TWI265765B - Base of image sensor module and method for forming the module - Google Patents

Abstract

The present invention discloses a base of image sensor module and method for forming the module. The base comprises a shielding case and a socket. The socket further comprises a hollow base component and a plurality of terminals beneath the base component. Moreover, an image sensor can be placed into the hollow base component and be fixed by the shielding case. At first, the method for forming an image sensor base is to provide an image sensor and a base. The image sensor could be fixed to the base by using a shielding case of the base.

Description

1265765

[Technical Field] The present invention relates to a pedestal of a module and a method of forming the same, and relates to a pedestal of an image sensor module and a method of forming the module. [Prior Art] In modern life, mobile phones, digital cameras, and personal digital assistants (PDAs) have become indispensable electronic products, especially mobile phones and individuals equipped with digital image sensors. Digital assistants are also becoming popular as ♦. Installed by such personal consumer electronics

Digital image sensors are also light and thin. U Referring to the figure, it is a schematic diagram of a conventional image sensor module 100. The module 100 includes an image sensor base 11 and an image sensor 120. The image sensor base further includes a base assembly 112 and a rigid printed circuit board 114, wherein the shadow & sensor 1 20 is fixed to the base assembly 丨Above 丨2. Furthermore, the printed circuit board 130 connected to the I 匕 pedestal assembly 11 2 is used to connect the above-described image sensor 120 circuit to an external system. An interface system, such as a cell phone or a number of assistants, can provide a connection element that is coupled to the printed circuit board 4 described above and is electrically coupled to the image sensor 1 2 described above. Referring to the soil map, it is a schematic diagram of another conventional image sensor module 200. The module 200 includes an image sensor base 2 and an image sensor 220. The image sensor base 2 1 further includes a base assembly 212 and a soft printed circuit board 214, wherein the image sensor 220 is fixed on the base assembly 2 12 . Again, ^ then this

1265765 V. DESCRIPTION OF THE INVENTION (2) The above printed circuit board 230 of the susceptor assembly 212 is used to connect the above-described image sensor 220 circuit to an external system. An interface system, such as a mobile phone or a number of assistants, can provide a connection element that is coupled to the printed circuit board 214 to be electrically coupled to the image sensor 220. " As mentioned earlier, traditional image sensor pedestals require a printed circuit board to connect to the external system. The printed circuit board, whether rigid or soft, must be manufactured at a certain cost, and the external system must also provide a corresponding connection element, which must be manufactured at a certain cost. Furthermore, the above-mentioned printed circuit board and the socket provided by the external system also take up extra space. In addition, in the communication hand, the position of the image sensor base is mostly located near the antenna, and often the electromagnetic interference (EMI, Electro-Magnetic Interference) of the radio frequency (rf, Radio Frequency) component. The circuit of the above printed circuit is exposed to such an electromagnetic interference environment, and the longer the line, the greater the probability of electromagnetic interference. Furthermore, the image sensor base described above also protects the electromagnetic interference of the image sensor therein. ‘With this, how to provide a kind of sensor base that can effectively reduce the space and cost of the image sensor base and reduce the influence of external electromagnetic interference is an important issue.

SUMMARY OF THE INVENTION The present invention provides an image sensor based on the above-mentioned term nn & stomach. Reduced electromagnetic interference machine ^ month: in order to meet the needs of the industry to reduce costs and the formation and its formation. 'Can be used to solve the above-mentioned traditional pedestal failed to achieve the standard

Page 8 1265756 V. Description of the Invention (3) One object of the present invention is to provide an image sensor base by which the grounding of the metal cover assembly of the image sensor base and the design of the four sides are simultaneously Provides physical protection and reduces electromagnetic interference. Another object of the present invention is to provide an image sensor base by which a plurality of terminals of the image sensor base are connected to an external system to reduce cost and reduce electromagnetic interference. Another object of the present invention is to provide an image sensor base, which is provided by a hollow base member provided by the image sensor base to reduce the overall height of the module and reduce the size of the module.

In order to achieve the above object, the present invention provides an image sensor base in an image sensor module. The image sensor module includes an image sensing device and the image sensor base, wherein the image sensor base includes a cover assembly and a base assembly. The image sensor includes an optical module and a sensor module, wherein the optical module is transparent to the sensor module. The sensor module includes an image sensing component, a substrate, and a plurality of sensing component terminals. The image sensing device is fixed on the substrate, and the substrate has a circuit in which the plurality of sensing element terminals are electrically coupled to the image sensing element. The susceptor assembly described above includes a hollow base member and a plurality of end members fixed to the base. The plurality of terminals are electrically coupled to the plurality of sensing element terminals of the image sensor. The cover assembly described above can secure the image sensor as described above to the base assembly. In order to achieve the above object, the present invention provides a method of forming an image sensor module. First, an image sensor base is provided, which includes a cover buckle total

Page 9 1265756 --- - V. Description of the invention (4) Forming a base assembly, wherein the base assembly includes a hollow base member and a plurality of terminals fixed to the base member . Next, an image sensor is provided. The image sensor includes an optical module and a sensor 'module. Wherein, the optical module comprises the necessary optical components and the device according to which the optical module can be transparently imaged on the sensor module. The sensor module includes an image sensing component, a substrate, and a plurality of sensing component terminals. The image sensing component is fixed on the substrate 〜, and the substrate has the above plurality of sensing component terminals, and is electrically coupled to the circuit of the image sensing component. Furthermore, the upper surface must be opposite to the susceptor assembly of the μ, and the above-mentioned η: terminal position on the substrate must be opposite to the plurality of terminals of the base member, and the image sense is placed thereon. The plurality of sensing element terminals of the above-mentioned hollow substrate are connected to the above: the sensor base and the forming method thereof can provide electromagnetic interference effects of the shirt image boundary The image is used to measure the work Ab: , and the 乍 is used to prevent the external fruit from being damaged by the external force of the image sensor module. The effect of the present invention is not limited in the following description. On the other hand, the direction in which the invention is discussed herein is a method of formation. In order to thoroughly understand the present invention, detailed steps and compositions thereof are presented. Obviously, the special details that are familiar to the skilled artisan 1265765

The composition or steps are not described in detail to avoid the necessary limitations of the invention. The preferred embodiments of the present invention will be described in detail below, but the present invention may be widely practiced in other embodiments, and the scope of the present invention is not limited by the scope of the following. . Referring to FIGS. 3A to 3D, there is shown a schematic structural view of an image sensor module 300 according to an embodiment of the present invention. The image sensor module 300 includes an image sensor 305 and a base sensor base 310. The image sensor 305 includes an optical module 320 and a sensor module 330. The image sensor base 31 described above includes a cover assembly 3 4 0 ' and a base assembly 3 5 0 (s 〇 c k e t).

In this embodiment, the optical module 32 0 includes the necessary optical components and fixing means thereof, and accordingly, the optical module 32 can be optically imaged on the sensor module 310. As shown in FIG. 3A, the optical module further includes a zoom lens set 322 and a lens holder 324. The lens unit base 324 may include a direction indicating component 326 for indicating the assembly direction when the optical module 320 is assembled to the image sensor base 31 0. As shown in FIG. 3A, the zoom lens group 322 may further include a first spiral structure 327, and the lens group base 324 may further include a second spiral structure 328, and the first spiral structure 327 described above. The second spiral structure 328 is coupled to the above-mentioned second spiral structure 328 so that the user can rotate and adjust the focal length of the lens group 32 2 by itself. As shown in FIG. B, the optical module 320 may further include a first filter element 329 (IR).

Page 11 1265765

Cut) 'This first filter element can filter the image sensor 3〇5 to sense light waves outside the wavelength range to reduce noise. In another preferred embodiment of the present embodiment, the optical module 32 can be a fixed-focus optical module 32A. The present invention is applicable to both the fixed focus and zoomable optical modules 32A. In this embodiment, the sensor module 330 includes an image sensing element 332 (image sens〇r element), a substrate 334 (substrate) and a plurality of sensing element terminals 336. The image sensing component 332 is configured to sense the light generated by the optical module 32, and is fixed on the substrate 334, and the substrate 34 has the above plurality of sensings. The terminal 336 is electrically coupled to the circuit of the image sensing component 332. Furthermore, the substrate 343 may also include other types of electronic components such as inductors, capacitors, and passive components such as resistors. The material of the substrate 334 may be ceramic, plastic, printed circuit board, or other substrate materials well known to those skilled in the art, and thus will not be described in detail herein. The conventional image sensing component 332 can be a Charge Coupled Device (CCD), a Complementary Metal Oxide Semi-conductor (CMOS), or other images well known to those skilled in the art. Sensing technology, so it will not be detailed here. As shown in the third c-graph, the image sensing element 332 is tied to the optical module 320 described above; the different sides of the substrate 334 described above. The sensor module 330 is referred to as a f1 ip chip, wherein the image sensing component 332 includes a plurality of bumps to enable the image sensing component 3 3 2 Electrically consuming with the plurality of sensing element terminals 336. The sensor module 332 may further include a second filter element 338 (ir cut) to filter the

1265765 V. INSTRUCTIONS (7) Image sensing element 3 3 2 To sense light waves outside the wavelength range to reduce noise. In addition, the sensor module 330 described above may include a dot 339 to encapsulate the image sensing component 3 32 described above on the substrate. However, as shown in FIG. B, in another preferred example according to the present embodiment, the image sensing element 332 and the optical module 320 are located on the same side of the substrate 334. The sensor module 330 is referred to as a chip and wire form, wherein a plurality of lines are connected to the image sensing element 3 3 2 from a plurality of sensing element terminals 336 on the substrate 334. The image sensing element 323 is electrically coupled to the plurality of sensing element terminals 336. The manner in which the conductive lines are connected is referred to as wire bonding. The present invention is applicable to an image sensor module 300 using the two sensor modules 33A. However, at the focal length of the same length, the sensor module 330 shown in the third c is thinner than the sensor module 330 shown in the third B. In the present embodiment, the base assembly 35 0 includes a hollow base member 352, a plurality of terminals 354 fixed to the base member 352, and a plurality of first fixings on the base member 352. Structure 356. The hollow base member 352 is for accommodating the image sensor 3〇5 described above, so that the shapes of the two should be in close contact with each other. As previously described, the direction indicating component 326 of the learning module 32 can be used to indicate the assembly direction of the image sensor 3〇5. Furthermore, in the present embodiment, the plurality of terminals 345 are elastic and can support the weight of the image sensor, and the plurality of terminals 4 can be elasticized with the image sensor. A plurality of sensing element terminals 336 of 305 are electrically coupled. External systems can also be sockets or other forms of connecting components

1265765 V. Description of the Invention (8) The plurality of terminals 354 are connected to the above, and further electrically connected to the plurality of sensing element terminals 3 3 6 of the image sensor 305. In this embodiment, the cover assembly 34 〇 can further include a plurality of second fixing structures 344 corresponding to the first fixing structure 356, and a plurality of pines corresponding to the second fixing structure 3 4 4 Remove the component 3 4 6 . The plurality of first fixing structures 344 include the plurality of first fixing structures 356 in the form of pressing, so as to fix the image sensor 3〇5 to the pedestal assembly 3 5 0 in. In addition, the plurality of release members 346 described above can be used to release the pressing combination of the two types of fastening structures described above for the user to remove the cover assembly 340 described above. In the present embodiment, the cover assembly 34A includes a plurality of grounding terminals 342, and the material of the cover assembly 340 includes metal to provide two functions: one of the functions provides metal shielding to prevent external electromagnetic interference. The image sensing function is affected; the other function provides better protection against external damage of the image sensor module 3 . When the image sensor module is connected to the external system, the cover assembly 34 can be grounded to increase the function of protecting electromagnetic interference. Further, the present invention does not include the hard printed circuit board 11 or the flexible printed circuit board 214 required in the prior art, and the above plurality of terminals 35 5 $ are taken. The plurality of terminals 354 are located in the metal shield range of the cover assembly 34, to avoid exposure of the rigid printed circuit board 114 or the flexible printed circuit board 214 of the prior art to external electromagnetic interference. Moreover, the circuit lengths of the plurality of terminals 354 are also shorter than those of the previous rigid printed circuit board 11 4 or the flexible printed circuit board 2 14 , which can reduce the probability of noise generation and reduce power consumption and heat consumption. An increasingly sophisticated image

Page 14 1265765 DESCRIPTION OF THE INVENTION (9) For the sensor, the above improvements are more important.

Referring to the fourth figure, it is a flow of a method of forming an image sensor module according to an embodiment of the present invention. First, in step 4 1 Q, an image sensor base is provided. The image sensor base includes a cover assembly and a base assembly. Wherein, the cover buckle assembly comprises a plurality of first fixing structures, and the base assembly comprises a hollow base member, a plurality of terminals fixed to the base member, and a plurality of the base members The second fixed structure. The plurality of first fixed structures and the plurality of second fixed structures may be used to fix the cover assembly to the base member in a tight manner. In this embodiment, the cover assembly may further include a plurality of loose elements corresponding to the plurality of first fixed structures. The user can use the plurality of loose elements to release the pressing combination of the plurality of first fixing structures and the plurality of second fixing structures, and the cover assembly is disengaged from the base member.

Port/following step 420, an image sensor is provided. The image sensor includes an optical module and a sensor module. Wherein, the optical module comprises the necessary optical components and fixing means thereof, whereby the optical mode and the gamma light are imaged on the sensor module. In this embodiment, the light-emitting module further includes a zoom lens group and a lens group base. The lens group base may further include a direction indicating component for later stepping to indicate in which direction the image sensor is assembled in the hollow base element =. In addition, the above lens group may further include a first spiral structure, and the lens group base may further include a second spiral structure, wherein the first spiral structure may be spirally matched to the above Second spiral knot

Page 15 1265765 V. Description of invention (10) Structure. The user system can utilize the above sensing module, and the sensor module has a plurality of sensing element terminals. The optical module is formed by light transmission, and the substrate is coupled to the image sensing element to correspond to the position of the sensing terminal of the hollow base element. The two spiral structures are described to adjust the focal length. The present invention comprises an image sensing component, a substrate, and the image sensing component is configured to sense an image of the upper surface, and is fixed to the plurality of sensing component terminals of the substrate, and the electrical component thereof The circuit. Furthermore, the shape of the substrate is matched, and the plurality of the plurality of terminals on the substrate and the plurality of terminals of the base member are in the embodiment, wherein the image sensing device and the optical module are They are located on different sides of the above substrate. In addition, the optical module may further include a first filter element to filter out unnecessary light waves to reduce noise. In another preferred embodiment of the present embodiment, the image sensing element and the optical module described above may be located on the same side of the substrate. The optical module may further include a second filter element to filter out unnecessary light waves to reduce noise. Performing the placing step 4 3 0 'putting the image sensor into the hollow base member to make the plurality of sensing element terminals on the substrate and the plurality of terminals of the base member electrically coupling. Finally, the encapsulating step 4404 is performed, and the image sensing device is fixed to the plurality of first fixing structures on the base member by using the plurality of second fixing structures of the cover assembly as described above, and the image sensing is performed. And the above image sensor base forms the above image sensor module. Obviously, the present invention may have been made in accordance with the description in the above embodiments.

Page 16 1265765 V. INSTRUCTIONS (11) Many corrections and differences. Therefore, it is to be understood that in addition to the above-mentioned claims, the scope of the appended claims is not limited to the scope of the appended claims. Included; other equivalent changes or modifications made without departing from the spirit of the invention are intended to be included within the scope of the following claims. ^

Page 17----^ 1265765 Brief description of the diagram [Simple description of the diagram] The first diagram is a schematic diagram of a conventional image sensor module; the second diagram is another conventional image sensor module. 3A to 3D are structural diagrams of an image sensor module according to an embodiment of the present invention;

The fourth figure is a schematic flow chart of a method for forming an image sensor module according to an embodiment of the invention. [Main component symbol description] I 0 0 image sensor module II 0 image sensor base 11 2 base assembly 11 4 printed circuit board 1 2 0 image sensor

2 0 0 image sensor module 210 image sensor base 2 1 2 base assembly 2 1 4 printed circuit board 220 image sensor 300 image sensor module

Page 18 1265756 Simple description of the picture 305 Image sensor 310 image sensor base 320 optical module 322 lens set 324 lens set base (lens holder 326 direction indicating element 327 first spiral structure 328 second spiral structure 329 first filter element (IR cut) 3 3 0 sensor module (sens 〇rm 〇du 1 e ) 332 image sensing element (image sensor Element) 334 Substrate 336 Sensing Element Terminal 338 Second Filter Element (IR cut) 3 3 9 Dispensing 340 Cover Assembly 342 Grounding Terminal 344 Second Fixed Structure 346 Release Element 3 5 0 Base Total (s 〇cket) 3 5 2 base member 354 terminal 356 first fixed structure 41 0 provides an image sensor base step

Page 19 1265756 Figure 420 provides an image sensor step 430. The step 440 of placing the image sensor into a hollow base member uses the cover assembly to mount the image sensor. Packaging step fixed to the image sensor base

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Claims (1)

1265765 6. Patent application scope 1. An image sensor base, the image sensor base comprises: a base assembly, the base assembly further comprising a hollow base member and a plurality of fixed bases a terminal of the base member, wherein the hollow base member is configured to receive an image sensor and the plurality of terminals are electrically coupled to a plurality of sensing element terminals of the image sensor; and a cover assembly The cover assembly fixes the image sensor in the base member. 2. The image sensor base according to claim 1, wherein the cover assembly is made of metal. 3. The image sensor base of claim 1, wherein the cover assembly further comprises a plurality of ground terminals. 4. The image sensor base according to claim 1, wherein the base member further comprises a plurality of first fixing structures, and the cover assembly further comprises a plurality of first fixings corresponding to the plurality of first fixing structures. a plurality of second fixed structures of the structure, wherein the plurality of first fixed structures are combined with the plurality of second fixed structures to be fastened. 5. The image sensor base of claim 4, wherein the cover assembly further comprises a plurality of loose elements corresponding to the plurality of second fixed structures, the user can utilize the plurality The loose element is loosened and the plurality of first fixing structures are fastened to the plurality of second fixing structures. The image sensor base of the first aspect of the invention, wherein the image sensor further comprises an optical module and a sensor module, wherein The optical module is configured to transmit light to the sensor module. 7. The image sensor base of claim 6, wherein the sensor module further comprises a substrate and an image sensing component, wherein the image sensing component is fixed to the substrate. 8. The image sensor base of claim 7, wherein the image sensing element and the optical module are located on the same side of the substrate. 9. The image sensor base of claim 7, wherein the image sensing element and the optical module are respectively located on different sides of the substrate. 10. The image sensor base of claim 7, wherein the optical module is an optical module of a certain focus. 11. The image sensor base of claim 7, wherein the optical module is a zoomable optical module. 12. The image sensor base according to claim 2, wherein the optical module further comprises a mirror group and a lens group base, the lens Page 22 1265765 VI. Scope of Application The group includes a first spiral structure, the lens set base includes a second spiral structure. The first spiral structure and the second two-rotation structure are spirally coupled. 1 . The image sensor base according to claim 2, wherein the lens group base further comprises a direction indicating component. The image sensor base of claim 8, wherein the optical module comprises a first filter element. The image sensor base of claim 9, wherein the sensor module comprises a second filter element. 1 6 · A method for forming an image sensor module, the method for forming the image sensor module includes: providing an image sensor base, the image sensor base comprising a cover assembly and a cover a base assembly, the base assembly comprising a hollow base member and a plurality of terminals fixed to the base member; an image sensor is provided, the image sensor comprising an optical module and a a sensor module, the sensor module further comprising a substrate, an image sensing component fixed to the substrate, and a plurality of sensing component terminals on the substrate; performing a placing step, the placing The step of inserting the image sensor into the hollow base member, and electrically coupling the plurality of sensing element terminals to the plurality of terminals of the image sensor base; Page 23 U65765 - - '__ ____________ - ^ - , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The method of forming an image sensor module according to claim 16 wherein the material of the cover assembly is metal. 18#. The method of forming an image sensor module according to claim 16 wherein the cover assembly further comprises a plurality of ground terminals. 19 κ方·, as described in the application of the image sensor module described in claim 6, wherein the above-mentioned base member further comprises a plurality of first fixed structures, and the cover assembly further comprises a phase Corresponding to the plurality of fixed structures of the plurality of first fixed structures, wherein the plurality of first fixed structures are combined with the plurality of fixed structures to be fastened. 2 Q 方 · The formation of the image sensor module described in claim 16 of the patent application, wherein the cover buckle assembly further comprises a plurality of loose corresponding to the plurality of second solid I structures The component, the user can utilize the plurality of loose elements, the plurality of first fixed structures, and the plurality of second fixed structures. The method is as described in claim 16 The image sensor of the image sensor module further includes an optical module and - wherein the optical module is used for light transmission imaging on the sensor module 1265756. Patent application 22. The method for forming an image sensor module according to claim 16 , wherein the sensor module further comprises a substrate and an image sensing component, wherein the image sensing component is fixed on the substrate . The method of forming an image sensor module according to claim 22, wherein the image sensing element and the optical module are located on the same side of the substrate. The method of forming an image sensor module according to claim 22, wherein the image sensing element and the optical module are respectively located on different sides of the substrate. The method of forming an image sensor module according to claim 22, wherein the optical module is an optical module of a certain focus. 26. The method of forming an image sensor module according to claim 22, wherein the optical module is a zoomable optical module. The method of forming an image sensor module according to claim 26, wherein the optical module further comprises a lens group and a lens group base. The lens group comprises a first spiral structure. The lens assembly base includes a second spiral structure, and the first spiral structure and the second spiral structure are snail 1265765 Sixth, the scope of application for patents, the combination of spin-phase. The method of forming an image sensor module according to claim 27, wherein the lens group base further comprises a direction indicating component. The method of forming an image sensor module according to claim 23, wherein the optical module comprises a first filter element. The method of forming an image sensor module according to claim 24, wherein the sensor module comprises a second filter element. I Ϊ page 26