TW527099U - Heat dissipation plate having gained heat dissipation efficiency - Google Patents

Heat dissipation plate having gained heat dissipation efficiency

Info

Publication number: TW527099U
Authority: TW; Taiwan
Prior art keywords: heat dissipation; gained; efficiency; plate; dissipation plate
Prior art date: 2002-07-19

Application number

TW091211096U

Other languages

English (en)

Inventor

Hai-Ching Lin

Original Assignee

Hai-Ching Lin

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2002-07-19

Filing date

2002-07-19

Publication date

2003-04-01

2002-07-19 Application filed by Hai-Ching Lin filed Critical Hai-Ching Lin

2002-07-19 Priority to TW091211096U priority Critical patent/TW527099U/zh

2003-04-01 Publication of TW527099U publication Critical patent/TW527099U/zh

2003-07-16 Priority to JP2003270136U priority patent/JP3099275U/ja

2003-07-16 Priority to US10/619,593 priority patent/US20040031589A1/en

2003-07-17 Priority to DE20311052U priority patent/DE20311052U1/de

Classifications

- H10W40/43—

TW091211096U 2002-07-19 2002-07-19 Heat dissipation plate having gained heat dissipation efficiency TW527099U (en)

Priority Applications (4)

Application Number	Priority Date	Filing Date	Title
TW091211096U TW527099U (en)	2002-07-19	2002-07-19	Heat dissipation plate having gained heat dissipation efficiency
JP2003270136U JP3099275U (ja)	2002-07-19	2003-07-16	ヒートシンク用導風装置
US10/619,593 US20040031589A1 (en)	2002-07-19	2003-07-16	Air guide apparatus of heat sink
DE20311052U DE20311052U1 (de)	2002-07-19	2003-07-17	Luftführung für eine Wärmesenke

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
TW091211096U TW527099U (en)	2002-07-19	2002-07-19	Heat dissipation plate having gained heat dissipation efficiency

Publications (1)

Publication Number	Publication Date
TW527099U true TW527099U (en)	2003-04-01

Family

ID=28451985

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW091211096U TW527099U (en)	2002-07-19	2002-07-19	Heat dissipation plate having gained heat dissipation efficiency

Country Status (4)

Country	Link
US (1)	US20040031589A1 (zh)
JP (1)	JP3099275U (zh)
DE (1)	DE20311052U1 (zh)
TW (1)	TW527099U (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWM248226U (en) *	2003-10-17	2004-10-21	Hon Hai Prec Ind Co Ltd	Heat dissipating device
US7159649B2 (en) *	2004-03-11	2007-01-09	Thermal Corp.	Air-to-air heat exchanger
US7038911B2 (en) *	2004-06-30	2006-05-02	International Business Machines Corporation	Push-pull dual fan fansink
CN2752958Y (zh) *	2004-09-03	2006-01-18	东莞莫仕连接器有限公司	带导流结构的散热装置
US20060102319A1 (en) *	2004-11-16	2006-05-18	Asia Vital Component Co., Ltd.	Heat dissipation enhancing device
TWI264271B (en) *	2005-05-13	2006-10-11	Delta Electronics Inc	Heat sink
TWI289648B (en) *	2005-07-07	2007-11-11	Ama Precision Inc	Heat sink structure
TWI308050B (en) *	2006-02-14	2009-03-21	Asustek Comp Inc	Heat-sink with slant fins
TWM336475U (en) *	2008-03-03	2008-07-11	Tai Sol Electronics Co Ltd	Heat dissipater with internal flow guiding function
TWM380512U (en) *	2009-10-29	2010-05-11	Wistron Corp	Heat sink and heat-dissipation fins thereof
CN104602469B (zh) *	2015-01-15	2017-09-26	华为技术有限公司	机柜
EP4113049B1 (en) *	2021-06-29	2024-09-04	ABB Schweiz AG	Heat exchanger, cooled device assembly comprising the heat exchanger, and method for manufacturing the heat exchanger

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH062314Y2 (ja) *	1989-08-30	1994-01-19	ナカミチ株式会社	放熱装置
US5158136A (en) *	1991-11-12	1992-10-27	At&T Laboratories	Pin fin heat sink including flow enhancement
US5375655A (en) *	1993-03-31	1994-12-27	Lee; Yong N.	Heat sink apparatus
TW307837B (zh) *	1995-05-30	1997-06-11	Fujikura Kk
US5734552A (en) *	1996-06-21	1998-03-31	Sun Microsystems, Inc.	Airfoil deflector for cooling components
US5957194A (en) *	1996-06-27	1999-09-28	Advanced Thermal Solutions, Inc.	Plate fin heat exchanger having fluid control means
US6110306A (en) *	1999-11-18	2000-08-29	The United States Of America As Represented By The Secretary Of The Navy	Complexed liquid fuel compositions
US20020109970A1 (en) *	2000-12-18	2002-08-15	Samsung Electro-Mechanics Co., Ltd.	Heat sink for cooling electronic chip
JP2002368468A (ja) *	2001-06-07	2002-12-20	Matsushita Electric Ind Co Ltd	ヒートシンクとその製造方法およびそれを用いた冷却装置
TW529737U (en) *	2001-06-20	2003-04-21	Foxconn Prec Components Co Ltd	Heat sink apparatus
US6637502B1 (en) *	2002-04-16	2003-10-28	Thermal Corp.	Heat sink with converging device

2002
- 2002-07-19 TW TW091211096U patent/TW527099U/zh not_active IP Right Cessation
2003
- 2003-07-16 JP JP2003270136U patent/JP3099275U/ja not_active Expired - Fee Related
- 2003-07-16 US US10/619,593 patent/US20040031589A1/en not_active Abandoned
- 2003-07-17 DE DE20311052U patent/DE20311052U1/de not_active Expired - Lifetime

Also Published As

Publication number	Publication date
US20040031589A1 (en)	2004-02-19
DE20311052U1 (de)	2003-12-04
JP3099275U (ja)	2004-04-02

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Legal Events

Date	Code	Title	Description
2003-08-01	GD4K	Issue of patent certificate for granted utility model filed before june 30, 2004
2007-05-21	MM4K	Annulment or lapse of a utility model due to non-payment of fees