[go: up one dir, main page]

TW335555B - Nonvolatile memory cell - Google Patents

Nonvolatile memory cell

Info

Publication number
TW335555B
TW335555B TW086110856A TW86110856A TW335555B TW 335555 B TW335555 B TW 335555B TW 086110856 A TW086110856 A TW 086110856A TW 86110856 A TW86110856 A TW 86110856A TW 335555 B TW335555 B TW 335555B
Authority
TW
Taiwan
Prior art keywords
silicon
oxide layer
layer
memory cell
nonvolatile memory
Prior art date
Application number
TW086110856A
Other languages
English (en)
Inventor
Willer Josef
Framosch Martin
Schafer Herbert
Krautschneider Wolfgang
Hofmann Franz
Stengl Reinhard
Reisinger Hans
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Application granted granted Critical
Publication of TW335555B publication Critical patent/TW335555B/zh

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/69IGFETs having charge trapping gate insulators, e.g. MNOS transistors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/68Floating-gate IGFETs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B69/00Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/60Electrodes characterised by their materials
    • H10D64/66Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
    • H10D64/68Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
    • H10D64/681Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator having a compositional variation, e.g. multilayered

Landscapes

  • Non-Volatile Memory (AREA)
  • Semiconductor Memories (AREA)
TW086110856A 1996-08-01 1997-07-30 Nonvolatile memory cell TW335555B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19631147A DE19631147C2 (de) 1996-08-01 1996-08-01 Nichtflüchtige Speicherzelle

Publications (1)

Publication Number Publication Date
TW335555B true TW335555B (en) 1998-07-01

Family

ID=7801536

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086110856A TW335555B (en) 1996-08-01 1997-07-30 Nonvolatile memory cell

Country Status (6)

Country Link
EP (1) EP0916161A1 (zh)
JP (1) JP2000515325A (zh)
KR (1) KR20000035785A (zh)
DE (1) DE19631147C2 (zh)
TW (1) TW335555B (zh)
WO (1) WO1998006139A1 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10110150A1 (de) * 2001-03-02 2002-09-19 Infineon Technologies Ag Verfahren zum Herstellen von metallischen Bitleitungen für Speicherzellenarrays, Verfahren zum Herstellen von Speicherzellenarrays und Speicherzellenarray
KR100426481B1 (ko) * 2001-06-26 2004-04-13 주식회사 하이닉스반도체 코드 저장 메모리 셀 제조 방법
DE10130765A1 (de) 2001-06-26 2003-01-09 Infineon Technologies Ag Transistor-Anordnung, Verfahren zum Betreiben einer Transistor-Anordnung als Datenspeicher und Verfahren zum Herstellen einer Transistor-Anordnung
US6853587B2 (en) * 2002-06-21 2005-02-08 Micron Technology, Inc. Vertical NROM having a storage density of 1 bit per 1F2
DE10241172B4 (de) 2002-09-05 2008-01-10 Qimonda Ag Halbleiterspeicher mit vertikalen Speichertransistoren und Verfahren zu dessen Herstellung
FR2861123B1 (fr) * 2003-10-15 2006-03-03 Somfy Procede d'initialisation et de commande d'une installation comprenant des ecrans sensibles au vent.
DE10352641A1 (de) * 2003-11-11 2005-02-17 Infineon Technologies Ag Charge-Trapping-Speicherzelle und Herstellungsverfahren
US7790516B2 (en) 2006-07-10 2010-09-07 Qimonda Ag Method of manufacturing at least one semiconductor component and memory cells

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05110114A (ja) * 1991-10-17 1993-04-30 Rohm Co Ltd 不揮発性半導体記憶素子
US5436481A (en) * 1993-01-21 1995-07-25 Nippon Steel Corporation MOS-type semiconductor device and method of making the same
US5408115A (en) * 1994-04-04 1995-04-18 Motorola Inc. Self-aligned, split-gate EEPROM device

Also Published As

Publication number Publication date
EP0916161A1 (de) 1999-05-19
DE19631147A1 (de) 1998-02-05
DE19631147C2 (de) 2001-08-09
KR20000035785A (ko) 2000-06-26
WO1998006139A1 (de) 1998-02-12
JP2000515325A (ja) 2000-11-14

Similar Documents

Publication Publication Date Title
TW347567B (en) Semiconductor device and method of manufacturing a semiconductor device
WO2003012878A1 (fr) Dispositif semi-conducteur
TW343391B (en) Nonvolatile semiconductor memory and methods for manufacturing and using the same
TW338193B (en) Non-volatile semiconductor memory
TW200419788A (en) Flash memory having local SONOS structure using notched gate and manufacturing method thereof
AU2667597A (en) Silicon carbide cmos and method of fabrication
MY118598A (en) Method for dual gate oxide dual workfunction cmos
MY111990A (en) Mos transistor and method for making the same
TW327240B (en) Semiconductor device and process for producing the same
TW340261B (en) Semiconductor device and the manufacturing method
WO2001099153A3 (en) A negative differential resistance device and method of operating same
EP2264771A3 (en) MOS thin film transistor and method of fabricating same
TW353806B (en) Intermediate voltage generator and nonvolatile semiconductor memory including the same
TW347594B (en) MOSFET and fabrication thereof
AU5590799A (en) Semiconductor processing methods of forming and utilizing antireflective material layers, and methods of forming transistor gate stacks
TW335555B (en) Nonvolatile memory cell
HK1046471A1 (zh) 製造以單一額外屏蔽注入方式運作的雙閾限電壓n-溝道及p-溝道mosfets
TW353751B (en) Nonvolatile semiconductor memory device
TW331041B (en) Semiconductor memory device
TW332296B (en) Non-volatile semiconductor memory having read-line selection transistor with shrunk area of selection transistor
TW340975B (en) Semiconductor memory
TW365703B (en) Semiconductor apparatus and the manufacturing method thereof
TW351860B (en) Memory cell arrangement and method for its production
TW343390B (en) Semiconductor device
IT1294312B1 (it) Processo per la fabbricazione di un dispositivo di memoria non volatile programmabile elettricamente