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TWD226028S - 半導體檢測針 - Google Patents

半導體檢測針 Download PDF

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Publication number
TWD226028S
TWD226028S TW111305316F TW111305316F TWD226028S TW D226028 S TWD226028 S TW D226028S TW 111305316 F TW111305316 F TW 111305316F TW 111305316 F TW111305316 F TW 111305316F TW D226028 S TWD226028 S TW D226028S
Authority
TW
Taiwan
Prior art keywords
probe pin
semiconductor probe
semiconductor
item
design
Prior art date
Application number
TW111305316F
Other languages
English (en)
Inventor
安範模
Original Assignee
南韓商普因特工程有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 南韓商普因特工程有限公司 filed Critical 南韓商普因特工程有限公司
Publication of TWD226028S publication Critical patent/TWD226028S/zh

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Abstract

【物品用途】;本設計物品是一種半導體檢測針，用於通過接觸半導體晶片或半導體器件等物體來檢查物體是否有缺陷。本設計物品的材質為金屬。;【設計說明】;無。

Description

半導體檢測針
本設計物品是一種半導體檢測針，用於通過接觸半導體晶片或半導體器件等物體來檢查物體是否有缺陷。本設計物品的材質為金屬。
無。
TW111305316F 2022-04-29 2022-10-27 半導體檢測針 TWD226028S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20220017284 2022-04-29
KR30-2022-0017284 2022-04-29

Publications (1)

Publication Number Publication Date
TWD226028S true TWD226028S (zh) 2023-06-21

Family

ID=88880621

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111305316F TWD226028S (zh) 2022-04-29 2022-10-27 半導體檢測針

Country Status (2)

Country Link
US (1) USD1030689S1 (zh)
TW (1) TWD226028S (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD240363S (zh) 2024-10-03 2025-09-11 中勤實業股份有限公司 桃園市龜山區頂湖一街16號 (中華民國) 基板容器之蓋體用的支承結構

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD240363S (zh) 2024-10-03 2025-09-11 中勤實業股份有限公司 桃園市龜山區頂湖一街16號 (中華民國) 基板容器之蓋體用的支承結構

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