TWI261612B - Latent hardener, manufacturing method for latent hardener, and adhesive - Google Patents

Abstract

There is provided an adhesive which hardens under the condition of low temperature within short time and has a high preserving property. The latent hardener of the present invention has hardener particles mainly comprising metal chelate and capsules covering the surface of the hardener particles where, in the surface part of the hardener particles, substituent of the resin component constituting the capsule is bonded to the metal chelate. Accordingly, mechanical strength of the capsule is high whereby the capsule is not broken in a step of kneading the latent hardener with an epoxy resin.

Description

SUNDIAL CONFIDENTIAL 发明, invention description (in the field of technology, prior art, content, embodiment and schematic description of the invention) A latent curing agent used for an adhesive when a semiconductor wafer and TCP are thermally bonded by a substrate. [Prior Art]

In the past, when a semiconductor wafer was to be mounted on a substrate, or a TCP (Tape Carrier Package) and an LCD (Liquid Crystal Display) were used to manufacture an electrical device, an adhesive containing a thermosetting resin epoxy resin was used. As shown in the symbol 111 of Fig. 7 (a), the LCD 111 includes a glass substrate 112, and an ITO electrode (Indium tin oxide) 113° LCD 111 disposed on the glass substrate 112, in the case of TCP, which will be described later, first in the LCD 111 The surface to be disposed on the ITO electrode 113 is coated with an adhesive. The symbol 125 in Fig. 7(b) is the case where the adhesive is applied to the LCD 111. Reference numeral 115 in Fig. 7(c) shows TCP, and TCP 115 includes a base film 116 and a metal wiring 117 disposed on the surface of the susceptor film 116. The metal wiring 117 of the TCP 115 is disposed on the face of the LCD 111 toward the adhesive 125 on the LCD 111, after the alignment position, 1261612

File:TW 1008(060307)CRF.doc

The arrangement surface of the metal wiring 117 of the SUNDIAL CONFIDENTIAL TCP 115 is pressed toward the adhesive i25. When the heating is pressed in this state, the adhesive 125 is softened, and the metal wiring 117 pushes the softened adhesive 125 back to contact the surface of the ITO electrode 113. In the above-mentioned adhesive, a hardener which is superimposed with an epoxy resin after heating and is like an imidazol type is generally added, and when the metal wiring ii 7 and the ιτ〇 electrode 113 are heated in a bonded state, the hardener is added. The catalytic action causes the epoxy to overlap and the adhesive 125 to harden. The symbol 101 of Fig. 7(c) shows the electrical equipment of the adhesive 125 in the cured state. The electric device 1〇1 fixes the TCP 115 and the LCD 111 through the cured adhesive in a state where the metal wiring 117 is in contact with the Ting electrode 113. Therefore, the TCPU 5 and the LCD 1U are electrically and mechanically connected. In the case where the above-mentioned adhesive is hardened, the adhesive must be heated at a high temperature of 18 Torr or more. When the circuit of the metal wiring 117 is very fine, the TCP 115 may be deformed by elongation or shortening during heating. This problem can be solved by lowering the heating temperature, but it prolongs the time required for the heat treatment and reduces productivity. An adhesive that is excellent in hardenability at low temperatures has been developed in recent years. 1261612

File:TW1008(060307)CRF.d〇〇

SUNDIAL CONFIDENTIAL Free radical polymerization (rad1CaUyP〇lyrnenzable) tree such as octa (4)*. A cerium and an adhesive containing a radical polymerization initiator. However, such an adhesive # is inferior in electrical properties and heat resistance in a hardened state by using a % oxygen resin. SUMMARY OF THE INVENTION The purpose of the present invention is to provide an adhesive which can be hardened under low temperature and short time conditions and has excellent preservability in order to solve the above problems of the prior art. The inventors of this month, etc., do not use a hardener generally used, but focus on a method of making an epoxy resin cation-coincident. After repeated research, the following methods were found: at least one alkoxy group in the structure, the kiln compound 5 (Siiane c〇Upling agent), and the chelating agent 5 (or metal alcohol) The salt (Alcoholate) is added to the adhesive to 'react the cations generated by the reaction of the metal complex with the silane coupling agent (Silane Coupling) to cause the epoxy resin to overlap (cation overlap). The subsequent enthalpy of adding a metal chelate compound and a silane coupling agent to harden the epoxy resin is explained below by the following reaction formulas (1) to (4). 1261612

Fiie: TW1008 (060307) CRF.doc SUNDIAL CONFIDENTIAL [Chemical 1] X-Si-0R+H20-X-Si-OH+R-〇H Reaction formula (1) + A1

OH-Si-X 厶

Al-O-Si-X+RH reaction formula (2)

R "Al-O-Si-X+X-Si-OH-^X-Si-O -Hh

;Al-〇-Si-X reaction formula (3)

R - CH-CH/ I 0 1 r-ch-ch2 OPT R-CH-CH2- R-CH-CH2 + >

\ / I Ο H+ OH* R-CH-CH2 \〇/ Reaction formula (4) A decane compound having at least one alkoxy group, as shown in the reaction formula (1), reacting with water in the binder, and activating the oxy group Will add water to break down 'to become Silanol base. When the adhesive is heated, the sulphuric acid base reacts with a metal chelate such as a chelate compound, and the compound is combined with the chelating chelate. (Reaction formula (2)) Then, as shown in the reaction formula (3), the Shixi burning alcohol base and the combined chelating chevure 1261612

File:T W1008(060307)CRF.doc

SUNDIAL CONFIDENTIAL Because of the equilibrium reaction, other stanol groups remaining in the binder will coordinate to form a Branstade acid point, as shown in reaction formula (4), because of the activated proton relationship, the ring at the end of the epoxy resin The oxygen ring opens the ring and coincides with the epoxy ring of the other epoxy resin (cationic overlap). Therefore, when a silane coupling agent and a metal chelating agent are added to a binder, a thermosetting resin such as an epoxy resin undergoes cation overlap. The reaction represented by the reaction formulas (2) to (4) is carried out at a temperature lower than the temperature at which the old adhesive is cured (180 ° C or higher), so that the above-mentioned adhesive is superior to the conventional adhesive. It can be hardened at a lower temperature and in a shorter time. However, when the metal chelate compound and the metal alkoxide (Alc〇h〇late) are directly dispersed in the joint (4) together with the silane coupling agent (Silane Coupling), the epoxy resin can be reacted at room temperature. Make the preservation worse. When the metal chelate is encapsulated in a capsule to form a so-called latent hardener, the preservation of the adhesive can be improved, but when the mechanical strength of the capsule is poor, the process of dispersing the latent resin into the epoxy resin sometimes It will also destroy the capsule. The present inventors have conducted intensive studies on improving the mechanical strength of the capsules. As a result, it has been found that if a capsule containing a substituent resin component such as (four) (hydr〇xyi) or carboxyl (carboxyl) is prepared, it is hardened. Agent 1261612

SUNDIAL CONFIDENTIAL

File:TWl〇〇8(〇6〇3〇7)CRF.doc The surface part of the metal chelate will bind to the substituent, which can improve the mechanical strength of the capsule, thus making it resistant to physical shock. Potential Hardener 0 This volume is based on the above-mentioned Transcend, and the invention contained in the first paragraph of the patent application, is a latent hardener with hardener particles and uranium uranium hardener particle surface. The capsule, the aforementioned hardener particles, are chelating. Or one of the metal Alcoholate, or both, as a main component, the capsule containing a resin component containing one or both of hydrazine Xyl or carb〇xyl The substituent on the surface of the hardener particle, the substituent which is described in the above-mentioned resin damage, reacts with the metal chelate to form a latent curing agent. The invention described in the second aspect of the invention is the latent curing agent according to the first aspect of the invention, wherein the metal chelate compound is a latent hardener mainly composed of an aluminum chelate compound. . The invention described in claim 3 is the latent hardener described in the first aspect of the patent application, and the aforementioned metal

Alcoholate is a latent hardener based on Ak〇h()late. The invention described in item 4 of the patent application is as for patent application 1261612

File:TWl〇〇8(〇6〇3〇7)CRF.doc

The potential component described in item 1 of the sundial CONFIDENTIAL range is a latent hardener based on the main component of polyvinyl alcohol (PVA) 4. The invention described in claim 5, which is a method for producing a latent hardener, which has a hardener particle and a capsule covering the surface of the hardener particle, and the capsule material The manufacturing process is that the capsule is composed of a resin component having a (four) reading base, a towel thereof, or a substituent of the two, and the average particle diameter of the powdery capsule material is larger than the average particle diameter of the hardener particles. The path is still small. A method for producing a latent curing agent, wherein the capsule material is adhered to the surface of the hardener particle, and the material is adhered to the surface of the hardener. The capsule material forms the aforementioned capsule. The invention described in claim 6 is a method for producing a latent curing agent according to the fifth aspect of the patent application, and has two types of engineering. One of the above-mentioned encapsulation processes is a process in which the surface of the hardener particles is adhered to the above-mentioned capsule material mixed with the pouch material to allow the hardener particles to be encapsulated. The second is a stirring process in which the above-mentioned capsule material is adhered to the above-mentioned hardener particles, and the capsule material is melted. 11 1261612

File:TW1008(060307)CRF.d〇c

SUNDIAL CONFIDENTIAL The scope of application for patents is the 7th tribute. The date of manufacture of the potential hardener described in item 5 of the scope of patent application and any of the 6 patent applications. The ratio of the average particle diameter of the 'J 逑 hardener particles to the average particle diameter of the aforementioned capsule material was _:80. The invention described in the eighth aspect of the patent application is the method for producing a latent hardener according to any one of the five patent applications and the application (5). The ratio of the average particle size to the average particle diameter of the aforementioned capsule material is 丨. . :5〇. The invention of claim 9 is the method for producing a latent curing agent according to claim 5, wherein the capsule is heated together with the curing agent particles after the capsule is formed. Apply for patent coverage! The invention described in the above item is followed by a sclerosing agent containing a thermosetting resin, Silane, and any of the items as claimed in the Patent Application No. 4 to 4 Agent. According to the configuration of the present invention, after the powdery capsule material and the hardener particles are mixed and stirred, the capsule material adheres to the surface of the hard particles due to the electrostatic effect. In this state, in the case of high-speed _ hardener particles, the capsule material will be dazzled in the state where static electricity adheres to the surface of the hardener particles. 12 1261612

FiIe: TW1008 (060307) CRF.doc SUNDIAL CONFIDENTIAL solution, the capsule material will be integrated into a capsule (encapsulated). When the substituent of the resin component is extremely high in reactivity with the curable particles, the substituent of the resin component in the encapsulation process reacts with the metal chelate on the surface of the hardener particle or the metal Ale oholate, and the substituent will react with the metal. The main metal bond of the chelate or metal A1 colar. In addition, when the substituent of the resin component reacts very little to the hardenable particles, it is heated together with the hardener particles after the encapsulation process, and the metal chelate or metal on the surface of the hardener particles can also be used. Alcoholate produces a reaction. The following reaction formula (5) shows a reaction state in which a substituent of a resin component binds to the aluminum chelate compound when the metal chelate compound employs an aluminum chelate compound. [Chemical 2] I \ /Α1\+〇Η-Χ^κΑ1'°-Χ +RH Reaction formula (7) ·

R The above reaction formula (5) shows the combination of Pr〇ton (hydrogen atom) and the combination of the integrator and the base. In addition, take

When the thiol group is a rebel group, the hydroxyl group of the M 熳 I in the slow group will react with the above reaction formula (5) and combine with aluminum. In the latent hardener of sample I, the tree that constitutes the capsule 13 1261612

SUNDIAL CONFIDENTIAL

File: TW 1 〇〇 8 (060307) CRF.doc The substituent of the lipid component binds to the metal chelate on the surface of the hardened particle, so the capsule has a high mechanical strength. Therefore, in the manufacturing process of the adhesive which is dispersed in the epoxy resin, the latent hardener of the present invention does not break the capsule due to physical impact. When the above-mentioned latent curing agent is mixed with a silane coupling agent (Silane Coupling) agent and a 5-oxo oxy-resin to form an adhesive, the surface of the powdery curable particles is coated with a capsule at normal temperature, and no ring occurs. The superposition reaction of the oxy-resin _, but when the adhesive is heated, the metal chelate constituting the curable particles is thermally expanded, and the capsule is also broken. When the capsule breaks, the hardening particles are mixed with the epoxy resin in the adhesive and the Silane Coupling agent, and the metal chelate constituting the hardener particles reacts with the silane coupling (Silane C〇upiing). Release cations into the adhesive, since the melting point is below 3 °C and below 35 °_ °C, the thermal decomposition temperature is below 50 °C and below 500 °C, and the softening temperature is below 0 °C and below 300 °C. The temperature is at _4〇. 〇The above 3 〇 (rc below the relationship of various conditions, the epoxy resin will violently overlap: (melting point is above 30 ° C above 35 °t, thermal decomposition temperature is above the mantra: below 500 C, softening temperature Above 〇°c and above 3〇〇°C, the glass transition temperature is above -40°C and above 300°C, etc., so that the adhesive is hard 14 1261612

File:TWl〇〇8(〇6〇3〇7)CRF.doc

SUNDIAL CONFIDENTIAL. When the average particle size of the hardener particles is too small, and the particle difference of the material of the rubber f is small, it is difficult to form a capsule, so the average particle size of the hardener particles is preferably 0.5 "m or more; 5"" the following. In addition, in the mixing process and the mixing process, a mixed mixing device (for example, "NHS-0" manufactured by Nara Machinery Co., Ltd.) can be used. This type of device has a mixture of hardenable particles and a sac material. The mixing device and the mixing device having the hardener particles capable of being mixed with the capsule material are attached. The ratio of addition of the hardener particles to the capsule material is calculated by the following formula (1). Formula (1).... ..M/mD XF/(4xdxf) In the above formula (1), Μ is the amount of addition of the hardener particles (g), melon is the amount of the capsule material added (g), and D is the powdery hardener particle. The average particle diameter (Vm)' d is the average particle diameter of the capsule material (the specific gravity of the hardener particles, and f is the specific gravity of the capsule material. In addition, the specific gravity refers to the density of each substance at a density of water at 4t of the standard substance) However, the above formula (!) is a theoretical formula, and the optimum addition ratio of the hardener particles to the capsule material is determined depending on the condition. Further, if the thermoplastic resin is added to the adhesive, the properties of the thermoplastic resin will be Increase cohesion, adhesive Significantly higher. As 151,261,612

File: TW1008(060307)CRF.doc SUNDIAL CONFIDENTIAL A highly polar thermoplastic resin is used. The thermoplastic resin not only incorporates the hardening reaction of the epoxy resin, but also the inorganic material through the decane coupling (SUaneC〇upUng). Therefore, not only the curability of the adhesive agent is increased, but also the affinity with the coated body of the inorganic material is improved. The above described objects, features, and advantages of the present invention will become more apparent from the description of the preferred embodiments of the invention. Engineering of a hardener.百先,准# A resin yarn having one or two substituents of a base or a carboxyl group, and dispersing the resin component in a solvent to form a resin solution, and then drying the lyophilized solution of the lyophilized solution , made into a powdery resin component (capsule material) (spray drying Qiu-ah method). Then, the (tetra) (4) end of the metal chelate compound is prepared to serve as a hardener particle. The symbol 31 in the first (4) diagram is the hardener particles, and the average particle diameter of the hardener particles is equal to or higher than the average particle diameter of the capsule material: 100 or more. The granules are then mixed with the curative particles 31 and the capsule material according to a predetermined addition ratio. After the mixing is carried out, the capsule material having an average particle diameter smaller than the hardener 31 is coated by electrostatic adhesion. Hardening 1261612

File:TW1008(060307)CRF.doc

SUNDIAL CONFIDENTIAL Particle 3 1 on the surface (mixed engineering). The symbol 32 in Fig. 1(b) shows the capsule material in this state.

A 'hardener particle ^ 3 1 I is coated on the surface of 31 with a plurality of capsule materials 32 ° · The hardener particles 静电 having the electrostatically attached capsule material 32 on the surface are placed on the surface of the stirring device hardener particles 31 The capsule material 32 melts and melts the capsule material 32 by colliding with the capsule material 32 on the surface of the other curable particles 31, or by twisting the fan blade, the inner wall, etc. of the device φ. The capsule material 32 becomes integrated (stirring work). At this time, the melted capsule material 32 comes into contact with the surface of the curable particles 31, and the substituent in the resin component constituting the capsule material 32 is bonded to the metal chelate compound on the surface portion of the curable particles 31. The symbol 33 of Fig. 1(c) shows the capsule formed by the integration of the capsule material 32. The capsule 33 covers the entire surface of the hardener particles 3, and the hardener particles 31 and the capsule 33 constitute a latent hardener: 30 〇: The reaction of the substituent of the resin component of the capsule material 32 with the metal chelate Will continue after contact, but will form the potential of the capsule 33 in the state of 17 1261612

File:TW1008(060307)CRF.doc

SUNDIAL CONFIDENTIAL is added to the sclerosing agent 3 埶 to make the reaction between the 苴 1 , , and 6 substituents and the metal chelate compound more rapid. Next, the manufacturing process of the above-described latent agent of the present invention prepared by the above-mentioned latent hardener 3 and the use of the adhesive of the present invention will be explained. The epoxy resin, the thermoplastic resin, the squeezing coupling (Silane Coupling) agent, the latent curing agent 3, the conductive particles, and the solvent described above are mixed and stirred at a predetermined addition ratio, respectively. Agent. In this state, the adhesive is paste-like. The capsule 33 of the latent hardener 30 has a high mechanical strength, so that the capsule 33 is not damaged during the stirring process. The symbol 21 of Fig. 20) shows a peeling film. The above-mentioned adhesive agent is applied to the surface of the release film 21 in a certain amount, and after drying, the core agent in mJ is volatilized to form a coating layer of the adhesive (Fig. The pay mark 2 of Fig. 2(b) shows an adhesive film in which a coating layer of 25-like impurities is formed. Symbol 27 of the figure shows the conductive particles in the adhesive along with the latent curing agent 3q. In this state, the curable particles 31 of the latent hardener 30 are enclosed in the capsule 33, and the hardenable particles 3 are not coupled with the decane in the adhesive constituting the coating layer 25 18 1261612

File;TW1008(060307)CRF.doc

The SUNDIAL CONFIDENTIAL (SU_ Couplmg) agent is in contact with and does not harden with the coating layer μ at normal temperature. The symbol u in the third figure (4) shows LCd, and lcdii forms a narrow, multi-sized (μ magnetic tm oxide) electrode 13 on the surface of the glass substrate 12 and the glass substrate 12. This figure shows five strips of ιτ〇 electrode i3. On the surface of the LCD 11 where the no-electrode 13 is formed, the Tcp portion to be described later is connected to the coating layer 25 (bursting) of the film 2A shown in Fig. 2(8). Since the adhesion between the release film 21 and the coating layer 25 is smaller than that between the coating layer 25 and the ITO electrode 13, the coating layer 25 remains on the LCD 11 after the release film 21 is peeled off (3 (c )))). The symbol 15 in Fig. 5 shows TCP. The generation (1) has an elongated base film 16, and on one surface of the base film 16, a narrow metal wiring 17 is arranged along the longitudinal direction of the base film 16 (here, five metal wirings are shown here) _ . The ends of the metal wires 17 in the longitudinal direction are respectively located at the ends in the longitudinal direction of the base film 16. Fig. 3(d) is a cross-sectional view taken along line AA of Fig. 5, on the side on the side where the TCP15 metal wiring 17 is disposed, facing the LCD11IT0: the electrode 13, the one end of the TCP 15 and the no electrode 13 The cloth layer 25 is opposed to each other, and the ITO electrode 13 of the LCD 11 and the metal wiring 17 of the TCP 15 are opposed to each other. 19 1261612

FileiTW 1008 (060307) CRF.doc

SUNDIAL CONFIDENTIAL In this state, the surface on which the metal wiring 17 of the TCP 15 is placed is pressed against the coating layer 25, and the portion where TC pi 5 and L c D ii overlap is pressed together, and then the whole is heated, so that The coating layer 25 is softened because the pressed metal wiring 17 presses and retreats the softened coating layer 25, and the conductive particles 27 in the remaining coating layer 25 are sandwiched between the metal wiring 17 and the ITO electrode 13. Between (Fig. 4(e)). In this case, if the heating and pressing are continued, the hardener particles 91 will thermally expand and the capsule 33 will be broken. When the capsule 33 is broken, the hardener particles 31 are mixed with the epoxy branch and the silane coupling agent in the coating layer 25, and the aluminum chelate constituting the hardener particles 31 is coupled with decane (Silane Coupling). Upon reaction, the cations in the coating layer 25 are released. This cation causes the epoxy to proceed (cation overlap). The metal wiring 17 and the It0 electrode 13 sandwich the conductive particles 27, and the coating layer 25 is hardened in this state. (Fig. 4(f)) The payout 1 〇 of Fig. 4(f) shows the electrical equipment in which the coating layer μ is in a hardened state. The electrical device 10 not only has its metal wiring 17 and its electric current: the pole 13 continues to be connected through the conductive particles 27, and the tCP 15 also hardens the coating layer 25 to form a mechanical connection, as shown in FIG. . 20 1261612

SUNDIAL CONFIDENTIAL

File: TW1008 (060307) CRF.doc In this way, the adhesive of the present invention not only has excellent preservability, but also hardens the epoxy resin due to the overlapping of cations, and can be cooled at a lower temperature and a shorter time than the conventional hardener. Allow the adhesive to harden. [Examples] A resin component made of polyvinyl alcohol (p〇lyvinyl alc〇h〇p pVA) (trade name "PVA2〇5" manufactured by Kura Co., Ltd.) was used. After the weight is dissolved, it is made into a resin component of 1 〇 weight / water / liquid. Then, the resin component 1% by weight of water is easily sprayed from the nozzle into nitrogen gas (temperature 160%), and dried to obtain a powdery capsule material 32 (average particle diameter of 0 8 / z (spray drying method) A fine powder of a metal chelate-aluminum chelate compound (Alumiun Tris etactate manufactured by Kawasaki Seiko Chemical Co., Ltd.) and a fine powder of a metal Aich〇late were prepared for each of the hardener particles 31 (Kawasei refining and drying) Alumium Isopropylate manufactured by Division A. In addition, the average particle diameter of the two kinds of hardener particles 31 is 5 / zm. Therefore, the ratio of the average particle diameter of the hardener particles 31 to the average particle diameter of the capsule material 32 is 5. : 〇 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 胶囊 胶囊 胶囊 胶囊 胶囊 胶囊 胶囊 胶囊 胶囊 胶囊 胶囊 胶囊 胶囊 胶囊 胶囊 胶囊 胶囊 胶囊 胶囊 胶囊 胶囊 胶囊To the hardener particles 31 21 1261612

FIle: TW1008 (060307) CRF.doc SUNDIAL CONFIDENTIAL After the surface, the mixture is stirred at a speed of 162 rpm (peripheral speed l〇〇m / sec) and a processing time of 5 minutes to form a capsule 33, and two kinds of potentials are obtained. After the hardener 30, these latent hardeners were heated at 4 (rc, 48 hours). These two latent hardeners 30, Phen〇Xy resin of thermoplastic resin (Phenoxy Associates, Inc.) Bisphenol A type epoxy resin (manufactured by the company, manufactured by Oily Shell Epoxy Co., Ltd., trade name "Ep828") and Silane Coupling agent (manufactured by the company, trade name "PKHH") and thermosetting resin (Silane Coupling) (manufactured by the company, product name "A-187") and conductive particles are added in the ratio shown in the following table to form two kinds of woven adhesives, and these adhesives are on the second (a). In the work of Fig. 2(b), the adhesive film 2 of Examples 1 and 2 was produced. [Table 1] Table 1: Composition of the adhesive of the adhesive Example 1 Example 2 Comparative Example 1 Comparative Example 2 Phenoxy resin 50 50 ' —-----^, 50 50 Bisphenol A-ring 50 50 50 resin latent curing 1--221261612

File:TW1008(060307)CRP.doc SUNDIAL CONFIDENTIAL Agent A 1 Potential Hardener B Alumium Tris Acetactate 1 Alumium Isopropylate 1 Silane Coupling Agent 1 1 1 1 Conductive Particles 5 5 5 5

* Potential hardener A : Alumium Tris Acetacetate + sac * Potential hardener B · Alumiun Isopropylate + capsule 氺 Each value in the above table is expressed by weight. Further, Tables 1 and 2 of the above Table 1 are examples in which two kinds of hardener particles of Examples 1 and 2 were used, and an adhesive was added without forming a capsule. Using the adhesive films 20 of Examples 1 and 2 and Comparative Examples 1 and 2, the following "room temperature storage test" and "40 ° C storage test" were carried out. [Room-temperature storage test] Using the adhesive films 20 of Examples 1 and 2 and Comparative Examples 1 and 2, the above-mentioned 3(a) to 3(d), 4(e), 4(f) Engineering, on TCP15 23 1261612 File:TWl〇〇8(〇6〇3〇7)CRF.doc

SUNDIAL CONFlDENTiAL After connecting to LCD11, the lcd11 degree (initial peel strength) was measured. The peeling strength at the time of peeling off the TCP 1 5 was also carried out by using the film of the second embodiment and the film 20 of the comparative example 2 at room temperature (25 〇, respectively, the next day, the third day, the seventh day, and the use of each after storage. Next, the film 2G was connected to the TCP 15 and the LCD 11 in the same manner as described above, and then the peel strength (peeling strength after storage) at the time of peeling off the TCP 15 on the LCD 11 was measured.

[40 ° C preservation test] This test was carried out except that the storage temperature of the adhesive film 20 was adjusted from room temperature to 40 C, and the film 20 was stored under the same conditions as in the "room temperature storage test" of the reference, and the TCP 15 was connected to the LCD 11 After the measurement, the peeling strength after storage is 0. In the above-mentioned "room storage test" and "4 (rc storage test), if the peel strength after storage is 90% or more of the initial peel strength, "◎" is drawn, and 80% or more is 90. % below "昼", 70% or more and 8〇% of the book "△", 70% or less and "X" for evaluation. The evaluation results are shown in Table 2 below. [Table 2] Table 2: Results of the evaluation test 24 1261612

File:TW1008(060307)CRF.doc

SUNDIAL CONFIDENTIAL Storage at room temperature 40 ° C Storage 1曰3曰7曰1曰Ο Θ 1 7曰 Example 1 ◎ ◎ ◎ ◎ ◎ ◎ Example 2 ◎ ◎ ◎ ◎ ◎ 〇 Comparative Example 1 Δ XXXX Comparative Example 2 — ^ — — — — * A: The adhesive hardens during the manufacturing process of the adhesive film. In addition, the TCP 15 is arranged with a metal wiring at intervals of 25 " m, and the LCD 11 is a surface area. The resistance per icm2 is formed by the electrode 13, and a load of 3 MPa is added to the portion where the dicule (7) and the LCD 11 overlap. After heating for 1 second, the temperature of the coating layer 25 was raised to 130 ° C and then connected. As can be seen from the above Tables 1 and 2, in the examples 1 and 2 in which the hardener particles 31 were enclosed in the capsule 33, the evaluation results of the "room temperature storage test" and the "40 ° C storage test" were very high. It was confirmed that the adhesive using the latent curing agent of the present invention has excellent preservation properties. On the other hand, in Comparative Examples 1 and 2 in which the curing agent particles were not sealed in the capsule, the results of the evaluation of the test were reduced as compared with the example and the second embodiment. In particular, the higher reactivity _ Akh〇i攸 (Alumiumlsopropylate) of Comparative Example 2, which is in the adhesive and the connection 25 1261612

File.TW 1008(060307)CRF.doc

In the manufacturing process of the SUNDIAL·CONFIDENTIAL film, the overlap reaction of the epoxy resin occurs, and the adhesive becomes too high to form the adhesive film itself. The case where the adhesive film is produced using an adhesive has been described above, but the use of the present invention is not limited thereto, and for example, the adhesive may be used directly in the form of a paste. The symbol 丨丨 of Fig. 6(a) is the same as that shown in Fig. 3(a), and is an LCD. When the LCD 11 is connected to 1〇315, it is first to be on the surface of the ITO electrode 13 of The portion to which Tcpi5 is connected is applied with an adhesive to form a coating layer 45 of an adhesive (Fig. 6(b)). Then, after entering the alignment position of rtcp15 in the above figure (d), 'in the above 4(e), 4(f), the connection of TCP15 and LCD11, the electrical equipment 4 can be obtained. 〇 (Fig. 6(c)). Although the use of the adhesive to connect the TCP 15 to the LCD 11 has been described above, the use of the present invention is not limited thereto, and various electrical devices can be used for the connection between the substrate and the semiconductor wafer. Each of the conductive particles 27 which can use the adhesive of the present invention can be used. In the above, the conductive particles are dispersed in the adhesive t. However, the use of the present invention is not limited thereto. For example, an adhesive containing no conductive particles is also included in the scope of the present invention. 26 1261612

File: TWl008(060307)CRF.doc sundial confidential Metal chelate compound can use various metal chelate compounds such as zirconium chelate, titanium chelate, and aluminum chelate. Among them, it is best to use the most reactive Things. The case where polyvinyl alcohol is used as the resin component has been described above. The scope of use of the present invention is not limited thereto, and any one having a substituent capable of reacting with a metal chelate compound or a metal Alcholate can be used as long as it is. For example, a resin such as a phenate resin, a urethane resin, a polyester resin or the like can be used. After the formation of the capsule 33, if the latent curing agent 3 is to be heated, the heating temperature is not limited to 40. (: When the heating temperature is too high, the capsule 33 is destroyed, so the heating temperature is preferably below the glass transition temperature of the resin component. The thermosetting resin is in addition to the epoxy resin, the urea resin, the melamine (melamin) resin, phenol resin, vinyl ether (vinyk ether) resin, Oxetane resin, and the like, but it is preferable to use an epoxy resin in consideration of the strength of the adhesive after hardening, etc. Further, the present invention employs For the silane coupling (Silane cQupling), it is preferable to use the substance shown by the following formula (6). [Chemical 3] X2 27 1261612

File:TW1008(060307)CRF.doc SUNDIAL CONFIDENTIAL X1——Si-X3 ......General formula (6) / (In the above general formula (6), at least one substituent in the substituents X1 to X4 is an alkane Alkoxy. The alkoxy group is preferably a methoxy group (Methoxy) or an ethoxy group (Ethoxy). Further, among the substituents X1 to X4 other than the ::oxy group, it is preferred to have at least A substituent is epoxy or vinyl, especially preferably a Glycidil group having an epoxy substituent. For example, a metal group having a vinyl group is, for example, a Metacryloxipropil group. Further, the substituents X1 to X4 are all composed of an Alchoxy group, the so-called Shi Xi. Silicate is also available.) Thermoplastic resins other than Phenoxy resin, such as polyethylene resin, urinary resin, Polyvinyl acetale, Ethylene vinyle Acetate,

Rubber such as Polybutatien rubber can also be used. In the adhesive of the present invention, not only the adhesiveness of the adhesive is high, but also the substituent of the resin component constituting the capsule on the surface of the hardener particle is bonded to the main component metal chelate of the curable particle. Therefore, the mechanical strength of the capsule is high, and the physical impact resistance of the latent hardener is also high. In view of the above, the present invention has been described above in terms of a preferred embodiment, and is not intended to limit the invention, and various modifications may be made without departing from the spirit and scope of the invention. And the scope of the present invention is defined by the scope of the appended claims. 28 1261612

File: TW1008 (060307) CRF.doc SUNDIAL CONFIDENTIAL [Simplified Schematic Description] Figs. 1(a) to 1(c) are diagrams for explaining an example of a latent hardener manufacturing process of the present invention. Figs. 2(a) and 2(b) are drawings for explaining an example of the construction of the adhesive film using the adhesive of the present invention. Figures 3(a) to 3(d) are drawings for the first half of the description of the bonding of the LCD and the TCP using the adhesive of the present invention. · Figures 4(e) and 4(f) are diagrams for the half-engineering of TCP and LCD. Figure 5 is a plan view showing the state of the TCP and LCD in an aligned position. Figs. 6(a) to 6(c) are explanatory views of other examples of bonding work using the adhesive of the present invention. 0 Figures 7(a) to 7(c) are illustrations of the first half of the process of bonding LCD and TCP using an adhesive of conventional technology. Schematic description 20, 45: adhesive (coating layer) 30: latent hardener 31: hardener particles 29

126 1 6 |i^TW1〇〇8(〇6〇3〇7)CRF.doc SUNDIAL CONFIDENTIAL 32 :Capsule Material 33 :Capsules

30

Claims (1)

I2*616|g:TWi008(060307)CRF.doc SUNDIAL CONFIDENTIAL Patent Application L, a latent hardener, comprising - hardener particles and a capsule covering the surface of the hardener particles, the hardener particles And having one or one of a metal chelate compound and a metal alkoxide (Alcoholate), the capsule has a resin component and has a base group a substituent of one or both of (1) and carb〇xyl, on the surface of the hardener particle, a substituent in the resin component, and a metal chelate and the metal The alkoxide (A-e) is a combination of two or a combination thereof. The latent hardener according to the invention of claim 2, wherein the main component of the metal chelate is an aluminum chelate. The latent hardener according to the invention of claim 2, wherein the main component of the metal alkoxide (Alcoholate) is aluminum Alc〇h〇late. 4. The latent hardener as described in the scope of claim The main component of the tree stagnation injury is polyethylene glycol (p〇lyVinyl alc〇h〇i, 乂8). 5. A method for producing a latent hardener, the latent hardener has one a hardener particle and a capsule covering the surface of the hardener particle, the method comprising: 31 SUNDIAL CONFIDENTIAL preparing a capsule material having a resin component having a lipid component having a hydroxyl group and a carboxyl group, the tree Or a substituent for both The capsule material is in the form of a powder, and the average particle diameter of the gum (10) material is smaller than the average particle diameter of the hardener particles; and the capsule is formed on the surface of the hardener particle, and the winning capsule is attached to the hardener This is accomplished by adhering the capsule material to the surface of the particle and then melting the capsule material. 6. The method of producing a latent hardener according to claim 5, wherein the step of forming the capsule comprises: combining the hardener particles with the capsule # to adhere the surface of the hardener particle The capsule material; The capsule material is applied in a state where the capsule material is adhered to the surface of the hardener particles, and the capsule material is transferred to form the capsule. The method for producing a latent hardener according to the fifth or sixth aspect of the invention, wherein the ratio of the average particle diameter of the hardener particles to the average particle diameter of the capsule material is 100:8 (). The method for producing a latent hardener according to the fifth or sixth aspect of the invention, wherein the ratio of the average particle diameter of the hardener particles to the average particle diameter of the capsule material is 100:50. The method for producing a latent hardener according to claim 5, wherein the capsule is to be combined with the hardener after the capsule is formed. The particles are heated together. 10. An adhesive comprising a thermosetting resin, a silane coupling agent, and a latent hardener as described in any one of claims 1 to 4. 33