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TWI267343B - Heat dissipation device with heat pipe - Google Patents

Heat dissipation device with heat pipe

Info

Publication number
TWI267343B
TWI267343B TW94115537A TW94115537A TWI267343B TW I267343 B TWI267343 B TW I267343B TW 94115537 A TW94115537 A TW 94115537A TW 94115537 A TW94115537 A TW 94115537A TW I267343 B TWI267343 B TW I267343B
Authority
TW
Taiwan
Prior art keywords
heat
base
cover
dissipation device
dissipating fins
Prior art date
Application number
TW94115537A
Other languages
Chinese (zh)
Other versions
TW200640352A (en
Inventor
Hsieh-Kun Lee
Wan-Lin Xia
Tao Li
Min-Qi Xiao
Original Assignee
Foxconn Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW94115537A priority Critical patent/TWI267343B/en
Publication of TW200640352A publication Critical patent/TW200640352A/en
Application granted granted Critical
Publication of TWI267343B publication Critical patent/TWI267343B/en

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat dissipation device with heat pipes includes a base, a cover spaced opposite to the base, a plurality of spaced first heat dissipating fins provided between the cover and the base and a heat pipe connecting the base and the cover. One end of the heat pipe connects with a heat sink located alongside the first heat dissipating fins. The heat dissipation device absorbs heat via base and the heat is transferred quickly to the cover, further the first heat dissipating fins and the heat sink for dissipation. Heat dissipation efficiency of the heat pipe is improved.
TW94115537A 2005-05-13 2005-05-13 Heat dissipation device with heat pipe TWI267343B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94115537A TWI267343B (en) 2005-05-13 2005-05-13 Heat dissipation device with heat pipe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94115537A TWI267343B (en) 2005-05-13 2005-05-13 Heat dissipation device with heat pipe

Publications (2)

Publication Number Publication Date
TW200640352A TW200640352A (en) 2006-11-16
TWI267343B true TWI267343B (en) 2006-11-21

Family

ID=38191834

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94115537A TWI267343B (en) 2005-05-13 2005-05-13 Heat dissipation device with heat pipe

Country Status (1)

Country Link
TW (1) TWI267343B (en)

Also Published As

Publication number Publication date
TW200640352A (en) 2006-11-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees