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TWI263351B - Semiconductor package and fabrication method thereof - Google Patents

Semiconductor package and fabrication method thereof

Info

Publication number
TWI263351B
TWI263351B TW094132399A TW94132399A TWI263351B TW I263351 B TWI263351 B TW I263351B TW 094132399 A TW094132399 A TW 094132399A TW 94132399 A TW94132399 A TW 94132399A TW I263351 B TWI263351 B TW I263351B
Authority
TW
Taiwan
Prior art keywords
chip
leads
fabrication method
conductive bumps
lead frame
Prior art date
Application number
TW094132399A
Other languages
English (en)
Other versions
TW200713613A (en
Inventor
Han-Ping Pu
Chien-Ping Huang
Original Assignee
Siliconware Precision Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siliconware Precision Industries Co Ltd filed Critical Siliconware Precision Industries Co Ltd
Priority to TW094132399A priority Critical patent/TWI263351B/zh
Priority to US11/523,719 priority patent/US20080224283A1/en
Application granted granted Critical
Publication of TWI263351B publication Critical patent/TWI263351B/zh
Publication of TW200713613A publication Critical patent/TW200713613A/zh
Priority to US13/214,076 priority patent/US8420452B2/en

Links

Classifications

    • H10W40/778—
    • H10W70/415—
    • H10W70/424—
    • H10W72/20—
    • H10W74/111—
    • H10W72/07251—
    • H10W72/227—
    • H10W72/247—
    • H10W72/251—
    • H10W72/29—
    • H10W72/926—
    • H10W90/726—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
TW094132399A 2005-09-20 2005-09-20 Semiconductor package and fabrication method thereof TWI263351B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW094132399A TWI263351B (en) 2005-09-20 2005-09-20 Semiconductor package and fabrication method thereof
US11/523,719 US20080224283A1 (en) 2005-09-20 2006-09-20 Leadframe-based semiconductor package and fabrication method thereof
US13/214,076 US8420452B2 (en) 2005-09-20 2011-08-19 Fabrication method of leadframe-based semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094132399A TWI263351B (en) 2005-09-20 2005-09-20 Semiconductor package and fabrication method thereof

Publications (2)

Publication Number Publication Date
TWI263351B true TWI263351B (en) 2006-10-01
TW200713613A TW200713613A (en) 2007-04-01

Family

ID=37966348

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094132399A TWI263351B (en) 2005-09-20 2005-09-20 Semiconductor package and fabrication method thereof

Country Status (2)

Country Link
US (2) US20080224283A1 (zh)
TW (1) TWI263351B (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI334205B (en) * 2007-05-14 2010-12-01 Advanced Semiconductor Eng Package structure and manufacturing method thereof
US9142502B2 (en) * 2011-08-31 2015-09-22 Zhiwei Gong Semiconductor device packaging having pre-encapsulation through via formation using drop-in signal conduits
US8916421B2 (en) * 2011-08-31 2014-12-23 Freescale Semiconductor, Inc. Semiconductor device packaging having pre-encapsulation through via formation using lead frames with attached signal conduits
US20130119532A1 (en) * 2011-11-11 2013-05-16 Taiwan Semiconductor Manufacturing Company, Ltd. Bumps for Chip Scale Packaging
US8597983B2 (en) 2011-11-18 2013-12-03 Freescale Semiconductor, Inc. Semiconductor device packaging having substrate with pre-encapsulation through via formation
US11291146B2 (en) 2014-03-07 2022-03-29 Bridge Semiconductor Corp. Leadframe substrate having modulator and crack inhibiting structure and flip chip assembly using the same
IT201700089965A1 (it) * 2017-08-03 2019-02-03 St Microelectronics Srl Procedimento di produzione di componenti elettronici e corrispondente componente elettronico
US11444048B2 (en) * 2017-10-05 2022-09-13 Texas Instruments Incorporated Shaped interconnect bumps in semiconductor devices
KR101892876B1 (ko) * 2017-12-01 2018-08-28 삼성전기주식회사 팬-아웃 반도체 패키지
WO2019227435A1 (zh) * 2018-05-31 2019-12-05 华为技术有限公司 一种电路板及移动终端
US10847483B2 (en) * 2018-08-29 2020-11-24 Texas Instruments Incorporated Integrated circuits with conductive bumps having a profile with a wave pattern
CN111356302B (zh) * 2018-12-21 2024-10-29 深南电路股份有限公司 电路板及其制造方法
TWI749465B (zh) * 2020-02-14 2021-12-11 聚積科技股份有限公司 積體電路的轉移封裝方法
US11355470B2 (en) 2020-02-27 2022-06-07 Amkor Technology Singapore Holding Pte. Ltd. Semiconductor device and methods of manufacturing semiconductor devices
TW202230674A (zh) * 2020-12-31 2022-08-01 王忠寶 一種電子裝置的框架及封裝體
US12021048B2 (en) * 2021-08-30 2024-06-25 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5933713A (en) * 1998-04-06 1999-08-03 Micron Technology, Inc. Method of forming overmolded chip scale package and resulting product
JP3736516B2 (ja) * 2002-11-01 2006-01-18 松下電器産業株式会社 リードフレームおよびその製造方法ならびに樹脂封止型半導体装置およびその製造方法
US7138707B1 (en) * 2003-10-21 2006-11-21 Amkor Technology, Inc. Semiconductor package including leads and conductive posts for providing increased functionality

Also Published As

Publication number Publication date
US20080224283A1 (en) 2008-09-18
TW200713613A (en) 2007-04-01
US8420452B2 (en) 2013-04-16
US20110300671A1 (en) 2011-12-08

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Legal Events

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