晶片封裝體 件可依印刷二立置二Γΐί不封裝體壓著元 由於本發明之標記置二整二 程的效i 降低成本以及提高標記印刷過 易懂了 上述和其他目的、特徵和優點能更明顯 明如下。特牛車父佳實施例’並配合所附圖式，作詳細說For other purposes, the present invention proposes a cartridge U that is adapted to be attached to the tray. This crystal 126Ί9Μ twf.doc/y chip package fixing module includes _ ¥&/ pieces. Wherein, the mask has a 1-element cover/, and a plurality of 曰I-pieces are suitable for being placed on the tray, and 曰 = a plurality of first assembly holes, and the cover is exposed. In addition, these first-assembly holes are suitable for the curtain. The i^ 日 兀 兀 组装 组装 组装 组装 组装 组装 组装 组装 组装 组装 组装 组装 组装 组装 组装 组装 组装 组装 组装 组装 组装 组装 组装 组装 组装 组装 组装It also includes a piece of agricultural body fixed mold that is placed on the mask to secure the housing of these chip packages. The top cover and the cover system together fix the chip package body; = the top cover and the cover system are together in the stagnation period of the module =: material 'the above-mentioned top cover is fixed on the cover screen. The ft includes a plurality of locking elements to lock the top cover in an embodiment of the present invention, and further includes a cover plate disposed on the cover, wherein the cover module is fixed, and the chip seals the component . In addition, in the above-mentioned: the two-body fixing module, the top cover has, for example, a plurality of second groups: I, the position of the holes, and the embodiment of the present invention corresponding to the first (four) holes, The above-mentioned solid package — is a top cover disposed on the mask, wherein the top cover and the chip package are pressed against the components. In addition, in the above package: == module, the mask has, for example, a component hole 'I267%Qwfd0C/y. In an embodiment of the invention, each of the chip package pressing components includes an assembly portion and a Chip package pressing portion. The assembly portion is assembled in the corresponding assembly hole, and the chip package pressing portion is connected to the assembly portion, and the chip package pressing portion extends from the mask to the element hole to press the chip package. To achieve the above or other objects, the present invention provides a marking printing apparatus adapted to print a mark on a chip package. The marking printing device includes a tray, a chip package fixing module and a printing element. Wherein the tray is adapted to carry a chip package. In addition, the chip package fixing module is adapted to fix the chip package on the tray, and the chip package fixing module comprises a mask and a plurality of chip package pressing elements. The mask has a component aperture and a plurality of first assembly apertures, the mask is adapted to be disposed on the tray, and the wafer package is adapted to be disposed on the tray exposed by the component aperture. The wafer package pressing members are assembled to the first assembly holes of the mask, and the wafer package pressing members are adapted to be detached by the mask to adjust the position of the chip package pressing members. In addition, the printing element is disposed above the tray. In an embodiment of the invention, the chip package fixing module further includes a top cover disposed on the mask, wherein the top cover and the cover system together fix the chip package pressing members. In an embodiment of the invention, the chip package fixing module further includes a top cover disposed on the mask, wherein the top cover and the cover system together fix the chip package pressing members. In addition, the above-mentioned wafer package fixing module including the top cover further comprises a plurality of locking elements for locking the top cover to the cover. In one embodiment of the present invention, the chip package f includes: a top cover disposed on the mask, wherein the top cover and the cover are fixed and the chip package is mounted. Body (four) components. Furthermore, the above includes static: if, the top cover has, for example, a plurality of second assemblies:: a set of positions corresponding to the positions of the first assembly holes. ^The handle of the _ implementation of the implementation of the above-mentioned chip package fixing module; the top cover of the iff shield 'the top cover and the cover system together to secure the top cover and package: 士η贝例The above-mentioned per-chip package pressing element is mounted on the t-port of the bank and the chip package body dust. Wherein the 'assembly part is connected, and ίί^ΐ-中', and the wafer package body glazing portion and the assembly portion are connected to the crystal system from the mask to the element hole, and are pressed and fixed== the invention of the marking device The chip package body can be printed according to the two-dimensional 不 不 封装 封装 封装 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于More clearly as follows. "Turkey car father's best example" and with the drawings, for details
I267%^wfdoc/y 【實施方式】 請參考圖2，其繪示本發明一實施例之一種標記印刷 裝置與晶片封裝體的立體示意圖。本實施例之標記印刷裝 置200適於在一晶片封裝體c上印刷/標記。標記印刷裝 置200包括一托盤210、一晶片封裝體固定模組22〇與一 印刷元件230。其中，托盤210適於承載晶片封裝體C。 此外，晶片封裝體固定模組220適於固定位於托盤210上 之晶片封裝體C，而印刷元件230則配置於托盤210上方。 圖3繪示圖2之晶片封裝體固定模組的立體分解示意 圖二睛麥考圖2與圖3，晶片封裝體固定模組22〇包括一 罩幕222與多個晶片封裝體壓著元件224。罩幕222具有 一凡件孔222a以及多個第一組裝孔222b，罩幕222適於 配置於托4 210上’且晶片封裝體c適於配置於元件孔 出的托盤210上。這些晶片封侧著元件224 、、且f罩幕222之這些第一組裝孔㈣，且這些 體壓著兀件224適於由罩幕222拆 以、古 ' 裝體麼著元件224的位置。換言之，:广二晶片封 224盥罝蓋" μ 、〇 日日片封衣體屢著元件 兵罩幕222亚非—體成型或者了干 而彼此固定。 J拆卸的方式 於罩暮222卜/W封裝咖定模組22G更包括-配置 於罩幕222上之頂蓋226，其中頂蓋挪 枯配置 同固定住這些^封裝體㈣元件224。梓幕功係共 片封裝體固定模组220更包括多個鎖固元件^列二^ I267^6i)twfdoc/y 頂蓋226鎖固於罩幕222上。然而，頂蓋226不一定要使 用鎖固元件228而固定於罩幕222上，亦可用扣合或是其 他機構設計來達到固定的目的，但是並未以圖面繪示。此 外，頂蓋226例如具有多個第二組裝孔226a，且這些第二 組裝孔226a的位置係對應於這些第一組裝孔222b的位 置。另外，罩幕222例如具有一位於元件孔222&的外圍之 頂盍組裝槽222c，且頂蓋226係組裴於頂蓋組裝槽222c 内。[Implementation] Please refer to FIG. 2, which is a perspective view of a marking printing device and a chip package according to an embodiment of the invention. The marking printing apparatus 200 of the present embodiment is adapted to be printed/marked on a chip package c. The marking printing device 200 includes a tray 210, a chip package fixing module 22 and a printing member 230. The tray 210 is adapted to carry the chip package C. In addition, the chip package fixing module 220 is adapted to fix the chip package C on the tray 210, and the printing element 230 is disposed above the tray 210. 3 is a perspective exploded view of the chip package fixing module of FIG. 2 . The chip package fixing module 22 includes a mask 222 and a plurality of chip package pressing members 224 . . The mask 222 has a vane hole 222a and a plurality of first assembling holes 222b. The mask 222 is adapted to be disposed on the holder 4 210 and the chip package c is adapted to be disposed on the tray 210 from which the component is bored. These wafers enclose the first assembly holes (4) of the elements 224, and the f-masks 222, and these body-clamping members 224 are adapted to be removed by the mask 222 to position the elements 224. In other words, the 广 晶片 晶片 盥罝 盥罝 & μ μ μ μ μ μ μ μ μ μ μ μ μ μ μ 222 222 222 222 222 222 222 222 222 222 222 222 222 222 222 222 222 222 222 222 The method of disassembling the cover 222/W packaged coffee module 22G further includes a top cover 226 disposed on the cover 222, wherein the top cover is configured to fix the package (4) member 224. The curtain module cascode fixing module 220 further includes a plurality of locking components. The two thystors 226 are locked on the mask 222. However, the top cover 226 does not have to be fixed to the cover 222 by using the locking member 228, and may be fastened by fastening or other mechanism design, but is not shown in the drawings. Further, the top cover 226 has, for example, a plurality of second assembly holes 226a, and the positions of the second assembly holes 226a correspond to the positions of the first assembly holes 222b. In addition, the mask 222 has, for example, a top cymbal assembly groove 222c located at the periphery of the element holes 222 & and the top cover 226 is assembled within the top cover assembly groove 222c.
晶片封裝體固定模組220的每一晶片封裝體壓著元件 224包括一組裝部224a與一晶片封裝體壓著部22仆。其 中，組裝部224a組裝於對應之第一組裝孔222b中，而曰 月封裝體壓著部224b與組裝部224a連接，且晶片封裝= 壓著部224b係從罩幕222延伸至元件孔22仏内，以屙著 住，片封裝體C (見圖2)。由上述可知，兩相對應二合 的第一組裝孔222b與第二組裝孔226a可將組裝部22二 固定於其中。Each of the chip package pressing members 224 of the chip package fixing module 220 includes an assembly portion 224a and a chip package pressing portion 22. The assembly portion 224a is assembled in the corresponding first assembly hole 222b, and the month package pressing portion 224b is connected to the assembly portion 224a, and the chip package = the pressing portion 224b extends from the mask 222 to the element hole 22 Inside, to hold on, the chip package C (see Figure 2). It can be seen from the above that the two assembly holes 222b and the second assembly holes 226a which are correspondingly combined can fix the assembly portion 22 therein.
以下對於使用本實施例之標記印刷裝£ 2 〇 〇進行印刷 示圮的過程作一說明。請參考圖4與圖2，其中圖4繪示 Ξ t之阳片封裝體@定模組固定晶片封裝體的俯視示意 圖。㊂本實施例之標記印刷裝置200對於晶片封穿俨c進 標記時，首先’將晶片封裝體c放胁托盤2:上。 者’將晶片封裝體固定模組220放置且固定於托般21〇 =j使得晶片封裝體C位於罩幕222之元件孔瓜内 及輯應的晶片聽體壓著元件224壓著住晶片封事體 11 doc/y 12679氣 C°:、=，3° 印刷標 值仔庄思的疋，當印刷元件23 晶片封裝體c時，晶片封己兀成而_ C 21〇 相對於托盤2H)的位置偏/ 封裝體C不會產生 二個WM Γ 此外’由於圖4中所緣示的 分顺㈣刪晶片《顏著元件 供印二耆广位置有所不同，因此三個晶片封裝體C可 ί Si 將有更多的選擇性。在此必須說明的 計^ ^所~ 片封裝縣著元件224的位置可依設 發:’。所改變’因此本實施例伽轉例並非限定本 综上所述，本發明之標記印刷裝置至少具有下列優點: 曰卜）由於本發明之標記印刷裳置的晶另封裝體固定 =組是採用可拆卸式的設計，因此晶ϋ封裝縣著元件可 又印刷軚纪位置的設計需求不同而有所調整。 ^二）由於本發明之標記印刷裝置的晶>!封裝體固定 二組是採料拆卸式的輯，因此可崎似本以及提高 標記印刷過程的效率。 ^雖然本發明已以較佳實施例揭露如上，然其並非用以 限^本發明，任何熟習此技藝者，在不脫離本發明之精神 =範圍内’當可作些許之更動與潤飾，因此本發明之保護 1巳圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 12 I267_twfdoc/y 圖1繪示習知之一種標記印刷裝置與晶 >；封裝體的立 體示意圖。 圖2繪示本發明一實施例之一種標記印刷裝置與晶片 封裝體的立體示意圖。 圖3繪示圖2之晶片封裝體固定模組的立體分解示意 圖。 圖4繪示圖2之晶片封裝體固定模組固定晶片封裝體 的俯視示意圖。 【主要元件符號說明】 100、200 :標記印刷裝置 110、210 :托盤 120、220 :晶片封裝體固定模組 122、222 :罩幕 122a、222a :元件孔 124、224:晶片封裝體壓著元件 130、230 :印刷元件 222b :第一組裝孔 222c :頂蓋組裝槽 224a ··組裝部 224b :晶片封裝體壓著部 226 :頂蓋 226a :第二組裝孔 228 :鎖固元件 13 f.doc/y c:晶片封裝體The following is a description of the process of performing the printing display using the marking printing device of the present embodiment. Please refer to FIG. 4 and FIG. 2, wherein FIG. 4 is a top plan view of the positive package of the positive package of the positive package. When the marking printing device 200 of the third embodiment marks the wafer encapsulation 俨c, the wafer package c is first placed on the tray 2:. The chip package fixing module 220 is placed and fixed on the carrier 21 〇 = j so that the chip package C is located in the component hole of the mask 222 and the corresponding wafer body pressing member 224 is pressed against the wafer sealing device. Body 11 doc / y 12679 gas C °:, =, 3 ° printing value of the value of Zhuang Zhuangsi, when printing component 23 chip package c, the wafer seal has been formed and _ C 21 〇 relative to the tray 2H) Positional offset / package C does not produce two WM Γ In addition, due to the singularity of the four-dimensional stencils, the three chip packages C can be different. ί Si will have more selectivity. The position of the component 224 that must be described here can be set as follows: The change </ RTI> is therefore not limited to the above description. The marking printing device of the present invention has at least the following advantages: ) ) 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于The detachable design makes it possible to adjust the components of the wafer packaging county and the design requirements of the printed position. ^B) Since the crystal >! package of the marking printing device of the present invention is fixed, the two groups are a collection of the detachable type, so that the efficiency of the marking printing process can be improved. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the invention, and those skilled in the art can make some modifications and refinements without departing from the spirit of the invention. The protection of the present invention is defined by the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS 12 I267_twfdoc/y FIG. 1 is a schematic view showing a conventional one of a marking printing device and a crystal package. 2 is a perspective view of a marking printing device and a wafer package in accordance with an embodiment of the present invention. 3 is a perspective exploded view of the chip package fixing module of FIG. 2. 4 is a top plan view of the chip package fixing module fixed chip package of FIG. 2. [Description of main component symbols] 100, 200: marking printing device 110, 210: trays 120, 220: chip package fixing modules 122, 222: masks 122a, 222a: component holes 124, 224: chip package pressing members 130, 230: printing element 222b: first assembly hole 222c: top cover assembly groove 224a · assembly part 224b: chip package pressing portion 226: top cover 226a: second assembly hole 228: locking element 13 f.doc /yc: chip package
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