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TWI263283B - Molding method and molding structure used to prevent vapor infiltration - Google Patents

Molding method and molding structure used to prevent vapor infiltration

Info

Publication number
TWI263283B
TWI263283B TW94112442A TW94112442A TWI263283B TW I263283 B TWI263283 B TW I263283B TW 94112442 A TW94112442 A TW 94112442A TW 94112442 A TW94112442 A TW 94112442A TW I263283 B TWI263283 B TW I263283B
Authority
TW
Taiwan
Prior art keywords
substrates
seal
molding
pieces
course
Prior art date
Application number
TW94112442A
Other languages
Chinese (zh)
Other versions
TW200638488A (en
Inventor
Wen-Ren Jiang
Shiou-Cheng Jang
Wie-Wen Yang
Chih-Hung Yeh
Original Assignee
Unividion Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unividion Technology Inc filed Critical Unividion Technology Inc
Priority to TW94112442A priority Critical patent/TWI263283B/en
Application granted granted Critical
Publication of TWI263283B publication Critical patent/TWI263283B/en
Publication of TW200638488A publication Critical patent/TW200638488A/en

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Abstract

A molding method and molding structure used to prevent vapor infiltration is disclosed, comprising the steps: first, seal is used to connect two pieces of substrates wherein between the two pieces of substrates is generated a micro gap; next, a first course of seal with low viscosity is used to fill the gap between the two pieces of substrates and to cover a circuit with part of it shown on one of the substrates; then, a second course of seal is used to cover on the first course of seal and the other circuit with part of it shown on one of the substrates. Hence, the double layer seal can be completely filled in the micro gap between the two substrates, which can ensure the reliability test of the product even when being used in the environment with high temperature and high humidity so that the quality of the product won't be affected.
TW94112442A 2005-04-19 2005-04-19 Molding method and molding structure used to prevent vapor infiltration TWI263283B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94112442A TWI263283B (en) 2005-04-19 2005-04-19 Molding method and molding structure used to prevent vapor infiltration

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94112442A TWI263283B (en) 2005-04-19 2005-04-19 Molding method and molding structure used to prevent vapor infiltration

Publications (2)

Publication Number Publication Date
TWI263283B true TWI263283B (en) 2006-10-01
TW200638488A TW200638488A (en) 2006-11-01

Family

ID=37966318

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94112442A TWI263283B (en) 2005-04-19 2005-04-19 Molding method and molding structure used to prevent vapor infiltration

Country Status (1)

Country Link
TW (1) TWI263283B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI472831B (en) * 2011-12-16 2015-02-11 輝能科技股份有限公司 Side package structure of electronic module

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111279045B (en) * 2017-11-08 2022-04-15 株式会社Lg化学 Method for manufacturing smart window

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI472831B (en) * 2011-12-16 2015-02-11 輝能科技股份有限公司 Side package structure of electronic module

Also Published As

Publication number Publication date
TW200638488A (en) 2006-11-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees