TW202322301A - Protective sheet, electronic device package, and manufacturing method for electronic device package - Google Patents

Abstract

Provided is a protective sheet that is for a circuit substrate, that has a first surface and a second surface on the opposite side from the first surface, and in which the adhesive strength of the first surface as measured in a probe tack test is at most 0.15 N/cm2, an index X calculated by formula 1 is 0.5-2.0, and the contained amount of a filler is 1.0-9.8 wt%. [Formula 1] X = Ftotal/Ttotal (when the protective sheet is formed into a rectangle having a size of 0.5 cm * 1.0 cm and the projective sheet is heated and pressed at 180 DEG C and 1 MPa for 5 minutes, Ftotal represents the average ([mu]m) of flow lengths at four sides at portions having the greatest flow, and Ttotal represents the total thickness ([mu]m) of the protective sheet).

Description

Protective sheet, electronic device package, and manufacturing method for electronic device package

The invention relates to a protective sheet, an electronic device package and a manufacturing method for the electronic device package.

There is known a method of forming an insulating layer on a substrate on which an integrated circuit (integrated circuit, IC) chip is mounted to protect the chip from electromagnetic waves (for example, Patent Document 1). [Patent Document 1] US Patent No. 7,445,968

In a first aspect of the present invention, a protective sheet is provided for a circuit board, the protective sheet has a first surface and a second surface opposite to the first surface, and in the protective sheet, the first surface The adhesive force obtained by the probe adhesion test is 0.15 N/cm ² or less, and the index X calculated from the following formula 1 is 0.5 to 2.0. [Formula 1] X=F _total /T _total (F _total ; when a rectangular protective sheet made of 0.5 cm×1.0 cm is heated and pressed at 180°C and 1 MPa for 5 minutes, the most fluid part of each side The average value of the long four sides of the flow (μm), T _total ; the total thickness of the protective sheet (μm))

The tensile breaking strength of the protection sheet may be 10 N/mm ² to 70 N/mm ² .

The protection sheet may include a first protection layer and a second protection layer. The first protective layer may be the outermost layer on the first surface side of the protective sheet. Furthermore, the second protective layer may be the outermost layer on the side of the second surface in the protective sheet.

In any one of the protective sheets, an index Y of the second protective layer obtained from the following formula 2 may be 0.5 to 1.5. [Formula 2] Y=F ₂ /T ₂ (F ₂ ; when the second protective layer made into a rectangle of 0.5 cm×1.0 cm is heated and pressed at 180°C and 1 MPa for 5 minutes, the most fluid on each side The average value of the long four sides of the part of the flow (μm), T ₂ ; the thickness of the second protective layer (μm))

In any one of the above protective sheets, the index Z of the first protective layer obtained by the following formula 3 may be 2.0 to 15.0. [Formula 3] Z=F ₁ /T ₁ (F ₁ ; when the first protective layer made into a rectangle of 0.5 cm×1.0 cm is heated and pressed at 180°C and 1 MPa for 5 minutes, the most fluid on each side The average value of the long four sides of the part of the flow (μm), T ₁ ; the thickness of the first protective layer (μm))

In any one of the protective sheets, the glass transition temperature of the second protective layer may be lower than 60°C.

In any one of the protective sheets, the film thickness of the first protective layer may be 5 μm to 150 μm, and the film thickness of the second protective layer may be 10 μm to 200 μm.

In any one of the protective sheets, a third protective layer may be included between the first protective layer and the second protective layer. Furthermore, the index W of the third protective layer obtained by the following formula 4 may be 1.0 to 3.0. [Formula 4] W=F ₃ /T ₃ (F ₃ ; when the third protective layer made into a rectangle of 0.5 cm×1.0 cm is heated and pressed at 180°C and 1 MPa for 5 minutes, the most fluid on each side The average value of the long four sides of the part of the flow (μm), T ₃ ; the thickness of the third protective layer (μm))

In any one of the protective sheets, the film thickness of the third protective layer may be 20 μm˜200 μm.

In any one of the protective sheets, the first protective layer, the second protective layer, and the third protective layer may contain polyurethane resin and a curing agent.

In any one of the protective sheets, the protective sheet may contain a filler, and the filler may have a higher mass concentration on the second side of the protective sheet than on the first side.

In addition, in the second form, an electronic device package is provided, including: a circuit substrate, with a conductive circuit disposed on the surface; an electronic device configured on the circuit substrate; and a protective layer, disposed on the circuit substrate and the electronic device, and the electronic device When viewed from the main surface of the circuit board or viewed from the side of the main surface, it has a polygonal shape of pentagon or more.

In the electronic device package, the electronic device may have a concave portion on a side surface.

In any one of the electronic device packages, the electronic device may have a polygonal shape of not less than a pentagon as viewed from the main surface.

In addition, in the third form, an electronic device package is provided, including: a circuit substrate, with a conductive circuit disposed on the surface; an electronic device configured on the circuit substrate; and a protective layer, disposed on the circuit substrate and the electronic device, the protective layer At least partially covering the connecting member electrically connecting the electronic device with the circuit substrate.

In the electronic device package, the connecting member may be a bump disposed on the lower surface of the electronic device.

In any one of the electronic device packages, the connecting member may be a lead frame on which the electronic device is mounted.

In addition, in the fourth form, an electronic device package is provided, including: a circuit substrate, with a conductive circuit disposed on the surface; an electronic device, configured on the circuit substrate; and a protective layer, disposed on the circuit substrate and the electronic device, and the electronic device With multi-layer ceramic capacitors (Multi-layer Ceramic Capacitors, MLCC).

In the electronic device package, the protective layer may include at least two layers.

In any one of the electronic device packages, the protective layer may be a cured product of a thermosetting resin.

In any of the electronic device packages, a conductive layer may be formed on the protective layer.

In a fifth aspect, there is provided a method of manufacturing an electronic device package, including the following steps: a mounting substrate on which an electronic device is mounted on a substrate provided with a conductive circuit on the surface, and the first surface is arranged to face the electronic device side. In any one of the protective sheets, a protective layer formed of the protective sheet is formed on the mounting substrate.

In the manufacturing method, the step of forming the protective layer may include hot pressing the protective sheet on the mounting substrate after disposing the protective sheet.

In the manufacturing method, a step of forming a conductive layer on the protective layer may be further included.

Furthermore, the summary of the invention does not list all the essential features of the invention. In addition, a subcombination of these feature groups can also be an invention.

Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the inventions according to the claims. In addition, all combinations of the features described in the embodiments are not necessarily essential to the solution means of the invention.

FIG. 1 shows an example of an electronic device package 100 according to this embodiment. The electronic device package 100 is a package in which electronic devices such as IC chips are installed, and has good electromagnetic wave shielding and heat dissipation properties. The electronic device package 100 includes a circuit substrate 10 , an electronic device 20 and an electronic device 22 (hereinafter also simply referred to as “electronic device 20 , etc.”), a connection member 24 , a protective layer 30 , and a conductive layer 40 .

The circuit substrate 10 is provided with a conductive circuit (not shown) on the surface, and carries electronic devices 20 and the like. The circuit substrate 10 can be a printed wiring substrate, a mounting module substrate, or the like. The conductive circuit may be a circuit formed of a conductive metal such as copper or a material containing a conductive metal. The circuit substrate 10 can be a rigid substrate or a flexible substrate.

The circuit board 10 may be processed as necessary. For example, printing, marks, and cutting grooves can be provided on the circuit substrate 10 .

Electronic devices 20 and the like are arranged on the circuit board 10 and perform various functions. The electronic device 20 can be, for example, integrated circuits such as memory chips, power chips, audio chips, or central processing unit (central processing unit, CPU) chips, active components such as transistors or diodes, or multilayer ceramic capacitors (MLCCs). Passive components such as capacitors, thermal resistors, inductors or resistors. In particular, MLCCs have external electrodes on the side surfaces, and the need for insulation protection is particularly high from the viewpoint of preventing contact with other conductors or leakage. With the protective sheet of this embodiment described later, the entire components of the MLCC can be sufficiently insulated and protected by the protective layer 30 .

The electronic device 20 and the like may be in the shape of a cube or a cuboid. The electronic device 20 and the like may have a more complicated shape, and may have a polygonal shape greater than or equal to a pentagon when viewed from the main surface (XY plane in FIG. 1 ) of the circuit board.

For example, in the electronic device 20 and the like, the planar shape viewed from the main surface may be hexagonal, octagonal or other polygonal. As an example, the electronic device 22 may be an inductor whose planar shape is an octagon. In addition, the electronic device 20 and the like may have a polygonal shape of pentagonal or larger when viewed from the side of the main surface (XZ plane, YZ plane, etc. in FIG. 1 ). For example, the electronic device 20 and the like may be in the shape of a cube or a cuboid having recesses or protrusions on the sides, and the electronic device 22 may be an inductor having recesses for forming coils on the sides.

A single or multiple electronic devices 20 and the like can be arranged on the circuit board 10 . For example, the electronic devices 20 and the like can be formed on the circuit substrate 10 in n×m arrays (n and m are integers greater than or equal to 2).

The thickness of the electronic device 20 and the like is desirably 2000 μm or less. This is because when the thickness exceeds 2000 μm, disconnection may occur due to a step difference from the circuit board 10 when the protective layer 30 and the conductive layer 40 are formed. In addition, the interval between the electronic devices 20 is desirably 50 μm or more. This is because if the interval is less than 50 μm, there is a possibility that the protective layer 30 and the conductive layer 40 cannot be sufficiently formed.

The connection member 24 electrically connects the electronic device 20 and the like to the circuit board 10 . The connection member 24 may include one or more of bumps such as solder balls arranged on the lower surface of the electronic device 20 and the like, a lead frame on which the electronic device 20 and the like are mounted, and bonding wires. In the example of FIG. 1 , bumps can be used as the connecting member 24 connecting the electronic device 20 and the circuit board 10 .

The protective layer 30 is provided on the circuit substrate 10 and the electronic device 20 to protect the circuit substrate 10 and the electronic device 20 from electromagnetic waves, shocks and the like. In addition, the protective layer 30 also has the function of insulating and protecting the circuit board 10 and the electronic device 20 from the conductive layer 40 . The protective layer 30 may cover the whole or a part of the electronic device 20 and the like and the region of the circuit board 10 where the electronic device 20 and the like are not provided. The protection layer 30 may only cover the area of the circuit substrate 10 where the conductive circuit is disposed, or may not cover the area without the conductive circuit.

Even when the electronic device 20 and the like have complicated shapes such as polygons as described above, the protective layer 30 sufficiently covers the electronic device 20 and the like. For example, even when the electronic device 22 has a concave portion on the side surface as shown in FIG. 1 , the protective layer 30 enters a part or the whole of the concave portion to protect the electronic device 22 . In addition, even if the electronic device 20 and the like have a polygonal shape with a large number of corners where the film thickness of the protective layer 30 tends to be thin, the protective layer 30 of this embodiment can cover the corners with a sufficient film thickness.

The protective layer 30 may at least partially cover the connection member 24 . For example, in FIG. 1 , the protective layer 30 covers the side surfaces of the connecting member 24 as a bump. Even in the case where the connecting member 24 includes a lead frame or a bonding wire, the protective layer 30 may cover at least a part of these.

The protective layer 30 may be a cured product of thermosetting resin or the like. The protective layer 30 may include at least two layers. For example, the protective layer 30 may be two, three or four or more layers. In order to keep the film thickness of the protective layer 30 in an appropriate range, the protective layer 30 is preferably three layers. Such a layer may be formed from the layer structure of the protective sheet described later. The layer structure, material, and the like of the protective layer 30 will be described later.

The film thickness of the protective layer 30 may vary depending on the location. For example, in the corners of the electronic device 20 and the like, the film thickness of the protective layer 30 may be thinner than that of the top surface of the electronic device 20 and the like. In addition, for example, in the corner recesses where the electronic device 20 and the like contact the circuit substrate 10 , the film thickness of the protective layer 30 may be thicker than the top surface of the electronic device 20 and the like.

The conductive layer 40 is provided on the protective layer 30 , and protects the electronic device 20 and the like from external electromagnetic waves, and/or releases heat generated from the electronic device 20 and the like to the outside. The conductive layer 40 may be a layer including metal. For example, the conductive layer 40 may be a metal thin film formed of metal itself, or a resin layer in which conductive fillers are dispersed. Details of the material of the conductive layer 40 and the like will be described later.

In the case of a thermosetting resin containing conductive fillers, the thickness of the conductive layer 40 may be 2 μm˜500 μm, preferably 5 μm˜100 μm. On the other hand, in the case of plating, vapor deposition, or sputtering, it may be 0.01 μm to 10 μm, preferably 0.1 μm to 5 μm. If the thickness is too thin, the electromagnetic wave blocking effect, the heat dissipation effect, and the mechanical strength may become insufficient, and if the thickness is too thick, the electronic device package 100 will be too large and the volume will increase.

The metal thin film and conductive filler used in the conductive layer 40 are preferably those with good electrical conductivity and/or thermal conductivity, for example, they can have a volume resistivity of 10 ⁻³ Ω·cm or less and/or a thermal conductivity of 10 W/m ·K or above.

The conductive layer 40 may be connected to the ground pattern exposed on the side or upper surface of the circuit substrate 10 and/or the ground pattern of the electronic device 20 . Furthermore, the electronic device package 100 may not have the conductive layer 40 .

Thus, according to the electronic device package 100 of this embodiment, the protective layer 30 insulates and protects the electronic device 20 etc. which have a complicated shape, and the connection member 24. As shown in FIG. In addition, with the electronic device package 100 , the conductive layer 40 can protect the electronic device 20 and the like from electromagnetic waves, and at the same time, can dissipate heat generated by the electronic device 20 and the like.

Furthermore, the protective layer 30 may be formed of a protective sheet 38 as described below. The protective sheet 38 prevents air inclusions sandwiching air between the protective layer 30 and the circuit board 10 , and can sufficiently cover and protect the periphery of the electronic device 20 having a complicated shape.

FIG. 2 shows an example of the protection sheet 38 of this embodiment. The protective sheet 38 is a sheet for a circuit board and is used to form the protective layer 30 shown in FIG. 1 . As shown in the figure, the protection sheet 38 has a first protection layer 32 , a second protection layer 34 and a third protection layer 36 .

The protection sheet 38 has a first surface (lower side in FIG. 1 ) and a second surface (upper side in FIG. 1 ) opposite to the first surface. The first surface side is the side in contact with the circuit board 10 , the electronic device 20 , etc., and the second surface side is the side in contact with the conductive layer 40 . The first protective layer 32 is the outermost layer on the first surface side of the protective sheet 38 . The second protective layer 34 is the outermost layer on the second surface side. The third protection layer 36 is disposed between the first protection layer 32 and the second protection layer 34 .

The adhesive strength of the first surface of the protective sheet 38 obtained by the probe adhesion test is less than 0.15 N/cm ² , preferably less than 0.12 N/cm ² , more preferably less than 0.10 N/cm ² . The probe stickiness test can be performed by the same test method as General Test Method 6. Preparation Test Method 6.12 Adhesion Test Method 3.4 Probe Stickiness Test Method of the Eighteenth Amendment Japanese Pharmacopoeia or a test method based thereon.

When the adhesive force satisfies the above-mentioned range, when the protective sheet 38 is arranged on the circuit board 10, the adhesiveness of the protective sheet 38 can be suppressed, and the undesired part of the protective sheet 38 can be prevented from sticking to the circuit board 10 or wetting and spreading (so-called of puddling). Moreover, if the viscosity of the protection sheet 38 is high, it may stick to the circuit board 10 at the time of pressing, and may prevent air discharge (so-called air inclusion). However, with the protection sheet 38 whose adhesive force satisfies the above-mentioned range, air can be discharged smoothly.

The adhesive strength of the second surface of the protective sheet 38 obtained by the probe adhesion test may be 0.01 N/cm ² or higher, preferably 0.05 N/cm ² or higher, more preferably 0.10 N/cm ² or higher . In addition, the difference between the adhesive force of the first surface and the second surface can be 0.05 N/cm ² to 0.40 N/cm ² , preferably can be 0.05 N/cm ² to 0.30 N/cm ² , more preferably can be 0.10 N/cm ² to 0.20 N/cm ² . When the adhesive force satisfies the above-mentioned range, the cushioning material which is in contact with the second surface and laminated on the protective sheet has sufficient adhesiveness with the second surface, thereby enabling efficient pressing. The cushioning material may be laminated on the protective sheet for the purpose of applying an appropriate pressure to the protective sheet during heating and pressing.

In addition, the index X of the protective sheet 38 obtained by the following formula 1 may be 0.5-2.0, preferably 0.6-1.7, more preferably 0.7-1.5. [Formula 1] X=F _total /T _total Here, F _total is the most fluid on each side when the protective sheet 38 made into a rectangle of 0.5 cm×1.0 cm is heated and pressed at 180°C and 1 MPa for 5 minutes. The average value (μm) of the long four sides of the flow of the part. T _total is _the total thickness (μm) of the protective sheet 38. In the case of the protective sheet 38 in FIG. equal. When the protective sheet 38 includes a peeling layer, the total thickness does not include the thickness of the peeling layer.

FIG. 3 shows an example of the flow length in this embodiment. The protective sheet 38 is sandwiched between two polyimide films, and cut into a rectangular reference shape of 0.5 cm×1.0 cm. It was pressed at 1 MPa for 5 minutes while maintaining it at 180°C. At this time, since a part of the protective sheet 38 softened and flowed between the polyimide films, the length of the most fluid part from the polyimide film was measured for each side.

For example, as shown in FIG. 3 , the flow is generated so as to protrude from the four sides of the polyimide film 35 having the same shape (reference shape) as the protective sheet 38 before pressing. Here, length L1 to length L4 from the side of the most fluid part are measured along a straight line extending at 90 degrees from each side of the polyimide film 35 on each of the four sides. The average value of the flow lengths L1 to L4 of the four sides expressed in units of μm was defined as the flow length F _total (μm).

When the index X is included in the above range, a sufficient amount of the protective layer 30 is formed around the circuit board 10 and the electronic device 20 , so that the electronic device package 100 can be more reliably insulated and protected. On the other hand, if the index X is too large compared to the above range, the fluidity of the protective sheet 38 during thermocompression bonding is too high, and a part of the protective layer 30 (for example, a corner of the electronic device 20, etc.) is insufficient in thickness. The problem.

When the index X is smaller than the above-mentioned range, the fluidity of the protective sheet 38 during thermocompression bonding is insufficient, and the electronic device 20 and the like cannot be sufficiently insulated and protected by the protective layer 30 , and there is a risk of insufficient withstand voltage. For example, there is a possibility that the protective layer 30 cannot be sufficiently formed on the concave corner portion where the circuit board 10 contacts the electronic device 20, the periphery of the connecting member 24, and/or around the electronic device 20 having a complicated shape (especially a concave portion). .

In addition, the tensile breaking strength of the protective sheet 38 may be 10 N/mm ² to 70 N/mm ² , preferably 15 N/mm ² to 50 N/mm ² , more preferably 20 N/mm ² to 40 N/mm ² . The tensile breaking strength can be measured in accordance with Japanese Industrial Standards (Japanese Industrial Standards, JIS)-C-2151:2019. For example, the tensile breaking strength can be calculated by using a tensile testing machine to stretch the protective sheet 38 at a speed of 50 mm/minute for one minute in an environment of 23° C. and 60% RH, and calculate when the protective sheet 38 breaks. The strength (tensile load value/sectional area of the protective sheet 38).

If the tensile breaking strength is too high, the fluidity of the protective sheet 38 during thermocompression bonding will be insufficient, and the electronic device 20 and the like may not be sufficiently insulated and protected by the protective layer 30 . If the tensile breaking strength is too small, the fluidity of the protective sheet 38 during thermocompression bonding is too high, resulting in a problem that the thickness of a part of the protective layer 30 (for example, a corner of the electronic device 20 etc.) is insufficient. On the other hand, when the tensile breaking strength is included in the above range, a sufficient amount of protective layer 30 is formed around the circuit board 10, the electronic device 20, etc., and the electronic device package 100 can be more reliably insulated. Protect.

The film thickness of the protective sheet 38 may be 50 μm˜500 μm, preferably 100 μm˜250 μm.

The first protective layer 32 mainly has a function of imparting fluidity to the protective sheet 38 . The index Z of the first protective layer 32 obtained by the following formula 2 may be 2.0 to 15.0, preferably 4.0 to 12.0, more preferably 5.0 to 10.0. [Formula 2] Z=F ₁ /T ₁ Here, F ₁ is when the first protective layer 32 made into a rectangle of 0.5 cm×1.0 cm is heated and pressed at 180°C and 1 MPa for 5 minutes. The average value (μm) of the four sides of the flow length of the most fluid part. T ₁ is the thickness (μm) of the first protective layer 32 . F ₁ can be measured by the same method as F _total .

As mentioned above, the index Z takes a larger range of values than the index X. Thereby, the first protective layer 32 flows well when the protective sheet 38 is thermocompression-bonded, and can penetrate into the periphery (especially the concave portion) of the electronic device 20 having a complicated shape, the connecting member 24, and/or the circuit board 10 In the gap with the electronic device 20 and the like.

When the index Z is too large compared to the above-mentioned range, the fluidity becomes too high, and a problem arises that the thickness of a part of the protective layer 30 (for example, the corner of the electronic device 20 etc.) is insufficient. On the other hand, if the index Z is smaller than the above-mentioned range, the fluidity of the protective sheet 38 during thermocompression bonding is insufficient, and there is a risk that the electronic device 20 and the like cannot be sufficiently insulated and protected by the protective layer 30 . On the other hand, when the index Z is included in the above range, a sufficient amount of protective layer 30 is formed around the circuit board 10 and the electronic device 20 , thereby insulating and protecting the electronic device package 100 more reliably.

The film thickness of the first protective layer 32 may be 5 μm˜150 μm, more preferably 5 μm˜50 μm, more preferably 10 μm˜30 μm. When the film thickness of the first protective layer 32 satisfies the above range, appropriate fluidity can be provided while suppressing the stickiness of the protective sheet 38 .

The glass transition temperature of the first protective layer 32 may be lower than 80°C, preferably lower than 60°C, and more preferably lower than 50°C. The glass transition temperature of the first protective layer 32 may be above 20°C, preferably above 30°C, and more preferably above 35°C.

The second protective layer 34 mainly has a role of preventing ion migration caused by metal ions from the conductive layer 40 in contact with while securing the thickness of the protective layer 30 . The index Y of the second protective layer 34 obtained by the following formula 3 may be 0.5-1.5, preferably 0.6-1.4, more preferably 0.7-1.2. [Formula 3] Y=F ₂ /T ₂ Here, F ₂ is when the second protective layer 34 made into a rectangle of 0.5 cm×1.0 cm is heated and pressed at 180°C and 1 MPa for 5 minutes. The average value (μm) of the four sides of the flow length of the most fluid part. T ₂ is the thickness (μm) of the second protective layer 34 . F ₂ can be measured by the same method as F _total .

As mentioned above, when the index Y falls within the above-mentioned range, the second protective layer 34 does not flow too much when the protective sheet 38 is thermocompression-bonded, and the film thickness of the protective layer 30 such as the corners of the electronic device 20 and the like remains firmly. The part that is prone to thinning. Accordingly, the electronic device package 100 can be more reliably insulated and protected. In addition, in the case where the conductive layer 40 is formed on the protective layer 30 , ion migration from the conductive layer 40 can be sufficiently prevented.

If the index Y is too large than the above range, the fluidity of the protective sheet 38 during thermocompression bonding is too high, resulting in a problem of insufficient thickness of a part of the protective layer 30 (for example, corners of the electronic device 20 and the like). On the other hand, if the index Y is smaller than the above-mentioned range, the fluidity of the protective sheet 38 during thermocompression bonding is insufficient, and the electronic device 20 and the like cannot be sufficiently insulated and protected by the protective layer 30, or there is a risk of ion migration. .

The film thickness of the second protective layer 34 may be 10 μm-200 μm, more preferably 30 μm-150 μm, more preferably 50 μm-100 μm. When the film thickness of the second protective layer 34 satisfies the above conditions, the film thickness of the entire protective layer 30 can be ensured while maintaining the heat dissipation properties of the electronic device 20 and the like.

The film thickness of the second protective layer 34 may be thicker than that of the first protective layer 32 . In this case, the lack of thickness at a part of the protective layer 30 (for example, a corner of the electronic device 20 and the like) can be eliminated more reliably. In addition, the film thickness of the first protective layer 32 may be thicker than that of the second protective layer 34 . In this case, the protective layer 30 can more reliably protect the surroundings (especially recesses) of the electronic device 20 having a complex shape, the connection member 24, and/or the gap between the circuit board 10 and the electronic device 20 , etc. .

The glass transition temperature of the second protective layer 34 may be lower than 60°C, preferably lower than 50°C, and more preferably lower than 40°C. The glass transition temperature of the second protective layer 34 may be higher than 0°C, preferably higher than 10°C, and more preferably higher than 20°C. In addition, the glass transition temperature of the second protection layer 34 may be lower than the glass transition temperature of the first protection layer 32 . Thereby, the adhesiveness of the buffer material which contacts the 2nd protective layer 34 and the 2nd protective layer 34 is fully ensured at the time of hot pressing, and it becomes possible to press efficiently.

The second protective layer 34 mainly has a role of ensuring the thickness of the protective layer 30 while having a certain fluidity. The index W of the third protective layer 36 obtained by the following formula 4 may be 1.0 to 3.0, preferably 1.2 to 2.7, more preferably 1.5 to 2.5. [Formula 4] W=F ₃ /T ₃ Here, F ₃ is when the third protective layer 36 made into a rectangle of 0.5 cm×1.0 cm is heated and pressed at 180°C and 1 MPa for 5 minutes, the The average value (μm) of the four sides of the flow length of the most fluid part. T ₃ is the thickness (μm) of the third protective layer 36 . F ₃ can be measured by the same method as F _total .

As mentioned above, the index W takes a value range between the index Y and the index Z. Thereby, when the protection sheet 38 is thermocompression-bonded, the third protection layer 36 has fluidity between the first protection layer 32 and the second protection layer 34, and has the ability to complement the first protection layer 32 and the second protection layer 34. The effect of the encapsulation performed.

The film thickness of the third protective layer 36 may be 20 μm-200 μm, more preferably 30 μm-150 μm, more preferably 40 μm-80 μm. When the film thickness of the third protective layer 36 satisfies the above conditions, the following effects can be achieved: the surroundings (especially recesses) of the electronic device 20 having a complicated shape, the connecting member 24, and/or the like can be protected by the protective layer 30 Or the effect of the gap between the circuit board 10 and the electronic device 20, etc., and the effect of remaining firmly in the portion where the film thickness of the protective layer 30 is likely to be thinned.

Furthermore, the third protective layer 36 may include multiple layers. For example, the third protective layer 36 can be formed by laminating two identical resin films.

The film thickness of the third protective layer 36 may be thicker than that of the first protective layer 32 . In this case, the lack of thickness at a part of the protective layer 30 (for example, a corner of the electronic device 20 and the like) can be eliminated more reliably. In addition, the film thickness of the first protective layer 32 may be thicker than that of the third protective layer 36 . In this case, the protective layer 30 can more reliably protect the surroundings (especially recesses) of the electronic device 20 having a complex shape, the connection member 24, and/or the gap between the circuit board 10 and the electronic device 20 , etc. .

The glass transition temperature of the third protective layer 36 may be lower than 60°C, preferably lower than 50°C, and more preferably lower than 40°C. The glass transition temperature of the third protective layer 36 may be higher than 0°C, preferably higher than 10°C, and more preferably higher than 20°C. In addition, the glass transition temperature of the third protection layer 36 may be lower than the glass transition temperature of the first protection layer 32 . Thereby, the shock absorbability of the third protective layer 36 is improved, and the shock absorbing force of the protective layer 30 as a whole can be improved.

At high temperature, the second protective layer 34 may be harder than the first protective layer 32 . For example, at 120° C., the Young's modulus of the second protective layer 34 may be higher than that of the first protective layer 32 . For example, the Young's modulus of the first protective layer 32 at 120° C. may be 0.5-3, and the Young's modulus of the second protective layer 34 may be 3-7. The Young's modulus of the third protective layer 36 can be between the first protective layer 32 and the second protective layer 34 , for example, it can be 1.5˜3.5 at 120° C. Since the first protective layer 32 to the third protective layer 36 have such a Young's modulus, the protective sheet 38 can exhibit appropriate fluidity at a high temperature for hot pressing.

The first protective layer 32 , the second protective layer 34 and the third protective layer 36 may be thermosetting resins. For example, the first protective layer 32 , the second protective layer 34 and the third protective layer 36 may include a thermosetting resin and a hardener.

As the thermosetting resin, a polymer having one or more functional groups that undergo a crosslinking reaction by heating can be used in one molecule. As functional groups, for example, hydroxyl group, phenolic hydroxyl group, methoxymethyl group, carboxyl group, amine group, epoxy group, oxetanyl group, oxazoline group, oxazinyl group, aziridinyl group, thiol group, etc. One or more of groups, isocyanate groups, blocked isocyanate groups, blocked carboxyl groups, and silanol groups.

Examples of thermosetting resins include polyurethane resins, acrylic resins, maleic resins, polybutadiene resins, polyester resins, urea resins, epoxy resins, Oxetane-based resin, phenoxy-based resin, polyimide-based resin, polyamide-based resin, polyamide-imide-based resin, phenol-based resin, cresol-based resin, melamine-based resin, alcohol One or more of acid-based resins, amino-based resins, polylactic acid-based resins, oxazoline-based resins, benzoxazine-based resins, silicone-based resins, and fluorine-based resins. Two or three of the first protective layer 32 , the second protective layer 34 , and the third protective layer 36 may use the same or homologous resin as the thermosetting resin.

As the curing agent, one or more of epoxy-based curing agents, aziridine-based curing agents, phenol-based curing agents, amine-based curing agents, isocyanate-based curing agents, and metal chelate-based curing agents can be used. Furthermore, the aziridine-based curing agent may be a curing agent containing a compound having an aziridine group, and the phenol-based curing agent may be a curing agent containing a compound having a structure in which a hydroxyl group is directly bonded to an aromatic group (aromatic ring). The amine-based curing agent may be a curing agent containing a compound having an amine group, and the isocyanate-based curing agent may be a curing agent containing a compound containing an isocyanate group. The metal chelate-based curing agent may include a complex formed by coordinating a multidentate ligand (chelate ligand) with a metal ion. Two or three of the first protective layer 32 , the second protective layer 34 and the third protective layer 36 may use the same or homologous curing agent.

The epoxy-based hardener may be an epoxy compound. An epoxy compound is a compound which has two or more epoxy groups in one molecule. As properties of the epoxy compound, both liquid and solid forms are acceptable. As an epoxy compound, a glycidyl ether type epoxy compound, a glycidylamine type epoxy compound, a glycidyl ester type epoxy compound, a cycloaliphatic (alicyclic type) epoxy compound etc. are mentioned, for example.

As the glycidyl ether type epoxy compound, for example, it can be selected from bisphenol A type epoxy compound, bisphenol F type epoxy compound, bisphenol S type epoxy compound, bisphenol AD type epoxy compound, cresol novolak type epoxy compound, phenol novolak type epoxy compound, α-naphthol novolac type epoxy compound, bisphenol A novolac type epoxy compound, dicyclopentadiene type epoxy compound, tetrabromobisphenol A One or more of epoxy compounds, brominated phenol novolak type epoxy compounds, tris(glycidyloxyphenyl)methane, tetrakis(glycidyloxyphenyl)ethane, and the like.

Examples of glycidylamine-type epoxy compounds include: tetraglycidyldiaminodiphenylmethane, triglycidyl p-aminophenol, triglycidyl m-aminophenol, tetraglycidyl m-xylene Diamine etc.

As a glycidyl ester type epoxy compound, diglycidyl phthalate, diglycidyl hexahydrophthalate, diglycidyl tetrahydrophthalate, etc. are mentioned, for example.

Examples of cycloaliphatic (alicyclic) epoxy compounds include epoxycyclohexylmethyl-epoxycyclohexanecarboxylate, bis(epoxycyclohexyl)adipate, and the like. In addition, a liquid epoxy compound can also be used.

The aziridine-based hardener may be an aziridine compound. As the aziridine compound, for example, it can be selected from N,N'-diphenylmethane-4,4'-bis(1-aziridine carbonyl), N,N'-toluene-2,4-bis( 1-Aziridine Carbonyl), Diisophthaloyl-1-(2-Methylaziridine), Tris-1-Aziridinylphosphine Oxide, N,N'-Hexamethylene -1,6-bis(1-aziridine carbonyl), trimethylolpropane-tri-β-aziridinyl propionate, tetramethylolmethane-tri-beta-aziridinyl propionate ester, tris-2,4,6-(1-aziridinyl)-1,3,5-triazine, trimethylolpropane tris[3-(1-aziridinyl)propionate], Trimethylolpropane tris[3-(1-aziridinyl)butyrate], Trimethylolpropane tris[3-(1-(2-methyl)aziridinyl)propionate], Trimethylolpropane Tris[3-(1-Aziridinyl)-2-Methylpropionate], 2,2'-Bishydroxymethylbutanol Tris[3-(1-Aziridinyl) propionate], pentaerythritol tetrakis [3-(1-aziridinyl) propionate], diphenylmethane-4,4-bis-N,N'-ethylidene urea, 1,6-hexaethylene Methylbis-N,N'-ethylideneurea, 2,4,6-(triethyleneimino)-Syn-triazine, bis[1-(2-ethyl)aziridinyl] One or more of benzene-1,3-carboxyamide and the like.

The phenolic hardener may be a phenolic compound. For example, the phenolic compound may be a phenol resin having two or more phenolic hydroxyl groups in one molecule, for example, may be selected from bisphenol A type phenol resin, bisphenol F type phenol resin, phenol aralkyl type phenol resin, bicyclic One or more of pentadiene-type phenol resins, triphenylmethane-type phenol resins, novolac-type phenol resins, dicyclopentadiene-type phenol resins, xylene-type phenol resins, and biphenyl-type phenol resins.

The amine hardener may be an amine compound. The amine compound may be a compound having two or more amine groups, and may be dimerized diamine or other polyamines.

The isocyanate-based hardener may be an isocyanate compound. The isocyanate compound may be one or more selected from aromatic polyisocyanate, aliphatic polyisocyanate, and alicyclic polyisocyanate.

Examples of the aromatic polyisocyanate include 1,3-phenylene diisocyanate, 1,4-benzene diisocyanate, 2,4-toluene diisocyanate (toluene diisocyanate (TDI)), 2,6-toluene diisocyanate Diisocyanate, 4,4'-diphenylmethane diisocyanate (methylene diphenyl diisocyanate (MDI)), 2,4-diphenylmethane diisocyanate, 4,4'-diisocyanate 3,3'-dimethyl-4,4'-diisocyanatobiphenyl, 3,3'-dimethyl-4,4'-diisocyanatodiphenylmethane, 1,5-naphthalene diisocyanate, 4,4',4''-triphenylmethane triisocyanate, m-isocyanatophenylsulfonyl isocyanate, p-isocyanatophenylsulfonyl isocyanate, etc.

Examples of the aliphatic polyisocyanate include ethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate (HDI), dodecamethylene diisocyanate, 1,6,11- Undecane triisocyanate, 2,2,4-trimethylhexamethylene diisocyanate, lysine diisocyanate, methyl 2,6-diisocyanatocaproate, bis(2-isocyanato Ethyl)fumarate, bis(2-isocyanatoethyl)carbonate, 2-isocyanatoethyl-2,6-diisocyanatohexanoate, and the like.

Examples of the alicyclic polyisocyanate include: isophorone diisocyanate (IPDI), 4,4'-dicyclohexylmethane diisocyanate (H12-MDI), cyclohexylene diisocyanate, methylene diisocyanate, Cyclohexyl diisocyanate (hydrogenated TDI), bis(2-isocyanatoethyl)-4-cyclohexene-1,2-dicarboxylate, 2,5-norbornane diisocyanate, 2,6- Norbornane diisocyanate, etc.

In addition, a trimethylolpropane adduct of diisocyanate, a biuret reacted with water, and a trimer having an isocyanurate ring are exemplified.

As the blocked isocyanate compound, as long as the isocyanate group in the isocyanate group-containing compound is protected by ε-caprolactam or methyl ethyl ketone (methyl ethyl ketone, MEK) oxime, etc. It is not particularly limited as long as it is a compound. Specifically, those obtained by blocking the isocyanate group of the isocyanate group-containing compound with ε-caprolactam, MEK oxime, cyclohexanone oxime, pyrazole, phenol, etc. are mentioned. In particular, when a hexamethylene diisocyanate trimer having an isocyanurate ring and blocked by MEK oxime or pyrazole is used in the present embodiment, storage stability goes without saying. A bonding material such as copper or copper is very preferable because of its excellent bonding strength and solder heat resistance.

The metal chelate hardener can be selected from one or more of aluminum chelate compounds, titanium chelate compounds, and zirconium chelate compounds. The central metal can be selected from iron, cobalt, indium and the like.

The curing agent can be used in an amount of 1 to 50 parts by weight, preferably 10 to 40 parts by weight, more preferably 20 to 30 parts by weight, based on 100 parts by weight of the thermosetting resin.

By adjusting the amount of the curing agent, the fluidity and viscosity of the first protective layer 32 , the second protective layer 34 and the third protective layer 36 can be adjusted. For example, the content of the curing agent in the second protective layer 34 may be the largest, the content of the curing agent in the third protective layer 36 may be the second largest, and the first protective layer 32 may contain no curing agent at all or contain the curing agent in an amount equal to or less than that of the third protective layer 36. hardener.

The first protection layer 32 , the second protection layer 34 and the third protection layer 36 may further include fillers. The filler is preferably insulating, for example, may be selected from inorganic fillers, phosphorous fillers, nitrogen fillers, fluorine fillers and polymer fillers. As the filler, one or more kinds can be used.

Examples of inorganic fillers include silica, hollow silica, porous silica, mica, talc, kaolin, clay, hydrotalcite, wollastonite, xonotlite, silicon nitride, boron nitride, Aluminum nitride, calcium hydrogen phosphate, calcium phosphate, glass flakes, hydrated glass, calcium titanate, sepiolite, magnesium sulfate, aluminum hydroxide, magnesium hydroxide, zirconium hydroxide, barium hydroxide, calcium hydroxide, titanium oxide , tin oxide, aluminum oxide, magnesium oxide, zirconium oxide, zinc oxide, molybdenum oxide, antimony oxide, nickel oxide, zinc carbonate, magnesium carbonate, calcium carbonate, barium carbonate, zinc borate, aluminum borate, inorganic ion extenders (as examples , IXE (registered trademark) manufactured by Toagosei Co., Ltd.).

Examples of phosphorus-based fillers include: melamine phosphate, melamine polyphosphate, guanidine phosphate, guanidine polyphosphate, ammonium phosphate, ammonium polyphosphate, ammonium amide phosphate, ammonium amide polyphosphate, amine formate phosphate, amine formamide polyphosphate (poly) phosphate compounds such as esters, organic phosphate compounds, phosphazene compounds, phosphonic acid compounds, aluminum diethylphosphinate, aluminum methylethylphosphinate, aluminum diphenylphosphinate, ethyl Phosphinic acid compounds such as aluminum butyl phosphinate, aluminum methyl butyl phosphinate, aluminum polyvinyl phosphinate, phosphine oxide compounds, phosphine compounds, phosphoramide compounds, and the like.

Examples of nitrogen-based fillers include benzoguanamine, melamine, melam, melem, melamine acetonitrile, melamine cyanurate, cyanuric acid compounds, isocyanuric acid compounds, and triazole-based compounds. , tetrazole compounds, diazo compounds, urea and other nitrogen-based fillers.

Examples of fluorine-based fillers include: polytetrafluoroethylene powder or its modified product, tetrafluoroethylene-perfluoroalkyl vinyl ether powder, tetrafluoroethylene-ethylene powder, tetrafluoroethylene-hexafluoropropylene powder, tetrafluoroethylene -Vinylidene fluoride powder, tetrafluoroethylene-hexafluoropropylene-perfluoroalkyl vinyl ether powder, polychlorotrifluoroethylene powder, chlorotrifluoroethylene-ethylene powder, chlorotrifluoroethylene-vinylidene fluoride powder, Polyvinylidene fluoride powder, polyvinyl fluoride powder, etc.

Examples of polymer fillers include polyethylene powder, polyacrylate powder, epoxy resin powder, polyamide powder, polyimide powder, polyurethane powder, liquid crystal polymer beads, polysiloxane In addition to the powder etc., the core-shell etc. of the multilayer structure using silicone, acrylic, styrene-butadiene rubber, butadiene rubber, etc. are mentioned.

The average particle diameter D ₅₀ of the filler may be 0.01 μm-100 μm, preferably 0.02 μm-40 μm, more preferably 0.05 μm-20 μm.

The second protective layer 34 and the third protective layer 36 may contain 0.1 wt %-30 wt %, preferably 1 wt %-25 wt %, more preferably 5 wt %-20 wt % of the filler. By setting the filler in the above range, the index X, index Y, and/or index Z (fluidity) can be adjusted close to an appropriate range.

The first protective layer 32 may contain no filler, or even if it contains the filler, it may contain the filler at a lower mass concentration than the second protective layer 34 and the third protective layer 36 . For example, when the first protective layer 32 contains a filler, it may contain 0.01 to 1 part by weight, preferably 0.01 to 0.5 parts by weight, and more preferably 0.01 to 0.1 parts by weight may be included.

As an example, the content of the filler in the second protective layer 34 is the most, the content of the filler in the third protective layer 36 is the second largest, and the first protective layer 32 does not contain filler at all or contains the filler with a mass concentration lower than that of the third protective layer 36. .

As a result, although the protective sheet 38 contains the filler, the mass concentration of the filler on the second surface side of the protective sheet 38 is larger than that on the first surface side. Thereby, the viscosity (adhesiveness) of the first protective layer 32 (that is, the first surface side) can be suppressed, and the fluidity can also be increased. In addition, by adjusting the amount of filler and/or the amount of hardener in the first protective layer 32 , the adhesive force of the first surface of the protective sheet 38 obtained by the probe adhesive test can be adjusted to be below a predetermined value. In addition, the fluidity can be easily adjusted to the order of the first protective layer 32 , the third protective layer 36 and the second protective layer 34 by adjusting the amount of filler and/or the amount of hardener.

In addition, as another example, the second protective layer 34 and the third protective layer 36 may contain fillers in the same amount, and the first protective layer 32 may contain no fillers at all or the mass of the second protective layer 34 and the third protective layer 36 may be less than that of the second protective layer 34 and the third protective layer 36. Concentrations contain fillers. Instead of these, the content of the filler in the third protective layer 36 may be the most, the content of the filler in the second protective layer 34 is the second largest, and the first protective layer 32 does not contain fillers at all or contains them at a mass concentration below the third protective layer 36. filler.

When the protective sheet 38 as a whole is 100% by weight, the content of the filler may be 0.1% by weight to 30.0% by weight, preferably 1.0% by weight to 9.8% by weight, more preferably 3.5% by weight to 8.5% by weight. If the filling amount of the protective sheet 38 as a whole is lower than this range, the fluidity becomes too high, and if the filling amount of the protective sheet 38 as a whole is higher than this range, then the protective layer will be formed when the cooling and heating cycle is performed. Cracks may cause poor appearance. In the protective sheet 38 as a whole, the content of the filler is merely an additional improvement, not an essential matter.

The first protective layer 32 , the second protective layer 34 and the third protective layer 36 may further include thermoplastic resin. As the thermoplastic resin, preferred are, for example, polyester, acrylic resin, polyether, urethane resin, styrene elastomer, polycarbonate, butadiene rubber, polyamide, esteramide resin , polyisoprene, and cellulose and select one or more. When a thermoplastic resin is included, it is preferable to set it as content of 5 weight% - 40 weight% in each layer of the 1st protective layer 32, the 2nd protective layer 34, and/or the 3rd protective layer 36.

The first protective layer 32 , the second protective layer 34 and the third protective layer 36 may further contain additives. For example, as additives, colorants (such as pigments, dyes, or carbon powders such as carbon black, carbon nanotubes, graphene, and fullerenes), flame retardants, anti-blocking agents, metal passivators, Thickener, dispersant, silane coupling agent, rust inhibitor, copper inhibitor, reducing agent, antioxidant, adhesion-imparting resin, plasticizer, ultraviolet absorber, defoamer, and leveling agent one or more of these.

FIG. 4 shows another example of the protection sheet 38 of this embodiment. As shown in FIG. 4 , the protection sheet 38 may only include the first protection layer 32 and the second protection layer 34 , and may not include the third protection layer 36 . In this case, the structures and materials of the first protection layer 32 and the second protection layer 34 can be as described above.

As another example, one or more of the first protection layer 32 , the second protection layer 34 and the third protection layer 36 may also be provided in multiple layers. For example, the protection sheet 38 may have one first protection layer 32 , one second protection layer 34 , and a plurality of third protection layers 36 sandwiched between them.

The protection sheet 38 may also include other layers as required. For example, the protection sheet 38 may further have a peeling layer or the like to be peeled off after being attached to the circuit board 10 . When the release layer is provided, it may be provided on the upper side of the second protective layer 34 (opposite side of the first protective layer 32 ).

FIG. 5 shows an example of the flow of the manufacturing method of the electronic device package 100 of this embodiment. The electronic device package 100 can be manufactured by performing at least a part of S100-S300. For ease of description, S100 to S300 are described sequentially, but these processes may also be executed in other order, and/or at least part of them may also be executed in parallel.

In S100 , the protection sheet 38 for forming the protection layer 30 is manufactured. The protection sheet 38 may be the protection sheet described in FIGS. 2 to 4 .

The method for producing the protective sheet 38 is not particularly limited, and examples include methods such as: the thermal curing of each layer (the first protective layer 32, the second protective layer 34, and the third protective layer 36) that will form the protective sheet 38 A composition obtained by dissolving a material such as a resin in a solvent or the like is sequentially applied and dried to form a laminated structure, or a previously cured or semi-hardened composition is laminated. Examples of coating methods include: gravure coating method, kiss coating method, die coating method, lip coating method, chipping wheel coating method, doctor blade method, roll coating method, knife coating method, spray coating cloth method, bar coating method, spin coating method, dip coating method, or various printing methods, etc.

Next, in S200 , the protective layer 30 formed of the protective sheet 38 is formed on the mounting substrate 12 . For example, first, the mounting substrate 12 is prepared. The mounting substrate 12 may be a circuit substrate 10 on which a conductive circuit is disposed on the surface to mount electronic devices 20 and the like. The protective sheet 38 manufactured in S100 is arranged on the mounting substrate 12 so that the first protective layer 32 (first surface side) faces the electronic device 20 and the like.

FIG. 6 shows an example of S200 in the flow of FIG. 5 . As shown in the figure, after arranging the protective sheet 38 such that the side of the first protective layer 32 faces the electronic device 20 and the like, the protective sheet 38 can be pasted on the mounting substrate 12 .

The protection sheet 38 may also be heat-pressed on the mounting substrate 12 after the protection sheet 38 is disposed. The uncured or semi-cured thermosetting resin of each protective layer of the protective sheet 38 can be cured by hot pressing. Here, when the thermosetting resin is completely cured, the protective sheet 38 becomes the protective layer 30 . In the case where the protection sheet 38 has a release sheet, the release sheet can be removed from the protection sheet 38 after heat pressing.

Hot pressing can be performed under reduced pressure or vacuum. Thereby, the adhesion of the first protective layer 32 to the mounting substrate 12 can be improved. Hot pressing can be performed at 100°C to 220°C, preferably 120°C to 200°C, more preferably 140°C to 180°C, for 1 minute to 120 minutes, preferably 1 minute to 40 minutes, more preferably 1 minute to 10 minutes and 0.1 MPa to 10 MPa, preferably 0.5 MPa to 3 MPa, more preferably 1 MPa to 2 MPa. In the case of performing additional heating, it can be performed under the same temperature conditions as the above-mentioned hot pressing, or the like.

When heat pressing is performed, each layer constituting the protective sheet 38 softens before being completely hardened, and flows to the side surface of the connection member 24 such as a recess or a bump at the corner between the circuit board 10 and the electronic device 20 . In particular, the first protective layer 32 having a higher fluidity than the other layers sufficiently protects the portions where the protective layer 30 is not easily formed due to flow to these parts. Thereby, the contact of the connection member 24 and other electric conductors, or electric leakage can be prevented.

On the other hand, since the second protective layer 34 and the third protective layer 36 with relatively low fluidity do not largely move even by heat pressing, a certain amount remains on the entire electronic device 20 and the like. Thereby, the insufficient thickness of a part (for example, the corner part of the electronic device 20 etc.) of the protective layer 30 can be eliminated more reliably.

FIG. 7 shows an example of the mounting substrate 12 on which the protective layer 30 is formed. As described above, the protective layer 30 is formed by curing the protective sheet 38 to insulate and protect the entire surface of the mounting substrate 12 .

In addition, in the said description, the example which used the protection sheet 38 which does not contain a peeling sheet was mentioned, but it is not limited to this. For example, the protective sheet 38 having a release sheet on the second protective layer 34 side may be heat-pressed, and the release sheet may be peeled off after the heat-pressing.

Next, in S300 , a conductive layer 40 is formed on the passivation layer 30 . The conductive layer 40 may be formed on a part or the whole of the region where the protective layer 30 is formed. Conductive layer 40 may be formed by transferring metal from metal-containing sheet 46 to mounting substrate 12 .

FIG. 8 shows an example of the metal-containing sheet 46 . The metal-containing sheet 46 forms a metal material layer 44 on the release sheet 42 .

For the release sheet 42, a film-like release base material that can be peeled off later or a release resin having cushioning properties can be used. Release sheet 42 may include a single layer or multiple layers of release substrate and/or release resin.

The peeling base material is a film-like base material provided with release properties on one side or both sides. The peeling base material is preferably a sheet having a tensile breaking strain at 150° C. of less than 50%. As the release base material, for example, polyethylene terephthalate, polyethylene naphthalate, polyvinyl fluoride, polyvinylidene fluoride, rigid polyvinyl chloride, polyvinylidene chloride, nylon, polyvinylidene Amide, polystyrene, polyvinyl alcohol, ethylene-vinyl alcohol copolymer, polycarbonate, polyacrylonitrile, polybutene, soft polyvinyl chloride, polyvinylidene fluoride, polyethylene, polypropylene, Polyurethane resin, ethylene vinyl acetate copolymer, polyvinyl acetate and other plastic sheets, cellophane, Dowling paper, kraft paper, coated paper and other paper, various non-woven fabrics, synthetic paper, metal foil, or One or more of these combined composite films.

The release resin is a resin that has conformability to the shape of the electronic device 20 and the like, and also has mold release properties. That is, the peeling resin is a resin from which the releasable cushioning member can be peeled after hot pressing or the like. The peeling resin preferably has a tensile fracture strain at 150° C. of 50% or more. In addition, the peeling resin is preferably melted during hot pressing.

Examples of release resins include polyethylene, polypropylene, polyethersulfide, polyphenylene sulfide, polystyrene, polymethylpentene, polybutylene terephthalate, cyclic olefin polymers, and silicone resins. One or more of ketones. From the viewpoint of both embedding property and detachability, polypropylene, polymethylpentene, polybutylene terephthalate, and silicone are particularly preferable.

The metal material layer 44 may be formed of conductive paste including thermosetting resin and conductive filler. For example, the metal material layer 44 can be formed by coating a conductive paste on the release sheet 42 and drying the solvent. The thermosetting resin in the conductive paste is preferably in an uncured or semi-cured state. Examples of the coating method include the coating method of the composition of each protective layer described above, screen printing, and the like.

As the thermosetting resin, the same resin as that used for the formation of the first to third protective layers can be used.

Examples of the conductive filler include metal particles, carbon particles, conductive resin particles, and the like. The conductive filler may contain metal particles as an essential component, and other components such as one or more carbon particles may also be selected and included.

Examples of metal particles include gold, platinum, silver, copper, nickel, aluminum, iron, or alloys thereof, but copper is preferred in terms of price and conductivity. In addition, the metal particles may include a core containing a metal, and a coating layer covering the core and containing a metal different from the core. As the core body and the cladding layer, the metals listed above can be used. As an example, the silver-coated copper particle etc. which have the nucleus body which consists of copper, and the coating layer which consists of silver are mentioned.

Examples of carbon particles include one or more selected from acetylene black, Ketjen black, furnace black, carbon nanotubes, carbon nanofibers, graphite, fullerenes, carbon nanowalls, and graphene. As the conductive resin particles, one or more selected from poly(3,4-ethylenedioxythiophene), polyacetylene, polythiophene, and the like can be cited, for example.

The average particle diameter D ₅₀ of the conductive filler is preferably about 1 μm˜100 μm, more preferably about 3 μm˜75 μm, and still more preferably about 5 μm˜50 μm. The average particle size of the conductive filler can be measured by a laser diffraction method or a scattering method, for example, the average value of the diameters of a circle equal to the projected area of the aggregate of filler particles can be obtained as the average particle size. By setting the average particle size of the conductive filler within the above-mentioned range, the electromagnetic wave shielding effect of the conductive layer 40 to be formed later can be further improved. In addition, for example, the moldability of the conductive layer 40 is improved because the fluidity when mixed with a thermosetting resin is good.

The shape of the conductive filler can be any shape such as spherical shape, needle shape, scale shape, flake shape, dendritic shape, grape shape, fiber shape, or plate shape. The content of the conductive filler in the metal material layer 44 is not particularly limited, but is preferably 100 to 1500 parts by weight, more preferably 100 to 1000 parts by weight relative to 100 parts by weight of the thermosetting resin. Thereby, regardless of the kind of electroconductive particle, necessary and sufficient electroconductivity can be provided to the electroconductive layer 40, and the electromagnetic wave shielding effect can fully be improved. In addition, it is also preferable in terms of improving the fluidity of the composition including the thermosetting resin and the conductive filler, and making it easier to form the metal material layer 44 .

The metal material layer 44 may further include thermoplastic resin. As the thermoplastic resin, the same resins as those that can be used for the first to third protective layers can be used.

The metallic material layer 44 may contain other additives. For example, as additives, crosslinking agents, colorants, flame retardants, fillers, lubricants, antiblocking agents, metal deactivators, thickeners, dispersants, silane coupling agents, rust inhibitors, copper poisons, etc. One or more of inhibitors, reducing agents, antioxidants, tack-imparting resins, plasticizers, ultraviolet absorbers, defoamers, and leveling regulators.

As a crosslinking agent, the compound which crosslinks with the functional group of a thermosetting resin is mentioned. For example, as the crosslinking agent, one of phenol-based curing agents, amine-based curing agents, isocyanate-based curing agents, epoxy-based curing agents, aziridine-based curing agents, and metal chelate-based curing agents can be used or Various.

As the colorant, for example, one or more of organic pigments, carbon black, ultramarine blue, red iron oxide, zinc oxide, titanium oxide, graphite, and dyes can be used. As the flame retardant, for example, one or more of halogen-containing flame retardants, phosphorus-containing flame retardants, nitrogen-containing flame retardants, and inorganic flame retardants can be used. As the filler, for example, one or more of glass fiber, silica, talc, and ceramics can be used.

As the lubricant, for example, one or more of fatty acid ester, hydrocarbon resin, paraffin, higher fatty acid, fatty acid amide, aliphatic alcohol, metal soap, and modified silicone can be used. As the anti-blocking agent, for example, one or more of calcium carbonate, silicon dioxide, polymethylsilsesquioxane, and aluminum silicate can be used.

Furthermore, the metal material layer 44 can be a metal foil. In this case, the metal foil may be formed by forming the same metal as an example of the conductive filler on the release sheet 42 by plating or the like.

FIG. 9 shows an example of S300 using the metal-containing sheet 46 . As shown in the figure, the metal material layer 44 side containing the metal sheet 46 is arranged and attached to the protective layer 30 . Next, the thermosetting resin of the metal material layer 44 is cured by hot pressing the metal-containing sheet 46 , whereby the conductive layer 40 is formed. After that, the release sheet 42 is removed. Thereby, the electronic device package 100 as shown in FIG. 1 is manufactured.

Hot pressing can be performed under reduced pressure or vacuum. Thereby, the adhesion of the metal material layer 44 to the mounting substrate 12 can be improved. Hot pressing can be performed at 100°C to 220°C (preferably 120°C to 180°C), for 1 minute to 120 minutes (preferably 1 minute to 60 minutes), at 0.1 MPa to 10 MPa (preferably 0.5 MPa to 3 MPa).

Furthermore, in S300 , the conductive layer 40 may be formed by other methods without using the metal-containing sheet 46 . For example, the conductive layer 40 can be formed by depositing a metal by plating, vapor deposition, or sputtering (hereinafter also referred to as “plating, etc.”). As a metal used for plating etc., gold, platinum, silver, copper, nickel, aluminum, iron, or these alloys are mentioned, for example. As another example, the conductive layer 40 can be coated or sprayed with conductive paste (for example, can be used in the metal material layer 44) on the protective layer 30 or (before hot pressing) the second protective layer 34, and then formed by hardening.

After S300 , a step of singulating the electronic device package 100 may be performed if necessary. For example, the electronic device package 100 can be cut in the X direction and the Y direction at a position corresponding to the product area to obtain individual products. In addition, S300 is not performed, and one without the conductive layer 40 may be used as the electronic device package 100 .

As described above, according to the present embodiment, the protective layer 30 is formed on the mounting substrate 12 using the protective sheet 38 having a predetermined structure and physical properties through the processes of S100 to S300 . Thereby, the protective layer 30 can be formed with a sufficient film thickness at the corners of the electronic device 20 and the like where the protective layer 30 flows too much and the film thickness tends to become thin, or where the protective layer 30 cannot flow sufficiently. In addition, according to this embodiment, when the protective sheet 38 is pasted, the first surface side can be prevented from being covered with liquid by adhering to the circuit board 10 and the like.

The protective layer 30 may contain a layer structure derived from the protective sheet 38 . For example, when the protective sheet 38 has a three-layer structure, at least a part of the protective layer 30 may have a three-layer structure derived from each of the first protective layer 32 to the third protective layer 36 . In particular, in the corner recesses where the circuit board 10 contacts the electronic device 20 and the like, the film thickness of the protective layer 30 becomes thicker, and the layer structure of the protective sheet 38 tends to remain. On the other hand, the layered structure of the protective sheet 38 does not have to remain at the corners of the electronic device 20 or the like where the film thickness of the protective layer 30 is reduced.

Hereinafter, examples of this embodiment will be described with reference to examples.

[Example] [Composition A1 for the first protective layer] Composition A1 for the first protective layer 32 having the following composition was prepared. Polyurethane resin (acid value: 5 mgKOH/g, weight average molecular weight: 54,000, Tg: -7°C, manufactured by TOYO CHEM) 100 parts by weight Epoxy compound (YDF-2005RD manufactured by NIPPON STEEL Chemical & Material Co., Ltd.) 20 parts by weight 20 parts by weight of solvent (methyl ethyl ketone)

[Composition A2 for the first protective layer] Adjusted to have the same composition as Composition A1 except that 6 parts by weight of silicon dioxide (SO-C6, D ₅₀ manufactured by Admatechs; 2.0 μm) was added Composition A2 for the first protective layer 32.

[Composition A3 for the first protective layer] Adjusted to have the same composition as the composition A1 except that 12 parts by weight of silicon dioxide (SO-C6, D ₅₀ manufactured by Admatechs; 2.0 μm) was added Composition A3 for the first protective layer 32.

[Composition A4 for the first protective layer] Adjusted to have the same composition as Composition A1 except for adding 15 parts by weight of silicon dioxide (SO-C6, D ₅₀ manufactured by Admatechs; 2.0 μm) Composition A4 for the first protective layer 32.

[Composition A5 for the first protective layer] Adjusted to have the same composition as that of Composition A1 except that 55 parts by weight of silicon dioxide (SO-C6, D ₅₀ manufactured by Admatechs; 2.0 μm) was added Composition A5 for the first protective layer 32.

[Composition A6 for the first protective layer] Adjusted to have the same composition as the composition A1 except that 1.5 parts by weight of silicon dioxide (SO-C6, D ₅₀ manufactured by Admatechs; 2.0 μm) was added Composition A6 for the first protective layer 32.

[Composition A7 for the first protective layer] Adjusted to have the same composition as the composition A1 except for adding 20 parts by weight of silicon dioxide (SO-C6, D ₅₀ manufactured by Admatechs; 2.0 μm) Composition A7 for the first protective layer 32.

[Composition B1 for Second Protective Layer] Composition B1 for the second protective layer 34 having the following composition was prepared. Polyurethane resin (acid value: 5 mgKOH/g, weight average molecular weight: 54,000, Tg: -7°C, manufactured by TOYO CHEM) 100 parts by weight of epoxy compound (Nippon Steel Chemical & Materials (NIPPON) STEEL Chemical & Material) YDF-2001) 20 parts by weight of silicon dioxide (SO-C6, D ₅₀ manufactured by Admatechs; 2.0 μm) 13.6 parts by weight (calculated as the solid content after removing the solvent 10% by weight) Solvent (methyl ethyl ketone) 20 parts by weight

[Composition B2 for Second Protective Layer] A second protective layer 34 having the same composition as that of Composition C1 was prepared except that silicon dioxide was changed to 24.4 parts by weight of talc (manufactured by Fuji Talc Co., Ltd. FH104 D ₅₀ ; 4.0 μm). Composition B2 was used.

[Composition B3 for the second protective layer] Composition B3 for the second protective layer 34 having the same composition as Composition B1 except that the content of silicon dioxide was changed to 35.0 parts by weight was prepared.

[Composition B4 for the second protective layer] Composition B4 for the second protective layer 34 having the same composition as Composition B1 except that no silicon dioxide was added was prepared.

[Composition B5 for _the second protective layer] A composition B1 having Composition B5 for the second protective layer 34 having the same composition.

[Composition B6 for the second protective layer] Except that the content of silicon dioxide (SO-C6 manufactured by Admatechs, D ₅₀ ; 2.0 μm) was changed to 0.15 parts by weight, a composition B1 having Composition B6 for the second protective layer 34 having the same composition.

[Composition B7 for _the second protective layer] A composition B1 having Composition B7 for the second protective layer 34 having the same composition.

[Composition B8 for _the second protective layer] A composition B1 having Composition B8 for the second protective layer 34 having the same composition.

[Composition B9 for the second protective layer] Except that the content of silicon dioxide (SO-C6 manufactured by Admatechs, D ₅₀ ; 2.0 μm) was changed to 15 parts by weight, a composition B1 having Composition B9 for the second protective layer 34 having the same composition.

[Composition B10 for the second protective layer] Except that the content of silicon dioxide (SO-C6 manufactured by Admatechs, D ₅₀ ; 2.0 μm) was changed to 1.5 parts by weight, a composition having Composition B10 for the second protective layer 34 having the same composition.

[Composition C1 for Third Protective Layer] Composition C1 for the third protective layer 36 having the following composition was prepared. Polyurethane resin (acid value: 5 mgKOH/g, weight average molecular weight: 54,000, Tg: -7°C, manufactured by TOYO CHEM) 100 parts by weight of epoxy compound (Nippon Steel Chemical & Materials (NIPPON) STEEL Chemical & Material) 20 parts by weight of silicon dioxide (SO-C6, D ₅₀ manufactured by Admatechs; 2.0 μm) 13.6 parts by weight of solvent (methyl ethyl ketone) 20 parts by weight Parts [Composition C2 for Third Protective Layer] Composition C2 for third protective layer 36 having the same composition as that of Composition C1 was prepared except that no silicon dioxide was added at all. [Composition C3 for _the third protective layer] A composition C1 having Composition C3 for the third protective layer 36 having the same composition. [Composition C4 for the third protective layer] Except that the content of silicon dioxide (SO-C6 manufactured by Admatechs, D ₅₀ ; 2.0 μm) was changed to 20 parts by weight, the same composition C1 was prepared. Composition C4 for the third protective layer 36 having the same composition. [Composition C5 for _the third protective layer] A composition C1 having Composition C5 for the third protective layer 36 having the same composition. [Composition C6 for the third protective layer] Except that the content of silicon dioxide (SO-C6 manufactured by Admatechs, D ₅₀ ; 2.0 μm) was changed to 55 parts by weight, the same composition C1 was prepared. Composition C6 for the third protective layer 36 having the same composition.

[Manufacturing of single layer A1] Composition A1 was coated on a release sheet. Thereafter, it was heated at 120° C. for 5 minutes to perform drying and semi-curing to form a single layer A1 corresponding to the first protective layer 32 with a film thickness of 15 μm.

[Manufacture of single layer B1] Composition B1 was coated on a release sheet. Thereafter, it was heated at 120° C. for 5 minutes to perform drying and semi-curing to form a single layer B1 corresponding to the second protective layer 34 with a film thickness of 45 μm.

[Manufacture of single layer C1] Composition C1 was coated on a release sheet. Thereafter, it was heated at 120° C. for 5 minutes to perform drying and semi-curing to form a single layer C1 corresponding to the third protective layer 36 with a film thickness of 60 μm.

[Manufacture of protective sheet H1] Composition A1 was coated on a release sheet. Thereafter, it was heated at 120° C. for 5 minutes to perform drying and semi-curing to form the first protective layer 32 with a film thickness of 15 μm. The composition 1C is coated on the first protective layer 32 . Thereafter, it was heated at 120° C. for 5 minutes to perform drying and semi-hardening to form the third protective layer 36 with a film thickness of 60 μm. Thereafter, the composition B1 is coated on the third protective layer 36 . Thereafter, it was heated at 120° C. for 5 minutes to perform drying and semi-curing to form the second protective layer 34 with a film thickness of 45 μm. In this way, the protective sheet H1 including the first protective layer 32 , the third protective layer 36 and the second protective layer is formed.

[Manufacture of protective sheet H2] Protective sheet H2 was produced by the same method as protective sheet H1 except that composition B2 was used instead of composition B1.

[Manufacture of protective sheet H3] Protective sheet H3 was produced by the same method as protective sheet H1 except that composition B3 was used instead of composition B1.

[Manufacture of protective sheet H4] Protective sheet H4 was produced by the same method as protective sheet H1 except that composition B4 was used instead of composition B1.

[Manufacture of protective sheet H5] Protective sheet H5 was produced by the same method as protective sheet H1 except that composition B5 was used instead of composition B1.

[Manufacture of protective sheet H6] Protective sheet H6 was produced by the same method as protective sheet H1 except that composition B6 was used instead of composition B1.

[Manufacture of protective sheet H7] Protective sheet H7 was produced by the same method as protective sheet H1, except that composition A5 was used instead of composition A1, composition B7 was used instead of composition B1, and composition C6 was used instead of composition C1.

[Manufacture of protective sheet H8] Protective sheet H8 was produced by the same method as protective sheet H1 except that composition A2 was used instead of composition A1.

[Manufacture of protective sheet H9] Protective sheet H9 was produced by the same method as protective sheet H1 except that composition A3 was used instead of composition A1.

[Manufacture of protective sheet H10] Protective sheet H10 was produced by the same method as protective sheet H1 except that composition A4 was used instead of composition A1.

[Manufacture of protective sheet H11] Protective sheet H11 was produced by the same method as protective sheet H1, except that composition B4 was used instead of composition B1, and composition C2 was used instead of composition C1.

[Manufacture of protective sheet H12] Protective sheet H12 was produced by the same method as protective sheet H1, except that composition A6 was used instead of composition A1, composition B10 was used instead of composition B1, and composition C3 was used instead of composition C1.

[Manufacture of protective sheet H13] Protective sheet H13 was produced by the same method as protective sheet H1, except that composition A7 was used instead of composition A1, composition B8 was used instead of composition B1, and composition C4 was used instead of composition C1.

[Manufacture of protective sheet H14] Protective sheet H14 was produced by the same method as protective sheet H1, except that composition A4 was used instead of composition A1, composition B9 was used instead of composition B1, and composition C5 was used instead of composition C1.

The following test/evaluation was performed about single layer A1 - single layer A7, single layer B1 - single layer B10, single layer C1 - single layer C6, and protective sheet H1 - protective sheet H14.

[Glass transition temperature] The glass transition temperature of each layer was measured, and the result was Single layer A1: 42°C Single layer B1: 22°C Monolayer C1: 27°C.

[flow length] Laminate a polyimide film (Capton 500H) on one side of the single layer A1 to single layer C1 and the protective sheet H1 to the protective sheet H14 at a speed of 2 m/min under heating conditions of 90°C. ), punched into a rectangle of 0.5 cm × 1 cm. After lamination, the release sheet was peeled off and placed on a polyimide film (Capton 500H). Thereby, the single layer A1 - the single layer C1 and the protective sheet H1 - the protective sheet H14 each have a shape sandwiched between two polyimide films.

Place a piece of heat-resistant release film (Opulent CR1012MT4 150 μm, Mitsui Chemicals Tocel ( Made by Mitsui Chemicals Tohcello), silicone rubber with a rubber hardness of 70 degrees (measured with JIS K 6253 A, TECLOCK rubber/plastic hardness tester (durometer) GS-719N) is used to attach these clips Hold, under the heating condition of 180 ℃, press at 1 MPa for 5 minutes. The length of the most flowing part among the parts flowing from each side of the polyimide film after melting was calculated, and the average value of the four sides was measured as the flow length (μm). Four samples were prepared for each of the single layer A1 to single layer C1 and the protective sheet H1 to H14, and the average value of the flow length (μm) was measured. In addition, the index X, the index Z, the index Y, and the index W were calculated based on the average value of the measured flow length (μm) and the film thickness (μm).

[Cooling and heating cycle] (Preparation of test single piece) A substrate in which 5×5 molded and sealed electronic components (1000 μm×1000 μm) were mounted in an array on a substrate made of glass epoxy was prepared. The thickness of the substrate was 0.3 mm, and the thickness of the mold seal, that is, the height (part height) H from the upper surface of the substrate to the top surface of the mold seal material was 0.7 mm. Thereafter, half-cuts were performed along the grooves serving as gaps between components to obtain test substrates. The depth of the half-cut groove is set to 0.8 mm (the depth of the cut groove of the substrate 20 is 0.1 mm), and the width of the half-cut groove is set to 200 μm. Under the conditions of 8 MPa and 170° C., the protective sheets H1 to H14 were bonded to the test substrate by thermocompression for 5 minutes, and the cushioning material was peeled off by hand. Then, the obtained electronic component mounting board|substrate was fully diced along the half-cut groove, and 25 test individual pieces were obtained about each protective sheet. The obtained test sheet was put into a thermal shock device ("TSE-11-A", manufactured by Espec Corporation), and exposed to high temperature: 125°C for 15 minutes, and low temperature exposure: -50°C for 15 minutes. 1000 alternate exposures were performed under the exposure condition of 10 minutes. Thereafter, the test pieces were taken out, the appearance of the electronic component protective layer was observed, and the number of damaged test pieces was counted, and the following criteria were used for evaluation. For each example, the number of tests was set to 10. +++: The number of damaged test single sheets is 0. ++: The number of broken test single sheets is 1 or more and 2 or less. +: The number of damaged test single sheets is 3 or more and 5 or less. (practical level) NG: The number of broken test pieces is 6 or more. [Table 1A] single layer A1 single layer A2 single layer A3 single layer A4 single layer A5 single layer A6 single layer A7 flow length 113 μm 91 μm 84 μm 73 μm 28 μm 109 μm 69 μm film thickness 15 μm 15 μm 15 μm 15 μm 15 μm 15 μm 15 μm index Z=7.53 Z=6.07 Z=5.60 Z=4.87 Z=1.87 Z=7.27 Z=4.60 [Table 1B] Single layer B1 Single layer B2 Single layer B3 Single layer B4 Single layer B5 Single layer B6 Single layer B7 Single layer B8 Single layer B9 Single layer B10 flow length 48 μm 60μm 58 μm 111 μm 96 μm 88 μm 29 μm 61 μm 62 μm 105 μm film thickness 60μm 60μm 60μm 60μm 60μm 60μm 60μm 60μm 60μm 60μm index Y=0.80 Y=1.00 Y=0.97 Y=1.85 Y=1.60 Y=1.47 Y=0.48 Y=1.02 Y=1.03 Y=1.75 [Table 1C] single layer C1 single layer C2 single layer C3 single layer C4 Single layer C5 Single layer C6 flow length 64 μm 142 μm 131 μm 81 μm 79 μm 40μm film thickness 45 μm 45 μm 45 μm 45 μm 45 μm 45 μm index W=1.42 W=3.16 W=2.91 W=1.80 W=1.76 W=0.89 [Table 2A] Protective sheet H1 Protective sheet H2 Protective sheet H3 Protective sheet H4 Protective sheet H5 Protective sheet H6 Protective sheet H7 flow length 106 μm 79 μm 80μm 123 μm 119 μm 120μm 42μm film thickness 120μm 120μm 120μm 120μm 120μm 120μm 120μm index X=0.88 X=0.66 X=0.67 X=1.03 X=0.99 X=1.00 X=0.35 Weight % of filler in the whole 7.00% 9.50% 11.90% 3.60% 3.70% 3.70% 31% Hot and cold cycle +++ ++ + +++ +++ +++ + [Form 2B] Protective sheet H8 Protective sheet H9 Protective sheet H10 Protective sheet H11 Protective sheet H12 Protective sheet H13 Protective sheet H14 flow length 90 μm 80μm 85 μm 252 μm 231 μm 58 μm 63 μm film thickness 120μm 120μm 120μm 120μm 120μm 120μm 120μm index X=0.75 X=0.67 X=0.71 X=2.10 X=1.93 X=0.48 X=0.35 Filler weight in bulk 8.40% 9.80% 10.50% 0.00% 1.20% 14.30% 11.10% Hot and cold cycle +++ ++ + +++ +++ + +

[Probe Adhesive Test] A probe adhesive test was performed using the protective sheets H1 to H10. According to the seventeenth revised Japanese Pharmacopoeia General Test Method 6. Preparation Test Method 6.12 Adhesion Test Method 3.4 Probe Adhesion Test Method Cut the protective sheets H1 to H10 into more than 2 cm squares for testing. In addition, the test was carried out by attaching a sheet to the weight ring, placing a total of 200 g of weights on it, and applying a load. The test was carried out when N=4, and the average value was taken as the result. The results are shown below. [Table 3A] Unit N/cm ² Protective sheet H1 Protective sheet H2 Protective sheet H3 Protective sheet H4 Protective sheet H5 Protective sheet H6 Protective sheet H7 first side 0.01 0.01 0 0.01 0.01 0.01 0 second side 0.09 0.14 0.26 0.01 0.03 0.05 0.28 [Table 3B] Unit N/cm ² Protective sheet H8 Protective sheet H9 Protective sheet H10 Protective sheet H11 Protective sheet H12 Protective sheet H13 Protective sheet H14 first side 0.01 0.01 0 0.01 0.01 0.01 0.01 second side 0.09 0.09 0.09 0.09 0.09 0.09 0.09

As shown in the figure, there is almost no stickiness on the first protective layer 32 side (first surface side). On the other hand, it shows that on the second protective layer 34 side (second surface side), the viscosity increases depending on the amount of the filler (silicon dioxide).

[Manufacturing of electronic device packages] Prepare a mounting board on which an IC chip and an octagonal inductor connected to the circuit board by bumps are mounted, and make the side of the first protective layer face the side of the circuit board, and test the protective sheet under the conditions of 180°C and 1 MPa H1 was subjected to thermocompression bonding for 5 minutes to manufacture electronic device package P1 with a protective layer. The electronic device package P2 - the electronic device package P14 are manufactured from the protection sheet H2 - the protection sheet H14 by the same method. For electronic device packages other than electronic device package P7, electronic device package P11, and electronic device package P13 among electronic device packages P1 to electronic device package P14 (satisfying index X=0.5 to 2.0), it is confirmed that any protective layer is rated at 15 The film thickness of μm or more is formed on any one of the side surfaces of the bump, the side surface of the inductor, and the upper corner of the IC chip, and has a sufficient insulating protection function. However, in P11 (index X > 2.0), the fluidity of the protective layer was too high, and a portion where the film thickness became thinner occurred. In addition, in P7 and P13 (index X<0.5), the fluidity of the protective layer was too low, and a portion where the protective layer could not spread occurred. In addition, for the protective sheets of H3, H7, H10, H13, and H14 with filler amounts of 10 parts by weight or more, the results of the thermal cycle test were worse than those of other protective sheets.

As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range described in the said embodiment. It is clear for those skilled in the art that various changes and improvements can be added to the above-described embodiments. It is clear from the description in the claims that such changes or improvements are included in the technical scope of the present invention.

The execution order of each process such as actions, procedures, steps, and stages in the methods shown in the scope of claims, the specification, and the drawings is not specifically stated as "before", "before", etc. In addition, It should be noted that as long as the result generator of the previous processing is not used in the subsequent processing, it can be implemented in any order. Regarding the flow of operations in the scope of claims, specification, and drawings, even if descriptions are made using "first" and "next" for convenience, it does not mean that they must be implemented sequentially.

10: Circuit board 12: Install the substrate 20: Electronic devices (substrates) 22: Electronic devices 24: Connecting components 30: protective layer 32: The first protective layer 34: Second protective layer 35: Polyimide film 36: The third protective layer 38: Protective sheet 40: Conductive layer 42: Stripping sheet 44: metal material layer 46: With metal sheet 100: Electronic device packaging L1～L4: length (flow length) S100, S200, S300: steps

FIG. 1 shows an example of an electronic device package 100 according to this embodiment. FIG. 2 shows an example of the protection sheet 38 of this embodiment. FIG. 3 shows an example of the flow length in this embodiment. FIG. 4 shows another example of the protection sheet 38 of this embodiment. FIG. 5 shows an example of the flow of the manufacturing method of the electronic device package 100 of this embodiment. FIG. 6 shows an example of S200 in the flow of FIG. 5 . FIG. 7 shows an example of the mounting substrate 12 on which the protective layer 30 is formed. FIG. 8 shows an example of the metal-containing sheet 46 . FIG. 9 shows an example of S300 using the metal-containing sheet 46 .

10: Circuit board

20: Electronic devices

22: Electronic devices

24: Connecting components

30: protective layer

40: Conductive layer

100: Electronic device packaging

Claims (25)

A kind of protection sheet, it is used for circuit substrate, and described protection sheet has first surface and the second surface that is opposite to described first surface, and in described protection sheet, the stickiness of using probe on the first surface The adhesive force obtained in the test is 0.15 N/cm ² or less, and the index X obtained from the following formula 1 is 0.5 to 2.0, and the protective sheet contains fillers at a content of 1.0 wt % to 9.8 wt %, [Formula 1] X=F _total /T _total (F _total ; when a rectangular protective sheet made of 0.5 cm×1.0 cm is heated and pressed at 180°C and 1 MPa for 5 minutes, the four sides with the longest flow in the most fluid part of each side The average value (μm), T _total ; the total thickness of the protective sheet (μm)). The protective sheet according to claim 1, wherein the tensile breaking strength is 10 N/mm ² to 70 N/mm ² . The protective sheet as claimed in item 1, wherein, The protective sheet includes: the first layer of protection; and second protective layer, The first protective layer is the outermost layer on the first side of the protective sheet, The second protective layer is the outermost layer on the second side of the protective sheet. The protective sheet according to claim 3, wherein the index Y of the second protective layer obtained by the following formula 2 is 0.5 to 1.5, [Formula 2] Y=F ₂ /T ₂ (F ₂ ; in When the second protective layer made into a rectangle of 0.5 cm×1.0 cm is heated and pressed at 180°C and 1 MPa for 5 minutes, the average value (μm) of the four sides of the flow length at the most fluid part of each side, T ₂ ; Thickness of the second protective layer (μm)). The protective sheet according to claim 3, wherein the index Z of the first protective layer calculated by the following formula 3 is 2.0 to 15.0, [Formula 3] Z=F ₁ /T ₁ (F ₁ ; in When the first protective layer made into a rectangle of 0.5 cm×1.0 cm is heated and pressed at 180°C and 1 MPa for 5 minutes, the average value (μm) of the four sides of the flow length at the most fluid part of each side, T ₁ ; Thickness of the first protective layer (μm)). The protective sheet as claimed in item 3, wherein, The glass transition temperature of the second protective layer is below 60°C. The protective sheet as claimed in item 3, wherein, The film thickness of the first protective layer is 5 μm to 150 μm, The film thickness of the second protective layer is 10 μm˜200 μm. The protective sheet as claimed in item 3, wherein, A third protection layer is included between the first protection layer and the second protection layer. The protective sheet according to claim 8, wherein the index W of the third protective layer obtained by the following formula 4 is 1.0 to 3.0, [Formula 4] W=F ₃ /T ₃ (F ₃ ; in When the third protective layer made into a rectangle of 0.5 cm×1.0 cm is heated and pressed at 180°C and 1 MPa for 5 minutes, the average value (μm) of the four sides of the flow length at the most fluid part of each side, T ₃ ; Thickness of the third protective layer (μm)). The protective sheet as claimed in item 8, wherein, The film thickness of the third protective layer is 20 μm˜200 μm. The protective sheet as claimed in item 8, wherein, The first protective layer, the second protective layer, and the third protective layer include polyurethane resin and a curing agent. The protective sheet as claimed in item 1, wherein, The protection sheet includes a filler, and the filler has a higher mass concentration on the second surface side than on the first surface side of the protection sheet. An electronic device package comprising: a circuit substrate with a conductive circuit disposed on its surface; an electronic device configured on the circuit substrate; and a protective layer disposed on the circuit substrate and the electronic device, The electronic device has a polygonal shape of pentagon or larger when viewed from the main surface of the circuit board or when viewed from the side of the main surface. The electronic device package as claimed in claim 13, wherein, The electronic device has a concave portion on the side surface. The electronic device package as claimed in claim 13, wherein, The electronic device has a polygonal shape of pentagon or more in view of the main surface. An electronic device package comprising: a circuit substrate with a conductive circuit disposed on its surface; an electronic device configured on the circuit substrate; and a protective layer disposed on the circuit substrate and the electronic device, The protective layer at least partially covers the connecting member electrically connecting the electronic device with the circuit substrate. The electronic device package as claimed in claim 16, wherein, The connection member is a bump disposed on the lower surface of the electronic device. The electronic device package as claimed in claim 16, wherein, The connecting member is a lead frame carrying the electronic device. An electronic device package, comprising: A circuit substrate with a conductive circuit disposed on its surface; an electronic device configured on the circuit substrate; and a protective layer disposed on the circuit substrate and the electronic device, The electronic device has a multilayer ceramic capacitor (MLCC). The electronic device package as claimed in claim 13, wherein, The protective layer comprises at least two layers. The electronic device package as claimed in claim 20, wherein, The protective layer is a cured product of thermosetting resin. The electronic device package according to any one of claim 13 to claim 21, wherein, A conductive layer is formed on the protection layer. A method for manufacturing an electronic device package, comprising the steps of: A mounting substrate on which electronic devices are mounted on a substrate provided with a conductive circuit on the surface, and the protective sheet as described in any one of claim 1 to claim 12 is arranged in such a way that the first surface faces the electronic device side , forming a protective layer formed by the protective sheet on the mounting substrate. The manufacturing method of electronic device packaging as claimed in item 23, wherein, The step of forming the protective layer includes hot pressing the protective sheet on the mounting substrate after disposing the protective sheet. The manufacturing method of electronic device packaging as claimed in claim 23 further includes the step of forming a conductive layer on the protective layer.

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