TW202303155A - Core of carrier for electronic component processing device, carrier, and method for removing core which is capable of reducing the costs of the carrier - Google Patents
Core of carrier for electronic component processing device, carrier, and method for removing core which is capable of reducing the costs of the carrier Download PDFInfo
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- 102100032306 Aurora kinase B Human genes 0.000 description 2
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- G—PHYSICS
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- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
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Abstract
Description
本發明關於一種在用於半導體積體電路元件等的被測電子元件(以下也簡稱為「被測裝置」(Device Under Test, DUT))的測試的電子元件處理裝置內搬送的載具的芯、及包括此載具的載具、以及將芯從載具移除的方法。The present invention relates to a core of a carrier transported in an electronic component processing device used for testing electronic components under test (hereinafter also referred to simply as "Device Under Test" (DUT)) such as semiconductor integrated circuit components. , and a carrier including the carrier, and a method of removing a core from the carrier.
作為電子元件處理裝置用的載具,已知有將插入主體與引導芯可拆卸地構成的插入件(例如,參考專利文獻1)。 [先前技術文獻] [專利文獻] As a carrier for electronic component processing apparatuses, there is known an insert in which an insertion body and a guide core are detachably configured (for example, refer to Patent Document 1). [Prior Art Literature] [Patent Document]
[專利文獻1]國際公開03/075024號[Patent Document 1] International Publication No. 03/075024
[發明所欲解決之問題][Problem to be solved by the invention]
在上述插入件中,插入件主體包括芯夾、扭力彈簧、以及主軸構成的卡勾機構,作為用於將引導芯拆卸於插入件主體的機構。因此,存在構成插入件的元件數量多、導致插入件的高成本化這樣的問題。In the above insert, the insert main body includes a hook mechanism composed of a core clip, a torsion spring, and a spindle, as a mechanism for detaching the guide core from the insert main body. Therefore, there is a problem that the number of components constituting the insert is large, resulting in high cost of the insert.
本發明要解決的問題是提供一種可以達成插入件的低成本化的芯、及包括此芯的載具、以及將此芯從載具移除的方法。 [解決問題之手段] The problem to be solved by the present invention is to provide a cost-effective core that can achieve an insert, a carrier including the core, and a method for removing the core from the carrier. [means to solve the problem]
[1]根據本發明的芯係為保持被測裝置並且在電子元件處理裝置內搬送的載具的芯,包括芯本體、保持部、以及卡勾。芯本體具有可插入前述被測裝置的第一開口。保持部設置在前述芯本體的底部並保持藉由前述第一開口而插入的前述被測裝置。卡勾從前述芯本體向上方延伸出,包括連接於前述芯本體的卡勾體、以及連接於前述卡勾體的前端的卡合部。前述卡勾體隨著接近前述卡勾體的前端部而向前述芯本體的外側傾斜。[1] The core according to the present invention is a core of a carrier that holds a device under test and is conveyed in an electronic component processing apparatus, and includes a core body, a holding portion, and a hook. The core body has a first opening into which the aforementioned device under test can be inserted. The holding part is disposed on the bottom of the core body and holds the device under test inserted through the first opening. The hook extends upward from the core body, and includes a hook body connected to the core body and an engaging portion connected to the front end of the hook body. The hook body is inclined toward the outside of the core body as it approaches the front end of the hook body.
[2]在上述發明中,前述卡合部可以從前述卡勾體的前述前端部向前述芯本體的外側突出,前述卡合部包括前端面以及將前述卡勾體的前述前端部與前述前端面連接的下表面,前述下表面傾斜以隨著從前述前端面向前述卡勾體的前述前端部接近而上升。[2] In the above invention, the engaging portion may protrude from the front end portion of the hook body to the outside of the core body, the engaging portion includes a front end surface and connects the front end portion of the hook body to the front end. A lower surface connected by planes, the lower surface is inclined to rise as the front end approaches from the front end to the front end of the hook body.
[3]在上述發明中,前述卡合部的前述前端面可以沿與由前述保持部規定的保持面的平面方向實質上平行的方向延伸。[3] In the above invention, the front end surface of the engaging portion may extend in a direction substantially parallel to a planar direction of a holding surface defined by the holding portion.
[4]在上述發明中,前述保持部可以是俯視時向前述第一開口的內部突出的保持片,前述保持片一體形成於前述芯本體。[4] In the above invention, the holding portion may be a holding piece that protrudes toward the inside of the first opening in plan view, and the holding piece is integrally formed with the core body.
[5]在上述發明中,前述保持部可以是安裝在前述芯本體的前述底部以覆蓋前述第一開口的薄膜。[5] In the above invention, the aforementioned holding portion may be a film mounted on the aforementioned bottom portion of the aforementioned core body so as to cover the aforementioned first opening.
[6]在上述發明中,前述卡勾可以與前述芯本體一體形成。[6] In the above invention, the hook may be integrally formed with the core body.
[7]在上述發明中,前述芯本體可以具有複數個前述第一開口,前述芯包括複數個前述保持部,分別設置在前述芯本體的前述底部以對應於前述複數個第一開口。[7] In the above invention, the core body may have a plurality of the first openings, and the core may include a plurality of holding portions respectively provided on the bottom of the core body to correspond to the plurality of first openings.
[8]根據本發明的載具,可以為保持被測裝置並且在電子元件處理裝置內搬送的載具,包括上述的芯、以及可拆卸地保持前述芯的載具本體,前述載具本體包括前述被測裝置可插入並且與前述第一開口連通的第二開口、以及可與前述卡勾的前述卡合部卡合的卡勾接收部。[8] According to the carrier of the present invention, it may be a carrier that holds the device under test and is transported in the electronic component processing device, and includes the above-mentioned core and a carrier body that detachably holds the core, and the carrier body includes The second opening through which the device under test can be inserted and communicated with the first opening, and the hook receiving portion capable of engaging with the engaging portion of the hook.
[9]在上述發明中,前述卡勾接收部可以包括前述卡合部的前述前端面所接觸的接觸面、以及突出部,前述突出部接觸於前述接觸面的前述芯本體的內側的端部,並且比前述接觸面更向上方突出。[9] In the above invention, the hook receiving portion may include a contact surface with which the front end surface of the engaging portion contacts, and a protruding portion, the protruding portion being in contact with an end portion inside the core body of the contact surface. , and protrude upwards more than the aforementioned contact surface.
[10]在上述發明中,在前述突出部中,與前述卡合部的前述下表面對置的對置面係可以傾斜以隨著向前述芯本體的內側而升高。[10] In the above invention, in the protruding portion, the facing surface facing the lower surface of the engaging portion may be inclined so as to rise toward the inner side of the core body.
[11]在上述發明中,可以為滿足下述式(1), θ1≥θ2 … (1) 但是,在上述式(1)中,θ1是前述卡合部的前述下表面相對於前述接觸面的傾斜角度,θ2是前述突出部的前述對置面相對於前述接觸面的傾斜角度。 [11] In the above invention, the following formula (1) may be satisfied, θ1 ≥ θ2 ... (1) However, in the above formula (1), θ1 is an inclination angle of the lower surface of the engaging portion with respect to the contact surface, and θ2 is an inclination angle of the opposing surface of the protruding portion with respect to the contact surface.
[12]在上述發明中,前述接觸面可以連接到規定前述第二開口的前述載具本體的內表面,前述卡勾在卡合於前述卡勾接收部的狀態下,前述卡勾體從前述突出部分離,並且前述卡合部從前述載具本體的前述內表面分離。[12] In the above invention, the aforementioned contact surface may be connected to the inner surface of the aforementioned carrier body defining the aforementioned second opening, and the aforementioned hook is in the state of being engaged with the aforementioned hook receiving portion, and the aforementioned hook body moves from the aforementioned The protruding portion is separated, and the engaging portion is separated from the inner surface of the carrier body.
[13]在上述發明中,前述卡合部的前述前端面的延伸方向實質上平行於前述卡勾接收部的前述接觸面的延伸方向。[13] In the above invention, the extension direction of the front end surface of the engaging portion is substantially parallel to the extension direction of the contact surface of the hook receiving portion.
[14]根據本發明的芯之移除方法,係為從上述的載具的載具本體,將卡合於前述載具本體的前述芯移除的芯之移除方法,包括準備具有對應於前述芯的前述卡勾體的位置的卡勾壓部的移除夾具的第一步驟、將前述移除夾具安裝到前述芯以使前述卡勾壓部從前述芯下方抵接於前述卡勾體的第二步驟、在前述卡勾壓部抵接於前述卡勾體的狀態下,經由將前述移除夾具往上方向上推,而將前述卡勾體推彎向前述第一開口的內側的第三步驟、以及使前述移除夾具向下方移動並且將前述芯從前述載具本體移除的第四步驟。 [發明的效果] [14] The method for removing a core according to the present invention is a method for removing a core from the carrier body of the carrier described above by removing the aforementioned core engaged with the aforementioned carrier body, comprising preparing a The first step of removing the jig of the hook pressing portion of the hook body of the core is to install the removing jig on the core so that the hook pressing portion abuts against the hook body from below the core The second step is to bend the hook body to the inside of the first opening by pushing the removal jig upward in the state where the hook pressing portion is in contact with the hook body. The third step, and the fourth step of moving the removal jig downward and removing the core from the carrier body. [Effect of the invention]
根據本發明,構成電子元件測試裝置用的載具的芯包括從芯本體向上方延伸出的卡勾,隨著此卡勾的卡勾體接近卡勾體的前端,而向芯本體的外側傾斜。根據本發明,藉由芯的卡勾體向芯本體的外側傾斜,利用卡勾體的撓曲而可以使芯與載具本體卡合,並且可以使用移除夾具藉由撓曲卡勾體而將芯從載具本體移除。According to the present invention, the core constituting the carrier for the electronic component testing device includes a hook extending upward from the core body, and as the hook body of the hook approaches the front end of the hook body, it inclines to the outside of the core body . According to the present invention, since the hook body of the core is inclined to the outside of the core body, the core can be engaged with the carrier body by using the deflection of the hook body, and the removal jig can be used by flexing the hook body to remove the core from the carrier body.
因此,根據本發明,由於不需要用於將芯拆卸於被測裝置載具本體的彈簧等其他元件,因此可以達成載具的元件數量減少、並且可以達成載具的低成本化。Therefore, according to the present invention, since other components such as a spring for detaching the core from the device under test carrier body are not required, the number of components of the carrier can be reduced and the cost of the carrier can be reduced.
以下,基於附圖說明本發明的實施方法。圖1是表示使用本實施方式的載具的電子元件測試裝置的示意剖面圖,圖2是表示圖1的電子元件測試裝置的立體圖,圖3是用於說明關於圖1以及圖2的電子元件測試裝置中的托盤的移送的概念圖。Hereinafter, the implementation method of this invention is demonstrated based on drawing. 1 is a schematic cross-sectional view showing an electronic component testing device using a carrier according to this embodiment, FIG. 2 is a perspective view showing the electronic component testing device in FIG. 1 , and FIG. Conceptual diagram of the transfer of pallets in the test setup.
在圖1以及圖2表示的電子元件測試裝置中,對被測裝置90(參考圖12)施加了高溫或低溫的熱應力,並使用測試頭5以及測試儀6測試(檢查)在此狀態下被測裝置90是否正常動作。然後,此電子元件測試裝置基於測試結果而將被測裝置90進行分類。作為被測裝置90的具體示例,例如,可以例示記憶體類的裝置。In the electronic component testing device shown in FIG. 1 and FIG. 2 , a high-temperature or low-temperature thermal stress is applied to the device under test 90 (refer to FIG. 12 ), and it is tested (inspected) using the
在電子元件測試裝置中,作為測試對象的多數被測裝置90搭載在定制托盤KST(參考圖5)。又,測試托盤TST(參考圖6)在電子元件裝置的處理器1內循環。被測裝置90從定制托盤KST轉移到測試托盤TST並進行測試。本實施方式的處理器1相當於本發明的「電子元件處理裝置」的一例。In the electronic component testing device, a large number of devices under
如圖1所示,在處理器1的下部設置有空間8,在此空間8配置有測試頭5。測試頭5上設置有插座50,此插座50通過電纜7而連接於測試儀6。As shown in FIG. 1 , a
在此電子元件測試裝置中,裝載在測試托盤TST的被測裝置90與測試頭5上的插座50接觸而電性連接,電訊號等被提供給這樣狀態的被測裝置90,基於從測試儀6輸出的訊號對被測裝置90進行測試(檢查)。此外,在更換被測裝置90的類型時,將插座50以及後述的芯730更換為適合被測裝置90的形狀、接腳數等的插座50以及芯730。In this electronic component testing device, the device under
如圖2以及圖3所示,處理器1包括收納部200、裝載部300、測試部100、以及卸載部400。收納部200收納測試前以及測試完成的被測裝置90。裝載部300將從收納部200移送的被測裝置90移送到測試部100。測試部100被構成為使得測試頭5的插座50面向內部。卸載部400將在測試部100進行測試的測試完成的被測裝置90分類。As shown in FIGS. 2 and 3 , the
圖4是表示在上述的電子元件測試裝置中使用的積體電路儲存器的爆炸立體圖,圖5是表示在上述的電子元件測試裝置中使用的定制托盤的立體圖。4 is an exploded perspective view showing an integrated circuit memory used in the above-mentioned electronic component testing device, and FIG. 5 is a perspective view showing a customized tray used in the above-mentioned electronic component testing device.
如圖4所示,收納部200包括測試前儲存器201以及測試完成儲存器202。測試前儲存器201收納將測試前的被測裝置90收容的定制托盤KST。測試完成儲存器202收納將對應於測試結果而分類的被測裝置90收容的定制托盤KST。測試前儲存器201以及測試完成儲存器202包括框形的托盤支撐框203、以及從此托盤支撐框203的下部進入而向上部升降的升降機204。複數個定制托盤KST堆疊在托盤支撐框203。這些堆疊的定制托盤KST藉由升降機204上下移動。As shown in FIG. 4 , the
如圖5所示,此定制托盤KST包括複數個收容被測裝置90的凹狀的收容部。這些複數個收容部排列成複數行複數列(例如14行13列)。此外,測試前儲存器201與測試完成儲存器202為相同的構造。As shown in FIG. 5 , this customized tray KST includes a plurality of concave-shaped housing portions for housing the device under
如圖2以及3所示,測試前儲存器201設置有兩個儲存器STK-B以及兩個空托盤儲存器STK-E。兩個儲存器STK-B彼此相鄰,在這兩個儲存器STK-B的旁邊,兩個空托盤儲存器STK-E彼此相鄰。在空托盤儲存器STK-E中,堆疊要移送到卸載部400的空的定制托盤KST。As shown in FIGS. 2 and 3 , the
在測試前儲存器201的旁邊設置有測試完成儲存器202。在此測試完成儲存器202設置有八個儲存器STK-1、STK-2、…、STK-8。測試完成儲存器202被構成為使得測試完成的被測裝置90可以對應測試結果被分類為並收納在最多八個類別。例如,測試完成的被測裝置90可以在測試完成儲存器202中分類為合格品以及不合格品之外,可以分類為動作速度高速的合格品、動作速度中速的合格品、以及動作速度低速的合格品,或是可以分類為需要重新測試的不良品以及不需要重新測試的不良品。Next to the
如圖2所示,收納部200更包括托盤移送臂205。托盤搬送臂205設置於收納部200以及裝置基座101之間。此托盤移送臂205將定制托盤KST從裝置基座101的下側移送到裝載部300。一對窗部370形成在裝置第101中對應於裝載部300的位置。As shown in FIG. 2 , the
裝載部300包括裝置搬送裝置310。此裝置搬送裝置310包括兩個軌道311、可動臂312、以及可動頭320。兩個軌道311架設在裝置基座101上。可動臂312沿兩條軌道311在測試托盤TST與定制托盤KST之間往復移動。此外,可動臂312的移動方向稱為Y方向。可動頭320由可動臂312支持並在X方向移動。複數個吸附墊(未示出)向下裝配在可動頭320。The
裝置搬送裝置310將以複數個吸附墊吸附複數個被測裝置90的可動頭320從定制托盤KST移動到精密器(preciser)360。由此,被測裝置90從定制托盤KST移送到精密器360。然後,裝置搬送裝置310藉由精密器360中的可動臂312以及可動頭320而修正被測裝置90的相互位置關係。之後,裝置搬送裝置310將被測裝置90移送到停止在裝載部300的測試托盤TST。由此,被測裝置90從定制托盤KST轉運到測試托盤TST。The
如圖2以及圖3所示,測試部100包括浸泡室110、測試室120、以及非浸泡室130。浸泡室110將作為目標的高溫或低溫的熱應力施加到搭載在測試托盤TST的被測裝置90。測試室120將在浸泡室110中施加有熱應力的被測裝置90按壓在測試頭5。非浸泡室130從測試室120中測試的被測裝置90去除熱應力。As shown in FIGS. 2 and 3 , the
在浸泡室110中將被測裝置90施加高溫的情況下,藉由在非浸泡室130中送風而將被測裝置90冷卻到室溫。另一方面,在對浸泡室110中將被測裝置90施加低溫的情況下,在非浸泡室130中藉由暖風或加熱器等而將被測裝置90加熱到不會發生結露程度的溫度。In the case where a high temperature is applied to the device under
如圖2所示,浸泡室110以及非浸泡室130比測試室120突出於上方。又,如圖3概念地所示,在浸泡室110設置有垂直搬送裝置,並且在前一個測試托盤TST存在於測試室120的期間,後續的複數個測試托盤TST以由垂直搬送裝置支持的狀態下待機。搭載在後續的複數個測試托盤TST的被測裝置90在待機期間被施加高溫或低溫的熱應力。As shown in FIG. 2 , the soaking
測試頭5配置在測試室120的中央。測試托盤TST被移送到此測試頭5之上。在測試室120的中央,搭載在測試托盤TST的被測裝置90的端子91(參考圖12)與測試頭5上的插座50(參考圖12)的接觸點51接觸,以進行被測裝置90的測試。搭載測試結束的被測裝置90的測試托盤TST被移送到非浸泡室130。在非浸泡室130中,測試結束的被測裝置90被散熱至室溫。搭載有已散熱的被測裝置90的測試托盤TST被搬出到卸載部400。The
在浸泡室110的上部,形成有用於將測試托盤TST從裝置基座101搬入到浸泡室110的入口。另一方面,在非浸泡室130的上部,形成有用於將測試托盤TST從非浸泡室130搬出到裝置基座101的出口。In the upper part of the soaking
如圖2所示,托盤搬送裝置102設置在裝置基座101。此托盤搬送裝置102將測試托盤TST從裝置基座101搬入到浸泡室110,並且將測試托盤TST從非浸泡室130搬出到裝置基座101。此托盤搬送裝置102例如由旋轉輥等構成。As shown in FIG. 2 , the
測試托盤TST藉由托盤搬送裝置102從非浸泡室130搬出到裝置基座101之後,搭載在此測試托盤TST上的所有被測裝置90被轉運到對應於藉由裝置搬送裝置410(後述)的測試結果的定制托盤KST。之後,測試托盤TST經由卸載部400以及裝載部300而被移送到浸泡室110。After the test tray TST is carried out from the
如圖2所示,在卸載部400設置有兩個裝置搬送裝置410。此裝置搬送裝置410與設置於裝載部300的裝置搬送裝置310為相同的構造。兩個裝置搬送裝置410將測試完成的被測裝置90從存在於裝置基座101的測試托盤TST轉運到對應於測試結果的定制托盤KST。As shown in FIG. 2 , two
兩對窗部470形成在裝置基座101。此兩對窗部470配置成使得移送到卸載部400的定制托盤KST面對裝置基座101的上表面。此兩對窗部470與上述窗部370的下側設置有升降台(未示出)。此升降台使搭載有測試完成的被測裝置90的定制托盤KST下降,並且傳送到托盤移送臂205。Two pairs of
以下,說明關於包括能夠保持被測裝置90的插入件的測試托盤TST的構成。Hereinafter, the configuration of the test tray TST including the insert capable of holding the device under
圖6是表示測試托盤TST的立體圖,圖7是表示本實施方式的插入件的爆炸立體圖。如圖6所示,測試托盤TST包括框架700以及複數個插入件(裝置載具)710。框架700包括矩形的外框架701、以及設置在外框架701內的格子狀的內框架702。在框架700形成有複數個矩形的開口703,藉由外框架701以及內框架702而區隔。在框架700,複數個貫通孔704形成在外框架701與內框架702的交叉部、以及內框架702的各個交叉部。如圖7所示,固定構件705插入貫通孔704中。本實施方法中的插入件710相當於本發明中的「載具」的一例。FIG. 6 is a perspective view showing the test tray TST, and FIG. 7 is an exploded perspective view showing the insert of this embodiment. As shown in FIG. 6 , the test tray TST includes a
每個插入件710對應於一個開口703設置。換言之,複數個插入件710被配置成在測試托盤TST的框架700內形成複數行/複數列的矩陣。Each
圖7是表示本實施方式的載具的爆炸立體圖,圖8是表示本實施方式的載具本體與芯卡合前的狀態的剖面圖,圖11是表示本實施方式的芯的仰視圖。如圖7所示,插入件710包括主體720、複數個芯730、以及複數個閂鎖740。本實施方式的主體720相當於本發明的「載具本體」的一例,本實施方式的芯730相當於本發明的「芯」的一例。7 is an exploded perspective view showing the carrier of this embodiment, FIG. 8 is a cross-sectional view showing the state before the carrier body and the core of this embodiment are engaged, and FIG. 11 is a bottom view showing the core of this embodiment. As shown in FIG. 7 , the
主體720是用於將插入件710相對於框架700保持為能夠微幅移動的構件。在複數個主體720中,對應於位於框架700的最外周的開口703的主體720係配置為主體720的外周部720a的一部分與外框架701重疊,並且外周部720a的其他部分與內框架702重疊。其他的主體720係配置為外周部720a與內框架702重疊。主體720的外周部720a的一部分藉由被外框架701或內框架702與固定構件705夾持,主體720被保持為相對於框架700在XY平面方向能夠微幅移動的狀態。The
又,主體720是用於裝配芯730並且保持芯730的構件。主體720是矩形框狀的樹脂成型體,具有對應於框架700的開口703的形狀。在主體720形成有與芯730的數量相同數量(在本實施方法中為四個)的矩形的開口721。複數個開口721在主體720中形成複數行/複數列的矩陣(本實施方法中為兩行兩列)。被測裝置90可以插通於每個開口721。在本實施方法中,雖然在主體720形成四個開口721,但開口721的數量不特別限定於此。Also, the
每個開口721形成為在圖中的Z方向上貫通主體720。藉由芯730裝配到主體720,開口721與芯730的開口733(後述)連通。本實施方式的開口721相當於本發明的「第二開口」的一例。Each
如圖8所示,主體720包括複數個卡勾接收部722。卡勾接收部722是用於與芯730的卡勾732(後述)卡合的部分。複數個卡勾接收部722形成在每個開口721的內部。複數個卡勾接收部722與規定開口721的主體720的內表面720b連接,並且向開口721的中心突出。在本實施方法中,一對卡勾接收部722設置在相對於通過開口721的中心的YZ平面對稱的位置。在本實施方法中,相對於一個開口721設置兩對,即,總共設置四個卡勾接收部722。As shown in FIG. 8 , the
卡勾接收部722具有接觸面722a、突出部722b、以及引導面722c。本實施方式的接觸面722a相當於本發明的「接觸面」的一個例子,本實施方式的突出部722b相當於本發明的「突出部」的一個例子。The
接觸面722a是與芯730的卡勾732(後述)接觸的面。接觸面722a連接到主體720的內表面720b,並且面向主體720的上方。接觸面722a在與圖中的XY平面實質上平行的方向延伸。The
突出部722b連接到接觸面722a的主體720的內側的端部。突出部722b具有對置面722d(參考圖10)。對置面722d是當主體720與芯730卡合時與卡勾732的卡合部736的下表面736b(稍後描述)對置的表面。此對置面722d相對於接觸面722a傾斜,以隨著從接觸面722a的端部向主體720的內側在圖中的Z方向上升。本實施方式中的對置面722d相當於本發明中的「對置面」的一例。The protruding
返回圖8,引導面722c連接到卡勾接收部722的側面的下端。引導面722c相對於圖中的Z方向傾斜,以隨著向下方而朝向開口721的外側的方向。Returning to FIG. 8 , the
此外,在本實施方法中,雖然卡勾接收部722包括突出部722b,但本發明並不特別限定於此。卡勾接收部722可以不包括突出部722b,並且接觸面722a延伸出至卡勾接收部722的端部。In addition, in this embodiment, although the
返回圖7,芯730為矩形框狀的樹脂成型體,包括芯本體731以及複數個卡勾732。複數個開口733形成在芯本體731。被測裝置90本實施方式的芯本體731相當於本發明的「芯本體」的一例,本實施方式的卡勾732相當於本發明的「卡勾」的一例,本實施方法的「開口733」相當於本發明中的「第一開口」的一例。Returning to FIG. 7 , the
芯730可從主體720拆卸,並且對應於被測裝置90的類型可以進行更換。芯本體731的形狀以及開口733的大小可以對應於被測裝置90的形狀適當設計。The
開口733在圖中的Z方向上貫通芯本體731。藉由芯730裝配到主體720,開口733與主體720的開口721連通。由此,從主體720的上方經由開口721而插入到插入件710的被測裝置90能夠經由開口733而插入到芯本體731,並且被芯730保持。The
在本實施方式中,在一個芯本體731形成有兩個開口733,兩個開口733沿圖中的X方向並列。兩個開口733分別與主體720中在圖中的X方向排列的兩個開口721對應。即,在本實施方法中,相對於一個主體720,在圖中的Y方向並列的兩個芯730被構成為卡合。此外,開口733的數量不特別限定於此,例如,可以在芯本體731僅形成一個開口733。在這種情況下,四個芯730卡合到一個主體720。In the present embodiment, two
如圖11所示,複數個保持片734設置在芯本體731的底部。複數個保持片734從芯本體731的框架形狀的底部向開口733的中心突出。複數個保持片734一體形成於芯本體731。這些保持片734藉由與從芯730上方插入到開口733內的被測裝置90的外周部分抵接,芯本體731可以保持被測裝置90。此外,由複數個保持片734保持的被測裝置90的端子91從開口733露出於下方(參考圖12)。本實施方式的保持片734相當於本發明的「保持部」的一例,並且也相當於本發明的「保持片」的一例。As shown in FIG. 11 , a plurality of holding
返回到圖7,複數個卡勾732是用於與主體720的卡勾接收部722卡合並且將芯730裝配在主體720的構件。複數個卡勾732從芯本體731向上方(圖中的Z方向)延伸出,與芯本體731一體形成。當將芯730從主體720的下方裝配到主體720時,複數個卡勾732設置在與主體720的卡勾接收部722對應的位置。即,在本實施方式中,在芯本體731中,在相對於通過開口733的中心的YZ平面對稱的位置設置有一對卡勾732。在本實施方法中,相對於一個開口733設置兩對,即,四個卡勾732。Returning to FIG. 7 , the plurality of
如圖8所示,卡勾732包括卡勾體735以及卡勾卡合部736。卡勾體735連接於芯本體731,並且隨著接近卡勾體735的前端部735a而向芯本體731的外側傾斜。換言之,卡勾體735相對於垂直於由複數個保持片734規定的表面(以下稱為底面B)的方向,即,相對於圖中的Z方向,僅傾斜角度θ
0。雖然沒有特別限定,但是卡勾體735的傾斜角度θ
0在5∘至20∘的範圍內較佳。本實施方式中的底面B是在芯730中將被測裝置90保持的保持面,相當於本發明中的「保持面」的一例。
As shown in FIG. 8 , the
卡合部736從卡勾體735的前端部735a向芯本體731的外側突出。稍後將描述關於卡合部736的詳細構成。The engaging
返回到圖7,複數個閂鎖740是用於輔助保持插入於芯730的被測裝置90的構件。複數個閂鎖740對應於主體720的開口721而設置於主體720。在本實施方法中,相對於一個開口721而設置兩個閂鎖740,相對於一個主體720而設置八個閂鎖740。Returning to FIG. 7 , the plurality of
如圖7所示,閂鎖740包括本體741、旋轉軸742、作用部743、連結部744、連結構件745、以及彈簧746。閂鎖740藉由設置在本體741的旋轉軸742而連接到主體720,並且在開口721內可旋轉。As shown in FIG. 7 , the
作用部743位於芯730的開口733內,並且與保持在被測裝置90芯730內的被測裝置90可接觸。藉由作用部743與被測裝置90接觸,可以抑制被測裝置90向上方飛出,並且插入件710可以更安定地保持被測裝置90。The acting
連結構件745是用於旋轉閂鎖740的構件。連結構件745與設置在本體741的連結部744連接。連結構件745藉由設置在連結構件745的內部的彈簧746而向下方施壓。藉由向上方推動連接件745,而閂鎖740旋轉,並且可以將作用部743退回到芯730的開口733的外側。由此,可以將被測裝置90往插入件710插入或移除被測裝置90。The
圖9是表示本實施方式的插入件的主體與芯卡合的狀態的剖面圖,圖10是表示放大圖9的X部分的剖面圖。FIG. 9 is a cross-sectional view showing a state in which the main body of the insert and the core are engaged, and FIG. 10 is a cross-sectional view showing an enlarged X portion in FIG. 9 .
說明關於芯730往主體720的裝配。首先,如圖7以及圖8所示,將芯730配置在主體720的下方,以使得芯本體731的開口733分別對應於主體720的開口721。接著,經由將芯730向上方往主體720移動,使每個卡勾732的卡合部736抵接於卡勾接收部722的引導面722c的下部。Attachment of the core 730 to the
使芯730進一步向上方移動的話,卡勾732沿著引導面722c的傾斜向芯本體731的內側撓曲,卡勾732被施壓向外側。藉由卡勾接收部722包括引導面722c,可以使卡勾732更容易撓曲,並且使芯730可以更容易地往裝配主體720。When the
使芯730進一步向上方移動的話,卡勾732的卡合部736的前端沿著卡勾接收部722的側面到達比突出部722b的更上方,並且卡勾732的撓曲被恢復。由此,如圖9所示,卡勾732卡合於主體720的卡勾接收部722,並且芯730裝配到主體720。When the
這裡,如圖10所示,卡合部736包括前端面736a以及下表面736b。卡合部736具有尖銳的形狀,以隨著朝向前端面736a而變細。經由前端面736a接觸於卡勾接收部722的接觸面722a,卡合部736與卡勾接收部722卡合。本實施方式的前端面736a相當於本發明的「前端面」的一例,本實施方式的下表面736b相當於本發明的「下表面」的一例。Here, as shown in FIG. 10 , the engaging
前端面736a的延伸方向與芯本體731的底面B的延伸方向實質上平行。又,前端面736a的延伸方向與卡勾接收部722的接觸面722a的延伸方向實質上平行。由此,前端面736a與接觸面722a之間的摩擦阻力變大,可以進一步安定化芯730與主體720的裝配狀態。The extending direction of the
如上所述,卡勾接收部722的接觸面722a在實質上平行於XY平面的方向上延伸。這裡,在接觸面722a朝向開口721的內側而在上升的方向傾斜的情況下,當芯730從主體720移除時,卡勾732的卡合部736卡在向上方傾斜的接觸面722a,並且卡勾732變得難以移除。又,在接觸面722a朝向開口721的內側而在下降的方向傾斜的情況下,卡勾732容易從接觸面722a滑落,並且芯730變得容易從主體720脫離。因此,在本實施方法中,藉由卡勾接收部722的接觸面722a在實質上平行於XY平面的方向延伸,使得芯730可以容易地從主體720移除,並且可以安定化芯730與主體720的裝配狀態。As mentioned above, the
卡合部736的下表面736b相對於卡勾接收部722的接觸面722a的延伸方向僅傾斜θ
1(θ
1>0∘),以使得隨著從前端面736a朝向卡勾體735的前端部753a而在圖中的Z方向上升。在卡合部736的下表面736b不傾斜(θ
1=0∘),並且卡勾接收部722不具有突出部722b的情況下,當芯本體731施加向下的力時,卡勾接收部722的邊緣部與卡合部736的下表面736b相接的邊作為軸而卡勾732施加向內側旋轉的力,卡勾732容易從卡勾接收部722脫離。相對於此,在本實施方法中,藉由卡合部736的下表面736b相對於接觸面722a的延伸方向傾斜,使得卡勾接收部722的邊緣部與卡合部736的下表面736b不接觸。因此,由於不存在上述的邊,可以抑制卡勾732向內側旋轉,並且可以安定化卡勾732與卡勾接收部722的卡合狀態。
The
此外,在本實施方式中,雖然卡合部736的下表面736b的角度固定為θ
1,但是只要包含以朝向前端部753a上升的方式傾斜的部分,則並沒有特別限定於此。例如,下表面736b可以具有相對於接觸面722a僅傾斜θ
1的部分、以及與接觸面722a實質上平行延伸並且與前端部753連接的部分。
In addition, in this embodiment, although the angle of the
如上所述,卡勾接收部722的對置面722d相對於接觸面722a傾斜,以隨著朝向主體720的內側而上升,並且此對置面722d的傾斜角度θ
2為θ
1以下(θ
1≥θ
2)。由此,即使在卡勾732卡合於卡勾接收部722的狀態下,卡勾接收部722的突出部722b也不接觸於卡勾732的下表面736b。由此,主體720可以將芯730以在圖中的XY平面方向上可微幅移動的狀態下保持。
As mentioned above, the
又,在卡勾732卡合於卡勾接收部722的狀態下,卡合部736與主體720的內表面720b僅分開距離D
1較佳。又,卡合部736與對置面722d中的接觸面722a側的邊僅分開距離D
2較佳。又,卡勾體735與卡勾接收部722僅分開距離D
3較佳。藉由保持距離D
1至D
3的間隙,可以抑制卡勾732與主體720相互干涉而卡勾732無意地從主體720脫離。又,藉由保持上述距離D
1至D
3的間隙,在芯730在圖中的XY平面方向上可微幅移動的狀態下,可以將芯730裝配在主體720。
In addition, when the
本實施方法中被測裝置90的測試使用上述的插入件710而進行。圖12是表示由本實施方式的插入件而保持被測裝置並進行被測裝置的測試的狀態的剖面圖。In this embodiment, the test of the device under
如圖12所示,將被測裝置90從主體720的開口721插入到插入件710,藉由複數個保持片734而將被測裝置90保持。保持複數個這樣的插入件710的測試托盤TST被移送到測試頭5上,使插座50的接觸點51與被測裝置90的端子91接觸。這裡,在測試室120內設置有在Z軸方向移動的驅動裝置(未示出)。使此驅動裝置下降,藉由安裝到驅動裝置的推動器121而將被測裝置90按壓在插座50的狀態下,進行被測裝置90的測試。此外,作為插座50的接觸點51沒有特別限定,可以例示如各向異性導電橡膠片、彈簧針等。As shown in FIG. 12 , the device under
接著,參考圖13至圖15說明關於從插入件710的主體720移除卡合於此主體720的芯730的方法。圖13至圖15是表示本實施方式的芯的移除方法的剖面圖(其之一)至(其之三)。Next, a method for removing the
首先,如圖13所示,準備具有對應於卡勾體735的位置的卡勾按壓部81的移除夾具80,將移除夾具80配置在芯730的下方,以使得卡勾按壓部81位於卡勾體735的下方。卡勾按壓部81以相對於芯本體731的底面B垂直插入的方式形成,並且當將移除夾具80配置在芯730的下方時,以卡勾體735位於卡勾按壓部81的延伸方向的延長線上的方式形成。本實施方式的移除夾具80相當於本發明的「移除夾具」的一例,本實施方式的卡勾按壓部81相當於本發明的「卡勾按壓部」的一例。First, as shown in FIG. 13 , a
接著,使移除夾具80向上方移動,將移除夾具80安裝到芯730,以使得卡勾按壓部81抵接於卡勾體735。另外,如圖14所示,藉由將移除夾具80向上方移動,藉由卡勾按壓部81而卡勾體735撓曲,並且被推彎向開口733的內側。由此,卡勾732的卡合部736從卡勾接收部722脫離,並且主體720與芯730的卡合被解除。此時,卡勾體735被推彎,以使得卡合部736比卡勾接收部722位於更芯本體731的內側。卡勾體735藉由被推彎而被推向芯本體731的外側,芯730由移除夾具80保持。Next, the
接著,如圖15所示,藉由將移除夾具80向下方移動,芯730與移除夾具80一起向下方移動,並且從主體720移除。Next, as shown in FIG. 15 , by moving the
如上所述,在本實施方法的芯730中,藉由卡勾732的卡勾體735向芯本體731的外側傾斜,而可以利用卡勾體735的撓曲將卡勾體732卡合到主體720的卡勾接收部722,並且可使用移除夾具80而移除卡合於主體720的芯730。因此,根據本實施方法的芯730,可以對應被測裝置90的類型而進行芯730的更換,並且不需要用於將主體720與芯730拆卸的其他元件。因此,在可在插入件710中可更換芯730的同時,可以達成此插入件710的元件數量的減少,並且可以達成此插入件710的低成本化以及前置時間的縮短。As mentioned above, in the
此外,以上說明的實施方法是為了易於理解本發明而記載的,並非用於限定本發明。因此,在上述實施方法公開的各要素旨在包含屬於本發明的技術範圍的所有設計變更以及均等物。In addition, the implementation method demonstrated above was described for easy understanding of this invention, and it does not limit this invention. Therefore, it is intended that each element disclosed in the above-mentioned embodiment method includes all design changes and equivalents belonging to the technical scope of the present invention.
例如,如圖16所示,芯730可以包括安裝到芯本體731底部的薄膜737,而取代保持片734。本實施方式的薄膜737相當於本發明的「保持部」的一例,並且相當於本發明的「薄膜」的一例。圖15是表示本實施方式的芯本體的變形例的仰視圖。For example, as shown in FIG. 16 , the
薄膜737是矩形的樹脂製薄膜,藉由複數個鉚接部738而安裝在芯本體731的框狀的底部。薄膜737以覆蓋芯本體731的一個開口733的方式安裝,並且經由將被測裝置90載置在薄膜737之上,使得芯本體731可以保持被測裝置90。The
複數個小孔H形成在膜737中以對應於設置在被測裝置90的底面的端子(未示出)。載置在薄膜737的被測裝置90的端子91藉由這些小孔H而突出於芯730的下方,以便在被測裝置90測試時可以與測試頭5上的插座50連接。A plurality of small holes H are formed in the
開口739形成在膜737的中央。經由使從安裝在測試室120的所定的位置的光感測器(未示出)發射的光通過此開口739,可以檢測出被測裝置90是否被芯730保持。An
在圖16所示的方法中,相對於一個開口733而安裝一個薄膜737,並且相對於一個芯本體731而安裝兩個薄膜。因此,由於可以對每一個開口733進行相對於開口733的薄膜737的位置對準,所以與使用覆蓋兩個開口733的一個薄膜737的情況相比,可以更準確地調整薄膜737的位置。In the method shown in FIG. 16 , one
1:處理器/電子元件處理裝置 5:測試頭 6:測試儀 7:電纜 8:空間 50:插座 51:接觸點 80:移除夾具 81:卡勾按壓部 90:被測裝置 91:端子 100:測試部 101:裝置基座 102:托盤搬送裝置 110:浸泡室 120:測試室 121:推動器 130:非浸泡室 200:收納部 201:測試前儲存器 202:測試完成儲存器 203:托盤支撐框 204:升降機 205:托盤移送臂 300:裝載部 310,410:裝置搬送裝置 311:軌道 312:可動臂 320:可動頭 360:精密器 370,470:窗部 400:卸載部 700:框架 701:外框架 702:內框架 703,739:開口 704:貫通孔 705:固定構件 710:插入件/載具 720:主體/載具本體 720a:外周部 720b:內表面 721:開口/第二開口 722:卡勾接收部 722a:接觸面 722b:突出部 722c:引導面 722d:對置面 730:芯 731:芯本體 732:卡勾 733:開口/第一開口 734:保持片/保持部 735:卡勾體 735a:前端部 736:卡合部 736a:前端面 736b:下表面 737:薄膜 738:鉚接部 740:閂鎖 741:本體 742:旋轉軸 743:作用部 744:連結部 745:連結構件 746:彈簧 B:底面/保持面 H:小孔 D1,D2,D3:距離 KST:定制托盤 TST:測試托盤 STK-B,STK-1,STK-2,STK-3,STK-4,STK-5,STK-6,STK-7,STK-8:儲存器 STK-E:空托盤儲存器, θ0,θ1,θ2:傾斜角度 1: Processor/Electronic Component Processing Unit 5: Test head 6: Tester 7: cable 8: space 50: socket 51: Touchpoint 80:Remove the fixture 81: hook pressing part 90: Device under test 91: terminal 100: Testing Department 101: device base 102: Pallet conveying device 110: soaking chamber 120:Test room 121: pusher 130: non-immersion chamber 200: storage department 201: Storage before test 202: Test complete storage 203: Pallet support frame 204: lift 205: Tray transfer arm 300: loading department 310,410: Device transfer device 311: track 312: movable arm 320: movable head 360: Precision 370,470: window 400: unloading department 700: frame 701: outer frame 702: inner frame 703,739: openings 704: through hole 705: fixed components 710: Insert/Vehicle 720: Main body/vehicle body 720a: peripheral part 720b: inner surface 721: opening/second opening 722: hook receiving part 722a: contact surface 722b: protrusion 722c: guide surface 722d: opposite surface 730: core 731: core body 732: hook 733: opening / first opening 734: holding piece/holding part 735: hook body 735a: front end 736: Engagement department 736a: front face 736b: lower surface 737:Film 738: riveting part 740:Latch 741: Ontology 742:Rotary axis 743: action department 744: link 745: Connecting components 746: spring B: Bottom/holding surface H: small hole D1, D2, D3: distance KST: Custom Tray TST: test tray STK-B, STK-1, STK-2, STK-3, STK-4, STK-5, STK-6, STK-7, STK-8: storage STK-E: Empty tray storage, θ0, θ1, θ2: tilt angle
圖1是表示使用本發明的實施方式的插入件的電子元件測試裝置的示意剖面圖。 圖2是表示圖1的電子元件測試裝置的立體圖。 圖3是用於說明關於圖1以及圖2的電子元件測試裝置中的托盤的移送的概念圖。 圖4是表示在上述電子元件測試裝置中使用的積體電路儲存器的爆炸立體圖。 圖5是表示在上述電子元件測試裝置中使用的定制托盤的立體圖。 圖6是表示本發明的實施方式的測試托盤的立體圖。 圖7是表示本發明的實施方式的插入件的爆炸立體圖。 圖8是表示本發明的實施方式的插入件的主體與芯卡合前的狀態的剖面圖。 圖9是表示本發明的實施方式的插入件的主體與芯卡合的狀態的剖面圖。 圖10是表示放大圖9的X部分的剖面圖。 圖11是表示本發明的實施方式的芯的仰視圖。 圖12是表示藉由本發明的實施方式的插入件保持被測裝置並進行被測裝置的測試的狀態的剖面圖。 圖13是表示本發明的實施方式的芯的移除方法的剖面圖(其之一)。 圖14是表示本發明的實施方式的芯的移除方法的剖面圖(其之二)。 圖15是表示本發明的實施方式的芯的移除方法的剖面圖(其之三)。 圖16是表示本發明的實施方式中的芯本體的變形例的仰視圖。 FIG. 1 is a schematic cross-sectional view showing an electronic component testing device using an interposer according to an embodiment of the present invention. Fig. 2 is a perspective view showing the electronic component testing device of Fig. 1 . Fig. 3 is a conceptual diagram for explaining transfer of trays in the electronic component testing apparatus of Figs. 1 and 2 . Fig. 4 is an exploded perspective view showing an integrated circuit memory used in the above-mentioned electronic component testing device. Fig. 5 is a perspective view showing a customized tray used in the electronic component testing device. Fig. 6 is a perspective view showing a test tray according to an embodiment of the present invention. Fig. 7 is an exploded perspective view showing the insert according to the embodiment of the present invention. 8 is a cross-sectional view showing a state before the main body of the insert and the core are engaged, according to the embodiment of the present invention. 9 is a cross-sectional view showing a state in which the main body of the insert and the core are engaged with each other according to the embodiment of the present invention. FIG. 10 is an enlarged cross-sectional view showing a portion X in FIG. 9 . Fig. 11 is a bottom view showing a core according to an embodiment of the present invention. 12 is a cross-sectional view showing a state in which a device under test is held by an interposer according to an embodiment of the present invention and a test of the device under test is performed. 13 is a cross-sectional view (one of them) showing a method of removing a core according to an embodiment of the present invention. 14 is a cross-sectional view (part 2 ) showing a method of removing a core according to the embodiment of the present invention. 15 is a cross-sectional view (Part 3 ) showing a core removal method according to the embodiment of the present invention. Fig. 16 is a bottom view showing a modified example of the core body in the embodiment of the present invention.
720:主體 720: subject
720b:內表面 720b: inner surface
722:卡勾接收部 722: hook receiving part
722a:接觸面 722a: contact surface
722b:突出部 722b: protrusion
722c:引導面 722c: guide surface
730:芯 730: core
732:卡勾 732: hook
733:開口 733: opening
734:保持片 734: Hold sheet
735:卡勾體 735: hook body
735a:前端部 735a: front end
736:卡合部 736: Engagement department
B:底面 B: Bottom
θ0:傾斜角度 θ 0 : tilt angle
Claims (14)
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| JP2021111571A JP2023008202A (en) | 2021-07-05 | 2021-07-05 | Core of carrier for electronic component handling device, carrier and method of removing core |
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| TWI822010B TWI822010B (en) | 2023-11-11 |
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| US5363038A (en) * | 1992-08-12 | 1994-11-08 | Fujitsu Limited | Method and apparatus for testing an unpopulated chip carrier using a module test card |
| US5543724A (en) * | 1994-10-03 | 1996-08-06 | Motorola, Inc. | Method and apparatus for locating conductive features and testing semiconductor devices |
| CN200962474Y (en) * | 2006-09-18 | 2007-10-17 | 丽羽电子股份有限公司 | Information socket structure |
| JPWO2009069190A1 (en) * | 2007-11-26 | 2011-04-07 | 株式会社アドバンテスト | Insert, tray and electronic component testing equipment |
| JP4924446B2 (en) * | 2008-01-24 | 2012-04-25 | 船井電機株式会社 | Housing, electronic device, and method for disassembling housing |
| CN201230114Y (en) * | 2008-06-24 | 2009-04-29 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
| DE102010047458A1 (en) * | 2010-10-06 | 2012-04-12 | Phoenix Contact Gmbh & Co. Kg | terminal |
| JP6048000B2 (en) * | 2012-08-30 | 2016-12-21 | セイコーエプソン株式会社 | Channel member, liquid ejecting head, and liquid ejecting apparatus |
| CN203243625U (en) * | 2013-03-06 | 2013-10-16 | 欧姆龙株式会社 | An electrical instrument, a frame body disassembling member used for the electrical instrument, and an electrical instrument assembly |
| US9459312B2 (en) * | 2013-04-10 | 2016-10-04 | Teradyne, Inc. | Electronic assembly test system |
| CN205066836U (en) * | 2015-10-26 | 2016-03-02 | 重庆通耐仪表科技有限公司 | Snap -on plastics water meter cover |
| JP6809978B2 (en) * | 2017-04-28 | 2021-01-06 | 株式会社アドバンテスト | Carrier for electronic component testing equipment |
| CN110651401B (en) * | 2017-05-12 | 2021-10-22 | 哈廷电子有限公司及两合公司 | plug-in connector module |
| JP7281250B2 (en) * | 2018-05-11 | 2023-05-25 | 株式会社アドバンテスト | test carrier |
| CN211697888U (en) * | 2019-12-25 | 2020-10-16 | 成都市博杰自动化设备有限公司 | Carrier for PCBA (printed circuit board assembly) connection board test |
| TWI729799B (en) * | 2020-05-07 | 2021-06-01 | 聖威光電科技發展股份有限公司 | Socket structure |
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