TW202303815A - Device for bearing and cleaning silicon wafer - Google Patents

Abstract

The embodiment of the present invention discloses a device for carrying and cleaning a silicon wafer. The device includes: a supporting part for supporting the silicon wafer in the horizontal direction; a cleaning part for the silicon wafer being supported by the supporting part When cleaning the lower surface of the silicon wafer, the cleaning part includes a first part and a second part, the first part is configured to spray cleaning liquid to the lower surface of the silicon wafer, and the second part is configured to be able to wherein the upper surface of the second part is formed with bristles and the upper surface of the second part is deformable between a first state and a second state, in which the bristles are not in contact with the silicon wafer In contact, in the second state, the bristles can be in contact with the lower surface of the silicon wafer to clean the lower surface of the silicon wafer through the rotation of the second portion relative to the lower surface of the silicon wafer.

Description

A device for carrying and cleaning silicon wafers

The invention belongs to the technical field of semiconductor wafer processing, in particular to a device for carrying and cleaning silicon wafers.

Silicon wafer is the material used for the manufacture of semiconductor components. Generally, after polysilicon has undergone processes such as remelting, pulling, slicing, chamfering, grinding, polishing, and cleaning, wafer-level silicon wafers with smooth and flat surfaces and neat edges can be obtained. As the diameter of silicon wafers becomes larger and the feature size of integrated circuits becomes smaller, higher requirements are placed on the flatness, cleanliness, and damage of the wafer surface.

During the processing of silicon wafers, the purpose of performing the chamfering process of silicon wafers is to eliminate the edges and corners, burrs, chipping, cracks or other defects and various edge surface contaminations on the edge surface of the silicon wafer due to cutting, so that Reduce the roughness of the silicon wafer surface, increase the mechanical strength of the silicon wafer edge surface, and reduce the surface contamination particles.

For the chamfering process, it is mainly based on the conditions of the chamfering equipment and the fineness of the grinding wheel grinding material used to select the appropriate grinding wheel speed, silicon wafer speed, silicon wafer removal amount, number of chamfering circles, grinding wheel model, Cutting fluid type, cutting fluid flow rate, etc., to produce products that meet customer needs.

The chamfering of silicon wafers is usually done by a chamfering machine. The chamfering machine is used to grind the edge of the wafer. During the chamfering process, the wafer is usually vacuum-adsorbed on the carrier and rotates with the carrier. By controlling the movement of the wafer, the grinding wheel with V-shaped grooves Spin to grind the wafer edge.

However, the surface cleanliness of silicon wafers before being chamfered is usually poor, and during the edge chamfering process, the silicon slag and grinding wheel debris generated will splash on the carrier table, which will cause the carrier table to be damaged when it carries and absorbs the silicon wafer. damage to the silicon wafer surface.

In order to solve the above technical problems, the embodiments of the present invention expect to provide a device capable of simultaneously solving the problems of carrying and cleaning silicon wafers.

Technical scheme of the present invention is realized like this: A device for carrying and cleaning a silicon wafer, the device comprising: a supporting part for supporting the silicon wafer in a horizontal direction; a cleaning part for cleaning the silicon wafer when the silicon wafer is supported by the supporting part The lower surface is cleaned, the cleaning part includes a first part and a second part, the first part is set to be able to spray cleaning liquid to the lower surface of the silicon wafer, and the second part is set to be able to rotate relative to the silicon wafer; wherein, the Bristles are formed on the upper surface of the second portion and the upper surface of the second portion is deformable between a first state in which the bristles are not in contact with the silicon wafer and a second state in which the bristles are not in contact with the silicon wafer. state, the bristles can be in contact with the lower surface of the silicon wafer to clean the lower surface of the silicon wafer through the rotation of the second portion relative to the lower surface of the silicon wafer.

An embodiment of the present invention provides a device for carrying and cleaning a silicon wafer, the device comprising: The supporting part for supporting the silicon wafer and the cleaning part for cleaning the lower surface of the silicon wafer. The cleaning part includes a first part capable of spraying cleaning liquid on the lower surface of the silicon wafer and a second part for cleaning the lower surface of the silicon wafer through bristles , wherein, the second part of the silicon wafer can be deformed between the first state and the second state, and only in the second state is in contact with the silicon wafer to clean the silicon wafer, unlike the conventional silicon wafer carrier, the present invention The device provided by the embodiment only partially supports the silicon wafer instead of supporting the silicon wafer in a manner of contacting the entire lower surface of the silicon wafer, thereby reducing the contact area between the supporting surface and the silicon wafer, avoiding splashes and damage caused by the previous polishing operation. The debris remaining on the surface of the carrying table will cause damage to the surface of the silicon wafer, and the device provided by the embodiment of the present invention can also clean the carried silicon wafer through the interaction between the first part spraying the cleaning liquid and the second part with bristles , to remove the debris attached to the surface of the silicon wafer due to the previous process, thus avoiding the damage to the surface of the silicon wafer caused by the uncleanness of the silicon wafer itself.

In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention.

It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

It is to be understood that the terms "length", "width", "top", "bottom", "front", "rear", "left", "right", "vertical", "horizontal", "top" , "bottom", "inner", "outer" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying No device or element must have a specific orientation, be constructed, and operate in a specific orientation and therefore should not be construed as limiting the invention.

In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of said features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

In the present invention, unless otherwise clearly specified and limited, terms such as "installation", "connection", "connection" and "fixation" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection , or integrated; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediary, and it can be the internal communication of two components or the interaction relationship between two components. Those with ordinary knowledge in the art can understand the specific meanings of the above terms in the present invention according to specific situations.

In the current chamfering operation of silicon wafers, silicon wafers are usually adsorbed and fixed by adsorption stages. Conventional adsorption stages are generally made of hard ceramics and usually have grooves on the surface, which results in the grinding of silicon wafers. The debris is very easy to adhere to the surface of the adsorption stage, thus causing damage to the surface of the silicon wafer when the silicon wafer is adsorbed.

In order to solve the above problems, referring to FIG. 1, an embodiment of the present invention provides a device 1 for carrying and cleaning a silicon wafer S, the device 1 comprising: a supporting part 10 for supporting the silicon wafer S in a horizontal direction; a cleaning part 20, The cleaning part 20 is used to clean the lower surface S1 of the silicon wafer S when the silicon wafer S is supported by the supporting part 10, the cleaning part 20 includes a first part 201 and a second part 202, and the first part 201 is arranged as The cleaning liquid can be sprayed to the lower surface S1 of the silicon wafer S, and the second part 202 is set to be able to rotate relative to the silicon wafer S; wherein, bristles 2022 are formed on the upper surface 2021 of the second part 202 and the second The upper surface 2021 of the part 202 can be deformed between a first state and a second state, in which the bristles 2022 are not in contact with the silicon wafer S, and in the second state, the bristles 2022 can be in contact with the silicon wafer S The lower surface S1 of the silicon wafer S is contacted to clean the lower surface S1 of the silicon wafer S by the rotation of the second portion 202 relative to the lower surface S1 of the silicon wafer S.

Specifically, the silicon wafer S is transferred by the robotic arm R to the device 1 for carrying and cleaning the silicon wafer S after the previous process, and the mechanical arm R fixes the silicon wafer S horizontally on the device 1, wherein the silicon wafer The lower surface S1 of S is in direct contact with the device 1, and Fig. 1 and Fig. 2 respectively show the first state and the second state of the upper surface 2021 of the second part 202 of the device 1, in the first state, as shown in Fig. 1 As shown, there is a certain gap between the bristles 2022 on the upper surface 2021 of the second part 202 and the lower surface S1 of the silicon wafer S, that is to say, the bristles 2022 of the second part 202 are not in contact with the lower surface S1 of the silicon wafer S. contact, and, in the embodiment shown in FIG. 1, the first part 201 is also spaced from the lower surface S1 of the silicon wafer S, and only the support portion 10 of the device 1 is connected to the lower surface S1 of the silicon wafer S. contact to support the silicon wafer S. In the second state, as shown in FIG. 2 , the upper surface 2021 of the second part 202 is deformed to protrude upward, so that the bristles 2022 formed on the upper surface 2021 can contact the lower surface S1 of the silicon wafer S. In this case, when the second part 202 of the device 1 rotates relative to the silicon wafer S, the bristles 2022 can clean the lower surface S1 of the silicon wafer S.

The embodiment of the present invention provides a device 1 for carrying and cleaning a silicon wafer S, the device 1 comprising: a supporting part 10 for supporting the silicon wafer S and a cleaning part 20 for cleaning the lower surface S1 of the silicon wafer S, the cleaning part 20 includes a first part 201 capable of spraying cleaning liquid to the lower surface S1 of the silicon wafer S and a second part 202 for cleaning the lower surface S1 of the silicon wafer S through bristles 2022, wherein the second part 202 of the silicon wafer S can be It deforms between the first state and the second state, and only contacts the silicon wafer S in the second state to clean the silicon wafer S. Unlike the conventional silicon wafer carrier, the device 1 provided by the embodiment of the present invention is only partially Supporting the silicon wafer S instead of supporting the silicon wafer S in a manner of contacting the entire lower surface S1 of the silicon wafer S, thereby reducing the contact area of the supporting surface with the silicon wafer S, avoiding the splashes and remaining on the supporting surface due to the previous polishing operation. Debris on the surface of the table can cause damage to the surface of the silicon wafer, and the device 1 provided by the embodiment of the present invention can also clean the silicon wafer S carried by the interaction between the first part 201 spraying cleaning liquid and the second part 202 with bristles 2022. Cleaning is performed to remove debris attached to the surface of the silicon wafer S due to the previous process, thereby avoiding damage to the surface of the silicon wafer due to the uncleanness of the silicon wafer itself.

In order to further avoid damage to the surface of the silicon wafer, for example, the supporting part 10 is made of rubber material with relatively low hardness.

In order to realize the conversion of the upper surface 2021 of the second part 202 between the first state and the second state, optionally, referring to FIG. 1, the second part 202 includes a cavity 2023 that can be filled with fluid, wherein the The upper surface 2021 of the second part 202 is formed above the cavity 2023 and is made of flexible material, so that as the cavity 2023 is filled with fluid, the upper surface 2021 of the second part 202 can change from the first state Deformation to the second state, specifically, as the cavity 2023 is filled with fluid, the upper surface 2021 made of flexible material is gradually convexly deformed under the action of the fluid filled in the cavity 2023, so that the original The bristles 2022 spaced apart from the lower surface S1 of the silicon wafer S (as shown in FIG. 1 ), gradually approach and finally contact the lower surface S1 of the silicon wafer S (as shown in FIG. 2 ).

According to an optional embodiment of the present invention, the upper surface 2021 of the second part 202 may be made of polyethylene polypropylene fiber, polytetrafluoroethylene, PDMS and other materials, for example.

According to an alternative embodiment of the present invention, referring to Fig. 1 to Fig. 3, the supporting part 10, the first part 201 and the second part 202 are arranged concentrically with respect to the longitudinal centerline X of the device 1, and in the horizontal direction, the The supporting part 10 is arranged at the outermost part of the device 1 and the second part 202 is located between the supporting part 10 and the first part 201 .

For example, in the embodiment shown in FIG. 3 , when viewed from above, the device 1 is substantially circular as a whole, wherein the first part 201 , the second part 202 and the support part 10 are arranged concentrically, and the first part 201 is substantially circular. Circular and located at the central position, the support portion 10 has a substantially annular shape and is located at the outermost in the radial direction, and the second portion 202 has a substantially annular shape and is located between the first portion 201 and the support portion 10 in the radial direction between. With the arrangement described above, the device 1 can be made more compact, and the cleaning operation can be performed more efficiently.

In order to better realize the spraying of cleaning liquid, optionally, the first part 201 includes a nozzle 2011, which is arranged eccentrically with respect to the longitudinal centerline X, and the first part 201 and the second part 202 are arranged to be able to The wafer S is rotated around the longitudinal centerline X. By arranging the nozzle 2011 eccentrically, when the first part 201 rotates around the longitudinal centerline X, the nozzle 2011 can spray cleaning liquid on more areas of the lower surface of the silicon wafer, and the spray angle of the nozzle 2011 can be set to spray out The cleaning liquid can cover the lower surface S1 of the silicon wafer S as much as possible, and the cleaning liquid sprayed from the nozzle can also wet the bristles, thereby cleaning the bristles.

In order to further facilitate the cleaning of the silicon wafer, optionally, the first part 201 and the second part 202 are arranged to be able to rotate in opposite directions relative to each other around the longitudinal centerline X, by making the first part 201 and the second part 202 face each other Rotating in opposite directions can make the bristles of the second part better cooperate with the sprayed cleaning liquid, so as to achieve the purpose of cleaning.

In order to improve the utilization of the cleaning liquid and reduce the production cost, optionally, referring to FIG. 1 , the device 1 also includes a water storage tank 30 for collecting the cleaning liquid, and the water storage tank 30 is configured to have an open mouth at the top 301, and the mouth 301 communicates with the space above the first part 201 and the second part 202, so that the cleaning solution sprayed on the lower surface S1 of the silicon wafer S can drop into the water storage tank 30 through the mouth 301, It is convenient for subsequent recycling, which not only saves the production cost, but also reduces the pollution to other parts of the device 1 caused by the random flow of cleaning liquid.

According to an embodiment of the present invention, the device 1 can be used to support the silicon wafer when the silicon wafer undergoes chamfering. After S is cleaned by the device 1, the robotic arm R will be separated from the silicon wafer for subsequent chamfering operations. At this time, the silicon wafer needs to be fixed on the device 1 by other means. In view of this situation, optionally, the water storage tank 30 is located directly below the support portion 10, and the support portion 10 is formed with a vent hole 302 that allows the space above the support portion 10 to communicate with the inside of the water storage tank 30. In the embodiment shown in Fig. 3, four ventilation holes 302 uniformly distributed on the upper surface of the supporting part 10 are provided, and the cleaning solution in the water storage tank 30 can be emptied after the cleaning of the silicon wafer is completed, and then The silicon wafer can be adsorbed on the supporting part 10 through the air hole 302 by continuously forming a negative pressure in the water storage tank 30. Since the negative pressure acts on the silicon wafer, it will not cause damage to the surface of the silicon wafer, and there is no need to add additional fixing devices. , so it is an economical and effective fixing method.

In order to facilitate the emptying of the water storage tank 30, optionally, as shown in FIG. 30. By setting the water pumping hole 303 at the bottom of the water storage tank 30, the cleaning liquid stored in the water storage tank 30 can also flow out of the water storage tank 30 by its own gravity. Of course, a pump can also be set at the water storage tank 303 to accelerate The cleaning liquid is discharged from the water storage tank, and a negative pressure can be formed in the water storage tank 30 to adsorb the silicon wafer on the supporting part 10 of the device 1 .

In order to improve the working efficiency of the device 1, the cleaning operation of the device 1 can be automatically performed. Optionally, referring to FIG. The level sensor 50 , the controller 40 is configured to stop the rotation of the first part 201 and the second part 202 according to the sensing result of the liquid level sensor 50 .

For example, referring to FIG. 4, the water storage tank 30 of the device 1 is provided with a first scale K1 and a second scale K2. During the cleaning stage of the silicon wafer by the device 1, the liquid level in the water storage tank 30 is constantly rising. When the liquid level sensing When the device 50 senses that the liquid level reaches the first scale K1, it sends a signal to the controller 40, and the controller 40 can stop the rotation of the second part 202 and discharge the fluid in the cavity 2023 immediately after receiving the signal. The upper surface 2021 of the second part 202 returns to the first state, while the first part 201 continues to spray cleaning liquid to the lower surface of the silicon wafer to perform secondary cleaning on the lower surface of the silicon wafer. When the liquid level sensor 50 senses When the liquid level reaches the second scale K2, send a signal to the controller 40 again, and the controller 40 can stop the rotation of the first part 201 and stop spraying cleaning fluid immediately after receiving the signal, and at the same time, the controller 40 can control the opening The water pumping hole 303 of the water storage tank 30 discharges the cleaning liquid contained therein, and finally forms a negative pressure in the water storage tank 30 to adsorb the silicon wafer on the supporting part 10 of the device 1, so that the subsequent cleaning can be performed when the mechanical arm R is withdrawn. chamfering operation, wherein the first scale K1 and the second scale K2 can be flexibly set according to actual product requirements and processing conditions, so that the cleaning operation of the device 1 can be controlled by the mutual cooperation of the controller 40 and the liquid level sensor 50 Automatically, improving work efficiency.

In order to better recycle the cleaning liquid, optionally, referring to FIG. 1 , the first part 201 further includes a first discharge hole 2012 for discharging the cleaning liquid on the upper surface of the first part 201 .

According to an alternative embodiment of the present invention, referring to FIG. 1, the cavity 2023 of the second part 202 is provided with a second discharge hole 2024, wherein the fluid filled in the cavity 2023 can be discharged through the second discharge hole , so that the upper surface of the second portion 202 can recover from the second state to the first state.

It should be noted that: the technical solutions described in the embodiments of the present invention can be combined arbitrarily if there is no conflict.

Embodiments of the present invention have been described above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned specific implementations, and the above-mentioned specific implementations are only illustrative, rather than restrictive, and those with ordinary knowledge in the art Under the enlightenment of the present invention, many forms can also be made without departing from the gist of the present invention and the protection scope of the claims, all of which belong to the protection of the present invention.

1: device 10: Support part 20: Cleaning part 201: Part 1 2011: nozzle 2012: First discharge hole 202: Part Two 2021: Upper Surface 2022: Bristles 2023: cavity 2024: Second discharge hole 30: water storage tank 301: Mouth 302: ventilation hole 303: pumping hole 40: Controller 50: Liquid level sensor K1: the first scale K2: second scale R: mechanical arm S: silicon chip S1: lower surface X: center line

1 is a schematic structural view of a device for carrying and cleaning a silicon wafer according to an embodiment of the present invention, which shows a second part of the device in a first state; 2 is a schematic structural view of a device for carrying and cleaning a silicon wafer according to an embodiment of the present invention, which shows that the second part of the device is in a second state; 3 is a top view of an apparatus for carrying and cleaning a silicon wafer according to an embodiment of the present invention, wherein the silicon wafer is removed; FIG. 4 is a schematic structural diagram of an apparatus for carrying and cleaning silicon wafers according to another embodiment of the present invention.

1: device

10: Support part

20: Cleaning part

201: Part 1

2011: nozzle

2012: First discharge hole

202: Part Two

2021: Upper Surface

2022: Bristles

2023: cavity

2024: Second discharge hole

30: water storage tank

301: Mouth

302: ventilation hole

303: pumping hole

R: mechanical arm

S: silicon chip

S1: lower surface

X: center line

Claims (10)

An apparatus for carrying and cleaning silicon wafers, the apparatus comprising: A supporting part for supporting the silicon wafer in the horizontal direction; a cleaning part, the cleaning part is used to clean the lower surface of the silicon chip when the silicon chip is supported by the support part, the cleaning part includes a first part and a second part, and the first part is arranged to be able to face the silicon chip spraying cleaning fluid on the lower surface, and the second part is configured to be able to rotate relative to the silicon wafer; Wherein, bristles are formed on the upper surface of the second part and the upper surface of the second part can be deformed between a first state and a second state. In the first state, the bristles are not in contact with the silicon chip. In the second state, the bristles can be in contact with the lower surface of the silicon wafer to clean the lower surface of the silicon wafer through the rotation of the second portion relative to the lower surface of the silicon wafer. The device for carrying and cleaning silicon wafers as claimed in claim 1, wherein the second part includes a cavity capable of being filled with fluid, the upper surface of the second part is formed above the cavity and is formed by a flexible The material is made such that as the cavity is filled with fluid, the upper surface of the second part can be deformed from the first state to the second state. The device for carrying and cleaning silicon wafers as claimed in claim 1 or 2, wherein the supporting part, the first part and the second part are arranged concentrically with respect to the longitudinal centerline of the device, and in the horizontal direction, the A support portion is disposed at an outermost portion of the device and the second portion is located between the support portion and the first portion. The device for carrying and cleaning silicon wafers as claimed in claim 3, wherein the first part includes nozzles arranged eccentrically with respect to the longitudinal centerline, and the first part and the second part are arranged to be opposite to each other. The silicon wafer is rotated about the longitudinal centerline. The device for carrying and cleaning silicon wafers as described in claim 3, the device also includes a water storage tank for collecting cleaning liquid, the water storage tank is configured to have an open mouth at the top, and the mouth is connected to the The first part communicates with the space above the second part. The device for carrying and cleaning silicon wafers as claimed in claim 5, wherein the water storage tank is located directly below the support part, and the support part is formed so that the space above the support part communicates with the inside of the water storage tank air vents. The device for carrying and cleaning silicon wafers as claimed in claim 6, wherein the water storage tank includes a water suction hole at the bottom, and the water suction hole communicates with the interior of the water storage tank to allow the water storage tank to be emptied. The device for carrying and cleaning silicon wafers as described in claim 5, the device further includes a controller and a liquid level sensor for sensing the liquid level in the water storage tank, the controller is configured to be able to according to The sensing result of the liquid level sensor stops the rotation of the first part and the second part. The device for carrying and cleaning silicon wafers as claimed in claim 1, wherein the first part further comprises a first discharge hole for discharging the cleaning liquid on the upper surface of the first part. The device for carrying and cleaning silicon wafers as claimed in claim 2, wherein the cavity of the second part is provided with a second discharge hole, and the fluid filled in the cavity can be discharged through the second discharge hole , so that the upper surface of the second portion can recover from the second state to the first state.

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