CN119819603A - Silicon wafer cleaning device, silicon wafer cleaning equipment and silicon wafer cleaning method - Google Patents

Abstract

The present disclosure provides a silicon wafer cleaning device, a silicon wafer cleaning equipment and a silicon wafer cleaning method, wherein the silicon wafer cleaning device comprises: a base; a first cleaning component and a second cleaning component connected to the base, wherein the first cleaning component is used to clean the surface of the silicon wafer by polishing, and the second cleaning component is used to clean the surface of the silicon wafer by sweeping; wherein at least one of the first cleaning component and the second cleaning component is configured to be movable relative to the other, so as to selectively enable only one of the first cleaning component and the second cleaning component to contact the surface of the silicon wafer.

Description

Silicon wafer cleaning device, silicon wafer cleaning equipment and silicon wafer cleaning method

Technical Field

The present disclosure relates to the field of semiconductor manufacturing, and in particular, to a silicon wafer cleaning apparatus, a silicon wafer cleaning device, and a silicon wafer cleaning method.

Background

In the silicon wafer manufacturing process, the surface cleaning of the silicon wafer is important. Silicon wafers are used for the production of electronic components, and the surfaces thereof are subjected to various complex process treatments, such as etching, evaporation, circuit design and the like. Thus, to ensure the accuracy and product performance of these processes, the surface of the wafer must be maintained at a high level of cleanliness, and any residue or contaminant can affect the quality of subsequent processes and the overall finished product performance. This makes cleaning of the wafer an essential and important step in the overall manufacturing process.

Since the front side of the silicon wafer is a key part of the subsequent manufacturing process, the subsequent manufacturing process has extremely high requirements on the cleanliness of the front side of the silicon wafer, and any pollutants, particles and residues which may affect the process need to be strictly removed. Currently, cleaning of silicon wafers is generally performed by a combination of physical and chemical cleaning using a brush in combination with a cleaning liquid to remove particles and minute foreign matters attached to the surface.

Although the existing cleaning technology can remove most of surface impurities, the problem of insufficient cleaning of the foreign matters with strong adhesion exists. These residues may affect the stability of the subsequent process and the product properties. Furthermore, cleaning of the back side of the wafer is often of less concern, but residues on its surface may also cause adverse effects in subsequent use. Therefore, the overall improvement of the cleanliness of the front and back surfaces of the silicon wafer is a necessary direction for further optimizing the manufacturing process and the product quality.

Disclosure of Invention

The present disclosure provides a silicon wafer cleaning device, a silicon wafer cleaning apparatus, and a silicon wafer cleaning method. The silicon wafer cleaning device combines two cleaning modes of polishing and cleaning and can be dynamically switched between the two modes, so that different cleaning requirements can be flexibly met.

The technical scheme of the disclosure is realized in that in a first aspect, the disclosure provides a silicon wafer cleaning device, which comprises:

a base;

A first cleaning component and a second cleaning component connected to the base, wherein the first cleaning component is used for cleaning the surface of the silicon wafer in a polishing manner, and the second cleaning component is used for cleaning the surface of the silicon wafer in a sweeping manner;

Wherein at least one of the first cleaning assembly and the second cleaning assembly is configured to be movable relative to the other to selectively enable only one of the first cleaning assembly and the second cleaning assembly to contact a surface of the silicon wafer.

In some alternative examples, the silicon wafer cleaning apparatus includes a drive coupled to at least one of the first cleaning assembly and the second cleaning assembly.

In some alternative examples, the first cleaning assembly includes a cleaning portion and a link, one end of the link being connected to the cleaning portion and the other end of the link being connected to the driving portion such that the driving portion can drive the cleaning portion via the link to move in a direction away from and toward the base.

In some alternative examples, the cleaning portion is cross-shaped and the cross-shape is arranged concentric with the base.

In some alternative examples, the cleaning portion includes a bracket and a polishing portion removably connected to the bracket.

In some alternative examples, the second cleaning assembly has a hardness less than the first cleaning assembly.

In some alternative examples, the silicon wafer cleaning apparatus further includes a control section connected to the driving section.

In some alternative examples, the control part controls the driving part to drive the first cleaning assembly to clean a surface of the silicon wafer, and to drive the second cleaning assembly to clean the surface of the silicon wafer after the first cleaning assembly cleans the surface of the silicon wafer.

In some alternative examples, the silicon wafer cleaning apparatus further comprises a supply means for supplying a cleaning liquid.

In a second aspect, the present disclosure provides a silicon wafer cleaning apparatus comprising:

the silicon wafer cleaning apparatus according to the first aspect;

and the driving module is used for driving the silicon wafer cleaning device to rotate and translate.

In some alternative examples, the silicon wafer cleaning apparatus includes two of the silicon wafer cleaning devices disposed opposite each other for cleaning both the front and back surfaces of the silicon wafer.

In a third aspect, the present disclosure provides a silicon wafer cleaning method performed by using the silicon wafer cleaning apparatus according to the second aspect.

In some alternative examples, the silicon wafer cleaning method includes driving a first cleaning assembly of a silicon wafer cleaning device of the silicon wafer cleaning apparatus to clean a surface of a silicon wafer and driving a second cleaning assembly of the silicon wafer cleaning device to clean the surface of the silicon wafer after the first cleaning assembly cleans the surface of the silicon wafer.

The present disclosure provides a silicon wafer cleaning device and a silicon wafer cleaning apparatus. The silicon wafer cleaning device comprises two cleaning assemblies. Because the two cleaning components can clean the surface of the silicon wafer in a polishing mode and a cleaning mode respectively, the silicon wafer cleaning device comprising the two cleaning components has different degrees of cleaning capability so as to meet the cleaning requirements for different types of pollutants, thereby not only effectively removing the pollutants with strong adhesive force, but also avoiding unnecessary excessive cleaning. In addition, since the two cleaning assemblies are capable of alternately contacting the silicon wafer by movement relative to each other, the silicon wafer cleaning apparatus is allowed to dynamically switch between different cleaning modes according to cleaning requirements, significantly improving cleaning efficiency.

Drawings

Fig. 1 is a schematic view of a brush provided in an embodiment of the present disclosure.

Fig. 2 is a bottom schematic view of the brush of fig. 1.

Fig. 3 is a half cross-sectional view of a silicon wafer cleaning apparatus provided in an embodiment of the present disclosure.

Fig. 4 is a schematic cross-sectional view of a silicon wafer cleaning apparatus according to an embodiment of the present disclosure.

Fig. 5 is a schematic cross-sectional view of a silicon wafer cleaning apparatus according to another embodiment of the present disclosure.

Fig. 6 is a schematic bottom view of a silicon wafer cleaning apparatus according to an embodiment of the present disclosure.

Fig. 7 is a schematic cross-sectional view of a portion of a silicon wafer cleaning apparatus provided in an embodiment of the present disclosure.

Fig. 8 is a schematic cross-sectional view of a silicon wafer cleaning apparatus according to another embodiment of the present disclosure.

Fig. 9 is a schematic cross-sectional view of a silicon wafer cleaning apparatus according to yet another embodiment of the present disclosure.

Fig. 10 is a schematic view of a silicon wafer cleaning apparatus according to an embodiment of the present disclosure.

Detailed Description

The technical solutions in the present disclosure will be clearly and completely described below with reference to the drawings in the present disclosure.

In the process of processing the silicon wafer, the silicon wafer needs to be cleaned for a plurality of times in order to ensure the surface quality of the silicon wafer and meet the requirements of subsequent processes. The primary purpose of cleaning is to remove various contaminants during processing, including particulate impurities, chemical residues, metal ions, and other organic or inorganic contaminants, among others. After each processing step of the wafer, new impurities may adhere to the surface due to exposure to different environments and process media, so that multiple cleaning operations are critical.

For example, in a Final Polishing (FP) process, once equipment is down, the wafer surface may be exposed to residual Polishing liquid for a long period of time. This causes crystallization of particles in the polishing liquid, and raised crystals are formed on the surface of the silicon wafer. Although these crystals may be largely removed by continuing to perform FP operations on these wafers, there may still be a small portion of residue on the front side of the wafer. In addition, since the FP process is generally performed only on the front surface of the silicon wafer, the back surface of the silicon wafer is not subjected to any processing and polishing treatment, and thus the crystals remaining on the back surface cannot be eliminated. Such crystal residue, once formed, may cause a series of problems during subsequent use of the silicon wafer. For example, raised crystals formed on the back side of the wafer may cause the wafer to be unevenly placed in subsequent manufacturing processes.

To solve the above problems, it is proposed in the art to add a cleaning process after the FP process. In the cleaning process, a brush is used in combination with a cleaning liquid such as pure water or a specific chemical solution in order to remove foreign matters such as contaminants, particles, residues, etc. from the surface of the silicon wafer. A brush 1 provided by some embodiments of the present disclosure is shown in fig. 1 and 2. The brush 1 has a disc shape as a whole, and includes a main body 11 and a brush portion 12. The brush 12 is provided on one circular surface of the disc-shaped body and has a substantially flat cleaning surface 12A. The brush 12 may be made of a flexible material, such as PVC material, to avoid scratching the surface of the wafer while cleaning. When the hairbrush 1 is used, the flat cleaning surface 12A of the brush part 12 of the hairbrush 1 can be used for contacting the surface to be cleaned of the silicon wafer, and a certain pressure is applied to the surface to be cleaned of the silicon wafer by the hairbrush 1 while the hairbrush 1 rotates around the axis of the hairbrush, so that the aim of cleaning the surface of the silicon wafer is fulfilled. In the above cleaning process, a cleaning liquid may be supplied to the surface to be cleaned of the silicon wafer to improve the cleaning ability.

However, the inventors have noted that the above-described cleaning means may suffer from a problem of low removal efficiency when encountering foreign substances having strong adhesion, such as crystals caused by polishing liquid, or the like, during production. This is because the brush portion 12 of the brush 1 is too soft to remove foreign matters having strong adhesion. Although the repeated cleaning helps to reduce the residue of the foreign matter, the foreign matter having a strong adhesion force cannot be cleaned with a cleaning liquid having a strong cleaning force.

Furthermore, as mentioned above, the main focus in the art is on cleaning the front side of the wafer, while less attention is paid to cleaning the back side of the wafer. In addition, the back surface of the silicon wafer often has more foreign matters with stronger adhesiveness due to the lack of a polishing process. The inventor finds that the residual pollutant on the back surface of the silicon wafer can have negative influence on the performance and stability of the product in the subsequent use. For example, impurities and residues on the back side of the silicon wafer may cause problems such as unstable equipment clamping, poor back contact and the like, and further affect process accuracy and product reliability. Therefore, ensuring the overall cleaning of the front and back surfaces of the silicon wafer is important to improving the quality and product performance of the manufacturing process.

To this end, some embodiments of the present disclosure propose a silicon wafer cleaning apparatus, a silicon wafer cleaning device, and a silicon wafer cleaning method. The silicon wafer cleaning device combines two cleaning modes of polishing and cleaning and can be dynamically switched between the two modes, so that different cleaning requirements can be flexibly met.

Embodiments of the present disclosure are described in detail below with reference to the attached drawings.

Referring to fig. 3, some embodiments of the present disclosure provide a silicon wafer cleaning apparatus 2. The silicon wafer cleaning apparatus 2 may include a base 21, a first cleaning assembly 22 and a second cleaning assembly 23 connected to the base 21. The first cleaning assembly 22 is used for cleaning the surface of the silicon wafer by polishing. The second cleaning component 23 is used for cleaning the surface of the silicon wafer in a sweeping manner.

At least one of the first cleaning assembly 22 and the second cleaning assembly 23 is disposed movable relative to the other to selectively enable only one of the first cleaning assembly 22 and the second cleaning assembly 23 to contact the surface of the silicon wafer.

The base 21 may provide the necessary stable support for the components of the silicon wafer cleaning apparatus 2 and may facilitate connection of the cleaning assembly to other apparatus, such as a robot. The base 21 may be generally cylindrical or may have other shapes, as not limited by the present disclosure.

The first cleaning assembly 22 and the second cleaning assembly 23 may be disposed on the same side of the base 21. As shown in fig. 3 and 4, the first cleaning assembly 22 and the second cleaning assembly 23 may be disposed on the lower side of the base 21 and extend from the lower surface of the base 21 in a direction substantially perpendicular to the lower surface of the base 21. For each of the first cleaning member 22 and the second cleaning member 23, one end is connected to the base 21, and the other end, that is, the end remote from the base 21, serves as a cleaning end for performing a cleaning operation. In fig. 3 and 4, the lower ends of the first cleaning member 22 and the second cleaning member 23 are cleaning ends.

The two cleaning assemblies may perform the cleaning operation differently from each other. The first cleaning member 22 can remove foreign matters, particularly strong adhesion foreign matters such as slurry crystals and residues having strong adhesion, on the surface of the silicon wafer by polishing, i.e., grinding or polishing. The second cleaning assembly 23 may then remove particulate contaminants or less-adherent impurities from the surface of the wafer by sweeping the wafer surface.

The silicon wafer cleaning device 2 has remarkable advantages compared with the hairbrush 1 due to the two cleaning assemblies, wherein the first cleaning assembly 22 can remove pollutants with strong adhesive force, the defect of insufficient cleaning force of the hairbrush 1 is overcome, the second cleaning assembly 23 can rapidly remove slightly adhered pollutants, unnecessary transitional cleaning is avoided, and the overall cleaning efficiency of the silicon wafer cleaning device 2 is improved.

One of the first cleaning assembly 22 and the second cleaning assembly 23 may be configured to be movable relative to the other, or both the first cleaning assembly 22 and the second cleaning assembly 23 may be movable relative to each other to achieve two positional relationships relative to each other. These two positional relationships are exemplarily shown in fig. 3 and 4, respectively.

In fig. 3, the second cleaning member 23 extends from the lower surface of the base 21 longer than the first cleaning member 22. In this state, when the silicon wafer cleaning apparatus 2 is continuously close to the surface of the silicon wafer to be cleaned in order to clean the silicon wafer, only the cleaning end of the second cleaning assembly 23, i.e., the lower end of the second cleaning assembly 23 in fig. 3, can be in contact with the surface of the silicon wafer to be cleaned, while the cleaning end of the first cleaning assembly 22 cannot be in contact with the silicon wafer. Therefore, based on the positional relationship of the first cleaning member 22 and the second cleaning member 23 shown in fig. 3, only the second cleaning member 23 can perform the cleaning operation.

In fig. 4, the first cleaning member 22 extends from the lower surface of the base 21 longer than the second cleaning member 23. In this state, when the silicon wafer cleaning apparatus 2 is continuously close to the surface of the silicon wafer to be cleaned, only the cleaning end of the first cleaning member 22, i.e., the lower end of the first cleaning member 22 in fig. 3, can be in contact with the surface of the silicon wafer to be cleaned, while the cleaning end of the second cleaning member 23 cannot be in contact with the silicon wafer. Therefore, based on the positional relationship of the first cleaning member 22 and the second cleaning member 23 shown in fig. 3, only the first cleaning member 22 can perform the cleaning operation.

By changing the extension length of the first cleaning assembly 22 and the second cleaning assembly 23 from the base 21 by relative movement, flexible switching for different contaminant types and cleaning requirements can be achieved, i.e. the cleaning device is allowed to select an appropriate cleaning mode according to the requirements of different silicon wafer surface states, such as the attached contaminant type, strength, and the like, and flexibility and applicability of the device are enhanced. Moreover, the polishing mode of the first cleaning component and the cleaning mode of the second cleaning component can be independently executed by the switching mode, so that the cleaning efficiency is ensured, and unnecessary interference and resource waste are avoided.

Some embodiments of the present disclosure provide a silicon wafer cleaning apparatus 2. The silicon wafer cleaning apparatus 2 includes two cleaning assemblies. Because the two cleaning components can clean the surface of the silicon wafer in a polishing mode and a cleaning mode respectively, the silicon wafer cleaning device comprising the two cleaning components has different degrees of cleaning capability so as to meet the cleaning requirements for different types of pollutants, thereby not only effectively removing the pollutants with strong adhesive force, but also avoiding unnecessary excessive cleaning. In addition, since the two cleaning assemblies can alternately contact the silicon wafer by movement relative to each other, the silicon wafer cleaning apparatus is allowed to dynamically switch between different cleaning modes according to cleaning requirements to independently perform cleaning operations without interfering with each other, ensuring cleaning efficiency and also avoiding unnecessary interference and resource waste.

To enable movement of the first cleaning assembly 22 and/or the second cleaning assembly 23 relative to each other, the silicon wafer cleaning apparatus 2 may include a drive 24 connected to at least one of the first cleaning assembly 22 and the second cleaning assembly 23, according to some embodiments of the present disclosure.

Referring to fig. 5, the driving part 24 may be provided in the base 2, and may be connected with at least one of the first cleaning assembly 22 and the second cleaning assembly 23. That is, the driving part 24 may be connected to the first cleaning assembly 22 or to the second cleaning assembly 23, or the driving part 24 may be connected to both the first cleaning assembly 22 and the second cleaning assembly 23 to drive the components connected thereto to move accordingly.

As an example, the driving part 24 may include a motor and a guide rail to drive the first cleaning assembly 22 and/or the second cleaning assembly 23 to linearly move along the guide rail by the motor. Alternatively, the driving part 24 may also include other driving or transmitting parts such as a cylinder, a hydraulic cylinder, a worm, etc., as long as the movement of the cleaning assembly can be achieved, which is not limited in the present disclosure.

In addition, the driving part 24 may further include a mechanical locking or limiting function to prevent an unexpected movement of the cleaning assembly due to external vibration or driving malfunction when a certain cleaning assembly is in the working position, thereby making the operation of the cleaning assembly in the working position more stable and also preventing the non-working cleaning assembly from being brought into the cleaning state.

The driving section 24 can realize automatic switching of the cleaning mode of the silicon wafer cleaning device 2, and can also make the state of the two cleaning components more stable when the cleaning operation is performed.

According to a further embodiment of the present disclosure, referring to fig. 5, the first cleaning assembly 22 may include a cleaning portion 22A and a link 22B. One end of the link 22B is connected to the cleaning portion 22A and the other end of the link is connected to the driving portion 24, so that the driving portion 24 can drive the cleaning portion 22A to move in a direction away from and toward the base 21 via the link 22B.

The cleaning portion 22A, as a core component of the first cleaning assembly 22, can directly perform a cleaning task on the surface of the silicon wafer. The link 22B is used to transmit the driving force provided by the driving portion 24. Thus, in this embodiment, at least the first cleaning assembly 22 is movable relative to the second cleaning assembly 23 between an operative position and an inoperative position to switch the cleaning mode of the silicon wafer cleaning apparatus 2.

Taking fig. 5 as an example, the link 22B is vertically provided in the silicon wafer cleaning apparatus 2, wherein a lower end of the link 22B may be fixedly connected to the cleaning portion 22A and an upper end of the link 22B is drivingly connected to the driving portion 24. The driving part 24 can push or pull the cleaning part 22A through the connecting rod 22B, thereby realizing the precise movement of the cleaning part 22A. In fig. 5, the expression "moving in a direction away from and toward the base 21" may mean moving in a vertical direction with respect to the lower side of the base 21.

The force of the driving portion 24 transmitted by the link 22B can make the movement of the cleaning portion 22A more stable and precise. That is, the cleaning portion 22A can be moved within a predetermined range in accordance with a preset path, ensuring the effectiveness of the cleaning operation. In particular, the cleaning requirements of silicon wafers of different thicknesses can be satisfied by adjusting the movement range of the cleaning portion 22A. In addition, the structure for transmitting force is simple and direct, and unnecessary energy loss is reduced.

In view of the fact that the wafer cleaning device 2 may perform a rotational movement about its central axis and/or a translational movement over the surface of the wafer when performing a cleaning operation, in some embodiments of the present disclosure, the cleaning portion 22A may be cross-shaped and the base 21 may be arranged concentrically such that when the wafer cleaning device 2 is rotated about its central axis, the cross-shaped cleaning portion 22A may also be rotated about its center to maximize coverage of the surface of the wafer being cleaned.

As shown in fig. 6, the cross-shaped structure of the cleaning portion 22A may extend in four directions. It will be appreciated that this significantly improves the coverage of the surface of the wafer by the cleaning portion 22A. Especially when cleaning large-diameter silicon chip, the cross can effectively cover center and edge area, reduces the dead angle. The concentric arrangement of the cleaning portion 22A and the susceptor 21 can make the distribution of the cleaning force on the surface of the silicon wafer more uniform, avoiding local excessive cleaning or insufficient cleaning due to uneven force. Particularly, the symmetrical advantage of the cross-shaped structure can reduce vibration or deformation of the cleaning part due to unbalanced force during movement, thereby improving stability and durability of the cleaning part 22A in high-strength operation.

Since the first cleaning assembly 22 cleans the surface of the silicon wafer by polishing, the first cleaning assembly 22 is also susceptible to wear after use. Frequent replacement or refurbishment of the first cleaning assembly 22 not only affects the efficiency of operation, but also creates a potential hazard for the overall stability of the wafer cleaning apparatus 2. In view of this problem, the inventors propose a modular design of the first cleaning assembly 22, in particular the cleaning portion 22A. Specifically, in some embodiments of the present disclosure, referring to fig. 7, the cleaning portion 22A may include a bracket 221 and a polishing portion 222 removably connected to the bracket 221.

The bracket 221 may serve as a main body of the cleaning portion 22A for providing stable support and connection with the link 22B. The polishing part 222 is used for actually performing polishing cleaning task. As an example, the polishing portion 222 may be removably coupled to the bracket 221 by means of a snap, a screw connection, magnetic attraction, or the like. The present disclosure is not limited in this regard.

Since only the polishing portion 222 can directly contact the surface of the silicon wafer while the first cleaning assembly 22 performs the cleaning task, only the polishing portion 222 is worn out. With the above structure, the polishing portion 222 can be easily removed, replaced or cleaned according to the cleaning requirement, so that the cleaning function of the first cleaning assembly 22 can be quickly recovered. It should be further appreciated that the polishing portion 222 may be configured as a module adapted to different cleaning requirements of silicon wafers. For example, the polishing and grinding parts 222 with different functions or different materials can be easily replaced according to the pollutant types of the silicon wafers or the cleaning task requirements, so that the applicability of the silicon wafer cleaning device 2 is improved.

In some embodiments of the present disclosure, the second cleaning assembly 23 may have a hardness less than that of the first cleaning assembly 22.

The lower hardness of the second cleaning assembly 23 is beneficial to gently sweeping particles on the surface of the silicon wafer or lightly adhering pollutants, and avoiding surface damage caused by excessive cleaning force. In contrast, a higher hardness first cleaning assembly 22 is suitable for applying a higher cleaning force to contaminants that are difficult to remove, ensuring a cleaning effect. As an example, the first cleaning member 22, particularly the cleaning portion 22A of the first cleaning member 22, may be made of PET material, for example, the cleaning portion 22A may be made of the same material as a polishing pad for double-sided polishing of a silicon wafer, and the second cleaning member 23 may be made of PVC sponge, for example, the second cleaning member 23 may be made of the same material as a brush for final polishing cleaning.

In order to further improve the automation level of the silicon wafer cleaning apparatus 2, referring to fig. 8, the silicon wafer cleaning apparatus may further include a control section 25 connected to the driving section 24.

In an actual production process, the silicon wafer cleaning device 2 may be required to perform two cleaning modes for the same silicon wafer. The control part 25 may control the driving part 24 to drive the two cleaning assemblies to alternately perform the cleaning operation in a predetermined order according to a predetermined cleaning strategy, and may also control the cleaning time period of each cleaning assembly, avoiding manual intervention during the cleaning process.

As an example of the cleaning strategy, the control part 25 may control the driving part 24 to drive the first cleaning member 22 to clean the surface of the silicon wafer, and after the first cleaning member 22 cleans the surface of the silicon wafer, drive the second cleaning member 23 to clean the surface of the silicon wafer.

According to the above example, the cleaning operation performed by the silicon wafer cleaning device 2 may be divided into two stages. The control part 25 may sequentially drive the second cleaning assembly 23 to perform a cleaning task by sensing a cleaning state of the first cleaning assembly 22, such as a completion signal, etc., and switching an operation of the driving part 24. After the cleaning task is completed, the control part 25 may return to the initial state, and wait for the next cleaning cycle to start.

The control section 25 can reduce the repetition of operations by controlling the two cleaning components to sequentially perform the polishing cleaning and the sweeping cleaning, making the cleaning process more efficient. Moreover, the polishing and grinding preferentially removes the pollutant with strong adhesive force, provides cleaner surface conditions for cleaning the residual particles by the cleaning assembly, and enhances the overall cleaning effect. The control part 25 makes full use of the polishing and cleaning advantages by coordinating the working sequences of the two cleaning modes, achieves the synergistic effect of cleaning mechanical and particle pollutants, and further remarkably improves the surface flatness and particle cleanliness of the silicon wafer.

According to some embodiments of the present disclosure, referring to fig. 9, the silicon wafer cleaning apparatus 2 may further include a supply device 26 for supplying a cleaning liquid.

The cleaning solution cooperates with the first cleaning assembly 22 and the second cleaning assembly 23 to enhance the removal of highly adhering contaminants and particulate impurities, wherein the chemical solution may dissolve or decompose contaminants that are difficult to mechanically remove. The supply device 26 can ensure that the cleaning effect of each area of the surface of the silicon wafer is consistent by uniformly spraying the cleaning liquid, so that partial cleaning deficiency is avoided. In addition, the cleaning liquid can reduce surface damage caused by mechanical friction, and particularly has a protective effect on the surface of a precisely processed silicon wafer, such as the front surface.

Referring to fig. 10, some embodiments of the present disclosure also provide a silicon wafer cleaning apparatus 3. The silicon wafer cleaning apparatus 3 may include the silicon wafer cleaning device 2 described above, and a driving module 31 for driving the silicon wafer cleaning device 2 to rotate and translate.

In some embodiments of the present disclosure, as shown in fig. 10, the silicon wafer cleaning apparatus 3 may include two silicon wafer cleaning devices 2 disposed opposite to each other for simultaneously cleaning the front and rear surfaces of the silicon wafer S.

As mentioned above, since the back surface of the silicon wafer S is not generally subjected to the final polishing process, the back surface is liable to have many foreign substances with strong adhesiveness. By adopting the structure shown in fig. 10, the two silicon wafer cleaning devices 2 can be operated in synchronization, thereby ensuring that both the front and back surfaces of the silicon wafer S achieve high cleanliness. The cleaning device 2 for the silicon wafer can effectively remove particles and pollutants with strong adhesive force, avoid the problem of unstable clamping or poor contact of equipment and ensure the stability of subsequent procedures.

Furthermore, the two silicon wafer cleaning devices 2 can be controlled independently. This means that the two silicon wafer cleaning devices 2 can respectively select different cleaning modes, for example, a cleaning mode is adopted for the front surface, and a polishing mode is adopted for the back surface, so that different cleaning requirements for the front surface and the back surface of the silicon wafer are met.

Some embodiments of the present disclosure also provide a method of cleaning a silicon wafer. The silicon wafer cleaning method is performed by using the silicon wafer cleaning apparatus 3 described above.

In some embodiments of the present disclosure, the silicon wafer cleaning method may include driving the first cleaning assembly 22 of the silicon wafer cleaning device 2 of the silicon wafer cleaning apparatus 3 to clean the surface of the silicon wafer S, and driving the second cleaning assembly 23 of the silicon wafer cleaning device 2 to clean the surface of the silicon wafer after the first cleaning assembly 22 cleans the surface of the silicon wafer S.

The technical schemes described in the present disclosure may be arbitrarily combined without any conflict.

The foregoing is merely illustrative of the present invention, and the present invention is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (13)

1. A silicon wafer cleaning apparatus, characterized in that the silicon wafer cleaning apparatus comprises:

a base;

A first cleaning component and a second cleaning component connected to the base, wherein the first cleaning component is used for cleaning the surface of the silicon wafer in a polishing manner, and the second cleaning component is used for cleaning the surface of the silicon wafer in a sweeping manner;

Wherein at least one of the first cleaning assembly and the second cleaning assembly is configured to be movable relative to the other to selectively enable only one of the first cleaning assembly and the second cleaning assembly to contact a surface of the silicon wafer.

2. The silicon wafer cleaning apparatus of claim 1, comprising a drive connected to at least one of the first cleaning assembly and the second cleaning assembly.

3. The silicon wafer cleaning apparatus according to claim 2, wherein the first cleaning assembly comprises a cleaning portion and a link, one end of the link is connected to the cleaning portion and the other end of the link is connected to the driving portion, so that the driving portion can drive the cleaning portion to move in a direction away from and toward the susceptor via the link.

4. A silicon wafer cleaning apparatus according to claim 3, wherein the cleaning portion has a cross shape, and the cross shape is arranged concentrically with the susceptor.

5. A silicon wafer cleaning apparatus according to claim 3, wherein the cleaning portion comprises a bracket and a polishing portion removably attached to the bracket.

6. The silicon wafer cleaning apparatus of any one of claims 2 to 5, wherein the second cleaning assembly has a hardness less than the first cleaning assembly.

7. The silicon wafer cleaning apparatus according to any one of claims 2 to 5, further comprising a control section connected to the driving section.

8. The silicon wafer cleaning apparatus according to claim 7, wherein the control section controls the driving section to drive the first cleaning member to clean a surface of the silicon wafer, and to drive the second cleaning member to clean the surface of the silicon wafer after the first cleaning member cleans the surface of the silicon wafer.

9. The silicon wafer cleaning apparatus according to any one of claims 1 to 5, further comprising a supply means for supplying a cleaning liquid.

10. A silicon wafer cleaning apparatus, characterized in that the silicon wafer cleaning apparatus comprises:

the silicon wafer cleaning apparatus according to any one of claims 1 to 9;

and the driving module is used for driving the silicon wafer cleaning device to rotate and translate.

11. The silicon wafer cleaning apparatus according to claim 10, wherein the silicon wafer cleaning apparatus comprises two of the silicon wafer cleaning devices disposed opposite to each other for cleaning the front surface and the back surface of the silicon wafer at the same time.

12. A silicon wafer cleaning method, characterized in that the silicon wafer cleaning method is performed by using the silicon wafer cleaning apparatus according to claim 10.

13. The method of claim 12, wherein the method comprises driving a first cleaning assembly of a wafer cleaning device of the wafer cleaning apparatus to clean a surface of a wafer and driving a second cleaning assembly of the wafer cleaning device to clean the surface of the wafer after the first cleaning assembly cleans the surface of the wafer.