1254998 九、發明說明： 【發明所屬之技術領域】 本發明是有關於-種封裝件及其封裝方法 一種利用電連接㈣的封裝件及其 j疋扎 【先前技術】 Γ圖、15傳統上，利用晶片花架（仏“_，或稱 釘線条）作為载具的封裝件丨， - Μ p ， 晶片花架11、—锃曰 方；日日片化架上的第—晶粒12 日曰 裝膠體14。 电連接線13，及一封 1晶片花架U具有—供第-晶粒12銲黏的晶墊⑴、及 間隔地環設於晶墊111周圍的電性接腳112。 第一晶粒12具有一表面、一 佈設於相反方；該表面的底面、— H玄表面與底面之間的積體電路 面上的銲墊121，每 數佈故於該表 ^ ^ 對應地與積體電路電連接。 中之：：：13的—端對應地輝連在第-晶粒12宜 腳112: ，相反的另—端銲連在其中之-電性接 腳112上，而使得第一晶粒12與 “生接 電連接線13對應地電連接。 包 腳112猎該些 封裝包覆晶塾U1、第_“12、 ，且立β八Ur 4 Φ A* I連接線1 3 且^地包覆母—電性接腳112，並使得每 1 1 2相堂;f请雜a亂η， 电丨生接腳 相對心_⑴的部分區域裸露在 製程中，利用每一帝w 可在後續的 h— "12裸露的部分對應地與-電+ 使:壯一電路板（圖未示出）相電連接並連結固定，進而 、衣件藉封裝於内的晶粒發揮其預定的電功能。 998 田然’也有在晶墊⑴上連結第 或更多晶教而脂：— 拉（圖未示出）， 而將之封裝整合以發揮多數 裝件H i _運算功能的封 。 表其基本構造大致相似，在此不另加說明 上述封料丨，大致是先將第— 架11之晶墊U ^ 在干晶於晶片花 呈η上的預定位置，接著以打 數電連接線13分別電連接第一晶粒12，將複 後進行灌桓彡 /、毛丨生接腳112，然 成封裝膠體Η，將第一晶粒 電連接線13宗敕4莘 2日日墊111、 使得每―性^包後’並部分地包覆每—電性接腳112, 屯性接_ 112相對遠離晶墊ηι 外，接菩| ^ _ 曰]^ 7刀&域裸露在 進行例如整/切腳；蓋印、整、 測等等，完成整個封裝過程。 ”又 觀檢 ，必封裝方式製備封裝如圖1所示的封裝件1時 降低，^ Ύ而由於打線機台昂貴，使得設備成本很難 而提向後利；同時也由於製程時間即是成本，以 、商入用“、°本身製程能力的限制，所以此等打線機台並不 打、、袭佈局極為複雜、且打線連接極為耗時的高引 腳數晶粒的打線連接過程。 子物屬導電物作為電路佈局’並配合高分 、Μ A ♦ 早纟或多層式結構的電連接板，具有價格便宜 利：：電路佈局簡單、方便等優點，因此，如何發展引人 制。I 接板取代打線、佈線的電連接型態，以降低生產 ’矛成本’是業界新的發展、研究的方向之一。 1254998 【發明内容】 因此’本發明之目的，即在提供—種封 方法，利用電連接板進行封裝以取代傳^封裝 ，以降低生產製程成本。 衣的打線製程 於是，本發明—種封裝件，包含—〜口 接板，及一晶粒單元。 化木、一電連 該晶片花架具有複數相間隔的電性接腳。 該電連接板可選擇地對應與該複數 並連結固定。 安腳相％連接 粒：元广應地與該電連接板電連接並連結固定。 。 #明-種封裝件的封裝方法，包含以下步驟 a對應-晶粒單元與_待鲜晶該晶粒 架的複數電性接腳位置，備製—電連接板。 日日 …粒單7L對應地電連接並連接固定於該電連 接板上。 (C)將該步驟（b)完成的 每該晶片花架的複數電性接腳相 【實施方式】 製品，以該電連接板對應地 電連接並連結固定。 有關本發明之前 以下配合參考圖式之 清楚的呈現。 述及其他技術内容、特點與功效，在 二個較佳實施例的詳細說明中，將可 在本發明被詳細指诚$ 4 細迷之則，要注意的是，在以下的況 明内容中，類似的元件e 千疋以相同的編號來表示。 1254998 苓閱圖2，本發明-種封裝件的一第 以如圖3所示之封裝方法所;::成了實施例’是 品的電路板上（圖未电連接於電子產 封裘件2包含-晶粒單元曰片產:：使用需求。 曰粒Λ 2、㈣電連接件23 U轉體Μ。 早7^有-第-晶粒第一晶粒12包括 、一相反於表面的麻而 表面 底一佈設於表面與底面之間的積體 毛路，及複數佈設於表面上的料ΐ2ι，每 ^ 地與積體電路電連接。 上 對應 晶片花架U,具有複數間隔地佈設的電性接腳112。 亩巴緣物爽設 ¥包材枓為例說明。在 牡偁化上，電連接板21具有一第 晶層 211、一每 層或==:，=料：…^ 導電材料為…：j圖示中僅以 晶層211、一第二銲晶層212 ，-一 夾設於第一、二銲晶層 之間的電路佈局⑴、-銲晶琿214，及—設置灰 弟Ϊ輝晶層212上的連接蟑215，第-、二薛晶層211、21 以南分子絕緣物為材料形成，電路佈局213、214、 連接蟑215則是以導電材料如銅、銘、錫或其合金為材舉 形成’鲜曰曰埠214包括-設置於第-銲晶層211上且對應仂 於連接珲215上方的第—銲晶區216,銲晶淳m與連制 215彼此對應地與電路佈局213相電連結。 “ ^連’、°件23分別以低毅或是無錯導電材料形成球 狀’以符合國際環保對無鉛製程之要求規範，並整齊間隔 地佈。又方、电連接板21的第一鋒晶區2 i 6上且與之對應電達 1254998 接，第-晶粒12之複數銲墊121分別對應地與該也 :相電連接並連接固定，使第—晶· 12之積體二 笔連接板2i的電路佈局213對應地電連接。= 連接件23也因外形而被稱g 等電 高叫 ㈣錫塊（順心叫）或踢球（ 電連接板21的連接埠215與晶片花年丨 接請彼此對應地藉錫膏22相電連接並連結固 、粒&電連接板21、晶片花架⑴對應地形成電= 封裝膠體14包覆晶粒單元之第—s 2卜複數電連接件23，以 ^ 、電連接板 π曰U 4 士 匕後日日片化架11，，並# 广“ U’之每一電性接腳112相對 …端部裸露，進而可電連接並固定連結於電°= 电路板上（圖未示出），而發揮封裝件 的運算功能。 f 了衣之日日粒早兀 上述的封裝件2，在配合 ，當可更清楚的明白。 斤不崎方法說明後 ，是圖封裝製備如圖2所示之封裝件2的封裝方法 片ί苹^了的=31 ’對應於_的晶粒單元與待輝晶晶 接著進广 112佈局，製備電連接板21。 接者進仃步驟32， 接板2\之銲晶埠川的第-銲晶區2^件23佈設於電連 然後進行步驟33 〇 —— 電連接板2i定位 ，\兀勺弟一晶粒12精石崔相對 *干121對應抵接觸電連接件23後 1254998 二熱：機將銲墊121、電連接件23與第一銲晶區216相 上:固疋亚電連接，使第-晶粒12相對固連於電連接板2ι 再進仃步驟34 ’在晶片花架U’每一電性接腳】 與電連接板21連結的部分塗置錫膏22。 ' 接者進行步驟35，精確相對定位電連接板2ι盘s 架U，，使電連接板21的連接槔215對應與每—待 =接^112抵接後，以熱壓方式使連接瑋US與電性接腳 错錫T 22對應地電連接並固定連結。 最後進行步，驟36，灌模形成封裝膠體14，使封裝膠體 广覆第-晶粒12、電連接板21、複數電連接件23,以 及部分地包覆晶片花架u，，並使得晶片花架u，之每— =聊m相對遠離連結有電連接板21的端部裸露，^ 封衣件2主要的封裝製備。 ，當然，熟悉封裝的技藝人士皆知，一般在實際生產中 二封裳過程尚包含有例如整編卩、外觀檢測 :印、電鑛·.等等步驟，但由於此些步驟並非本發明重1 斤 在’故在此不多加贅述。 此外，要特別加以㈣的是，事實上將電連接件2 :於電連接板21上，再將第—隸12之料12]、電 j將“接件23直接佈設於第—隸12的銲墊⑵上， ^位後再以熱風機將電連接板21之第-輝晶@ 216與第一 曰曰叔12措該些電連接件23相連結固定並電連接實施；且 10 1254998 ^電:!可以改為塗置在電連接板21之物215上預 過程兒_ 1]2對應連結的部分，#繼續進行後續的步驟 #此等實施細節’需視整體實施而微調變化，且 〜了本發明創作重點，故諒可不多加贅述。 二較佳:二明一種封裝有複數晶粒的封裝件的-第 雷同^ 述封裝件2相似，封裝過程也大致 〇 ，、不同處僅在於本例所說明的封裝件2，，苴s 元更包含一笫-曰4 ，、日日粒早 人— 日日粒以，且電連接板21，的銲晶蟑214，更包 二鋒晶層212上且被連接蟑215環圍其中的 乐—却日日區217，第-曰4vr + 連”第-… 電連接件23電連接並固定 ί、、°於弟―1于晶區217上，而使封裝件可以整合第_、二 =12'24的運算功能’而發揮更強大的處理效能，由於 是::：構件均與第一實施例所述類似，且封裝方法亦僅 :°一顆晶粒的對應定位連結，在此不再多加費述。 粒單元可以包含更多的晶粒 封裝件具有更乡的運算功能 彳衣後的 缢仆，僅移/狀干^ 、此寺構造與封裝方法的 實質一二t : 電路佈局、銲晶蟑與連接槔的 位置不同而已，在此不再――舉;^ 連接板的次數與定位 由上述說明可知，本發明封裝件2、 、 主要是應用電連接板21、21，具有 ::：：法’ 213簡單、方便的優點，而可預先對應二=路佈局 粒單元以及待銲晶的晶片花架 ^而、衣正合的晶 與鲜晶埠2H、214，的電連接板2ι’衣備出具有連接蜂出 1 ，再將晶粒單元與 1254998 日日片化架11，分別對呢界电逑接 ,. 板21、21 ’電連接並固定：；鱼 、、、口，進而可直接進行後續灌模 連 ^ ^ ^ $成封裝膠體14等過程，而 封牧元成一完整的封裝件2、1254998 IX. Description of the Invention: [Technical Field] The present invention relates to a package and a method of packaging the same, and a package using the electrical connection (4) and its prior art [Fig. 15] Using the wafer holder (仏"_, or the nail line" as the package of the carrier, - Μ p , wafer holder 11, 锃曰 ;; the first granule on the day slab The colloid 14. The electrical connection line 13, and a 1-wafer holder U have a pad (1) for bonding the first die 12 and an electrical pin 112 spaced around the pad 111. The granule 12 has a surface, and is disposed on the opposite side; the bottom surface of the surface, the pad 121 on the integrated circuit surface between the H-shaped surface and the bottom surface, each of which is corresponding to the table and the integrated body The circuit is electrically connected. The middle end of:::13 is correspondingly connected to the first die 112, and the opposite other end is soldered to the electrical pin 112, so that the first The die 12 is electrically connected to the "electric connection wire 13". The package foot 112 hunts the package-coated wafer U1, the first _"12, and the vertical β-Ur 4 Φ A* I connection line 1 3 and covers the mother-electricity pin 112, and makes each 1 1 2 phase church; f please a chaotic η, electric twins pin relative to the heart _ (1) part of the area exposed in the process, using each emperor w can be in the subsequent h- "12 bare part corresponding to - Electric + makes: Zhuangyi circuit board (not shown) is electrically connected and fixed, and the fabric is then subjected to its predetermined electrical function by the packaged crystal. 998 Tianran' also has a connection on the crystal pad (1) The first or more crystals are greased: - pulled (not shown), and the package is integrated to perform the sealing of most of the H i _ computing functions. The basic structure of the table is roughly similar, and the above description is not further described here. The sealing material 大致 is generally obtained by firstly placing the crystal pad U ^ of the first frame 11 at a predetermined position on the wafer flower η, and then electrically connecting the first die 12 with the electrical connection line 13 respectively. Carrying the filling/and the hairpin 112, and then forming the encapsulating colloid, the first die electrical connection line 13 is 敕4莘2 day mat 111, so that each of the packages After 'and partially covering each of the electrical pins 112, the 接 接 _ 112 is relatively far from the crystal pad ηι, and the 菩 | | ^ _ 曰 ^ ^ 7 刀 域 域 域 域 域 域 域 域 域 域 域 域 域 域 域 域 域 域 域 域 域 域Printing, finishing, testing, etc., complete the entire packaging process. "Inspection, the package must be packaged as shown in Figure 1 when the package 1 is reduced, ^ Ύ and because the wire machine is expensive, making equipment costs difficult At the same time, because the process time is the cost, and the commercial use of ", ° its own process capacity limit, so these wire machine is not hit, the layout is extremely complicated, and the connection is extremely time-consuming. High pin count die bonding process. Sub-materials are used as circuit layouts and are equipped with high-scoring, Μ A ♦ early or multi-layer structure of electrical connection boards, which are cheap and profitable:: circuit layout is simple and convenient Such advantages, therefore, how to develop the introduction of people. I replace the wire connection, wiring electrical connection type, to reduce the production of 'spear cost' is one of the new development and research direction of the industry. 1254998 [Summary] Therefore Purpose of the invention That is to say, in the method of providing a sealing method, the electrical connecting board is used for packaging instead of the packaging, so as to reduce the cost of the production process. The wire bonding process of the invention, the invention, the package, comprises a ~ port plate, and a die The unit has a plurality of electrically spaced pins that are spaced apart from each other. The electrical connecting plate is selectively connectable and fixed to the plurality. The foot unit is connected to the grain: Yuan Guang Ying and the electricity The connection board is electrically connected and fixed. The method of encapsulating the package includes the following steps: corresponding to a-die unit and the position of the plurality of electrical pins of the die holder, ready-to-wire connection The slabs 7L are electrically connected and fixed to the electrical connection board. (C) The plurality of electrical pin phases of each wafer holder completed in the step (b). [Embodiment] The article is electrically connected and fixed by the electrical connection plate. Prior to the present invention, the following is a clear representation of the reference drawings. Having described other technical contents, features, and effects, in the detailed description of the two preferred embodiments, it will be described in detail in the present invention. It should be noted that in the following descriptions. Similar elements e are denoted by the same number. 1254998 Referring to FIG. 2, a package of the present invention is shown in FIG. 3; and is formed on the circuit board of the embodiment of the present invention (the figure is not electrically connected to the electronic package) 2 Inclusion-grain unit 曰 film production:: use requirements. 曰 Λ 2, (4) electrical connection 23 U 转 Μ. Early 7^ have - first-grain first grain 12 includes, one opposite to the surface The upper surface of the surface is disposed between the surface and the bottom surface of the integrated body, and the plurality of materials 布2ι disposed on the surface are electrically connected to the integrated circuit. The upper corresponding wafer holder U is disposed at a plurality of intervals. The electrical pin 112. The mu-bar edge material is provided as an example. In the oysterization, the electrical connection plate 21 has a crystal layer 211, a layer or a ==:, = material: ...^ The conductive material is a circuit layer (1), a solder wafer 214, and a layer 211, a second solder layer 212, and a sandwich between the first and second solder layers. A connection 蟑215 is provided on the gray layer 222, and the first and second spheroidal layers 211 and 21 are formed of a south molecular insulator, and the circuit layouts 213 and 214 and the connection 215 are The conductive material such as copper, indium, tin or an alloy thereof is formed to form a 'salt 214 comprising: a first solder crystal region 216 disposed on the first solder layer 211 and corresponding to the solder germanium 215, soldered The wafer m and the connection 215 are electrically connected to the circuit layout 213 correspondingly to each other. The "^ lian" and the ° member 23 are respectively formed into a spherical shape with low or no error conductive materials to meet the requirements of the international environmental protection requirements for the lead-free process. And the cloth is arranged at regular intervals, and the first frontal crystal region 2 i 6 of the electrical connection plate 21 is connected to the corresponding electric power of 1254998, and the plurality of pads 121 of the first die 12 are correspondingly corresponding thereto: The phases are electrically connected and fixed to each other so that the circuit layout 213 of the integrated wiring plate 2i of the first crystal 12 is electrically connected correspondingly. The connector 23 is also called the g-electric high-pitched (four) tin block due to the shape. Calling or kicking the ball (the connection port 215 of the electrical connection board 21 and the wafer flower are connected to each other by the solder paste 22 and electrically connected to the solid, grain & electrical connection board 21, and the wafer flower stand (1) correspondingly forms electricity. = the encapsulant 14 covers the first part of the die unit - s 2 - the plurality of electrical connectors 23, to ^, the electrical connection plate曰U 4 匕 匕 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日Show), and play the computing function of the package. f The day of the clothing is as early as the above-mentioned package 2, when it is matched, it can be more clearly understood. After the description of the method, the package is prepared as shown in the figure. The encapsulation method of the package 2 shown in FIG. 2 is performed by arranging the die unit corresponding to _ and the crystal grain to be etched into the width 112 to prepare the electrical connection board 21. In step 32, the second soldering pad 2 of the soldering plate 2/2 is placed on the electrical connection and then step 33 〇 - the electrical connection plate 2i is positioned, 12 fine stone Cui relative * dry 121 corresponding to contact electrical connection member 23 after 1254998 two heat: machine will be the welding pad 121, electrical connector 23 and the first solder crystal region 216: solid-state electrical connection, make the first crystal The granules 12 are relatively fixed to the electrical connection plate 2 ι and then the solder paste 22 is applied to the portion of the wafer connection frame 21 that is connected to the electrical connection plate 21 . The receiver performs step 35 to accurately position the electrical connection board 2 盘 架 U, so that the connection 槔 215 of the electrical connection board 21 corresponds to each of the waiting to be connected, and the connection 玮 US is made by hot pressing. It is electrically connected and fixedly connected to the electrical pin. Finally, in step 36, the filling mold forms the encapsulant 14 to make the encapsulant cover the first die 12, the electrical connection plate 21, the plurality of electrical connectors 23, and partially cover the wafer holder u, and make the wafer holder u, each - = talk m relatively far away from the end of the connection with the electrical connection plate 21 exposed, ^ seal 2 main package preparation. Of course, those skilled in the art of packaging are well aware. Generally, in the actual production, the process of two-story dressing includes steps such as finishing, appearance inspection, printing, electric mining, etc., but since these steps are not the invention 1 Jin is in 'so there is no more to repeat here. In addition, in particular, (4), in fact, the electrical connector 2: on the electrical connection board 21, and then the material 12 of the 12th, the electric j will be directly connected to the 12th On the soldering pad (2), after the ^ position, the first - Huijing@216 of the electrical connection board 21 is connected and fixed to the first electrical connection member 23 by a hot air blower and electrically connected; and 10 1254998 ^ Electric:! can be applied to the object 215 of the electrical connection board 21, the pre-process _ 1] 2 corresponding to the connected part, # continue with the subsequent steps # these implementation details 'subject to the overall implementation and fine-tuned changes, and ~ The focus of the creation of the present invention, forgive me can not add more details. Second preferred: two Ming-encapsulated package with a plurality of die-like package - similar to the package 2, the packaging process is also roughly ambiguous, the difference is only In the package 2 described in the present example, the 苴s element further comprises a 笫-曰4, a day-to-day granule, an early-day granule, and an electrical connection plate 21, a solder crystal 214, and a second ridge. On the layer 212 and surrounded by the connection 215, the music-day day area 217, the first-fourth 4vr + connection"--the electrical connection member 23 is electrically connected and fixed. ί,, ° Yudi -1 on the crystal area 217, so that the package can integrate the _, two = 12'24 computing function' to play a more powerful processing performance, because::: components are the first The embodiment is similar, and the encapsulation method is only: ° corresponding positioning connection of one crystal, which will not be further described here. The granule unit can contain more die-packed parts and has more computing functions. After the 彳 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The position of the connection port is different, and no longer here--the number and the positioning of the connection plate are as described above. The package 2 of the present invention is mainly applied to the electrical connection plates 21 and 21 and has the :::: method. ' 213 is simple and convenient, but can be pre-corresponding to the two-way layout of the granule unit and the wafer holder to be soldered, and the galvanized and fresh-crystal 埠 2H, 214, the electrical connection plate 2 With the connection of the bee out 1, and then the die unit and the 1254998 day chipization frame 11, respectively, the wire is connected to the boundary, the plates 21, 21 'electrically connected and fixed:; fish,, and mouth, and then directly Subsequent filling of the mold ^ ^ ^ $ into the assembly of the colloid 14 and other processes, and sealing the animal into a complete package 2
Sx3 , 而可以改善目前的封&制 矛王中，利用打線機台打線以電 扣 、衣 , 連接日日粒早元與晶片花架， 所產生的設備成本過高、I 古 、 …、*徒呵生產利潤，以及香卩 機台本身製程能力，而不適用 又限衣 ^ , 週用於打線佈局極為複雜、且 線連接極為耗時的高引腳數晶粒的缺點。 且同時，利用電連接板21、21 曰 古私一 n 連、、、口日日片化架11，時且 ·· 較南的誤i容許範圍，因而較無須考量、要求 二 之精密度I平整产，而π丨、7 JJ欠 日日 化¥ 件可以採用㈣或鄉Μ人一 再者’電連接 ' 飞…銘之付合國際環保要求規範的材料， 而滿足低鉛或是無鉛製程的要求 〃 目的。 隹貝運到本發明的創作Sx3, and can improve the current seal & spear king, using the wire machine to wire the wire to buckle, clothing, connecting the day and the grain early Yuan and wafer flower stand, the equipment cost is too high, I ancient, ..., * The production profit, as well as the processing ability of the Shannon machine itself, is not applicable and limited, and is used for the shortcomings of the high-pin-numbered die with extremely complicated layout and extremely time-consuming line connection. At the same time, the use of the electrical connection plates 21, 21, the ancient private n-connection, the mouth, the daily slab, 11, and the south of the allowable range of error, so there is no need to consider, the requirements of the second precision I Leveling production, while π丨, 7 JJ owe day-to-day purchases can be used (4) or nostalgic people repeatedly 'electrically connected' fly... Ming to meet the requirements of international environmental protection requirements, and meet the low lead or lead-free process Request for the purpose. Mussel transported to the creation of the present invention
At、惟以上所述者，僅為本發明之較佳實施例而已，者不 旎以此限定本發明實施之範 田 範圍及說明書内容所作之内單的，凡依本餐明申請專利 曰π合所作之間早的等效變化與修飾， 本發明專利涵蓋之範圍内。 仍屬 【圖式簡單說明】 圖1是一側視示意圖，說明一習知的封裝件； 圖2是—側視示意、圖，言兒明本發明—種封裝 Μ 一較佳實施例； 、弟 圖3是一流程圖，說明封裝製備如圖2所示之 的過程；及 、衣件 圖4是一側視示意圖， 說明本發明一種封裝件的一第 12 1254998 二較佳實施例。 13 1254998 【主要元件符號說明】 1 封裝件 216 第一銲晶 11 晶片4匕架 22 錫膏 111 晶墊 23 電連接件 112 電性接腳 3 1 步驟 12 第一晶粒 32 步驟 121 銲墊 33 步驟 13 電連接線 34 步驟 14 封裝膠體 35 步驟 2 封裝件 36 步驟 11， 晶片花架 2， 封裝件 112 電性接腳 21， 電連接板 21 電連接板 214’ 鲜晶谭 211 第一銲晶層 217 第二銲晶 212 第二銲晶層 24 弟 >—晶粒 213 電路佈局 214 銲晶埠 215 連接埠 14The above is only the preferred embodiment of the present invention, and is not limited to the scope of the invention and the contents of the specification. Early equivalent changes and modifications between the combinations are within the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a side elevational view showing a conventional package; FIG. 2 is a side view, a view, and a preferred embodiment of the present invention; Figure 3 is a flow chart illustrating the process of packaging as shown in Figure 2; and Figure 4 is a side elevational view of a preferred embodiment of a package of the present invention. 13 1254998 [Description of main component symbols] 1 Package 216 First solder crystal 11 Wafer 4 truss 22 Solder paste 111 Crystal pad 23 Electrical connector 112 Electrical pin 3 1 Step 12 First die 32 Step 121 Solder pad 33 Step 13 Electrical connection 34 Step 14 Package colloid 35 Step 2 Package 36 Step 11, wafer holder 2, package 112 Electrical pin 21, electrical connection plate 21 Electrical connection plate 214' Fresh crystal 211 First solder layer 217 second solder crystal 212 second solder crystal layer 24 brother> dies 213 circuit layout 214 solder wafer 215 connection 埠 14