TWI241229B - Semiconductor wafer grinding apparatus and wafer grinding process - Google Patents

Abstract

The present invention relates to a semiconductor wafer grinding device and a process for wafer grinding. The wafer outer perimeter grinding device 1, are equipped: wafer input-retrieval unit 2; wafer alignment unit 3; wafer seam grinding unit 4; wafer perimeter grinding unit 5; internal translating unit; first feed device 49; and second feed device 50. The internal translating unit is composed of a first translating unit 81,a second one and a third one 83.

Description

1241229 V. Description of the invention (1) [Detailed description of the invention] [Technical field to which the invention belongs] The present invention relates to a device for mirror-polishing the outer peripheral portion of a semiconductor wafer, that is, to the circumference of a semiconductor wafer The peripheral inclined surface, the peripheral end surface, and the wafer polishing device for polishing and cleaning and drying the notched inclined surface and the notched end surface provided in the notched portion are performed in separate devices. [Conventional Technology] A slope is formed on the semiconductor wafer to form an embedding, ie, a notch, for positioning, and a portion including the notch spans the outer periphery of the semiconductor wafer, that is, the corner of the entire contour removal edge. FIG. 1 (a) is a plan view of a semiconductor wafer, and FIG. 1 (b) is a partial cross-sectional view of the semiconductor wafer W. As shown in FIG. In addition, FIG. 2 is a perspective view showing an enlarged periphery of the notch N. FIG. The pattern forming surface Sp of the semiconductor wafer, the circumferential inclined surface Sb, and the circumferential end surface (which forms the outer cylindrical surface) Sc, due to the generation of dust in the post-processing due to grinding, so the notched inclined surface including the notch N is not mirrored. machining. In the past, wafers were managed in batches (for example, per box), but in recent years, for example, the host computer has issued instructions to the manufacturing equipment to process the first to third wafers and the first wafer in the box with different conditions, respectively. The method of processing the wafers from 8 to 15 wafers has a great demand for managing wafers by one wafer per wafer. Therefore, the same position must be returned. [Problems to be Solved by the Invention]

In order to respond to the above-mentioned needs, the present invention aims to: even through the wafer polishing device, it is not necessary to change the order of the wafers, and to simplify each wafer W

1241229 V. Description of the invention (2), which reduces wafer management load. [Means for solving problems] The above-mentioned problems are solved by the following means. Decision-making method '-a kind of wafer polishing device, equipped with a release unit for two people; wafer alignment unit; wafer gap research order-round i receiving and discharging polishing unit; wafer cleaning unit; wafer dry: When the wafer is filled with the above wafer, the unit is centered at the predetermined position and used for the alignment function of the 1st site θ W 疋 in the direction in which it is located. Wafer defect: Grinding: = Plane surface grinding is provided on the wafer bevel slope and defect ^ Second soil is used to mirror the circumferential bevel and circumference on the wafer's circumferential part: Surface grinding and grinding function The clean unit is equipped with the following functions: to facilitate the research and drying of the f element. The equipment is used to remove the drying liquid from the above-mentioned wafers. The above-mentioned 0 is equipped with: The wafer box is received and discharged =; the wafer is cut; the wafer is taken out to use the alignment unit; the round power is sent: the notch mirror is taken out from the wafer notch grinding unit described above = page 5 1241229

V. Description of the invention (3) The third conveying function for grinding the wafer to load the wafer into the above-mentioned circumferential grinding unit; taking out the circumferential inclined surface and the circumferential end surface of the wafer from the above-mentioned wafer circumferential grinding unit with mirror polishing The fourth transfer function for loading the wafer into the wafer cleaning unit, and taking out the cleaned wafer from the wafer cleaning unit, and loading the wafer into the wafer. The fifth transfer function of the wafer drying unit; and taking out the wafer from which the cleaning liquid has been removed from the wafer drying unit, and loading the wafer onto the wafer receiving and discharging unit from the wafer cassette The sixth transfer unit with the same slit in the above-mentioned wafer cassette. The second round box receives the element »wafer; the mouth unit shed, the upper circle is positioned towards the Chaoyuan system with a notched end system with a circumferential end preparation: a solution method to clean the bright with a dirty round, a wafer research The discharge circle and wafer are equipped with the above mentioned wafers. They are prepared for: use of surface crystals: use of surface crystals to take advantage of the net L function tm early element Nakaguchi unit; crystal unit grinding unit transfer unit, The mirror-grinding circular notch polishing mirror-polishing polishing circle polishing device is used to load the alignment unit in the direction predetermined by the center. The wafer is cleaned to produce a circular alignment unit: the wafer is cleaned. Features are as follows: the wafer is stored with: a fixed position, an alignment function, not placed on the wafer function; the above-mentioned wafer-side grinding function, because the above-mentioned grinding and drying unit is attached with washing; the wafer notch unit; At the time of the wafer of the wafer cassette of the wafer cassette, the wafer wafer cleaning operation for attaching the wafer wafer with a gap of the wafer gap to the wafer gap is attached to: Crystal Grinding said single drying said receiving-discharging single receiving-discharging 'The abrasive grain notched given port-port bevel polishing unit and a wafer having a peripheral bevel with earlier sewage ternary removed from the washed crystals

1241229 V. Description of the invention (4) Liquid drying function. The wafer transfer unit is composed of a first transfer unit, a second transfer unit, and a third transfer unit. The first transfer unit is provided with: The wafer is taken out from the slit of the wafer box in the above-mentioned document receiving and discharging unit of the wafer box receiving and discharging unit, and used to load the wafer into the first transfer function of the wafer positioning unit; The wafer alignment unit takes out the wafers that have been positioned and oriented, and is used to load the wafers into the second transfer function of the wafer notch grinding unit; and to take out the removed cleaning liquid from the above = round drying unit. And a sixth transfer unit for loading the wafer in the same slit in the wafer box as described above for receiving the wafer from the wafer box into the discharge port unit, the above-mentioned _ = has: The above-mentioned wafer notch grinding unit takes out the notch obliquely; bismuth has a mirror-polished wafer, and the third transfer function for loading the wafer into the above-mentioned circumferential part; and taking out from the above-mentioned wafer grinding part circle The beveled surface and the circumferential end surface are provided with a mirror-polished wafer, and the fourth transfer function is used to fill the f-circle in the wafer cleaning unit. The transfer unit is provided with: ⑼ The wafer cleaning unit is taken out and washed. No. :: Can be used to fill the crystal wafer in the fifth drying unit of the wafer: Jt solver is also a kind of wafer peripheral grinding device, in the first round grinding device, ▲ In the first transfer unit of the fans, the first transfer unit is: Xiang Xiang, Yuan Yuan Su? The wafer escapes above the discharge port unit, the wafer pair can be moved toward the crystal and drying unit, and it has a crotch part that rotates in a stand-alone manner, and a crotch part provided in the crotch part. Two independent wrists.

Page 7 1241229 V. Description of the invention (5) 5 types of wafers wafer alignment Early wafer washing is characterized by having a crystal system on it; a registration function mill with a predetermined position is set on the upper grinding function It is arranged on the peripheral polishing work fluid cleaning and the wafer is cleaned to produce the wafer carrying unit attached to the wafer. The wafer is removed from the wafer and the wafer is removed from one of the wafers. Transfer peripheral grinding and polishing device 5 yuan 9 Wafer missing unit crystal • The wafer round wafer box is filled with the wafer 5 and used for the wafer to describe the lack of the wafer) The wafer wafer's circumferential energy 5 The above-mentioned crystal grinding operation unit is provided with a cleaning liquid sending unit, and is received and discharged into the shed, and is loaded on the upper positioning unit. The round box of the fourth invention receives the row element, the wafer element, and the crystal unit unit shed. The wafer is positioned from the direction of the household unit. The surface and the notch end unit are provided with a surface and a circle Equipped with: used dirty washing wafer washing; dry cleaning solution drying unit in the above-mentioned wafer slot cutting unit of the first orientation completion of the grinding unit on the first wafer circumference part of the unit part grinding unit The solution is the exit unit. Peripheral grinding | Round conveying unit Preparation: Wafers for mirror surface grinding are used to install the circle alignment unit in the predetermined direction of its center: Wafer circles for mirror surface are used for cleaning The cleaning function, the washing function in the upper unit, and the cassette receiving and ejecting wafers, and the transport function; wafers, while the two transport function is used to grind and load in the unit or the above wafers are equipped with: crystal grinding single circle When receiving and discharging the dry single box, when receiving and discharging, the crystal is notched, the notch is notched, the notch of the grinding single port is notched, and the circumferential oblique cleaning unit of the grinding part is attached to the wafer: Removing said wafer from said circular wafer is placed out of alignment and the wafer notch is positioned RESEARCH unit and the circle circumference removed to another of said wafer to mirror polishing apparatus 1

Page 8 1241229

The function of transferring the wafer and loading the wafer from the wafer described above. The fifth invention has a mouth for receiving and discharging, and a mouth in a direction predetermined by its center. Grinding the inclined surface and the peripheral grinding unit f are produced by cleaning the contamination of the circle, and the wafer slits processed in the above characteristics are used to load the crystal from the wafer into the circular drying unit and fill the crystal. The same solution in Yizhong is to store and store the crystal unit; the location of the packing, the wafer alignment single side and the notched end unit; the two for the end face are used to clean the cells between the units using the wafer cleaning sheet. Use the above-mentioned crystals to be stored in a round-loading unit and loaded on an upper-cleaning unit. A wafer drying sheet is taken out and removed. The sixth from the above-mentioned crystal cutting slit is a wafer-round wafer box for the above-mentioned wafers. ; Used to clean both the mirror surface or mirror polishing equipment or one single clean liquid cleaning element; used to move from the liquid wafer to transport The wafer from the above-mentioned round transfer unit, the wafer cleaning, and the fifth wafer of the cleaning liquid that has been washed out, and the round box is received and discharged into the transfer unit. The polishing method 'received in and discharged' will allow the wafer to have the notched orientation surface polished and set one of the wafers to be placed on the wafer circle or plural wafers. The wafers used as the wafer cleaning and cleaning liquid will be completed. The fourth wafer of the same wafer unit is used to send the function; the circle is used to export the unit to be equipped with: The wafer box of the shed is positioned to come to the direction of the missing or plural wafers. The circumference of the wafer periphery is attached to the drying function of the crystal cleaning unit; the transfer unit, the same solution of the first and the seventh invention of the box of each unit is the wafer polishing method of the fifth invention, It specifically intends to replace the above-mentioned wafer notch grinding unit by using a “location grinding unit” for mirror-polishing a crystal-cut tangent flat edge and a positioning oblique surface.

Page 9 1241229 V. Description of the invention (7) [Inventive embodiment] Fig. 3 is an external view of a wafer polishing apparatus according to an embodiment of the present invention. As shown in the figure, the wafer peripheral grinding device of the present embodiment is a solid cup that is entirely covered by the frame 10, and one portion thereof, the wafer cassette exit unit 2, is exposed. The wafer cassette receiving and discharging unit 2 only opens a few rows of wafers. The peripheral polishing device 1 is controlled by a control device for controlling the whole including other devices, and is provided at a height position outside the frame ^. The operation panel 丨 丨 and the display device 12 can be operated by the operator. The plurality of transparent windows 13 have a function of covering the whole, t The windows for observing the operation state of the polishing device 丨 on the outer periphery of the wafer from a suitable outside, and are detachable for repair, adjustment, and the like. / The wafer cassette receiving and discharging unit 2 has a shed-like structure. A wafer box 21 loaded with wafer evaluations before processing is placed on the entrance shed 21] = Into a horizontal state ', the wafer peripheral portion is taken from here and polished, and mirror polished. Finish mirror mounting. Place a round box there to make the wafers available; The outline of setting 1 is a plan view of the alignment unit 3, the wafer missing port V; V ^ 5, the internal transfer unit, and two ::: grinding unit device 49, second material supply device 59) (first material supply device) In addition, in this example, the early unit is installed in the frame 10, and the internal transfer unit is not described later. Page 10 1241229 5. Description of the invention (8) The unit 81 and the second transfer unit 82 are transferred by three The unit is constituted by a first transfer unit and a second transfer unit 83. The movement of m w (circle!) (indicated by arrows in Figure 4) is as follows. Initially, crystal 2. ^ ^, Placed in the wafer cassette 211 and placed in the wafer cassette receiving and discharging unit Stomach < Take out the wafer from the wafer box 211 and move it to the wafer alignment unit 3. On the wafer. Position the center of the wafer 3 so that the center of the wafer boundary comes to a predetermined position, and orient the notch in a predetermined direction. After adjusting the position and direction as described above, move to wafer notch grinding 疋 and perform notch grinding there. The positions of the wafers to be polished are as follows: to η: Min is the notch slope above and below—and the notch end surface Scn. After that, it is moved back to the peripheral grinding unit 5. Here, the circumferential portion, that is, the circumferential inclined surface Sb and the circumferential end surface Sc which are not up and down, is polished. After that, it is moved to the wafer cleaning unit 6 and is cleaned by the grinding operation in the wafer peripheral grinding unit 5 and the grinding operation in the round peripheral grinding unit 5. Further, the circle W 7 ′ can remove the cleaning liquid from the crystal by rotating the wafer with the cleaning liquid at high speed in the wafer cleaning 6. Yeyou can use any kind of crystal for pure water, alkaline or acidic solution. The cleaned 4 internal transport unit is composed of the aforementioned first-transport unit 82-second and third transport unit 83. Suppose: 20% more unit number or less unit number, can be moved by design, for example, can perform these functions through a transfer unit

1241229 V. Description of the invention (9) m 1 Another I'th—the conveying unit 81 has a mobile station 812 that can move on two linear tracks 8 ^ 1; a crotch 814 that can rotate on it; And the two arms with two joints and two holding parts provided in the cymbal mesh section 8 丨 4, the robot: the transfer robot can be regarded as the carcass and wrist of the human, in a state not shown by the κ line in FIG. 4 When the lower part of the drawing is regarded as the forward direction, the right and left wrists are prepared. 〃 Click ‘to explain the specific actions or functions of each unit according to the diagram. Figure 5 shows the main parts of the wafer cassette receiving / exporting unit 2 and the first transfer unit 81. The first transfer unit 81 is moved to the front of the wafer cassette 211, and the left wrist is extended, and the wafer w placed in a substantially horizontal state is pulled out from the wafer cassette 211 on the receiving and discharging shed 21 using the left-hand suction tray 813L. This = Attached disk 813R is empty. The wrist is closed and the first transfer unit 81 is moved to the left (Fig. 4), and stopped before the wafer alignment unit 3. The wafer alignment unit 3 is in a state of being loaded with the wafer w aligned with the complete position and direction (the state of being mounted on the stage 3 丨), and because the right-hand suction tray 813R has no items, the right hand is extended. The attached disk 813R lifts the wafer W. In this way, the right-hand suction pad 813r has alignment completion = wafer w, and the left-hand suction pad 813L has unfinished wafer w. Then, the left-hand suction tray 813 L is extended, so that the wafer W which has not been completely aligned is loaded on the table 31 of the wafer alignment unit 3. The state at this time is shown in FIG. 6. After the wafer is loaded, the first transfer unit 81 is in a state in which the right-hand suction tray 13R has a wafer w, and the left-hand suction tray 81 does not have any wafers. The wafer alignment unit 3 has a table 31, a positioning 32, and an orientation.

Page 12 1241229 V. Description of Invention (10) Set 33. Fig. 7 shows the night of wafer alignment unit 3, which is used to attract the holding wafer. At the moment, the stage 3 1 system has no attraction mechanism. The structure can be moved with slight force when placed on the stage 31. Q1 causes movement on the stage 31 when the BΗ circle is pushed in the main horizontal direction. Positioning device 32 is in this state, with the wheel of the outer diameter of the post-like / sixty-eight

W. -2, ,, B Make the center of wafer W and the center of stage 3 i. One wafer W will attract and hold on stage 31: the mechanism will move. 'Sound nγ Μ ^ ^ 疋 4 retreat 3 2 and retreat 3 1 started with a low connection and then turned around again. The heading device 33 is provided with a drive mechanism for a notch detection 3 console 31. The notch detection system walks around the wafer W. When a notch is detected, the rotation of the table 31 is stopped. Orientation heading device 33 The gap detector 331 can use a light-emitting part and a light-receiving part structure, a slight pressure to push and push, and a "quote" tester, etc., which can detect any form of the gap = The mechanical sense of the ^ is as described above. The wafer whose direction has been determined in the above manner is sucked by the same right-hand suction plate 第 of the first transfer unit 81 and removed from the wafer alignment unit 3. Therefore, the first transfer unit 81 is removed from the wafer alignment unit 3 = holding the fine R on the right hand, and turning it to the direction of the wafer notch grinding early element 4 and loading it into the wafer notch grinding unit 4. 4 on the table 44. The round-notch grinding unit 4 can be selected from various forms as disclosed in Japanese Patent Application Laid-Open No. 8_1 68947 or Japanese Patent Application No. 2 001-1 86523.

1241229 V. Description of the invention (11) Appropriate device. The wafer notch polishing is briefly described using FIG. 8 and FIG. 9 as an example. Fig. 8 is an oblique view showing the three inclined states of the table 44; and 70 is an enlarged view of a part of the main table 43 and two grinding tables. The wafer notches 1 to 4 are provided with the above-mentioned stage 44 and the main shaft stage 43 and are polished by the grinding table 41 and the grinding table 42 of the rotating shaft of the main researcher. Two mouths = formed at different angles to each other ..., there is a small grinding table 41 for mirror grinding the notch end surface Scn, and a% ^ grinding table 42 for mirror grinding notch bevel Sbn. Each ^ is formed by moving the spindle table 43 in the direction of the spindle. ^ "The table 44 is as shown by the dashed line in Fig. 8. Three oblique angles can be obtained. The upper and lower notch slopes Sbn are mirror-finished. (Solid line in Fig. 4) The first two Γ and daggers are rotated to supply the slurry to the grinding section. When the grinding is completed, the rotation does not become the initial position of the obstacle of the transport action and is retracted. Adding ii = mirror polishing The crystal is passed through the second transfer unit 82-4 Λ. The figure shows a schematic illustration of the second transfer unit 82, wafer notch grinding?? In the example, 10: the top is a linear-moving-type conveying unit, which is provided in the frame 822. The linear guide 821 and the movable body suspended above it are movable in the JL f 2Γ body 8 22 series, which are equipped with a vertically movable grip A shaft 823 and a holding portion 824 constituted by three holding claws provided with // below (lower end). Moving body page 14 1241229 V. Description of the invention (12) 822 can be moved in the wafer notch 5. Liu Yuedou,, soil,, < grinding 4, yen and yen circumference grinding unit handle Hold the axis ^ 'above the position of the sun net unit 6. The moving body 82 2 can lower = 823 to the wafer notch grinding unit', where any notched polished wafer W is raised ^ and moved along a straight track 821 ;:; Again: the person lowers the holding shaft 823 and lowers it, and holds it;] = part grinding unit 5 is held on the rotating table 55 of unit 5 because it is carried on the wafer circumference and is moved round = 时 第 —The slurry supply device 59 retreats to the position indicated by the solid line that does not interfere with the crystal 0 = green /, and turns to the dotted line position in Figure 4 to supply the slurry during grinding. Add 2 2: There is a vacuum chuck and the wafer W passes through the vacuum chuck. The two-circumferential wafer grinding unit 5 is attached to the turntable 55. Two or three semi-cylindrical first grinding tools 51 The second grinding tool 53 and the third grinding tool 53. Because the first grinding tool 51 is a circumferential bevel Sb 'of the second grinding tool 5 2 is pressing the circumferential end surface m and the grinding tool 53 is pressing the upper circumferential bevel Sb. And it is studied so that it has a polishing surface that roughly follows the curvature of the respective surface to be polished. When disturbing, each grinding tool is retracted to the non-grinding position. When the mirror grinding of the sloping surface sb and the circumferential end surface Sc is completed, each grinding flute I2: 53 is retreated to the dotted position in FIG. 10, and again The wafer W is removed from the turntable 55 through-> 1 + ^ single 疋 82. When the second transfer order = the wafer holding wafer W 'is moved again to the wafer grinding unit 5 located on the wafer circumference. Above the cleaning unit 6. In addition, the wafer notch polishing sheet

Page 15 1241229 V. Description of the invention (13), wafer mounting of Λ® circumferential grinding unit 5 and wafer cleaning unit 6: The position is on a straight line, and the distance between the first two is set by "H" m, the interval is the same, which can simplify the control of wafer transfer. = = Used to show the schematic top view of the wafer cleaning unit 6. ^ 1 1 'Side view of Erming wafer cleaning unit 6, wafer drying unit 7, and third moving S Ϊ j knife. The wafer cleaning unit 6 is provided with a roller 61 in a circular shape. Each wafer support roller 61-side keeps and matches * I 4 effect relationship can move forward and backward. Each of the wafer support rollers 61 includes a rounded portion 612 and a flange portion 611, and the driving source shown in the figure is a rotary drive. All of the circle support rollers 61 can be passed through and are not contained in: ί :; 1 circle production holding roller 61 is in the retracted position, and the circle W is held by Pei ^, after that, all wafer support rollers 61 —Mianbao Department is moving forward. The notch of wafer w coincides with a round branch: when this happens, the roller will not be recessed into the notch. By crystal 1W # Λ ^ ^-«W ^ κ ^ φ, 3 f, through the day-to-day back support roller 6 1 rotation drive. Cleaning == and 4 is provided with a pair of cleaning rollers 62 above and below. Each wheel; (3) the other two are supported on the front end side of the "衮" wheel arm 621, and the arm drive system is fixed to the arm shaft 622. The arm shaft 6 22 is transmitted through the second, and the movable shaft 6 23 can rotate relative to the chassis 10. Drive Pei Zhi624 through 4 talks with Ren Zhizhi ,, roller 62 is a rotary drive. For example, the transmission mechanism of a forbearance is added by a pulley and a belt, and the arm is moved through Λ circle ^., The moving device 623, and the roller arm 621 is rotated, and the two

1241229 V. Description of the invention (14) The cleaning roller 62 holds the crystal and sandwiches it into a sandwich. The wafer support roller 6H is positioned so as not to interfere with the cleaning roller. Then, nt = moving device 62 4 and the cleaning roller 6 is set. . Drive ^, in addition, the transparent support roller 61 starts to "turn ^ Temple to pour the washing liquid from the washing liquid nozzle 63 toward the ㈣. Crystal ， Γ :, while rotating through the rotating cleaning roller 6 卩-while in the previous step The slurry attached at that time is removed. In addition, the outside of the cleaning roller 62 is sponge or non-woven, and although it is elastic, it can be retreated to the company and the appropriate department through the rotation of the roller arm 621. The transport unit (the position where the second transport unit 82 and the third transport unit impede the internal operation) is completed. The crystals cleaned in the wafer cleaning unit 6 are completed, and the transmission unit 83 can pass through the wafer cleaning unit. 6 to take out. The third, third, and second conveying units are substantially the same linear moving shape-moving: early, 83, equipped with a linear track 831 and county 70 installed on the top plate of the machine frame, and moving mobile body 83 2. The moving body 832 is provided with three movable claws, 834, and 834, which can be moved up and down, and three holding claws provided at the front end (lower end). The moving body 832 can be moved to the wafer cleaning 6 and holding 4 sides. Position: Smuggling in the middle of the woods 7 above the moving body 8 32 series makes the holding shaft 8 33 down Lowered to wafer cleaning w a = was the wafer to be cleaned on the wafer support roller 61? ^ Put + '= and raise the holding axis 833 again' and follow the straight line to move the coffee. When the circular drying unit 7 is lowered, it will hold the crystals to the plurality of holding claws 7 on the rotating table 75 of the drying unit 7 and load them on the round book AW. Each holding claw

Page 17 1241229

V. Description of the invention (15) The 751 series is set at equal distances from rotating a φ, and supporting the crystal U] QW u 7 Μ. When the liquid is scattered toward the center, Γ does not make the liquid handle ^ claw 751 is a kind of centrifugal force A structure for cleaning the contact area of W. / The way to stay in the contact part is reduced and the wafer circle w is cleaned and cleaned at night. Set 752 is to rotate the rotary table 75 at high speed, and it is attached to the crystalline cover. Round ¥ dry. In addition, the ring is loaded or unloaded. ♦ Move ^^ / retreat to the bottom to perform wafer W core dehydration). When s is moved to the bottom, the drying operation can be performed (depending on the moving distance; when the circle is dried, the cover 76 is lowered, and the wafer w can be moved through the first to the current: stop: 疋 turntable 75 Unloading τ. The first transfer unit 81; and the bonus and the left-hand suction tray are both rotated by hand m, and then follow; Yes. The first transfer unit that removes the wafer $ is received into the discharge shed 21: ==: Wafer ^ of the wafer box 211

It is initially loaded on the take-out section nw moving linear track 811. The wafer U is the same slit in the same wafer box 211 as the wafer. Wafer W is outside the wafer% / Grinding device 1 after each wafer box 21 1 of the round box received by the grinding process is also in the same crystal system due to wafer box 2 ", and: = 卢A piece of crystal that is managed can simplify management and reduce management burden. Therefore, the order of processing has not changed, so in this example, Φ, 4_ company, two wafer cassettes 2 1 1 are placed in the receiving and discharging.

Page 18 1241229

V. Description of the invention (16) Shed 21. This is because even after grinding all the wafers-each wafer 211 is sent to the next step, the mirror polishing operation can be performed on the aa wafer ^ in the other wafer cassette 2U, so no time will occur. Missing, == volume production. In addition, the first conveying unit 81 in this embodiment is a conveying robot having two joints and two gripping portions, so that it can be seen in the shape of a bending arm. Turn and reduce the turning radius. Therefore, even in the column formed by the wafer gap ^ = 4, the wafer peripheral grinding unit 5 and the wafer cleaning unit 6 ', and the wafer cassette receiving and discharging unit 2 and wafer alignment unit 3 It is not necessary to place such a wide area between the columns. Therefore, it is possible to reduce the entire polishing device for the peripheral portion of the wafer, and to reduce the machine area. However, the first conveying unit 81 may use other shape = two conveying units. In the above embodiments, the wafer notch grinding unit 4 and the wafer peripheral grinding unit 5 perform mirror polishing of the wafer in the above-mentioned order, and the order may be reversed or repeated iteratively. After polishing the wafer circumferential portion, in order to widely mirror the wafer notch, the direction of the notch must be determined at this time. However, the servo horse can be used for the mirror polishing of the circle grinding unit 5; Determines the direction in which to stop rotation. When the server described is used for mirror polishing of wafers with positioning planes described later, wafer grippers are generally used to prevent the wafer from failing to hold on the hooking plane. It is also possible to use pins to orient the wafer during transfer. Ά In addition, the wafer notch grinding unit 4 and the wafer peripheral grinding unit 5 are

1241229 V. Description of the invention (17) Each unit is mirror polished and then polished. In addition, the first part is only to take out or fill the notch that is explained for the current situation, and the straight arc-shaped defect is used to supply the cylindrical slurry to the grinding. According to the present invention, a positioning plane circular notch grinding sheet is attached. [Invention Effect] As described above, each wafer is ground through both the end surface and the inclined surface of the notch or the peripheral portion, and the end surface and the inclined surface can be researched in different units. Removal or loading can also be set to live on one wrist.止 'includes a wafer peripheral portion and a notch for a semiconductor wafer. As is known to all, the semiconductor wafer is not provided with a port called a crystalline tangent flat edge (commonly referred to as a positioning plane) as described above. When polishing a wafer having the positioning plane, a side surface of the f tool can be brought into contact with the positioning plane, and a positioning plane polishing device for mirror-polishing the material portion is used. Therefore, when polishing wafers as described above in a wafer wrist peripheral grinding device, a positioning plane polishing unit can be used instead of the crystal 4 as a plane polishing device. Also: In the wafer polishing apparatus, even the order of the wafers can be used to simplify the & and reduce the wafer management load.

1241229 Schematic illustration [Schematic illustration] Figure 1 (A) is the semiconductor wafer,

A partial cross-sectional view. It is a + conductor wafer W. FIG. 2 is an oblique view showing an enlarged notch N and its periphery. The diagram outside I3 shows the outline of the Γ of the wafer wrist peripheral grinding device according to the embodiment of the present invention. The figure illustrates the grinding peripheral part of the wafer outside the embodiment of the present invention. The diagram shows the wafer. The cassette receiving / discharging port 2 and the first conveying unit 8] [m3] m] are explanatory diagrams when an unfinished wafer w is loaded on the wafer alignment table 31. Figure 7 is a bottom view of the main part of the wafer alignment unit 3. Status: 8 :: The figure shows the center of the wafer notch grinding unit 4 ^: of the table: 卩 9: The spindle table 43 and the tenth place in the Λ-round notch grinding unit 4 are shown in the figure 10, the second transfer unit 82, and the wafer notch grinding A schematic explanatory diagram of the unit 4 and the wafer peripheral grinding unit 5. FIG. 11 is a schematic bottom view showing the wafer cleaning unit 6. Figure 12 is for explaining wafer cleaning unit 6, wafer drying unit? 3. Partial side view of moving single tl83. [Description of component symbols] 1 Wafer peripheral grinding device 1241229 Brief description of the diagram 2 Wafer cassette receiving and discharging α single 3 Wafer alignment unit 4 Wafer lacking σ Grinding unit 5 Wafer peripheral grinding unit 6 Wafer cleaning Unit 7 Wafer drying unit 10 Frame 11 Operating panel 12 Display device 13 Transparent window 21 Receiving and discharging shed 31 ^ 44 Platform 32 Positioning device 33 Orientation device 41 ^ 42 Grinding table 43 Spindle table 49 First slurry supply device 51 First Grinding Tool 52 Second Grinding Tool 53 Second Grinding Tool 55 ^ 75 Rotary Table 59 No.-Slurry Supply Device 61 Wafer Support Roller 62 Cleaning Roller ❿

Page 1241229

Simple illustration on page 23 63 Cleaning liquid nozzle 76 Cover 81 First transfer unit 82 Second transfer unit 83 Third transfer unit 211 Wafer case 331 Notch detector 611 Flange portion 612 Cylinder portion 621 Roller arm 622 Arm shaft 623 Arm drive 624 Roller drive 751 Holding claw 752 Drive 811, 821, 831 Linear rail 812 Moving table 813 Suction plate 813L Left-hand suction plate 813R Right-hand suction plate 814 Body 822 > 832 Moving body 823 ^ 833 Holding shaft 824 ^ 834 Holding portion 1241229 Schematic description of Ναα Sb circumferential bevel Sbn missing D bevel Sc circumferential end Sen missing V end Sp pattern forming surface W wafer IΗΗI page 24

Claims (1)

1241229 6. Scope of patent application [Scope of patent application] 1. A wafer polishing device, which includes: a wafer box receiving and discharging unit; wafer alignment unit; wafer notch grinding unit; wafer peripheral grinding unit; crystal The round washing early element, the wafer drying unit, and the wafer transfer unit are characterized in that the wafer box receiving and discharging unit is provided with: a receiving and discharging shed for loading the wafer box containing the wafer box, and The wafer alignment unit is provided with the following functions: when loading the wafer, positioning the wafer to a predetermined position in the center of the wafer, and aligning the notch in a predetermined direction; The notch grinding unit is provided with: a wafer notch grinding function for mirror-polishing the notch slope and the notch end face of the wafer notch grinding, and the wafer peripheral grinding unit is provided with: for mirror grinding the wafer circumference Wafer peripheral part grinding function of the circumferential inclined surface and the peripheral end surface of the wafer 'The wafer cleaning unit is provided with: Clean the contamination of the wafers due to the above polishing operation. Page 1241229 Scope of patent application The above-mentioned crystal drying unit has: ## 1 π & θ9 WK < drying function, because the cleaning in the wafer cleaning unit is used to remove the cleaning liquid from the cleaning liquid attached thereto. The transport unit is equipped with ... Take out a wafer from the slit of the wafer box placed in the receiving and discharging port of the wafer box receiving and discharging unit, and use it to load the wafer into the first transfer function of the crystal Q alignment early element; Take out the wafer that has been positioned and oriented from the wafer alignment unit, and use it to load the wafer into the second transfer function of the wafer notch grinding unit; take out the notch slope and notch from the wafer notch grinding unit The third surface transfer function is used to load the wafer with mirror-polished wafer on the end surface, and load the wafer into the circumferential grinding unit; take out the wafer with the circumferentially inclined surface and the wafer whose mirror is polished on the circumferential end surface from the wafer circumferential-grinding unit. And a fourth transfer function for loading the wafer in the wafer cleaning unit, taking out the cleaned wafer from the wafer cleaning unit, and loading the wafer on the wafer for drying The fifth transfer function of the unit; and taking out the cleaned wafer from the wafer drying unit, and loading the wafer onto the wafer on which the wafer is received from the wafer cassette into the discharge port unit In the box Sixth same slit of the transport unit. 2 · —A kind of wafer polishing device, which has: Wafer box receiving and discharging unit; Wafer alignment unit; Wafer notch grinding unit; Wafer peripheral grinding unit; Wafer cleaning unit; Page 26 1241229 and VI. Patent application scope Wafer drying unit Wafer transfer unit, characterized in that: The above-mentioned wafer box receiving and discharging unit is used for loading the wafer positioning unit containing the wafer box. The unit includes: loading The above-mentioned crystal has a predetermined position in the center, and uses a predetermined alignment function. The above-mentioned crystal is used to mirror-polish the wafer notch grinding function provided on the wafer, and the above-mentioned crystal is used to mirror-polish the wafer set on the wafer. The circular peripheral part has a polishing function for cleaning with a cleaning solution. The wafer drying unit is provided with a receiving and discharging shed for the box, and when the wafer is round, the wafer is positioned so that The notch is oriented toward the pre-round notch. The grinding unit is provided with a notched bevel and a notched end surface. The circumferential grinding unit is provided with a circumferential bevel and a circumferential end surface. The circular cleaning unit is provided with: grinding operation. The fouling system attached to the wafer is equipped with: «Due to the drying function of the cleaning and removing cleaning liquid in the wafer cleaning unit, the first transfer order 2. The second transfer order, wherein the first transfer unit is provided with wafers taken out from the slits placed in the wafer cassette received and described in the wafer cassette, and the first transfer function of the circular registration unit is positioned and oriented. The second transfer function of the notch grinding unit takes out the cleaned wafer, and the wafer transfer unit is used to clean the wafer with the cleaning liquid attached to it. The wafer transfer unit is composed of: yuan and the third transfer unit, and the exit The above-mentioned unit of the unit is received on the shed to load the wafer into the crystal; taken out of the wafer alignment unit, and used to load the wafer into the wafer energy; and from the wafer drying unit, The wafer is loaded on the wafer from above The wafer cassette is received into the same slit in the wafer cassette on the discharge port unit.