WO2012171320A1 - A new contact smart card packaging method - Google Patents

Abstract

A contact smart card packaging method is provided, comprising the following steps: (1) using CSP (Chip Scale Package) or WLCSP (Wafer Level Chip Scale Package) techniques, processing the contact smart card chip wafer die which need to be packaged, and the thickness of the processed contact smart card chip wafer die can not be more than 0.60 mm; (2) designing and manufacturing the corresponding carrier tape or carrier sheet, according to the data of the chip size, the corresponding welding spot, etc. of the processed contact smart card chip wafer die obtained with CSP or WLCSP processing; (3) using traditional SMT (Surface mounted technology) techniques, pasting the processed contact smart card chip wafer die obtained in the step (1) on the corresponding position of the carrier tape or carrier sheet obtained in the step (2). The packaging method uses the mature SMT techniques in the pasting process, the reliability of processing is greatly improved, at the same time, the carrier tape production control requirements are more relaxed, the form of the carrier tape or the carrier sheet is more diversified (which can be flaky), therefore, the production costs are greatly reduced, reliability is greatly improved.

Description

 Description

 A new contact smart card packaging method

Technical field

 The invention relates to the field of contact smart card production, wherein the contact smart card comprises a contact part of a dual interface smart card, and the dual interface smart card means that the smart card has both a contact interface and a non-contact interface, specifically a new one. The packaging method of the contact smart card. In particular, a new production process and method used in the process of packaging contact smart card chip wafers in a smart card circuit board, which is generally referred to in the industry as a carrier tape or carrier. Background technique

 According to the existing production process, the contact smart card chip wafer (die) will package the contact smart card chip wafer (die) onto the carrier tape or carrier before packaging into a finished contact smart card, and then tape A carrier tape or carrier with contact smart card chip wafers, the back of the carrier tape or carrier is embedded into the card of the contact smart card that has been washed with the corresponding size by hot melt adhesive or other adhesive. On the base. The front side (contact surface) of the carrier tape or carrier is a large gold-plated metal surface for contact smart cards to communicate with the outside, and the back side of the carrier tape or carrier is connected to the contact smart card chip wafer (die). The circuit, the contact smart card chip wafer die (die) mounting area and the surrounding vacant area, the vacant area can be used to apply hot melt adhesive or other adhesive and embedded in the card base of the smart card.

 The process of packaging a contact smart card chip wafer (die) onto a carrier tape or carrier is generally referred to as a tape carrier package. An important requirement of the tape carrier package is that the packaged chip is in a wafer grain state. This is not a concept with the usual chip packaging in the electronics industry. Generally speaking, the chip package refers to the chip package.

There are currently two methods for carrier tape packaging of contact smart cards. One method is to use a wire bonding process to first thin the contact smart card chip wafer and then Contact smart card chip wafer dicing to obtain a number of contact smart card chip wafers, followed by die bonding or mounting, the so-called die bond is the use of a binder Or the solder bonds the back side of the contact smart card chip wafer die to the die bond, and then uses the wire bonding process, usually using a wire bond, and finally using Thermal curing or UV irradiation curing (UV) protects the contact smart card chip wafers and bonding wires. The process is as follows:

 Contact smart card chip wafer (wafer) thinning one dicing die bond - wire bond - package (UV illuminating glue to cure, thermosetting process)

 The difference between thermosetting and UV: As the name suggests, thermosetting is the curing of the protective adhesive by heating, and UV is cured by UV irradiation.

 This method currently dominates the market, with current gold costs and protection

UV glue (ultraviolet glue) costs rise, and packaging costs are also rising. Another method is called FC0S (a smart card chip packaging method patented by Infineon, Flip Chip on Substrate, on-board flip chip), which is based on flip chip technology (flip chip technology). Contact smart card chip wafers are bonded to the back side of the carrier tape by conductive paste or thermocompression bonding or thermosonic bonding.

 Flip-chip technology is not a new process. It refers to the process of connecting semiconductor chip particles directly to the carrier tape. This process begins with a useful solder joint (PAD) gold ball or other conductive bump for each contact smart card chip wafer on a contact smart card chip wafer, and then contacts The smart card chip wafer is flipped so that its solder joint (PAD) faces the carrier tape. The solder joint (PAD) on the tape carrier circuit has a one-to-one correspondence with the solder joint (PAD) position of the contact smart card chip die of the long bump, between the two (ie, the contact smart card chip wafer particle) The solder joint (PAD) between the (die) and the carrier tape can be mechanically bonded together by an anisotropic conductive adhesive.

Flip-chip technology increases the density of devices on the carrier tape and is relative to current leads Bonding technology (through gold wire connection), it is a more direct and stable electrical connection that eliminates gold wire bonding and protective glue. The main process is as follows:

 Contact smart card chip wafer (Wafer) thinning a scribe-bump and UBM (under bump metal, bump underlying metal layer) processing a flip-chip solder (hot or hot sonic, can Adding a binder) a test;

 After a long period of research and development, Infineon successfully cooperated with German smart card manufacturer Giesecke & Devrient (G&D) to launch the innovative FC0S packaging process, which is the first time to apply flip chip technology to smart card packaging. The FC0S technology encapsulates the contact smart card chip wafers (die) in a smart card module (a circuit board with a smart card chip) in a flip-chip package. The functional lining of the contact smart card chip wafer (die) is directly connected to the board by flip chip bonding, eliminating the need for traditional gold wire and protective glue (UV glue) packaging, saving the cost of packaging both. In addition, due to the elimination of metal lines in the package, this new connection technology saves module space, and it can place larger contact smart card chip wafers (die) with the same module size, enabling contact smart cards. Add more features; you can also make the contact smart card module smaller. In addition, compared to the traditional gold wire bonding technology, FCXS contact smart card has stronger mechanical stability and optical visual effects, smaller and thinner module size, stronger corrosion resistance and toughness, it uses Non-halogen materials, in line with green environmental requirements.

 The disadvantage of FC0S is that the equipment investment of the flip-chip bonding process is too high, and there are special requirements for the plating metal of the carrier tape. It is necessary to ensure that the plating metal of the circuit on the back side of the carrier tape must be soldered to the solder material on the bumps of the wafer, if the carrier tape Gold plating, its thickness must be limited to 1 2Um to limit the formation of fragile gold-tin compounds, so its overall production cost is high. Summary of the invention

 In view of the deficiencies in the prior art, the present invention aims to provide a new method for packaging a contact smart card, which aims to solve the problem of thin and small size of the package while meeting the requirements of low cost and high reliability.

In order to achieve the above object, the technical solution adopted by the present invention is: A new contact smart card packaging method is characterized in that the specific steps are as follows: Step (1) processing a contact smart card chip wafer particle to be processed to obtain a processed contact smart card chip wafer particle: the required package The contact smart card chip wafer particle 101 is provided with a plurality of original solder joints 102, and the contact smart card chip wafer particles 101 to be packaged are processed by a CSP or WLCSP process, and the original solder joint 102 is disposed correspondingly. A new solder joint 202 is added, and then the original solder joint 102 and the new solder joint 202 are connected in a corresponding manner by the internal connecting line 203, in order to increase the area of the original solder joint 102 and increase the spacing between the original solder joints 102. The gap between the solder joints 202 is at least 0.2 mm, and the diameter of the new solder joints 202 is at least 0.11. At the same time, the chip solder joint starting point identifier 204 is set on the contact smart card chip wafer particles 101 to be packaged. , obtaining processed contact smart card chip wafer particles 205;

 Step (2) Designing and processing the carrier tape or carrier to be matched with it: According to the chip size and corresponding solder joint data of the processed contact smart card chip wafer particles 205 obtained by CSP or WLCSP processing, the corresponding load is designed and produced. The tape or carrier is such that the conductive connection points of the carrier tape or carrier are identical in size and structure to the newly added solder joints 202 on the processed contact smart card chip wafer particles 205;

Step (3) attaching the processed contact smart card chip wafer particles to the carrier tape or carrier adapted thereto: the processed contact smart card chip obtained by the step (1) by using a conventional SMT chip process The particles 205 are attached to the respective positions of the carrier tape or the carrier sheet obtained in the step (2). Based on the above technical solution, the contact smart card chip wafer particles 101 that need to be packaged are obtained by dicing the wafer Wafer of the smart card chip. The thickness of the wafer 205 of the contact-type smart card chip is not higher than 0. 60 mm. On the basis of the above technical solutions, the specific processing method of the carrier tape or the carrier is as follows: (1) a double-sided copper-clad PCB substrate having a thickness of less than or equal to 0.35 mm is used. The well-known PCB production process, after etching, punching, and sinking copper to form a circuit board circuit and a contact surface, and then performing gold plating or immersion gold to form a carrier tape or carrier with a conductive connection point suitable for a contact smart card package.

 The position and size of the conductive connection points on the carrier tape or carrier are adapted to the size of the processed contact smart card chip wafer particles 205 and the new solder joints 202 generated in step (1).

 3 The solder resist is covered around the conductive connection points on the carrier tape or the carrier, on the line, and at the via points, wherein the solder resist oil is filled with the via holes on the carrier tape or the carrier. Based on the above technical solution, the carrier tape or the carrier sheet obtained in the step (2) is provided with a conductive connection point 401 corresponding to the position of the newly added solder joint 202 on the back surface thereof.

 A plurality of front surface (contact surface) metal faces 502 are formed on the front surface (contact surface) through a plurality of dividing lines 503,

 The front surface (contact surface) is provided with an internal connection line connection point 501, and the conductive connection point 401 and the internal connection line connection point 501 are connected by a carrier tape or a carrier internal connection line 403. The method for packaging the new contact smart card according to the present invention has the advantages that: the existing wire bonding process or the FC0S process has high requirements on the carrier tape or the carrier film, and no company in the country can do well, basically by France. FCI monopolizes, so the cost is also high. The invention adopts different generation methods, adopts the mature SMT patch process in the mounting process, the processing reliability is greatly improved, and the production control requirements of the carrier tape or the carrier sheet are more relaxed, and the carrier tape or the carrier tape is more relaxed. The form is more flexible (can be sheet-like), so the production cost is greatly reduced and the reliability is greatly improved. DRAWINGS

 The invention has the following figures:

 Figure 1 Contact particle array structure of smart card chip.

Figure 2 Wafer structure diagram of the processed contact smart card chip. Figure 3 is a plan view of the surface of the processed smart card chip wafer. Figure 4 Schematic diagram of the circuit structure of the carrier tape or the back of the carrier.

 Figure 5 Schematic diagram of the circuit structure of the front side (contact surface) of the carrier tape or carrier.

 Figure 6 Schematic diagram of the solder resist oil coverage of the carrier tape or carrier.

 Figure 7 shows the second example of the solder resist oil coverage of the carrier tape or carrier.

 Figure 8 Carrier or carrier via fill map.

detailed description

 The invention will be further described in detail below with reference to the accompanying drawings.

 The new contact smart card packaging method of the present invention can be applied to a carrier tape or a carrier, and can also be used for ordinary circuit board materials (and bulk materials). The method for packaging a new contact smart card according to the present invention includes at least three important steps, namely:

 The contact smart card chip wafer particles that need to be packaged are processed into contacted smart card chip wafer particles (using CSP or WLCSP process), and the design process is adapted to (refer to the processed contact smart card chip wafer particles) ( The carrier tape or carrier that can be used for the patch, and the processed contact smart card chip wafer particles are attached to the carrier tape or carrier to which it is adapted (using the SMT chip process). The CSP (Chip Scale Package) is a chip scale package; the WLCSP (Wafer Level Chip Scale Package) is a wafer level (WL) chip size package (CSP); the SMT (Surface Mounted Technology) is used for paste Sheet surface assembly technology (surface mount technology). The ISSI 55160 smart card chip of ISSI is taken as an example to describe the packaging method of the new contact smart card according to the present invention.

The ISSI55160 smart card chip shown in Figure 1 is a contact smart card chip wafer particle 101 that needs to be packaged. The contact smart card chip wafer particle 101 to be packaged is obtained by dicing the wafer wafer Wafer of the smart card chip. The packaged contact smart card chip wafer particles 101 are provided with a plurality of original solder joints 102. Encapsulating the ISSI 55160 smart card chip by using the packaging method of the present invention includes the following steps: Step (1), processing the contact smart card chip wafer particles that need to be packaged to obtain the processed contact smart card chip wafer particles:

 Using the CSP or WLCSP process, the contact smart card chip wafer particles 101 to be packaged are processed, a new solder joint 202 corresponding to the original solder joint 102 is set, and then the original solder joint 102 is used to connect the original solder joint 102, new 2mm。 The distance between the new solder joints 202 is at least 0. 2mm, the distance between the new solder joints 202 is at least 0. 2mm The solder joint 202 has a diameter of at least 0.1 匪, and at the same time, a chip solder joint starting point identifier 204 is set on the contact smart card chip wafer particle 101 to be packaged, and the processed contact smart card chip wafer granule is obtained ( Contact smart card chip wafers 205 processed by CSP or WLCSP process; as shown in FIG. 2, the number of new solder joints 202 may be more than the original solder joints 102, and the additional new solder joints 202 are not needed. The internal connection line 203 is connected;

 The thickness of the wafer 205 of the contact smart card chip after the processing is not higher than (not exceeding) 0. 60mm; Step (2) Designing and processing the carrier tape or carrier to be matched with it: The chip size of the processed contact smart card chip wafer particle 205 obtained by CSP or WLCSP processing, corresponding solder joint (refer to the new solder joint 202) Data, quantity, spacing, etc.) to design and produce the corresponding carrier tape or carrier such that the conductive connection points of the carrier tape or carrier and the new solder joints 202 on the processed contact smart card chip wafer particles 205 are The size and structure are consistent. The specific processing method of the carrier tape or the carrier is as follows:

 1 Use a double-sided copper-clad PCB substrate with a thickness less than or equal to 0.35 mm, using a well-known PCB production process, etching, punching, and sinking copper to form circuit board lines and contact surfaces, and then performing gold plating or immersion gold Forming a carrier tape or carrier with a conductive connection point suitable for a contact smart card package,

The position and size of the conductive connection points on the carrier tape or carrier are adapted to the size of the processed contact smart card chip wafer particles 205 and the new solder joints 202 generated in step (1). 3 The solder resist oil is covered around the conductive connection points on the carrier tape or the carrier, on the line, and at the via points, wherein the solder resist oil is filled with the via holes on the carrier tape or the carrier. Step (3) attaching the processed contact smart card chip wafer particles to the carrier tape or carrier adapted thereto: the processed contact smart card chip obtained by the step (1) by using a conventional SMT chip process The particles 205 are attached to the respective positions of the carrier tape or the carrier sheet obtained in the step (2). As shown in FIG. 4 and FIG. 5, the carrier tape or the carrier sheet obtained in the step (2) is provided with a conductive connection point 401 corresponding to the position of the newly added solder joint 202 on the back surface thereof, and the conductive connection point 401 and the newly added solder joint. 202 is the corresponding solder joint relationship, the size, position and size of the two must be exactly the same to ensure that the new solder joint 202 can be soldered to the position of the conductive connection point 401 using the SMT chip process, and the processed contact smart card The size of the chip wafer 205 may not exceed 0. 60mm.

 Step (2) on the carrier tape or the carrier sheet, a plurality of front surface (contact surface) metal faces 502 are formed on the front surface (contact surface) through a plurality of dividing lines 503,

 The front surface (contact surface) is provided with an internal connection line connection point 501, and the conductive connection point 401 and the internal connection line connection point 501 are connected by a carrier tape or a carrier internal connection line 403. The carrier tape or carrier internal connection line 403 is disposed on the back side of the carrier tape or carrier. The flow of the invention is illustrated by one:

 Contact smart card chip wafer (Wafer) - dicing → CSP processing → SMT patch

The flow of the present invention is illustrated as two:

Contact smart card chip wafer (Wafer) - dicing → WLCSP package → SMT patch ^→ test; The following is a schematic diagram of the second embodiment of the present invention.

One of the possible processes of the WLCSP package), the WLCSP package is taken as an example, and the present invention is further described in detail. As technology and processes advance, new packaging technologies are changing rapidly, and a new class of chip packaging technologies such as CSP (Chip Size Packaging) and WLCSP (Wafer Level Chip Sized Packaging) are now mature. . The advantages of CSP combining and flip chip technology and surface mount technology are that it has a package size close to the chip size and a thin package body. There are five main types: flexible substrate CSP, hard substrate CSP, lead frame CSP, wafer level CSP and laminated CSP. For wafer level CSP package, it is generally called WLCSP, which is different from traditional chip packaging. (First cut and then sealed, and at least 20% of the original chip is added after packaging). This latest technology is first packaged and tested on the entire wafer, and then cut into individual IC particles, so after packaging The volume is equivalent to the original size of the IC bare crystal. By using this technology, the chip size can be ultra-thin and ultra-small, which is impossible with conventional chip molding technology. The minimum thickness can be less than 0.25 mm, which is much lower than the current minimum thickness of 0.5 mm, and can effectively achieve economies of scale to reduce costs. The chip package using this technology has low cost and high yield. Reduce the characteristics of board occupancy. It has become increasingly popular on the packaging of non-smart card industry chips. But no one in the smart card industry has used it, because the traditional tape carrier packaging line does not support this production process. Due to the advantages of this package thickness, as well as the cost advantage. The present invention utilizes this technology to implement a new method for packaging a contact smart card, including the following steps: First, the contact smart card chip wafer (Wafer) is processed into a thickness of not more than 0.40 mm by the WLCSP process. Chip for patch (SMT). In this embodiment, the WLCSP processing of Changjiang Electronics Technology Co., Ltd. is selected, and the size of the single contact smart card chip wafer (wafer) on the contact smart card chip wafer (wafer) is 2013xl692um, and the single piece after processing is completed. The size of the chip (contact smart card chip wafer granule) is 2013xl692um, the specific process can be as follows: (1) The packaging process of the wafer-level CSP for making the contactor on the wafer: the wafer-secondary wiring, the thinning, the contactor, the contactor, the plating, the test, the screening, the dicing, the laser marking →SMT patch one test

 (2) The packaging process of the wafer-level CSP for making solder balls on the wafer: wafer-secondary wiring, thinning, making solder balls on the wafer, molding or encapsulating or surface coating, testing, screening Film-one laser marking→SMT patch-test

 At the same time, a carrier tape or a carrier which can be directly soldered (PAD) according to this process is designed, as shown in Figs. 1 to 5, so that the new solder joint 202 and the conductive connection point 401 are matched in size and structure. As shown in Figure 4, the WLCSP packaged chip is then soldered to the carrier tape or carrier using an automated solder placement machine that meets the requirements.

 Unlike traditional PCB boards, the carrier tape or slide described above requires some special processing, as detailed below:

 The PCB of the traditional patch is generally covered with solder resist oil except for the patch solder joint. Before the patch is used, the steel mesh is first scraped on the solder joint of the PCB board, and then the paste is pasted. The chip machine attaches the chip or other device to the corresponding position on the PCB board, and then heats the PCB board to which the chip or device is pasted by the heating furnace to melt the solder paste and connect it to the corresponding pin of the chip or device, and finally removes the heating furnace. The tin is naturally cured at room temperature to complete the patch.

 The thickness of the PCB board of the patch used in the present invention is thinner than that of the general PCB board, generally between 0.08 mm and 0.25 mm, and the area of the PCB board is large, if the conventional method is used, that is, the patch is removed. The soldering oil is covered in other places outside the solder joint. When the PCB passes through the heating furnace after the mounting, the thermal expansion and contraction coefficients of the various components of the PCB (patch solder joint, substrate, solder resist oil, etc.) are different. When the PCB board returns to normal temperature after heating, there will be a certain degree of bending and unevenness.

 The invention solves the problem that the soldering oil and the other components of the PCB board have different thermal expansion and contraction coefficients by using a method of covering the soldering oil in a small area around the solder joint of the PCB board to cause the PCB board to be heated and then returned to the normal temperature to bend, Uneven problems. The range of solder mask oil is based on the surrounding of all the solder joints:

Method 1: The area covered by these solder resist oils can be monolithic. As shown in Fig. 6, all the areas of the full protection area 604 are implemented according to the traditional circuit board solder resist oil process, and the solder resist oil is butt welded. Points, lines, and via points are all protected, where:

 In the solder joint protection area 603, the solder resist oil protects the solder joint 602, and the solder joint 602 is the aforementioned conductive connection point 401;

 The via point 601 is used to lay the carrier tape or the carrier internal connection line 403. After the entire package processing process is completed, the via connection point 501 becomes the internal connection line connection point 501;

 Method 2: The area covered by the solder resist oil may also cover only the line, the via point and the periphery of the solder joint. As shown in Fig. 7, the soldering oil is only applied to the line laying and via point area 701 and the solder joint area 702. Coverage (specifically how the solder resist is applied, how the pad portion avoids coating is a well-known technique for circuit board technology and will not be described in detail herein).

 In addition to the wires, vias and solder joints on the carrier tape or the carrier, the other part is the substrate of the PCB. Since the solder joints are protected around the solder joints, the wires and the via holes, the solder bridge will not be generated in the production. For other quality problems, other PCB substrates without solder resist oil have good acid and alkali resistance, insulation properties and other electrical properties. Therefore, the partial solder resist oil shown in Figure 6 and Figure 7 is used. The process does not affect the quality and reliability of the product, including salt spray resistance, while at the same time solving the warpage caused by the traditional covering process.

 In addition, the general PCB double-panel vias (vias 601) are leaky, even if some of the PCB vias are covered with solder resist, but the vias are not completely covered.

 The PCB board (carrier tape or carrier) used in the present invention is generally a double-sided board, and the circuits on both sides need to be connected to the circuit through a via (via point 601), since the smart card card needs to be used in the packaging process. The glue is used to fix and bond the smart card chip module and the card base. If the PCB board has a gap in the via hole of the smart card chip module, the hot melt adhesive may overflow to the front side (contact surface) of the smart card during the smart card card packaging process. This will cause some trouble in the production process and use.

 The invention fills the over-hole by brushing the soldering oil on the PCB board when the solder resist oil is applied to the PCB board, so as to ensure that the hot-melt glue used in the smart card card packaging process does not overflow to the smart card. The front side (contact surface). The range of solder resist oil is based on the inclusion of all vias. As shown in Figure 8, the via 801 is protected and filled with solder resist 802.

Through the above processing, the carrier tape or the carrier can fully meet the requirements of large-scale smart card production. The contact smart card chip package packaged in this process is very similar to the smart card package film packaged by FC0S and gold wire bonding method, but in fact each process step is different, and the smart card chip processed for CSP or WLCSP is used. The contact smart card circuit board (carrier tape or carrier) is very different from the smart card circuit board used in the FC0S and gold wire bonding methods. The smart card circuit board required by the FC0S needs the flip chip bonding requirement for the FC0S process, the gold wire. The board used in the bonding method needs to be suitable for gold wire (or aluminum wire) wire bond requirements. The CSP or WLCSP process or the SMT chip process used in the packaging method of this new contact smart card chip is mature, but requires special design and processing in the production process of the carrier tape or carrier, which makes this The technology of the new contact smart card chip packaging method enables high-efficiency production, low overall processing cost, high reliability, and great economic value. The contents not described in detail in the present specification belong to the prior art well known to those skilled in the art.

Claims

Claim  A new method for packaging a contact smart card, characterized in that the specific steps are as follows:  Step (1) processing the contact smart card chip wafer particles to be processed to obtain the processed contact smart card chip wafer particles: the contact smart card chip wafer particles (101) to be packaged, and having a plurality of original solder joints (102), using the CSP or WLCSP process, processing the contact smart card chip wafer particles (101) to be packaged, and setting a new solder joint (202) corresponding to the original solder joint (102), and then using the internal The connecting wire (203) connects the original solder joint (102) and the new solder joint (202) to each other in order to increase the area of the original solder joint (102) and increase the spacing between the original solder joints (102). The new solder joints (202) have a spacing of at least 0.2 匪, and the new solder joints (202) have a diameter of at least 0.1 匪. At the same time, chip solder joints are placed on the contact smart card chip wafers (101) to be packaged. Starting point identification (204), obtaining processed contact smart card chip wafer particles (205);  Step (2) Designing and processing the carrier tape or carrier: The chip size and corresponding solder joint data of the processed contact smart card chip wafer (205) obtained by CSP or WLCSP processing are designed and produced. Carrier tape or carrier, such that the conductive connection points of the carrier tape or carrier are identical in size and structure to the newly added solder joints (202) on the processed contact smart card chip wafer particles (205);  Step (3) affixing the processed contact smart card chip wafer particles to the carrier tape or carrier adapted thereto: the processed contact smart card chip obtained in step (1) by using a conventional SMT chip process The particles (205) are attached to the respective positions of the carrier tape or the carrier sheet obtained in the step (2).  2. The method of packaging a new contact smart card according to claim 1, wherein the contact smart card chip wafer (101) to be packaged is obtained by dicing a wafer Wafer of the smart card chip. 3. The method of packaging a new contact smart card according to claim 1, wherein: the thickness of the processed contact smart card chip wafer particles (205) is not higher than 0.60mm.  4. The method of packaging a new contact smart card according to claim 1, wherein the specific processing method of the carrier tape or the carrier is as follows:  1 Use a double-sided copper-clad PCB substrate with a thickness less than or equal to 0.35 mm, using a well-known PCB production process, after etching, punching holes, sinking copper to form circuit board lines and contact surfaces, and then performing gold plating or immersion gold to form Carrier tape or slide with conductive connection points for contact smart card packaging,  2 The position and size of the conductive connection point on the carrier tape or carrier should be the same as the size and new solder joint of the processed contact smart card chip wafer (205) generated in step (1). (202) Adaptation,  3 The solder resist is covered around the conductive connection points on the carrier tape or the carrier, on the line, and at the via points, wherein the solder resist oil is filled with the via holes on the carrier tape or the carrier.  5. The method of packaging a new contact smart card according to claim 4, wherein the carrier tape or the carrier tape obtained in the step (2) is provided on the back side thereof with a new solder joint (202). Corresponding conductive connection point (401),  Forming a number of front (contact surface) metal faces (502) through a plurality of dividing lines (503) on the front side (contact surface),  The front side (contact surface) metal surface (502) is provided with an internal connection line connection point (501), and the conductive connection point (401) and the internal connection line connection point (501) are passed between the carrier tape or