TWD206651S - 功率模組 - Google Patents
功率模組 Download PDFInfo
- Publication number
- TWD206651S TWD206651S TW109302243F TW109302243F TWD206651S TW D206651 S TWD206651 S TW D206651S TW 109302243 F TW109302243 F TW 109302243F TW 109302243 F TW109302243 F TW 109302243F TW D206651 S TWD206651 S TW D206651S
- Authority
- TW
- Taiwan
- Prior art keywords
- power module
- design
- drive
- dotted line
- case
- Prior art date
Links
- 238000010586 diagram Methods 0.000 description 1
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Abstract
【物品用途】;本設計係指一種用於控制及驅動之功率模組。;【設計說明】;圖式所揭露之虛線部分,為本案不主張設計之部分。
Description
本設計係指一種用於控制及驅動之功率模組。
圖式所揭露之虛線部分,為本案不主張設計之部分。
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW109302243F TWD206651S (zh) | 2020-04-24 | 2020-04-24 | 功率模組 |
| US29/738,677 USD976852S1 (en) | 2020-04-24 | 2020-06-18 | Power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW109302243F TWD206651S (zh) | 2020-04-24 | 2020-04-24 | 功率模組 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD206651S true TWD206651S (zh) | 2020-08-21 |
Family
ID=85025004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW109302243F TWD206651S (zh) | 2020-04-24 | 2020-04-24 | 功率模組 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD976852S1 (zh) |
| TW (1) | TWD206651S (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1090465S1 (en) | 2024-03-05 | 2025-08-26 | Industrial Technology Research Institute | Power module housing |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1034492S1 (en) * | 2021-10-04 | 2024-07-09 | Transportation Ip Holdings, Llc | Housing for a full phase module gate drive |
| USD1039243S1 (en) * | 2021-10-08 | 2024-08-20 | Mahdi Al-Husseini | Mortarboard with electronic tube display |
| JP1713167S (ja) * | 2021-11-17 | 2022-04-21 | 半導体モジュール | |
| USD1078668S1 (en) * | 2023-05-22 | 2025-06-10 | Semikron Danfoss International GmbH | Semiconductor power module for vehicles |
| USD1099055S1 (en) * | 2023-08-31 | 2025-10-21 | Xpt Eds (Hefei) Co., Ltd. | Power semiconductor module |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD188003S (zh) | 2017-06-14 | 2018-01-21 | 慶良電子股份有限公司 | 電連接器之部分 |
Family Cites Families (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020034088A1 (en) * | 2000-09-20 | 2002-03-21 | Scott Parkhill | Leadframe-based module DC bus design to reduce module inductance |
| USD466076S1 (en) | 2001-06-18 | 2002-11-26 | Kabushiki Kaisha Toshiba | Power converter |
| USD503149S1 (en) * | 2003-05-19 | 2005-03-22 | Kabushiki Kaisha Toshiba | Power converter |
| US7573107B2 (en) | 2004-09-23 | 2009-08-11 | International Rectifier Corporation | Power module |
| USD556686S1 (en) * | 2006-04-27 | 2007-12-04 | Hitachi, Ltd. | Power module for power inverter |
| USD587662S1 (en) * | 2007-12-20 | 2009-03-03 | Fuji Electric Device Technology Co., Ltd. | Semiconductor device |
| USD653634S1 (en) * | 2010-10-28 | 2012-02-07 | Fuji Electric Co., Ltd. | Semiconductor |
| USD689446S1 (en) * | 2010-10-28 | 2013-09-10 | Fuji Electric Co., Ltd. | Semiconductor |
| USD653633S1 (en) * | 2010-12-14 | 2012-02-07 | Fuji Electric Co., Ltd. | Semiconductor |
| US9001518B2 (en) | 2011-04-26 | 2015-04-07 | International Rectifier Corporation | Power module with press-fit clamps |
| USD686174S1 (en) * | 2011-08-12 | 2013-07-16 | Fuji Electric Co., Ltd | Semiconductor device |
| JP2013051366A (ja) * | 2011-08-31 | 2013-03-14 | Hitachi Ltd | パワーモジュール及びその製造方法 |
| US10122293B2 (en) | 2012-01-17 | 2018-11-06 | Infineon Technologies Americas Corp. | Power module package having a multi-phase inverter and power factor correction |
| CN104620377B (zh) * | 2012-10-29 | 2017-09-01 | 富士电机株式会社 | 半导体装置 |
| USD754084S1 (en) * | 2013-08-21 | 2016-04-19 | Mitsubishi Electric Corporation | Semiconductor device |
| USD775091S1 (en) * | 2014-08-19 | 2016-12-27 | Infineon Technologies Ag | Power semiconductor module |
| JP1536191S (zh) * | 2014-08-19 | 2015-10-26 | ||
| USD776071S1 (en) * | 2014-08-19 | 2017-01-10 | Infineon Technologies Ag | Power semiconductor module |
| USD774479S1 (en) * | 2014-11-28 | 2016-12-20 | Fuji Electric Co., Ltd. | Semiconductor module |
| JP6361821B2 (ja) * | 2015-04-27 | 2018-07-25 | 富士電機株式会社 | 半導体装置 |
| CN108141976B (zh) * | 2016-03-22 | 2020-05-05 | 富士电机株式会社 | 外壳、半导体装置和外壳的制造方法 |
| JP6838298B2 (ja) * | 2016-06-22 | 2021-03-03 | 富士電機株式会社 | 半導体装置及び半導体装置の製造方法 |
| JP6984127B2 (ja) * | 2016-12-28 | 2021-12-17 | 富士電機株式会社 | 半導体装置および半導体装置の製造方法 |
| CN110383475B (zh) * | 2017-03-14 | 2023-06-06 | 罗姆股份有限公司 | 半导体装置 |
| CN117393509A (zh) * | 2017-04-20 | 2024-01-12 | 罗姆股份有限公司 | 半导体器件 |
| USD864884S1 (en) * | 2017-10-23 | 2019-10-29 | Mitsubishi Electric Corporation | Semiconductor device |
| JP1649258S (ja) * | 2019-01-11 | 2022-12-21 | 半導体モジュール | |
| JP1650295S (ja) * | 2019-01-11 | 2020-01-20 | 半導体モジュール | |
| JP1644633S (zh) * | 2019-03-26 | 2019-11-05 | ||
| USD903611S1 (en) * | 2019-03-29 | 2020-12-01 | Mitsubishi Electric Corporation | Semiconductor device |
| US20210175155A1 (en) * | 2019-12-06 | 2021-06-10 | Alpha And Omega Semiconductor (Cayman) Ltd. | Power module having interconnected base plate with molded metal and method of making the same |
| JP1669329S (zh) * | 2020-03-13 | 2020-10-05 |
-
2020
- 2020-04-24 TW TW109302243F patent/TWD206651S/zh unknown
- 2020-06-18 US US29/738,677 patent/USD976852S1/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD188003S (zh) | 2017-06-14 | 2018-01-21 | 慶良電子股份有限公司 | 電連接器之部分 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1090465S1 (en) | 2024-03-05 | 2025-08-26 | Industrial Technology Research Institute | Power module housing |
Also Published As
| Publication number | Publication date |
|---|---|
| USD976852S1 (en) | 2023-01-31 |
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