[go: up one dir, main page]

TWD143605S1 - Light-emitting diode - Google Patents

Light-emitting diode

Info

Publication number
TWD143605S1
TWD143605S1 TW099306260F TW99306260F TWD143605S1 TW D143605 S1 TWD143605 S1 TW D143605S1 TW 099306260 F TW099306260 F TW 099306260F TW 99306260 F TW99306260 F TW 99306260F TW D143605 S1 TWD143605 S1 TW D143605S1
Authority
TW
Taiwan
Prior art keywords
small
light
soldering pad
emitting diode
creation
Prior art date
Application number
TW099306260F
Other languages
Chinese (zh)
Inventor
Satoshi Shimizu
Kazuhisa Iwashita
Tatsuo Tonedachi
Kazuhiro Inoue
Teruo Takeuchi
Original Assignee
東芝股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東芝股份有限公司 filed Critical 東芝股份有限公司
Publication of TWD143605S1 publication Critical patent/TWD143605S1/en

Links

Abstract

【物品用途】;本創作的物品是發光二極體，作為電氣機器等之光源使用的發光二極體。;【創作特點】;如各圖所示，是將焊接墊封裝在透明之扁矩形狀的樹脂封裝體內，該焊接墊大體上是由兩塊一大一小的板體所構成，在大的板體上配置兩個小方塊，同時在小的板體的右下方配置一個小方塊，該些板體之間以金屬線連接；另外，該些焊接墊係如「以斜格線表示透明部之背面立體圖」所示，其一部分的底面及四周面分別露出於樹脂封裝體的外表面。[Purpose of the article]; The article in this creation is a light-emitting diode, which is used as a light source for electrical equipment, etc.; [Features of the creation]; As shown in the figures, the soldering pad is encapsulated in a transparent flat rectangular resin package. The soldering pad is generally composed of two plates, one large and one small. Two small squares are arranged on the large plate, and a small square is arranged at the lower right of the small plate. The plates are connected by metal wires; in addition, as shown in the "three-dimensional back view of the transparent part indicated by oblique grid lines", the bottom surface and surrounding surfaces of a part of the soldering pad are exposed on the outer surface of the resin package.

TW099306260F 2010-09-29 2010-12-06 Light-emitting diode TWD143605S1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010023305 2010-09-29

Publications (1)

Publication Number Publication Date
TWD143605S1 true TWD143605S1 (en) 2011-11-01

Family

ID=44486627

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099306260F TWD143605S1 (en) 2010-09-29 2010-12-06 Light-emitting diode

Country Status (2)

Country Link
US (1) USD644190S1 (en)
TW (1) TWD143605S1 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD658606S1 (en) * 2010-09-29 2012-05-01 Kabushiki Kaisha Toshiba Portion of a light-emitting diode
USD656469S1 (en) * 2011-04-28 2012-03-27 Kabushiki Kaisha Toshiba Portion of a light-emitting diode
TWD145643S (en) * 2011-04-28 2012-03-01 東芝股份有限公司 Light-emitting diode
USD674757S1 (en) * 2011-10-31 2013-01-22 Silitek Electronics (Guangzhou) Co., Ltd. Package carrier of light emitting diode
USD674758S1 (en) * 2011-10-31 2013-01-22 Silitek Electronic (Guangzhou) Co., Ltd. Light emitting diode
USD674360S1 (en) * 2012-03-30 2013-01-15 Silitek Electronic (Guangzhou) Co., Ltd. LED package
USD674362S1 (en) * 2012-03-30 2013-01-15 Silitek Electronic (Guangzhou) Co., Ltd. LED package
USD674363S1 (en) * 2012-03-30 2013-01-15 Silitek Electronic (Guangzhou) Co., Ltd. LED package
USD674358S1 (en) * 2012-03-30 2013-01-15 Silitek Electronic (Guangzhou) Co., Ltd. LED package
USD674359S1 (en) * 2012-03-30 2013-01-15 Silitek Electronic (Guangzhou) Co., Ltd. LED package
USD674357S1 (en) * 2012-03-30 2013-01-15 Silitek Electronic (Guangzhou) Co., Ltd. LED package
USD1089808S1 (en) * 2021-01-20 2025-08-19 Hamamatsu Photonics K.K. Light-emitting element module
JP1701505S (en) * 2021-01-20 2021-12-06
JP1701619S (en) 2021-01-20 2021-12-06
USD1083850S1 (en) 2021-01-20 2025-07-15 Hamamatsu Photonics K.K. Light-emitting element module
JP1712335S (en) 2021-01-20 2022-04-12 Light emitting element module

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6747341B2 (en) * 2002-06-27 2004-06-08 Semiconductor Components Industries, L.L.C. Integrated circuit and laminated leadframe package
US6995315B2 (en) * 2003-08-26 2006-02-07 Allegro Microsystems, Inc. Current sensor
US7709754B2 (en) * 2003-08-26 2010-05-04 Allegro Microsystems, Inc. Current sensor
US7242076B2 (en) * 2004-05-18 2007-07-10 Fairchild Semiconductor Corporation Packaged integrated circuit with MLP leadframe and method of making same
USD511328S1 (en) * 2004-06-23 2005-11-08 Harvatek Corporation Light-emitting diode
US7759775B2 (en) * 2004-07-20 2010-07-20 Alpha And Omega Semiconductor Incorporated High current semiconductor power device SOIC package
USD509809S1 (en) * 2004-08-10 2005-09-20 Harvatek Corporation Metal base design for surface mount device LED
USD506187S1 (en) * 2004-10-12 2005-06-14 Harvatek Corporation Metal base design for surface mount device LED (light emitting diode)
US7511361B2 (en) * 2005-01-05 2009-03-31 Xiaotian Zhang DFN semiconductor package having reduced electrical resistance
US7211882B2 (en) * 2005-03-22 2007-05-01 Harvatek Corporation LED package structure and method for making the same
US7868432B2 (en) * 2006-02-13 2011-01-11 Fairchild Semiconductor Corporation Multi-chip module for battery power control
TWD130663S1 (en) * 2007-06-14 2009-09-01 羅姆電子股份有限公司 Light-emitting diode module
US7714334B2 (en) * 2007-08-16 2010-05-11 Lin Peter P W Polarless surface mounting light emitting diode
USD599303S1 (en) * 2007-12-05 2009-09-01 Seoul Semiconductor Co., Ltd. Light emitting diode (LED)
US8106406B2 (en) * 2008-01-09 2012-01-31 Fairchild Semiconductor Corporation Die package including substrate with molded device
US20090278241A1 (en) * 2008-05-08 2009-11-12 Yong Liu Semiconductor die package including die stacked on premolded substrate including die
US7776658B2 (en) * 2008-08-07 2010-08-17 Alpha And Omega Semiconductor, Inc. Compact co-packaged semiconductor dies with elevation-adaptive interconnection plates

Also Published As

Publication number Publication date
USD644190S1 (en) 2011-08-30

Similar Documents

Publication Publication Date Title
TWD143605S1 (en) Light-emitting diode
TWD140389S1 (en) Light-emitting diode
TWD141371S1 (en) Light-emitting diode
TWD138653S1 (en) Light-emitting diode
USD749051S1 (en) Light emitting diode (LED) package
USD709464S1 (en) Light emitting diode (LED) package
TWD143606S1 (en) Light-emitting diode
USD691745S1 (en) Light emitting diode lamp
JP2013539051A5 (en)
IN2014CN03370A (en)
WO2012067723A3 (en) Board assemblies, light emitting device assemblies, and methods of making the same
TWD143386S1 (en) LED Package Carrier
USD847102S1 (en) Light emitting diode
TWD158547S (en) Lid of junction box
TWD146854S (en) Light emitting diode package
EP2492586A3 (en) Lighting device
SG196747A1 (en) Thinned and flexible semiconductor elements on three dimensional surfaces
TWD145643S (en) Light-emitting diode
WO2012116157A3 (en) Chip module embedded in pcb substrate
TWD147384S (en) Light emitting diode package
TWD148148S (en) Led chip
USD717486S1 (en) Surface mounted confinement light fixture
TWD146855S (en) Light emitting diode lead-frame
TWD148152S (en) Led chip
JP2010267910A5 (en)