1309878 九、發明說明： 【發明所屬之技術領域】 尤指一種薄 之系統晶片 本發明係有關於-觀像池封裝結構， 型夕曰曰片取像模組封裝結構，可整合不同功能 於同-基板内，達到輕·小與模組化者。 【先前技術】 隨者科技發達與消費者強力需求下，各式各樣的隨 • 資訊電子產品以及設備因應而生，而手機結合數位相機功 能’即是其中-項重要之發明。觀察目前市售所有手 可以發現__薄短小去發展，尤其是具有照像功能之 手機’更是當紅的機種，甚至有人預測以後手機會完全取 代數位相機，成為結合照像、通訊、上網等，具有多功能 之整合機種。 i 請參閱圖一所示’其係為習用微型取像模組(C〇mpact Camem Module，CCM)之結構示意圖。習用之微型取像模 _ '组1係包括有：一基板10、-取像感測晶片11及-蓋體 結構12，其中，將該取像感測晶片11設置於基板1〇上， 並將蓋體結構12環繞該取像感測晶片u設於該基板1〇 上，用以保護該取像感測晶片11，且於該蓋體結構12上 设置一蓋板120 ’使取像感測晶片η可透過鏡頭2擷取 外界影像。 以照像手機為例，微型取像模組1利用軟性印刷電路 板3與手機基板4電性導通，並將控制微型取像模組1、 1309878 鏡頭2之系統晶片4卜42、43設置在手機基板*上 以控制微麻像·丨與綱2之趣，使手機具有照像 之功能。 j而1用之微型取像模組結構，無自動對焦 風 變焦之系統功能，必須由後端之軟硬體協助驅動，’所以^ 端手触必__聰格之微餘像池，重新設叶手 機基板，故需要時間她長，進而增加了組裝的困難声， 且難以達到最佳之影像效果。 八 【發明内容】 3敗第-目的，秘提供—觀賴_裝結携 ^裝方法’其係使用基板内埋的技術將多晶片之系统 =至同-基板上，發揮更大的影像功能及提升產品附加 本發明之另-目的’在於提供一種 ，其封裝方法，其係藉由系統晶片外圍所環繞之$二冓 以確實保㈣統晶片，提高取像模組封裝結二 及再一目的，在於提供一種取像模組封裝結構 及?封裝方法，該取賴_魏構的厚度，與原本之取 像模組封裝結構的厚度近似’故可在 取 ^結構職的雜下完成_，贿合產品輕 本發明之更一目的，在於挺也# 、扣ί、一種取像模組封裝結構 1309878 及其封裝方法，賴減可整合各式各樣的光學功能至模 組内，提供手機廠商更完整的解決方案。 為達上述之目的，本發明係提供一種取像模組封裝結 構’其係主要係包括有：-基板、—取像_晶片、一蓋 體結構、-電路層、至少-系統晶片、—封膠堤及一封膠 所組成。 該基板具有-第-基板面及—第二基板面，該取像感 測晶片具有一作動面與一非作動面，該取像感測晶片係以 该非作動面設置於該第一基板面上。該蓋體結構係環繞該 取像感測晶片設於該第一基板面上’用以保護該取像感測 晶片，且該蓋體結構相對應該作動面設置一蓋板。該電路 層係設於該第二基板面上，且有至少一系統晶片設於該電 路層上，以複數根銲線與該電路層導通電性。該封膠堤係 環繞該系統晶片設於該電路層上，且該封膠堤具有一導 通孔’该導通孔内具有一金屬導線用以導通該電路層之電 性。該封膠係填充於該封膠堤内，用以封裝保護該系統晶 本發明之取像模組封裝方法，其係包括以下步驟：於 一基板上形成一電路層；於該電路層上形成一封膠堤，且 於該封膠堤形成一導通孔；於該導通孔形成一金屬導線； 於該封膠堤所環繞區域之該電路層上設置至少一系統晶 片，且以打線方式與該電路層電性導通；填封膠於該封膠 堤内，用以封裝保護該系統晶片；以及，於該基板另一面 上設置一取像感測晶片與一蓋體結構’該蓋體結構係環繞 1309878 該取像感測晶片，用以保護該取像感測晶片，且該蓋體結 構更包括一蓋板’該蓋板係對應該取像感測晶片之作動面 設置。 本發明係將馬達驅動晶片、數位訊號處理晶片及快閃 記憶體整合至取像模組封裝結構内，達到整合光學功能的 效果。 【實施方式】 為了能更清楚地描述本發明所提出之取像模組封裝 結構及其封裝方法，以下將配合圖示詳細說明之。 凊參閱圖二A及圖二b所示，其係分別為本發明之 取像模組封裝結構較佳實施例剖面側視及仰視示意圖。其 中，取像模組封裝結構5主要係由：一基板5〇、一取像 感測晶片51、一蓋體結構52、一電路層53、系統晶片 (54a、54b、54c)、一封膠堤55及一封膠56等所共同組 成。 該基板50具有一第一基板面5〇1及一第二基板面 502 ’ 一般來說，該基板5〇通常係使用陶瓷材料或高分子 材料作為基板的材料，當然，也可以是使用業界常用之市 售習知的FR4、FR5、或是BT基板者。該取像感測晶片 51係用來擷取外界影像，通常是電荷耦合裝置（charge coupled device，CCD )或互補式金屬氧化半導體 (complementary metal oxide semiconductor，CMOS )，且 該取像感測晶片51具有一作動面與一非作動面512, 1309878 所謂作動面511係指具有擷取外界影像功能的那一面。於 本較佳實施例中，該取像感測晶片51係以覆晶封裝技術 (Flip Chip technology)將取像感測晶片51以該非作動面 512設置於該第一基板面501上，使取像感測晶片51的 作動面511朝向取像模組封裝結構5的上方。 該蓋體結構52係環繞該取像感測晶片51設於該第一 基板面501上，用以保護該取像感測晶片51。並於該蓋 體結構52開設一開口 521對應該取像感測晶片51之作動 面511，並於該開口 521上設置一蓋板522，該蓋板522 必須使用可透光之材料’才可以使外界之光線通過蓋板 522到達該取像感測晶片51之作動面511。可以依照不同 需求使用不同材質之蓋板522 ’舉例來說，例如：使用紅 外線濾光玻璃’或早純之素玻璃’或具有抗反射功能之抗 反射玻璃，或是藍玻璃等，使取像模組封裴結構5可以具 有更多種功能。 將該電路層53塗佈於該基板50之第二基板面5〇2 上，該電路層53之厚度非常薄幾乎可以忽略，為說明方 便才晝出示意圖，在此合先述明。該電路層53具有設計 好之電路，用以提供電性導通，藉由該電路層作為整 合之媒介’使整合之元件之間的電性可以相互溝通正常運 作。 於本較佳實施例中，可將各種不同功能之系統⑼ 54a、54b、54c整合至取像模組封裝結構5内之電路層y 上，並以複數根銲線541與該電路層53導通電性，舉例 1309878 來說’取像模組封裝結構5常用之系統晶片為：系統晶片 54a為一馬達驅動晶片，用以控制驅動取像模組封裝結構 5之鏡頭馬達（圖中未示），進而調整數位相機鏡頭焦距。 系統晶片54b為一數位影像訊號處理及影像邏輯運算之 晶片（Digital Signal Process〇r，DSP )，除了 將類比訊號轉 換成數位訊號外’更進一步處理影像之訊號， 以呈現所需1309878 IX. Description of the invention: [Technical field of the invention] In particular, a thin system wafer The present invention relates to a viewing-pool structure, a holly-film imaging module package structure, which can integrate different functions in the same -In the substrate, it is light, small and modular. [Prior Art] With the development of technology and the strong demand of consumers, all kinds of information electronic products and equipment are produced in response, and the combination of digital camera function and mobile phone is one of the important inventions. Observe that all the hands of the current market can be found __ thin and short to develop, especially the mobile phone with photo function 'is more popular model, and even some people predict that the mobile phone will completely replace the digital camera in the future, become a combination of photo, communication, Internet, etc. , with a multi-functional integrated machine. i Please refer to the figure shown in Figure 1 for the structure of the C〇mpact Camem Module (CCM). The conventional micro imaging module _ 'group 1 includes: a substrate 10, an image sensing wafer 11 and a cover structure 12, wherein the image sensing wafer 11 is disposed on the substrate 1 The cover structure 12 is disposed on the substrate 1 to surround the image sensing chip u for protecting the image sensing wafer 11 , and a cover 120 ′ is disposed on the cover structure 12 for image sensing. The measuring wafer η can capture an external image through the lens 2. Taking the photo mobile phone as an example, the micro image capturing module 1 is electrically connected to the mobile phone substrate 4 by using the flexible printed circuit board 3, and the system wafers 4 and 42 of the lens 2 for controlling the micro image capturing module 1, 1309878 are disposed at The mobile phone substrate* is used to control the micro-mass image, 丨 and 纲2, so that the mobile phone has the function of photo. j and 1 use the miniature image capture module structure, no auto focus wind zoom system function, must be driven by the back end of the software and hardware, 'so ^ hand touch must __ Cong Ge's micro-image pocket, heavy The new leaf phone substrate is set up, so it takes time for her to grow, which increases the difficulty of assembly and makes it difficult to achieve the best image quality. Eight [Summary of the Invention] 3 defeat the first-purpose, the secret provides - the concept of the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ And the additional object of the present invention is to provide a packaging method for improving the image-capturing module package and the second one by using the two-dimensional array surrounded by the periphery of the system wafer. The purpose is to provide an image capturing module package structure and a packaging method, and the thickness of the DM structure is similar to the thickness of the original image capturing module package structure, so that it can be completed in the structure of the structure. The purpose of the invention is that it also has a special purpose, which is Ting Ye, ί, an image capture module package structure 1309878 and its packaging method, which can integrate various optical functions into the module and provide A more complete solution for mobile phone manufacturers. In order to achieve the above object, the present invention provides an image capture module package structure, which mainly includes: a substrate, an image capture wafer, a cover structure, a circuit layer, at least a system wafer, and a seal. It consists of a glue bank and a glue. The substrate has a first substrate surface and a second substrate surface. The image sensing wafer has an active surface and a non-active surface. The image sensing chip is disposed on the first substrate surface with the non-actuating surface. on. The cover structure is disposed on the first substrate surface surrounding the image sensing chip to protect the image sensing wafer, and the cover structure is provided with a cover plate corresponding to the active surface. The circuit layer is disposed on the surface of the second substrate, and at least one system wafer is disposed on the circuit layer, and the plurality of bonding wires are electrically connected to the circuit layer. The sealant bank is disposed on the circuit layer around the system wafer, and the sealant bank has a via hole. The via hole has a metal wire for conducting electricity of the circuit layer. The encapsulant is filled in the seal embankment for encapsulating and protecting the image capture module of the present invention. The method includes the steps of: forming a circuit layer on a substrate; forming a circuit layer on the circuit layer Forming a via hole, and forming a via hole in the sealant bank; forming a metal wire in the via hole; installing at least one system wafer on the circuit layer surrounding the sealant bank, and wire-bonding the circuit The layer is electrically conductive; a sealant is encapsulated in the sealant to protect the system wafer; and an image sensing wafer and a cover structure are disposed on the other side of the substrate. The cover structure surrounds 1309878 The image sensing chip is configured to protect the image sensing wafer, and the cover structure further includes a cover plate that is disposed opposite the active surface of the image sensing wafer. The invention integrates the motor drive chip, the digital signal processing chip and the flash memory into the image capture module package structure to achieve the effect of integrating the optical function. [Embodiment] In order to more clearly describe the imaging module package structure and the packaging method thereof according to the present invention, the following will be described in detail with reference to the drawings. Referring to FIG. 2A and FIG. 2B, which are respectively a cross-sectional side view and a bottom view of a preferred embodiment of the image capturing module package structure of the present invention. The image capturing module package structure 5 is mainly composed of a substrate 5A, an image sensing wafer 51, a cover structure 52, a circuit layer 53, a system wafer (54a, 54b, 54c), and a glue. The bank 55 and a piece of glue 56 are combined. The substrate 50 has a first substrate surface 5〇1 and a second substrate surface 502′. Generally, the substrate 5〇 usually uses a ceramic material or a polymer material as a material of the substrate, and of course, it can also be commonly used in the industry. It is commercially available as FR4, FR5, or BT substrate. The image sensing chip 51 is used to capture an external image, usually a charge coupled device (CCD) or a complementary metal oxide semiconductor (CMOS), and the image sensing chip 51 is used. There is an active surface and a non-actuating surface 512, 1309878 The so-called active surface 511 refers to the side that has the function of capturing external image. In the preferred embodiment, the image sensing chip 51 is provided on the first substrate surface 501 by using the Flip Chip technology to mount the image sensing wafer 51 on the first substrate surface 501. The actuating surface 511 of the sensing wafer 51 faces the upper side of the image capturing module package 5. The cover structure 52 is disposed on the first substrate surface 501 around the image sensing wafer 51 for protecting the image sensing wafer 51. An opening 521 is formed in the cover structure 52 to correspond to the active surface 511 of the image sensing wafer 51, and a cover 522 is disposed on the opening 521. The cover 522 must be made of a material that can transmit light. The external light is passed through the cover 522 to the actuating surface 511 of the image sensing wafer 51. The cover plate 522 of different materials can be used according to different requirements. For example, for example, using infrared filter glass or early pure glass, or anti-reflective glass with anti-reflection function, or blue glass, etc. The module sealing structure 5 can have more functions. The circuit layer 53 is applied to the second substrate surface 5〇2 of the substrate 50. The thickness of the circuit layer 53 is very thin and can be neglected. For the sake of explanation, the schematic diagram is shown, which will be described first. The circuit layer 53 has a designed circuit for providing electrical conduction, by which the circuit layer acts as an integrated medium to enable the electrical communication between the integrated components to communicate with each other. In the preferred embodiment, the system (9) 54a, 54b, 54c of various functions can be integrated into the circuit layer y in the image capturing module package structure 5, and guided by the plurality of bonding wires 541 and the circuit layer 53. Conductivity, for example, 1309878, the system chip commonly used in the image capture module package structure 5 is: the system chip 54a is a motor drive chip for controlling the lens motor that drives the image capture module package structure 5 (not shown) , and then adjust the focal length of the digital camera lens. The system chip 54b is a digital signal processing (DSP) for digital image processing and image logic operations. In addition to converting the analog signal into a digital signal, the image signal is further processed to present the desired image.
的效果。系統晶片54c為—快閃記憶體（Hash Mem〇ry )， 用以儲存數位資料。 該封膠堤55係環繞系統晶片54a、54b、54c設於該 電路層53上，且該封膠堤55具有一導通孔551，該導通 孔55丨内具有一金屬導線552用以導通該電路層53之電 性’該封膠堤55通常係使用陶兗材料或高分子材料，至 =填充於該封膠堤55内之封膠56，制以封裝保護系統 片4a 54b、54c及銲線541’避免受到外力撞擊而遭 到破壞，或是因為灰塵、雜質等污染物沾附其上，造成接 j不良之結果’以提高取賴㈣裝結構5的使用安全可 罪又至於軟丨生印刷電路板（printe(j Qrcuk，fpc ) 係藉由銲墊553與金屬導線552電性導通至電路層 故取像模la封裝結構5係透過設於該封膠堤55上之 权丨生印刷電路板57，與手機或數位相機等產品結合，使 ，組廠可整合各式各樣的鱗魏絲賴組封裝結構 内，，供手機或數位相鱗下游朗更完整的解決方 案，使其組裝更簡便。 於本較佳實施财，封膠堤55的寬度大约lmm、厚 1309878 度大約0.35mm，基板50厚度大約〇 2inm，而蓋體結構 52厚度大約L5mm，故取像模組封裝結構5的主要厚度 表現’還是集中在蓋體結構52的厚度表現，而封膠堤55 的厚度約相當於基板5〇c的厚度，故該取像模組封裝 5可在幾乎柯加厚度的下完賴裝，哺合產品輕 薄短小的需求。 +請參閱圖三A至圖^所示，其係為本發明之取像 模組封裝方法步驟流程示意圖。 如圖二A所示’於一基板5〇上形成一電路層53，該 基板50係為陶究材料、南分子材料、、或是 BT基板者。 如圖三B所示，於該電路層53上形成一封勝堤％， 該封膠堤55於該電路層53上環繞出一環繞區域故，作 為後續女置系統晶片之區域，並於該封膠堤55上形成一 導通孔5S卜作為與電路| μ導通電性之通孔，以利後 續之作業。 如圖三C所示’於該導通孔551内填充一金屬導線 552，並形成複數個銲墊553與金屬導線552 使電路層53、金屬導線552與銲墊553三者之間的電性 相互導通，當然金屬導線552亦可延封膠堤％外緣塗佈， 其係為本領域技術者所了解，在此便不在加以圖示資述 之。 乂如圖三D所示，於該電路層53之環繞區域55a上設 置系統晶片54a、54b、54c，並以打線方式與該電路層53 12 1309878 電性V通’其中’系統晶片54a、54b、54e係分別為馬達 驅動晶片、數位訊號處理晶片、快閃記憶體，至於系統晶 片54a、54b、54c之用途，已於先前說明過，在此便不在 多作贅述。 如圖三E所示，將封膠56填充至該封膠堤55内， 用以封裝保護系統晶片54&、541)、54(；，避免系統晶片543、 54b、54受到損害。 如圖二F所示，於該基板5〇另一面上設置一取像感 測晶片51與一蓋體結構52，其中，該蓋體結構52係環 繞該取像感測晶片51，用以保護該取像感測晶片51，且 於該蓋體結構52上開設置一開口 521，該開口 521係對 應取像感測晶片51之作動面511設置，於開口 521處設 置可透光之蓋板522，至於蓋板522所使用之材質與特 性，已於前述實施例中詳述過’在此便不在多作資述。再 將一軟性印刷電路板57電性連接至銲墊553，藉由鲜整 553與該金屬導線552電性導通，使封裝結構藉軟性印刷 電路板57與外界連接。 請參閱圖四所示，其係為本發明之取像模組封裝結構 應用示意圖。如圖所示’將一鏡頭基座6設於取像模組封 裝結構5之蓋體結構52上，該鏡頭基座6具有鏡片61， 其中，該鏡片61係對應該蓋板522設置。透過取像模組 封裝結構5控制鏡片61 ’達到定焦、光學變焦或自動對 焦等動作’使模組廠依照不同之設計，將各式各樣的光學 功能整合至模組内’達到單一模組整合，以提供手機薇商 13 1309878 更完整的解決方案 以上所述係_難實關詳細綱本發明，而非限 制本發明之細。大凡熟知此馳藝人士皆_瞭 而作些微的輕及調整，仍將不失本發明之要義所在，： ^脫離本伽之精姊關。紅崎，本發明實施之且 體性，誠已符合專觀情規定之㈣專 p 貴審查委S惠料視，並賜料_禱。 羞5月Effect. The system chip 54c is a flash memory (Hash Mem〇ry) for storing digital data. The sealing bank 55 is disposed on the circuit layer 53 around the system wafers 54a, 54b, 54c, and the sealing bank 55 has a via hole 551. The via hole 55 has a metal wire 552 for conducting the circuit. The electrical property of the layer 53 is usually made of a ceramic material or a polymer material, to the sealing compound 56 filled in the sealing bank 55, and the protective protection system sheets 4a 54b, 54c and the bonding wires are formed. 541' to avoid being damaged by external impact, or because of dust, impurities and other contaminants adhering to it, resulting in poor results of the joints to improve the use of the shackles (four) installed structure 5 is safe and guilty and soft The printed circuit board (printed circuit board (j Qrcuk, fpc) is electrically connected to the circuit layer by the bonding pad 553 and the metal wire 552. Therefore, the image module la package structure 5 is transmitted through the sealing film provided on the sealing bank 55. The circuit board 57, combined with products such as mobile phones or digital cameras, enables the group to integrate a wide variety of scales in the Weislai package structure, providing a more complete solution for downstream mobile phones or digital scales. It is easier to assemble. In the preferred implementation, the width of the sealant 55 About lmm, thickness 1309878 degrees about 0.35mm, the thickness of the substrate 50 is about in2inm, and the thickness of the cover structure 52 is about L5mm, so the main thickness performance of the image module package structure 5 is still concentrated on the thickness performance of the cover structure 52. The thickness of the sealing embankment 55 is equivalent to the thickness of the substrate 5〇c, so the image capturing module package 5 can be finished under almost the thickness of the Koga, and the product is required to be light and short. 3A to FIG. 2 are a schematic flow chart of the steps of the image capturing module packaging method of the present invention. As shown in FIG. 2A, a circuit layer 53 is formed on a substrate 5, and the substrate 50 is a ceramics. The material, the south molecular material, or the BT substrate. As shown in FIG. 3B, a yoke% is formed on the circuit layer 53, and the sealant 55 surrounds the circuit layer 53 so as to surround the surrounding area. As a region of the follow-up female system chip, a via hole 5S is formed on the sealant bank 55 as a through hole with the circuit | μ conduction property, so as to facilitate subsequent operations. As shown in Fig. 3C The via hole 551 is filled with a metal wire 552, and a plurality of pads 553 are formed. The wire 552 electrically connects the circuit layer 53, the metal wire 552 and the pad 553 to each other. Of course, the metal wire 552 can also be coated with the outer edge of the glued dam, which is known to those skilled in the art. The system wafers 54a, 54b, 54c are disposed on the surrounding area 55a of the circuit layer 53 and are wired and connected to the circuit layer 53 12 1309878. The electrical V-channel 'where the system wafers 54a, 54b, 54e are respectively a motor-driven wafer, a digital signal processing chip, a flash memory, and the use of the system wafers 54a, 54b, 54c have been previously described. I will not repeat them. As shown in FIG. 3E, a sealant 56 is filled into the sealant bank 55 for encapsulating the protection system wafers 54&, 541), 54 (;, to avoid damage to the system wafers 543, 54b, 54. As shown in FIG. 5, an image sensing chip 51 and a cover structure 52 are disposed on the other surface of the substrate 5, wherein the cover structure 52 surrounds the image sensing chip 51 for protecting the image. The illuminating cover 51 is disposed on the cover structure 52, and the opening 521 is disposed corresponding to the actuating surface 511 of the image sensing wafer 51, and the light transmissive cover 522 is disposed at the opening 521. The materials and characteristics of the cover 522 have been described in detail in the foregoing embodiments. 'There is no further description here. A flexible printed circuit board 57 is electrically connected to the pad 553 by fresh 553. The metal wire 552 is electrically connected to the metal wire 552, so that the package structure is connected to the outside by the flexible printed circuit board 57. Referring to FIG. 4, it is a schematic diagram of the application structure of the image capturing module of the present invention. A lens base 6 is disposed on the cover structure 52 of the image capturing module package structure 5, the mirror The pedestal 6 has a lens 61, wherein the lens 61 is disposed corresponding to the cover 522. The lens module 61 is controlled by the image capturing module package 5 to achieve a fixed focus, optical zoom or auto focus operation, so that the module factory is different. Designed to integrate a wide range of optical functions into a module' to achieve a single module integration to provide a more complete solution for the mobile phone Weishang 13 1309878. Limiting the details of the present invention. Those who are familiar with this artisan are slightly lighter and more accommodating, and will still lose the essence of the present invention: ^From the essence of this gamma. Hongqi, the present invention is implemented Physicality, sincerity has met the pre-existing rules (4) special p review committee S benefit information, and give _ prayer. Shame May
【圖式簡單說明】 圖一係為習用微型取賴組之結構示意圖。 實施例 A/射㈣之取賴_裝結構較佳 剖面侧視示意圖。 圖二B 剖面仰視示 係為本發明之取賴_裝結構較佳 意圖。 實施例 係為本發狄取賴組封裝方法步[Simple description of the diagram] Figure 1 is a schematic diagram of the structure of the conventional micro-rejection group. Example A/Shooting (4) Dependence - The structure is preferably a cross-sectional side view. Figure 2B is a schematic view of the present invention. Embodiment is a method for encapsulating a method
圖三A至圖三ρ 驟流程示意圖。 圖四係為本㈣之取賴_裝結構期示意圖 【主要元件符號說明】 U〜取像感測晶片 120〜蓋板 3〜軟性印刷電路板 1〜微型取像模組 I。〜基板 I2〜蓋體結構 2〜鏡頭 4〜手機基板 4卜42、43〜系統晶片 14 1309878 5〜取像模組封裝結構 50〜基板 501〜第一基板面 502〜第二基板面 51〜取像感測晶片 511〜作動面 512〜非作動面 52〜蓋體結構 521〜開口 522〜蓋板 53〜電路層 54a、54b、54c〜系統晶片 54卜銲線 5 5〜封膠堤 551〜導通孔 552〜金屬導線 553〜銲墊 56〜封膠 57〜軟性印刷電路板 6〜鏡頭基座 61〜鏡片Figure 3A to Figure 3 are schematic flow diagrams. Fig. 4 is a schematic diagram of the (4) reliance_installation structure period. [Main component symbol description] U~ image sensing wafer 120~ cover 3~soft printed circuit board 1~mini image capture module I. ~ Substrate I2 to cover structure 2 to lens 4 to mobile phone substrate 4, 42, 43 to system wafer 14 1309878 5 to image capture module package structure 50 to substrate 501 to first substrate surface 502 to second substrate surface 51 to Image sensing wafer 511 to actuating surface 512 to non-actuating surface 52 to cover structure 521 to opening 522 to cover 53 to circuit layer 54a, 54b, 54c to system wafer 54 to bonding wire 5 5 to sealing bank 551 to conducting Hole 552~metal wire 553~pad 56~sealing 57~soft printed circuit board 6~lens base 61~lens
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