TWI250591B - Sliding type fingerprint sensor package - Google Patents

Abstract

A sliding type fingerprint sensor package includes a carrier with an upper surface. A sensor chip is attached to the upper surface of the carrier. The active surface of the sensor chip includes a sensing region for sensing fingerprint by sliding. A plurality of bonding pads are formed on one side of the active surface. A groove is formed between the sensing region and the bonding pads. A plurality of connecting elements electrically couple the bonding pads to the carrier. A molding compound seals the connecting elements and covers the bonding pads along the groove. The groove is used for preventing the molding compound flowing to the sensing region.

Description

1250591 Case No. 931073% Lunar Amendment 5, Invention Description (2) Covering the sensing area 1 2 1 ' However, as the size of the sensing wafer 120 is getting smaller, it is no longer possible to sense the wafer 1 2 The active surface of 0 leaves a sufficient range, even because the pressing surface of the mold is too close to the periphery of the sensing wafer 120, causing the sensing wafer to be chipped. SUMMARY OF THE INVENTION The main object of the present invention is to provide a touch-sliding fingerprint sensor package structure, which is formed between a pad and a sensing area of a sensing wafer active surface to form a guiding groove for The diversion overflows to the mold flash or the sealant of the guide trough to prevent the sealant of the sealant from contaminating the sensing area. A second object of the present invention is to provide a touch-sliding fingerprint sensor package structure, which is formed by using a mold having a dummy area to form a gel, so that the surface of the extended portion of the sealant is Sensing the active face of the wafer coplanar to avoid fragmentation of the sensing wafer. The touch-sliding fingerprint sensor package structure of the present invention comprises a carrier, a sensing wafer, a plurality of guiding elements and a glue body, wherein the carrier has an upper surface, the sensing chip The sensing chip is disposed on the upper surface of the carrier, and the sensing chip has an active surface, the active surface includes a sensing area, a plurality of soldering holes and a guiding groove, wherein the sensing area is used for sliding The sensing contact sliding fingerprint is formed on one side of the active surface, the guiding channel is formed between the pads and the sensing region, and the guiding components are electrically connected The pads are connected to the carrier, and the sealing system covers the guiding elements and covers the pads of the sensing wafer, and the edge of the sealing body is adjacent to the guiding groove to expose the sensing area.

1250591_ V. Description of the Invention (3) 'Embodiment】

The invention will now be described by way of example with reference to the accompanying drawings. According to an embodiment of the present invention, referring to FIGS. 2 and 3, a touch/month type 4 感 sensor package structure 2 〇〇 includes a carrier 2 1 〇, a sensing wafer 220, a plurality of guiding elements 2 3〇 and a colloid 24〇, wherein the carrier 210 0 can be a substrate, and the material can be BT, FR — 4 or ( 10 ) 5′′. The carrier 210 has an upper surface. 211 and the lower surface 212, the upper surface 211 is formed with a plurality of connection pads 213, and the lower surface 212 is formed with a plurality of electrically connected to the connection pads 213, and the external pads 21 are formed. 4 is used for external electrical transmission, and the sensing wafer 2 2 is disposed on the upper surface 21 1 of the carrier 2 1 0 , and can be adhered to an adhesive layer 250 such as an epoxide. The carrier 21 is disposed on the upper surface 211,

Preferably, the upper surface 2 11 of the carrier 2 1 can be formed with a positioning groove 2 1 5 ′ to accommodate the sensing wafer 2 2 0 . Referring to FIG. 3 , the sensing wafer 2 2 0 has an active surface 2 21 . In this embodiment, the active surface 221 of the sensing wafer 220 is rectangular, and the length of the long sides 2 21 a, 221 b is greater than 3 times the length of the short sides 221 c and 221 d . The active surface 221 has a rectangular sensing area 22 2 , and the sensing area 22 is formed with a plurality of sensing elements (not shown) such as a fingerprint sensing integrated circuit for the touch-slip sensing. Contacting the sliding fingerprint, a plurality of pads 223 are formed on one side of the active surface 221. In the embodiment, the pads 223 are disposed on the active surface 221 and on one side of the short side 221c. A guiding groove 224 is formed between the soldering pad 223 and the sensing region 222. The guiding channel 224 extends through the two longer sides 221a and 221b of the active surface 221, and the guiding elements 230 are for

Page 91250591 -^^iE〇I356_Yearly-Day Revision ____15, Invention Description (5) ~ A piece of colloid 2 4 0 or molded waste rubber cover or contaminate the sensing area 2 2 2 The extension region 243 of the second encapsulation portion 242 of the encapsulant 240 is formed on the side of the short side 2 21 d of the sensing wafer 220, so that the sensing wafer 2 2 〇 can be avoided. The short side is broken for 21 d. The scope of the present invention is defined by the scope of the appended claims. Any changes and modifications made by those skilled in the art without departing from the scope of the invention are within the scope of the invention.

1250591

[Figure 岑 simple description] Figure 1 · Japan public 牿 牿 八 八 测 奇 奇 奇 奇 奇 奇 汗 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- </ RTI> </ RTI> </ RTI> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; » Simple description of component symbols: 10 0 fingerprint sensor 110 substrate 120 sensing wafer 121 sensing area

130 Bonding wire 140 Sealing body 141 Opening 200 Fingerprint sensor 210 Carrier 211 Upper surface 212 Lower surface 213 Connection pad 214 External pad 215 Positioning groove 220 Sensing wafer 221 Active surface 221a Long side 221b Long side 221c Short side 221d Short side 222 sensing area 223 pad 224 guiding groove 230 guiding element 240 shooting body 241 first encapsulation portion 241a side

1250591 Schematic description 242 Second encapsulation 243 Extension 243a surface 250 Adhesive layer 300 Mold 310 Dummy area

Claims (1)

1250591 Scope of application for patents [Scope of application] 1. A touch-sliding fingerprint sensor package structure comprising: a carrier having an upper surface; a sensing wafer disposed on the carrier In the upper surface, the sensing chip has an active surface, which comprises a sensing region formed on the active surface; a plurality of pads formed on one side of the active surface; a guiding groove formed on the active surface and disposed between the pads and the sensing region; a plurality of conductive elements electrically connecting the pads to the carrier; and a glue covering the conductive elements and covering the pads of the sensing wafer, the sealing One side of the colloid is adjacent to the flow guiding groove to expose the sensing area. 2. The touch-slip fingerprint sensor package structure of claim 1, wherein the sensing area of the active surface of the sensing wafer is rectangular. 3. The touch-slip fingerprint sensor package structure of claim 1 or 2, wherein the sealant system overflows the guide channel. 4. The touch-sliding fingerprint sensor package structure according to claim 1 or 2, wherein the active surface of the sensing wafer is a rectangle, and the flow guiding groove is continuous with the active surface. Two longer sides. 5. The touch-slip fingerprint sensor package structure as described in claim 4, wherein the encapsulation system has a first package portion and a second package 1250591 VI. Applying for the patent scope department, the system is formed by the assembly department. If the application is specific, the face is related to the sensing. 7. If the application is specialized, the application is as follows. Times. 9. If the application is specifically configured, wherein the sensing wafer 10 is disposed, such as an application-specific configuration, wherein the application is specifically configured, wherein the sensing wafer is on the side of the two shorter sides, the first These conductive elements. The touch-slip fingerprint sensor package of the fifth aspect of the invention has an extension portion, and the active surface of the wafer of the extension is coplanar. The touch-slide type fingerprint sensor package of the fourth aspect of the invention is provided on one side of the short side of the active surface. The length of the long side of the active surface of the touch-slip fingerprint sensor package described in item 4 of the benefit range is greater than the length of the short side. The range of the touch-slip finger-level sensor package carrier described in item 1 The upper surface is formed with a positioning groove, and the touch-sliding fingerprint sensor package sensing chip described in the first item is attached to the carrier by an adhesive layer. The touch-slide type fingerprint sensor package carrier of the first item is a substrate. ❿ Φ Page 15