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TW356602B - Application-specific integrated semiconductor product with dummy-elements as well as logic element and method to the design of application-specific integrated semiconductor basically no change of design is necessary for processing of memory unit for semiconductor product - Google Patents

Application-specific integrated semiconductor product with dummy-elements as well as logic element and method to the design of application-specific integrated semiconductor basically no change of design is necessary for processing of memory unit for semiconductor product

Info

Publication number
TW356602B
TW356602B TW086119584A TW86119584A TW356602B TW 356602 B TW356602 B TW 356602B TW 086119584 A TW086119584 A TW 086119584A TW 86119584 A TW86119584 A TW 86119584A TW 356602 B TW356602 B TW 356602B
Authority
TW
Taiwan
Prior art keywords
application
specific integrated
design
integrated semiconductor
semiconductor product
Prior art date
Application number
TW086119584A
Other languages
English (en)
Inventor
Christoph Ludwig
Bjoern Steurich
Markus Huebl
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Application granted granted Critical
Publication of TW356602B publication Critical patent/TW356602B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/90—Masterslice integrated circuits
    • H10D84/903—Masterslice integrated circuits comprising field effect technology
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/90—Masterslice integrated circuits
    • H10D84/903—Masterslice integrated circuits comprising field effect technology
    • H10D84/907—CMOS gate arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/10—Integrated device layouts

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Semiconductor Memories (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
TW086119584A 1997-01-31 1997-12-23 Application-specific integrated semiconductor product with dummy-elements as well as logic element and method to the design of application-specific integrated semiconductor basically no change of design is necessary for processing of memory unit for semiconductor product TW356602B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19703611A DE19703611A1 (de) 1997-01-31 1997-01-31 Anwendungsspezifisches integriertes Halbleiterprodukt mit Dummy-Elementen

Publications (1)

Publication Number Publication Date
TW356602B true TW356602B (en) 1999-04-21

Family

ID=7818926

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086119584A TW356602B (en) 1997-01-31 1997-12-23 Application-specific integrated semiconductor product with dummy-elements as well as logic element and method to the design of application-specific integrated semiconductor basically no change of design is necessary for processing of memory unit for semiconductor product

Country Status (5)

Country Link
EP (1) EP0856890A1 (zh)
JP (1) JPH10223766A (zh)
KR (1) KR19980071188A (zh)
DE (1) DE19703611A1 (zh)
TW (1) TW356602B (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0993030A3 (en) * 1998-08-13 2002-07-24 International Business Machines Corporation Integrated chip dummy trench patterns to ease trench etch process development
DE19907921C1 (de) 1999-02-24 2000-09-28 Siemens Ag Halbleiterspeicheranordnung mit Dummy-Bauelementen auf durchgehenden Diffusionsgebieten
DE19910886B4 (de) * 1999-03-11 2008-08-14 Infineon Technologies Ag Verfahren zur Herstellung einer flachen Grabenisolation für elektrisch aktive Bauelemente
US6232154B1 (en) * 1999-11-18 2001-05-15 Infineon Technologies North America Corp. Optimized decoupling capacitor using lithographic dummy filler
DE10204688C1 (de) * 2002-02-06 2003-10-09 Infineon Technologies Ag Speicherbaustein mit verbesserten elektrischen Eigenschaften
DE10322634A1 (de) * 2003-05-20 2004-12-23 TOS Team für Organisation und Systeme GmbH Verfahren und Vorrichtung zur Steuerung einer Kommunikation
JP4830360B2 (ja) * 2005-06-17 2011-12-07 株式会社デンソー 半導体装置およびその製造方法
JP5651387B2 (ja) * 2010-06-24 2015-01-14 ルネサスエレクトロニクス株式会社 半導体集積回路装置
US9343320B2 (en) * 2013-12-06 2016-05-17 Globalfoundries Inc. Pattern factor dependency alleviation for eDRAM and logic devices with disposable fill to ease deep trench integration with fins

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6085492A (ja) * 1983-10-17 1985-05-14 Hitachi Ltd ダイナミツクメモリ装置
US4675848A (en) * 1984-06-18 1987-06-23 Visic, Inc. Dynamic RAM memory
JPS6390096A (ja) * 1986-10-01 1988-04-20 Nec Corp 半導体記憶装置
JPH01145843A (ja) * 1987-12-01 1989-06-07 Matsushita Electric Ind Co Ltd 半導体装置
JPH01246834A (ja) * 1988-03-29 1989-10-02 Seiko Epson Corp 半導体装置の製造方法
JP3141486B2 (ja) * 1992-01-27 2001-03-05 ソニー株式会社 半導体装置
JP2827675B2 (ja) * 1992-03-26 1998-11-25 日本電気株式会社 半導体記憶装置
US5375068A (en) * 1992-06-03 1994-12-20 Digital Equipment Corporation Video teleconferencing for networked workstations
US5278105A (en) * 1992-08-19 1994-01-11 Intel Corporation Semiconductor device with dummy features in active layers
KR0121992B1 (ko) * 1993-03-03 1997-11-12 모리시다 요이치 반도체장치 및 그 제조방법
TW299458B (zh) * 1994-11-10 1997-03-01 Intel Corp

Also Published As

Publication number Publication date
JPH10223766A (ja) 1998-08-21
EP0856890A1 (de) 1998-08-05
DE19703611A1 (de) 1998-08-06
KR19980071188A (ko) 1998-10-26

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