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TWI267115B - Method for making a circuit device - Google Patents

Method for making a circuit device

Info

Publication number
TWI267115B
TWI267115B TW094113626A TW94113626A TWI267115B TW I267115 B TWI267115 B TW I267115B TW 094113626 A TW094113626 A TW 094113626A TW 94113626 A TW94113626 A TW 94113626A TW I267115 B TWI267115 B TW I267115B
Authority
TW
Taiwan
Prior art keywords
circuit device
resin
sealing
conductive pattern
supporting substrate
Prior art date
Application number
TW094113626A
Other languages
English (en)
Other versions
TW200605160A (en
Inventor
Sadamichi Takakusaki
Yusuke Igarashi
Motoichi Nezu
Takaya Kusabe
Original Assignee
Sanyo Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co filed Critical Sanyo Electric Co
Publication of TW200605160A publication Critical patent/TW200605160A/zh
Application granted granted Critical
Publication of TWI267115B publication Critical patent/TWI267115B/zh

Links

Classifications

    • H10W76/10—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4647—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer around previously made via studs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4682—Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil
    • H10W70/05—
    • H10W74/019—
    • H10W74/117—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H05K1/187—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding the patterned circuits being prefabricated circuits, which are not yet attached to a permanent insulating substrate, e.g. on a temporary carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4658—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern characterized by laminating a prefabricated metal foil pattern, e.g. by transfer
    • H10P72/7424—
    • H10W72/07504—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/884—
    • H10W74/00—
    • H10W90/701—
    • H10W90/734—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW094113626A 2004-07-29 2005-04-28 Method for making a circuit device TWI267115B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004222115A JP4596846B2 (ja) 2004-07-29 2004-07-29 回路装置の製造方法

Publications (2)

Publication Number Publication Date
TW200605160A TW200605160A (en) 2006-02-01
TWI267115B true TWI267115B (en) 2006-11-21

Family

ID=35732821

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094113626A TWI267115B (en) 2004-07-29 2005-04-28 Method for making a circuit device

Country Status (5)

Country Link
US (1) US7163841B2 (zh)
JP (1) JP4596846B2 (zh)
KR (1) KR100728855B1 (zh)
CN (1) CN100444342C (zh)
TW (1) TWI267115B (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006027283A1 (de) * 2006-06-09 2007-12-13 Infineon Technologies Ag Verfahren zur Herstellung eines Halbleiterbauteils
JP2008060372A (ja) * 2006-08-31 2008-03-13 Sanyo Electric Co Ltd 回路装置およびその製造方法、配線基板およびその製造方法
US7872350B2 (en) * 2007-04-10 2011-01-18 Qimonda Ag Multi-chip module
JP5609064B2 (ja) * 2009-11-02 2014-10-22 住友電気工業株式会社 シールドフラットケーブルおよびその製造方法
TWI419278B (zh) * 2010-10-26 2013-12-11 欣興電子股份有限公司 封裝基板及其製法
US20120174394A1 (en) * 2011-01-11 2012-07-12 Samsung Electro Mechanics Co., Ltd. Method for manufacturing multilayer circuit board
US8563366B2 (en) * 2012-02-28 2013-10-22 Intermolecular Inc. Memory device having an integrated two-terminal current limiting resistor
JP2015119073A (ja) * 2013-12-19 2015-06-25 日本シイエムケイ株式会社 多層プリント配線板および、その製造方法
US9844136B2 (en) * 2014-12-01 2017-12-12 General Electric Company Printed circuit boards having profiled conductive layer and methods of manufacturing same
CN109788665B (zh) * 2017-11-14 2020-07-31 何崇文 含电子元件的线路基板及其制作方法
US11769719B2 (en) * 2018-06-25 2023-09-26 Intel Corporation Dual trace thickness for single layer routing
US10888002B2 (en) * 2019-03-28 2021-01-05 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with embedded tracks protruding up to different heights

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JPH0350890A (ja) * 1989-07-19 1991-03-05 Canon Inc プリント基板のスルホール導体化方法
EP0751561A4 (en) * 1994-03-18 1997-05-07 Hitachi Chemical Co Ltd PRODUCTION METHOD OF A SEMICONDUCTOR PACK AND SEMICONDUCTOR PACK
JPH09275178A (ja) * 1996-04-03 1997-10-21 Matsushita Electric Ind Co Ltd 半導体パッケージとその製造方法
JP3173439B2 (ja) * 1997-10-14 2001-06-04 松下電器産業株式会社 セラミック多層基板及びその製造方法
US6545359B1 (en) * 1998-12-18 2003-04-08 Semiconductor Energy Laboratory Co., Ltd. Wiring line and manufacture process thereof, and semiconductor device and manufacturing process thereof
US7091606B2 (en) * 2000-01-31 2006-08-15 Sanyo Electric Co., Ltd. Circuit device and manufacturing method of circuit device and semiconductor module
JP3906653B2 (ja) * 2000-07-18 2007-04-18 ソニー株式会社 画像表示装置及びその製造方法
JP3417388B2 (ja) * 2000-07-19 2003-06-16 松下電器産業株式会社 半導体装置
JP3546961B2 (ja) * 2000-10-18 2004-07-28 日本電気株式会社 半導体装置搭載用配線基板およびその製造方法、並びに半導体パッケージ
JP2002185097A (ja) * 2000-12-12 2002-06-28 Hitachi Chem Co Ltd 接続方法とその方法を用いた回路板とその製造方法並びに半導体パッケージとその製造方法
JP3773896B2 (ja) * 2002-02-15 2006-05-10 Ｎｅｃエレクトロニクス株式会社 半導体装置の製造方法
JP2003298232A (ja) * 2002-04-02 2003-10-17 Sony Corp 多層配線基板の製造方法および多層配線基板
JP2003304065A (ja) * 2002-04-08 2003-10-24 Sony Corp 回路基板装置及びその製造方法、並びに半導体装置及びその製造方法
JP2003303863A (ja) * 2002-04-10 2003-10-24 Hitachi Cable Ltd 配線板及びその製造方法、ならびに配線板を用いた半導体装置の製造方法
JP2004014672A (ja) * 2002-06-05 2004-01-15 Toppan Printing Co Ltd 半導体装置用基板及びその製造方法
JP2004039867A (ja) * 2002-07-03 2004-02-05 Sony Corp 多層配線回路モジュール及びその製造方法
JP2004047587A (ja) * 2002-07-09 2004-02-12 Eastern Co Ltd 配線回路基板の製造方法および配線回路基板
TW563233B (en) * 2002-09-11 2003-11-21 Advanced Semiconductor Eng Process and structure for semiconductor package
JP4073305B2 (ja) * 2002-12-04 2008-04-09 三洋電機株式会社 回路装置
JP2005332896A (ja) * 2004-05-19 2005-12-02 Oki Electric Ind Co Ltd 半導体装置、チップサイズパッケージ、半導体装置の製造方法、及びチップサイズパッケージの製造方法

Also Published As

Publication number Publication date
US7163841B2 (en) 2007-01-16
CN100444342C (zh) 2008-12-17
KR20060046532A (ko) 2006-05-17
JP2006041376A (ja) 2006-02-09
US20060024862A1 (en) 2006-02-02
JP4596846B2 (ja) 2010-12-15
KR100728855B1 (ko) 2007-06-15
TW200605160A (en) 2006-02-01
CN1728353A (zh) 2006-02-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees