1254341 五、發明說明（1 ) 發明之領域 本發明係關於在液晶顯示裝置用玻璃基板之製造等之 中所使用之輸送式之基板處理裝置，尤其是關於在此基 板處理裝置中，使基板傾斜而使處理液從基板之表面上 被排除之一種傾斜式排液裝置。 先前之技術說明 液晶顯示裝置所使用的玻璃基板，是在做爲素材之基 板的表面反覆地進行蝕刻、剝離等之化學處理而製成。 其處理裝置有乾式及濕式之區別，濕式更有批量式及枚 葉式之分別。而且，枚葉式更細分爲利用旋轉式及滾輪 輸送等之輸送方式。 這些基板處理裝置之中，輸送方式者爲使基板向水平 方向輸送之同時，使處理液在基板上被供給之基本構成 ，爲了高效率之故而使用蝕刻處理或剝離處理等。 使用蝕刻處理之輸送式之基板處理裝置中，從基板輸 送線線之上方所配置的陣列狀之多數個噴嘴噴射出之鈾 刻液，基板通過此蝕刻液中，使基板表面全體被供給蝕 刻液。這種噴淋處理使基板表面上除了塗布有罩材之部 份以外，可以選擇地被進行鈾刻。 蝕刻後，同樣之噴嘴所噴射出洗淨水將基板洗淨，使 蝕刻處理迅速停止，初期之洗淨下之洗淨水的污染可被 抑制，以降低此初期之洗淨水的廢棄量做爲目的，洗淨 前基板之表面上殘留之蝕刻液以物理方法被除去。此排 1254341 五、發明說明（2) 液裝置之一種方式爲，基板在輸送途中暫時地停止，並 向側方向傾斜，而使蝕刻液從表面向側方向傾斜之方式 。剝離處理用之基板處理裝置也同樣地進行藥液處理、 排液、水洗。 【本發明欲解決之課題】 然而，液晶顯示裝置所使用的玻璃基板，有朝基板之 大型化同時電路高精細化發展之趨勢。雖然使用此基板 之配線材料以前多使用鉻，伴隨著最近之高精細化，有 朝比電阻値較小的A 1或者A1 / Mo轉換之趨勢。因此，蝕 刻用之輸送式之基板處理裝置也開始使用A1用鈾刻液， 而伴隨著此蝕刻液之使用，會有以下之問題產生。 A1用蝕刻液與鉻用蝕刻液比較，其黏度較高。因此， 蝕刻後在以傾斜式排液裝置使基板傾斜時，排液性會惡 化。即，A1用蝕刻液之表面張力較大之故，即使基板傾 斜也會使表面上的蝕刻液多量地殘留在側緣部上。基板 回復水平姿勢之時，此蝕刻液再度在表面上擴散。 使基板之傾斜角度大之時，雖然可以解決上述問題， 在基板朝大型化發展之現狀中，會有與設備產生干涉之 故，因而欲使基板之傾斜角度增大時有所困難，而且， 使傾斜角度增大時，完成此項傾斜需要很多時間，因而 使排液所需之基板停止時間變長，故而形成基板之傾斜 角度無法增大之一個限制。由於此限制，使用A 1用鈾刻 液之情況時，其排液性之惡化即不可避免。其結果會有 1254341 五、發明說明（4) 傾斜基板之側緣部對接之時，會有產生將側緣部削除的 異物之虞，故最好是與傾斜基板之側緣部接近之非接觸 式較佳。 本發明之傾斜式排液裝置，雖然對黏性高的A 1用蝕刻 液特別適合，但是效果上程度稍差的其他鈾刻液、或蝕 刻以外之處理液亦有效。 發明較佳實施例之詳細說明 下面將根據圖面說明本發明之實施例。第1圖是本發 明之一個實施例中使用傾斜式排液裝置之輸送式之基板 處理裝置的平面圖。第2圖是同傾斜式排液裝置之平面 圖。第3圖是從第2圖中之X-X線之箭頭方向示圖。 輸送式之基板處理裝置被用來進行液晶顯示裝置用的 玻璃基板1 0 (以下只稱基板1 〇 )之A1用鈾刻處理。此基 板處理裝置如第1圖所示，採用直線狀之第1線A、在第 1線A上以直角接觸之第2線B、在第2線B以直角接觸 而與第1線A並列之第3線C所組合成的U迴轉式配置 〇 第1線A是由受入部1、除液部2、蝕刻部3及排液部 4成直線狀連結所構成。鈾刻部3裝備有’從基板1 〇之 表面上方使A 1用蝕刻液被散佈用之噴淋單元3 1。而且’ 排液部4被裝備在本實施例相關之傾斜式排液裝置40中 ，其構成將敘述於後。 第2線B爲水洗部5，裝備有從基板1 〇之表面上方洗 1254341 五、發明說明（5) 淨水被散佈用之噴淋單元5 1。第3線C是由移載裝置6 、自轉乾脫水機7、移載裝置8及取出部9成直線狀連結 所構成。 第1線A及第2線B具有，爲了基板10在線之長度方 向上被輸送而在輸送方向上以預定間隔並列之多數個輸 送滾輪。各輸送滾輪爲在輸送方向上成直角之滾輪。第2 線B，即水洗部5之入口部設置有使基板1 0之進行方向 被變更90度用之轉向機構52。 受到A 1用蝕刻液處理之基板1 0，由輸送裝置1 1輸送 到受入部1。其基板1 〇由輸送滾輪而從除液部2向鈾刻 部3移動。通過這些裝置之時受到蝕刻處理。通過蝕刻 部3後之基板1 〇接著由滾輪輸送，經過排液部4內之傾 斜式排液裝置40而向水洗部5移動。 移動到水洗部5之出口部之基板1 0，由移載裝置6從 水洗部5輸送到自轉乾脫水機7。以自轉乾脫水機7乾燥 之後的板1 0，由移載裝置8從自轉乾脫水機7輸送到取 出部9，更進一步從輸送裝置1 1輸送到外部。 本實施例相關之傾斜式排液裝置40如第2及3圖所示 ’具有：使基板10在水平方向上被輸送用之多數個輸送 滾輪4 1，及使輸送滾輪41上之基板1 0向輸送方向側方 傾斜之排液裝置本體42，及排液裝置本體42，及在排液 裝置本體42之一側部上所設置之排液促進裝置43。 _送滾輪41爲在輸送方向上以預定間隔配置之水平驅 1254341 五、發明說明（6) 動滾輪，設置在驅動軸4 1 a之多數個位置之大徑部4 1 d 上使基板10做點支持，以兩側之鍔部41c進行基板1〇 之寬度方向的定位。然後，多數個輸送滾輪4 1被同步驅 動’使基板1 0以預定速度前進，而且在任意位置上停止 〇 排液裝置本體42具有，使基板10在輸送方向之多數 個位置上所支持之多個基板支持樑42a，及使多個基板支 持樑42 a向基板1 〇在輸送方向側方傾斜之兩側的一對升 降裝置42b，42c。多個基板支持樑42a爲在輸送滾輪41 之間平行配置、在輸送方向成直角之樑，而以在基板1 0 之輸送方向平行之多個連結元件42d成一體化。然後， 在不傾斜之水平狀態中，多個基板支持樑42a僅位在基 板輸送面下方一點之處。 兩側的一對升降裝置42b，42c在此爲馬達式起重機， 使中央之基板支持樑42a傾斜時，可以使多個基板支持 樑42a同步地傾斜。即，位於傾斜方向下游側之升降裝 置42b，可使多個基板支持樑42 a之一端部被旋轉自如地 被支持用之支持元件42e被升降，由於其上升而使多個 基板支持樑42a之一端部上面可定位於基板輸送面之稍 微上方。位於傾斜方向上游側之升降裝置42c，可使多個 基板支持樑42a之另一端部，經由桿42 f而使另一端部 上面上升而定位於基板輸送面之稍微上方爲止，接著進 行預定行程之上升，而使多個基板支持樑42a以一端部 1254341 五、發明說明（7 ) 的轉動支點爲中心而向一端側傾斜。 因而，輸送滾輪41上之基板10被移載到基板支持樑 42a之上，而且向輸送方向側方以預定幾角度傾斜。由於 基板支持樑42a之傾斜，使輸送滾輪41與連結元件42d 不產生干涉，由連結元件42d而使基板支持樑42a在輸 送i孩輪41上之充分下方處被連結。基板支持樑4 2 a之一 端部上設置有止件42g，以防止由於基板1 0之傾斜而橫 向歪斜。 排液促進裝置43具有在基板10之輸送方向上以預定 間隔配置之多個接觸元件43a。這些多個接觸元件43 a爲 垂直圓棒狀之細金屬銷，各上端部被固定在上方之水平 支持元件43b上，各下端部則做爲自由端而被開放。然 後，基板10向側方以預定角度傾斜之時，基板10之傾 斜方向下游側的側緣部在多數個接觸元件43 a上開設有 很小之間隙的對向位置上，設置有此排液促進裝置43。 而，接觸元件4 3 a基本上以等節距配置，此節距方面 雖然後面將詳細敘述，但是設置在與基板支持樑42a上 之止件4 2 g干涉的位置中，接觸元件4 3 a被省略。 其次，將說明本實施例相關之傾斜式排液裝置40之功 tb ° 蝕刻部3處之蝕刻處理完成之基板1 0，進入排液部4 ，而停止在排液裝置本體42上之預定位置。此時，排液 裝置本體42之基板支持樑42a，在基板輸送面之下方以 1254341 五、發明說明（8) 水平姿勢成待機狀態。基板1 0停止在排液裝置本體42 上之預定位置時，基板支持樑42a之一端部會稍微上升 ，另一端部則大幅上升。因而，基板1 〇從輸送滾輪4 1 上向基板支持樑42 a上進行移載，進而向側方以預定角 度傾斜。 雖然由於基板之傾斜，基板1 0之表面上殘留之蝕刻液 向側方流動，而從基板1 0之表面上排除，但是蝕刻液是 A1用高黏度之蝕刻液，故僅以預定角度傾斜之時，由於 表面張力會有比較多的蝕刻液在傾斜方向下游側的側緣 部上殘留。然而，本實施例相關之傾斜式排液裝置40中 ，基板10之傾斜方向下游側的側緣部接近排液促進裝置 43之多個接觸元件43 a，滯留在側緣部上之蝕刻液接觸 多個接觸元件43a。其結果，蝕刻液傳到各接觸元件43a 而從傾斜方向下游側的側緣部有效率地排除，從而，使 側緣部上殘留的蝕刻液變成很少。 由傾斜而進行排液完成時，基板支持樑42 a回到本來 狀態。因而，基板10從基板支持樑42a上向輸送滾輪41 上進行移載，由於輸送滾輪41被再度進行驅動，而從排 液部4輸送到水洗部5。 排液部4中，由於傾斜式排液裝置40使基板10之傾 斜角度不會增大而進行有效率之排液之故，可避免排液 所需時間之延長。而且，可避免設備之大型化。水洗部5 中，對基板1 0之進行初期洗淨，雖然其初期洗淨水因爲 -10- 1254341 五、發明說明（9) 污染顯著之故而被廢棄，但是被帶到水洗部5之蝕刻液 減少，故廢棄之初期洗淨水亦因而減少。 傾斜式排液裝置40使基板1 0之傾斜角度在5〜20度較 佳，尤其在8〜1 5度時更佳。此傾斜角度太小之時，無法 充分地進行排液，太大之時會有設備上之干涉與傾斜所 需時間增大的問題。接觸元件43 a之配置排列節距較佳 爲2〜15公厘，尤其在3〜8公厘時更佳。此節距太小之時 ，會成爲液殘留之原因，太大之時會在相鄰接觸元件之 間會變成難以排液，兩者均會使排液性降低。接觸元件 43a之尺寸，使用圓棒之外徑爲1〜8公厘較佳，尤其在 2〜4公厘時更佳。此外徑太小之時，會使加工困難，太大 之時會因爲配置排列之增大而使排液性降低。 【發明之效果】 如以上之說明，本發明之傾斜式排液裝置，由於傾斜 基板之傾斜方向下游側的側緣部與沿著側緣部配列之多 個接觸元件對接或接近，即使在處理液黏度高之情況下 ，亦不必使基板之傾斜角度增大，而可使處理液從其表 面上有效率地被排除。因而，持續排液之水洗的負荷會 減少，使用水成本亦可降低。而且，可避免排液所需時 間之延長，並且可避免設備長度增加。 附圖之簡單說明 第1圖是本發明之一個實施例中使用傾斜式排液裝置 之輸送式之基板處理裝置的平面圖； -11- 1254341 五、發明說明（1〇) 第2圖是同傾斜式排液裝置之平面圖； 第3圖是從第2圖中之X-X線之箭頭方向示圖。 元件之符號說明 1 受入部 2 除液部 3 蝕刻部 4 排液部 40 傾斜式排液裝置 41 輸送滾輪 42 排液裝置本體 42a 多個基板支持樑 42b , 42c 升降裝置 43 排液促進裝置 43a 接觸元件 43b 水平支持元件 5 水洗部 6 , 8 移載裝置 7 自轉乾脫水機 9 取出部 10 基板 11 輸送裝置 41a 驅動軸 41d 大徑部 1254341 五、發明說明（11) 41c 鍔 部 42d 連 結 元 件 42e 支 持 元 件 42g 止 件 51 噴 淋 單 元 52 轉 向 機 構 31 噴 淋 單 元1. Field of the Invention The present invention relates to a substrate processing apparatus of a transport type used in the manufacture of a glass substrate for a liquid crystal display device, and the like, and more particularly to tilting a substrate in the substrate processing apparatus. An inclined liquid discharge device that removes the treatment liquid from the surface of the substrate. Prior Art Description The glass substrate used in the liquid crystal display device is produced by chemically etching, peeling, or the like on the surface of the substrate as a material. The treatment equipment has the distinction of dry and wet, and the wet type has the distinction of batch type and leaf type. Further, the leaf type is further subdivided into a conveying method using a rotary type and a roller conveying. Among these substrate processing apparatuses, the transport method is a basic configuration in which the processing liquid is supplied to the substrate while the substrate is being conveyed in the horizontal direction, and an etching treatment, a peeling treatment, or the like is used for high efficiency. In the substrate processing apparatus of the transport type using the etching process, the uranium engraving liquid is ejected from a plurality of array-shaped nozzles disposed above the substrate transfer line, and the substrate passes through the etching liquid, so that the entire surface of the substrate is supplied with the etching liquid. . This showering treatment allows the uranium engraving to be selectively performed on the surface of the substrate in addition to the portion to which the cover material is applied. After the etching, the same nozzle sprays the washing water to wash the substrate, so that the etching process is quickly stopped, and the contamination of the washing water in the initial washing can be suppressed, thereby reducing the amount of the washing water in the initial stage. For the purpose, the etching liquid remaining on the surface of the front substrate is physically removed. This row 1254341 V. Description of the Invention (2) One mode of the liquid device is a method in which the substrate is temporarily stopped during transportation and tilted in the lateral direction to incline the etching liquid from the surface to the side. The substrate processing apparatus for peeling treatment also performs chemical liquid processing, liquid discharge, and water washing in the same manner. [Problems to be Solved by the Invention] However, the glass substrate used in the liquid crystal display device tends to be large in size as the substrate is enlarged and the circuit is highly refined. Although the wiring material using this substrate has been previously used with chromium, with the recent high definition, there is a tendency to convert to A 1 or A1 / Mo which is smaller than the resistance 値. Therefore, the substrate processing apparatus for etching is also used to use the uranium engraving solution for A1, and the following problems occur depending on the use of the etching liquid. The etching solution of A1 is higher in viscosity than the etching solution for chromium. Therefore, when the substrate is tilted by the tilt type draining device after the etching, the liquid discharge property is deteriorated. In other words, the surface tension of the etching liquid for A1 is large, and even if the substrate is inclined, the etching liquid on the surface remains in a large amount on the side edge portion. When the substrate returns to the horizontal posture, the etching solution spreads again on the surface. When the tilt angle of the substrate is made large, the above problem can be solved, and in the current state of development of the substrate, there is interference with the device, and thus it is difficult to increase the tilt angle of the substrate, and When the tilt angle is increased, it takes a lot of time to complete the tilting, so that the substrate stopping time required for liquid discharge becomes long, and thus the restriction that the tilt angle of the substrate cannot be increased is formed. Due to this limitation, when the uranium engraving solution for A 1 is used, the deterioration of the liquid discharge property is unavoidable. As a result, there will be 1,254,341. V. Inventive Note (4) When the side edges of the inclined substrate are butted together, there is a possibility that the side edge portion is removed, and therefore it is preferable that the side edge portion of the inclined substrate is non-contact. The formula is preferred. The inclined liquid discharge device of the present invention is particularly suitable for an etching liquid having a high viscosity of A 1 , but other uranium engraving liquids having a slightly less effective effect or treatment liquids other than etching are also effective. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described based on the drawings. Fig. 1 is a plan view showing a substrate processing apparatus of a transport type using an inclined draining device in an embodiment of the present invention. Figure 2 is a plan view of the same inclined draining device. Fig. 3 is a view from the direction of the arrow on the X-X line in Fig. 2. The transport type substrate processing apparatus is used for argon engraving of A1 for glass substrate 10 (hereinafter referred to as substrate 1 〇) for liquid crystal display devices. As shown in Fig. 1, the substrate processing apparatus adopts a linear first line A, a second line B that is in contact with the first line A at a right angle, and a second line B that is in contact with the first line A at a right angle. In the U-turn type arrangement in which the third line C is combined, the first line A is formed by linearly connecting the receiving unit 1, the liquid removing unit 2, the etching unit 3, and the liquid discharging unit 4. The uranium engraving portion 3 is equipped with a shower unit 31 for arranging A 1 with an etching liquid from above the surface of the substrate 1 . Further, the liquid discharge portion 4 is provided in the inclined liquid discharge device 40 according to the present embodiment, and its constitution will be described later. The second line B is the water washing unit 5, and is equipped to be washed from the upper surface of the substrate 1 12 1254341. 5. Description of the invention (5) The shower unit 51 for water purification is dispersed. The third line C is constituted by the transfer device 6, the spin dry dehydrator 7, the transfer device 8, and the take-out portion 9 being linearly connected. The first line A and the second line B have a plurality of transport rollers that are transported in the longitudinal direction of the substrate 10 at a predetermined interval in the transport direction. Each of the conveying rollers is a roller that is at right angles in the conveying direction. The second line B, that is, the inlet portion of the water washing portion 5 is provided with a steering mechanism 52 for changing the direction in which the substrate 10 is rotated by 90 degrees. The substrate 10 subjected to the etching solution for A 1 is transported to the receiving unit 1 by the transport device 1 1 . The substrate 1 is moved from the liquid removing portion 2 to the uranium engraving portion 3 by the conveying roller. The etching process is performed by these devices. The substrate 1 which has passed through the etching portion 3 is transported by the roller, and is moved to the water washing portion 5 through the tilting liquid discharge device 40 in the liquid discharge portion 4. The substrate 10 moved to the outlet portion of the water washing portion 5 is transported from the water washing portion 5 to the spin-drying dehydrator 7 by the transfer device 6. The plate 10, which has been dried by the spin dry dehydrator 7, is transported from the spin-drying dehydrator 7 to the take-out portion 9 by the transfer device 8, and further transported from the transport device 11 to the outside. As shown in FIGS. 2 and 3, the inclined liquid discharge device 40 according to the present embodiment has a plurality of transport rollers 41 for transporting the substrate 10 in the horizontal direction and a substrate 10 on the transport roller 41. The liquid discharge device main body 42 which is inclined to the side in the transport direction, and the liquid discharge device main body 42, and the liquid discharge promoting means 43 provided on one side of the liquid discharge device main body 42. The feed roller 41 is a horizontal drive 1254341 arranged at a predetermined interval in the transport direction. 5. Description of the invention (6) The movable roller is disposed on the large diameter portion 4 1 d at a plurality of positions of the drive shaft 4 1 a to make the substrate 10 Point support is performed in the width direction of the substrate 1 by the crotch portion 41c on both sides. Then, a plurality of conveying rollers 41 are synchronously driven to advance the substrate 10 at a predetermined speed, and stopping the squib discharging device body 42 at an arbitrary position, so that the substrate 10 is supported at a plurality of positions in the conveying direction. The substrate supporting beam 42a and a pair of lifting devices 42b, 42c for causing the plurality of substrate supporting beams 42a to be inclined to the sides of the substrate 1 in the conveying direction side. The plurality of substrate supporting beams 42a are beams which are arranged in parallel between the conveying rollers 41 and are at right angles in the conveying direction, and are integrated by a plurality of coupling elements 42d which are parallel in the conveying direction of the substrate 10. Then, in the horizontal state without tilting, the plurality of substrate supporting beams 42a are located only a little below the substrate conveying surface. The pair of lifting devices 42b, 42c on both sides are motor cranes, and when the center substrate supporting beam 42a is inclined, the plurality of substrate supporting beams 42a can be inclined in synchronization. In other words, the lifting device 42b located on the downstream side in the oblique direction allows the support member 42e, which is rotatably supported by one of the plurality of substrate supporting beams 42a, to be lifted and lowered, and the plurality of substrate supporting beams 42a are raised by the rise thereof. The upper end portion can be positioned slightly above the substrate transport surface. The lifting device 42c located on the upstream side in the oblique direction allows the other end portions of the plurality of substrate supporting beams 42a to be raised upward by the rod 42f and positioned slightly above the substrate conveying surface, and then the predetermined stroke is performed. When the plurality of substrate supporting beams 42a are raised, the one end portion 1254341 is tilted toward the one end side around the pivot point of the invention (7). Thus, the substrate 10 on the transport roller 41 is transferred onto the substrate supporting beam 42a, and is inclined at a predetermined angle to the side in the transport direction. Due to the inclination of the substrate supporting beam 42a, the conveying roller 41 and the connecting member 42d are not interfered with each other, and the substrate supporting beam 42a is connected to the substrate support beam 42a sufficiently below the conveying wheel 41. One end of the substrate supporting beam 4 2 a is provided with a stopper 42g to prevent lateral skew due to the inclination of the substrate 10. The liquid discharge promoting device 43 has a plurality of contact elements 43a arranged at predetermined intervals in the conveying direction of the substrate 10. These plurality of contact members 43a are fine metal pins of a vertical round bar shape, and the upper end portions are fixed to the upper horizontal support member 43b, and the lower end portions are opened as free ends. Then, when the substrate 10 is inclined at a predetermined angle to the side, the side edge portion on the downstream side in the oblique direction of the substrate 10 is provided with the discharge at a position where a small gap is formed in the plurality of contact members 43a. Promoting device 43. However, the contact elements 43a are arranged substantially at equal pitches, which, although described in detail later, are disposed in a position that interferes with the stoppers 42g on the substrate support beam 42a, the contact elements 4 3 a Was omitted. Next, the substrate 10 in which the etching process at the etching portion 3 of the inclined liquid discharge device 40 according to the present embodiment is completed will enter the liquid discharge portion 4 and be stopped at a predetermined position on the liquid discharge device body 42. . At this time, the substrate supporting beam 42a of the liquid discharging device main body 42 is placed in a standby state below the substrate conveying surface by a 1254341 fifth and a description of the invention (8). When the substrate 10 is stopped at a predetermined position on the liquid discharge device body 42, one end portion of the substrate supporting beam 42a rises slightly, and the other end portion rises greatly. Therefore, the substrate 1 is transferred from the transport roller 4 1 to the substrate supporting beam 42 a and further inclined to the side at a predetermined angle. Although the etching liquid remaining on the surface of the substrate 10 flows sideways due to the inclination of the substrate, and is removed from the surface of the substrate 10, the etching liquid is a high-viscosity etching liquid for A1, so it is inclined only at a predetermined angle. At the time of the surface tension, a relatively large amount of the etching liquid remains on the side edge portion on the downstream side in the oblique direction. However, in the inclined liquid discharge device 40 according to the present embodiment, the side edge portion on the downstream side in the oblique direction of the substrate 10 is close to the plurality of contact members 43a of the liquid discharge promoting device 43, and the etching liquid contact remaining on the side edge portion A plurality of contact elements 43a. As a result, the etching liquid is transmitted to the respective contact elements 43a and is efficiently removed from the side edge portion on the downstream side in the oblique direction, so that the etching liquid remaining on the side edge portions becomes small. When the draining is completed by the tilting, the substrate supporting beam 42a returns to the original state. Therefore, the substrate 10 is transferred from the substrate supporting beam 42a to the transport roller 41, and the transport roller 41 is again driven to be transported from the drain portion 4 to the water washing portion 5. In the liquid discharge portion 4, since the inclined liquid discharge device 40 does not increase the inclination angle of the substrate 10, efficient drainage is performed, and the time required for liquid discharge can be prevented from being prolonged. Moreover, the size of the device can be avoided. In the water washing unit 5, the initial cleaning of the substrate 10 is carried out, and the initial washing water is discarded because it is significantly contaminated by the invention, but the etching liquid brought to the water washing unit 5 is discarded. As a result of the reduction, the initial wash water is also reduced. The inclined liquid discharge device 40 preferably makes the inclination angle of the substrate 10 5 to 20 degrees, particularly preferably 8 to 15 degrees. When the inclination angle is too small, the liquid discharge cannot be sufficiently performed, and when it is too large, there is a problem that the time required for interference and tilting on the apparatus increases. The arrangement of the contact elements 43a is preferably from 2 to 15 mm, more preferably from 3 to 8 mm. When the pitch is too small, it may become a cause of liquid residue. If it is too large, it will become difficult to discharge between adjacent contact elements, and both will lower the liquid discharge. The size of the contact member 43a is preferably from 1 to 8 mm in outer diameter of the round bar, particularly preferably from 2 to 4 mm. In addition, when the diameter is too small, processing is difficult, and when it is too large, the liquid discharge property is lowered due to an increase in the arrangement arrangement. [Effects of the Invention] As described above, in the inclined liquid discharge device of the present invention, the side edge portion on the downstream side in the oblique direction of the inclined substrate is in contact with or close to the plurality of contact elements arranged along the side edge portion, even when processing In the case where the viscosity of the liquid is high, it is not necessary to increase the inclination angle of the substrate, and the treatment liquid can be efficiently removed from the surface thereof. Therefore, the load of the water washing for continuous drainage is reduced, and the cost of using water can also be lowered. Moreover, it is possible to avoid an increase in the time required for draining and to avoid an increase in the length of the device. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing a substrate processing apparatus of a transport type using a tilt type liquid discharge apparatus according to an embodiment of the present invention; -11- 1254341 V. Description of the invention (1〇) Fig. 2 is the same tilt A plan view of the liquid discharge device; Fig. 3 is a view from the arrow direction of the XX line in Fig. 2; DESCRIPTION OF REFERENCE NUMERALS 1 receiving portion 2 liquid removing portion 3 etching portion 4 liquid discharging portion 40 inclined liquid discharging device 41 conveying roller 42 liquid discharging device body 42a plurality of substrate supporting beams 42b, 42c lifting device 43 liquid discharging promoting device 43a contact Element 43b Horizontal support element 5 Washing part 6, 8 Transfer device 7 Self-drying dehydrator 9 Take-out part 10 Substrate 11 Conveying device 41a Drive shaft 41d Large diameter part 1254341 V. Invention description (11) 41c Crotch part 42d Coupling element 42e Support Element 42g stop 51 spray unit 52 steering mechanism 31 shower unit