TW202111476A - CPU heat dissipation module especially having locking bolts to lock the heat dissipation block tightly with the top cover - Google Patents

Abstract

A CPU heat dissipation module includes a CPU mounting bracket, a first heat dissipation block, and several locking bolts. The CPU mounting bracket includes a base and a top cover connected with the base. The top cover is changeable between an open position and a closed position relative to the base, and the top cover has a number of screw holes. The first heat dissipation block is located above the top cover and has a first top surface and a first bottom surface. The first heat dissipation block is formed with a number of perforations extending from the first top surface to the first bottom surface and respectively corresponding to the screw holes. Each locking bolt passes through a respective perforation to be detachably screwed with a respective screw hole. The invention can ensure stable fixation between the first heat dissipation block and the CPU, and therefore produce better heat dissipation effect.

Description

CPU cooling module

The present invention relates to a heat dissipation module, in particular to a CPU heat dissipation module.

As shown in Figure 1, the conventional method of fixing a heat sink 1 on a motherboard 2 in a computer mainframe is usually to install a bracket 3 with an array of buckling mechanisms 301 on the heat sink 1 to utilize the The buckling mechanism 301 is buckled to the card hole 201 of the motherboard 2 respectively, so that the bottom surface of the heat dissipation block 1 can contact a CPU 4 on the motherboard 2 for the CPU 4 to dissipate heat. However, the fastening mechanisms 301 use the technical means of forced support to buckle the card holes 201 of the motherboard 2, and the fixing effect is not very good. Moreover, if the motherboard 2 is used for a period of time The subsequent deformation will also affect the fixing effect of the fastening mechanisms 301. In this way, the heat dissipation block 1 and the CPU 4 will be in poor contact, which will affect the heat dissipation effect. In addition, if the thickness of the heat dissipating block 1 is thickened in order to increase the heat dissipation effect, the length of the fastening mechanisms 301 often needs to be increased. However, the excessively long fastening mechanism 301 is not only in the fastening It is not easy to implement in operation, and it will also affect the fixed effect.

Therefore, the purpose of the present invention is to provide a CPU heat dissipation module that can overcome at least one of the disadvantages of the prior art.

Therefore, the CPU heat dissipation module of the present invention includes a CPU mounting frame, a first heat dissipation block, and several locking bolts.

The CPU mounting frame includes a base and a top cover connected with the base. The top cover can be changed between an open position and a closed position relative to the base, and the top cover has a number of screw holes.

The first heat dissipation block is located above the top cover and has a first top surface and a first bottom surface. The first heat dissipation block is formed with a number extending from the first top surface to the first bottom surface and respectively corresponding to the Perforation of screw holes.

The locking bolts respectively correspond to the perforations, and each locking bolt passes through the respective perforations to be detachably screwed with the respective screw holes.

The effect of the present invention is that by using the locking bolts to pass through the through holes of the first heat dissipation block to be screwed with the screw holes of the top cover of the CUP mounting frame, a good fixing effect can be produced for the first heat dissipation block, and The first heat sink is firmly fixed to the top cover. In addition, even if a motherboard is deformed after a period of use, it will not affect the fixing of the locking bolts to the top cover. As a result, the present invention can ensure that the first heat dissipating block is firmly in contact with a central processor, and has a good heat dissipation effect on the central processor.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same numbers.

Refer to FIGS. 2, 3, and 4, which are a first embodiment of the CPU heat dissipation module 100 of the present invention. The door lock 100 is suitable for being installed on a motherboard 200 and can be connected to a processor socket 210 and a central processing unit. The device 220 is used in conjunction. The CPU heat dissipation module 100 includes a CPU mounting frame 10, a first heat dissipation block 20, and four locking bolts 30.

The CPU mounting frame 10 includes a base 11 and a top cover 12 connected to the base 11. The top cover 12 can be in an open position (see FIG. 4) and a closed position (see FIG. 2) relative to the base 10 To change between, the top cover 12 has four screw holes 121. It can be understood that in other variations of the first embodiment, the number of the screw holes 121 may also be two, three or more than four. In addition, in the first embodiment, the processor socket 210 is installed on the base 11, the CPU 220 is installed on the processor socket 210, and has a heat sink 221 at the top. When the top cover 12 is in the closed position, the central processing unit 220 can be firmly combined with the processor socket 210.

As shown in Figures 2, 3, and 5, the first heat dissipation block 20 is located above the top cover 11, and includes a core 21 extending along a thickness direction Z, and a plurality of two oppositely disposed on the core 21 The first fin portion 22 and a plurality of second fin portions 23 that are disposed opposite to each other on the core portion 21.

The core 21 has a first top surface 211, a first bottom surface 212, and a first outer peripheral surface 213 connected between the first top surface 211 and the first bottom surface 212.

The first fin portions 22 extend outward from the first outer peripheral surface 213 along a first direction X, and the first fin portions 22 are spaced apart in a second direction Y intersecting the first direction X Arranged, the second fin parts 23 extend outward from the first outer peripheral surface 213 along the second direction Y, and the second fin parts 23 are arranged at intervals in the first direction X. In the first embodiment, the second direction Y is perpendicular to the first direction X.

The first heat dissipation block 20 is also formed with four through holes 24. In the first embodiment, each through hole 24 extends from the first top surface 211 to the first bottom surface 212 and penetrates the first outer peripheral surface 213. It can be understood that in other variations of the first embodiment, the number of the perforations 24 may also be two, three or more than four.

The locking bolts 30 respectively correspond to the through holes 24, and each locking bolt 30 can pass through the respective through holes 24 to be detachably screwed to the respective screw holes 121. It can be understood that in other variations of the first embodiment, the number of the locking bolts 30 can also be two, three, or more than four.

Thereby, as shown in Figures 2 and 3, when the present invention is assembled, the first heat dissipation block 20 can be placed on the CUP mounting frame 10. At this time, the first bottom surface 212 of the core 21 can be Make contact with the top surface of the heat sink 221 of the central processor 220, and then each locking bolt 30 can be passed through the respective through holes 24 to be screwed with the respective screw holes 121, so as to dissipate the first heat. The block 20 is firmly fixed on the top cover 12 of the CUP mounting frame 10, so that the first bottom surface 212 of the core 21 can be forced to firmly contact the top surface of the heat sink 221 of the central processor 220, and The waste heat of the central processor 220 can be effectively transferred to the first heat dissipation block 20 for heat dissipation.

Based on the above description, the advantages of the present invention can be summarized as follows:

1. In the present invention, the locking bolts 30 can be used to pass through the through holes 24 of the first heat dissipation block 20 to be screwed with the screw holes 121 of the top cover 12 of the CUP mounting frame 10, thereby stabilizing the first heat dissipation block 20 Ground is fixed on the top cover 12. Compared with the prior art, the locking bolts 30 and the screw holes 121 can be screwed to produce a good fixing effect on the first heat sink 20, and even if the motherboard 200 Deformation after using for a period of time will not affect the fixing effect of the locking bolts 30 on the top cover 12. In this way, it can be ensured that the first heat dissipation block 20 and the central center The processor 220 is firmly in contact, so that the first heat dissipation block 20 has a good heat dissipation effect on the central processor 220.

2. Compared with the conventional technology, if the thickness of the first heat dissipation block 20 is thickened in the present invention in order to increase the heat dissipation effect, even the locking screws 30 will also become longer, but the locks The locking operation of the screw lock 30 is still easy to perform and will not be affected. Moreover, the fixing effect produced by the locking bolts 30 to the top cover 12 will not be affected thereby.

It is understandable that, as shown in FIG. 6, in other variations of the first embodiment, if the heating power of the central processing unit 220 (see FIG. 2) is relatively large, it can also be installed on the first heat sink 20 A cooling fan 300 is added to increase the cooling effect.

Referring to Figures 7 and 8, it is a second embodiment of the present invention. The second embodiment is similar to the first embodiment. The difference between the second embodiment and the first embodiment is:

The CPU heat dissipation module 100 further includes a second heat dissipation block 40 and a heat pipe 50 connected between the first and second heat dissipation blocks 20 and 40.

A first insertion hole 214 is formed on the first top surface 211 of the core 21 of the first heat dissipation block 20.

The two heat dissipation blocks 40 include a core 41, the core 41 has a second bottom surface 411 contacting the first top surface 211, and the second bottom surface 411 forms a second insertion hole 412. It is understandable that, in the second embodiment, the two heat dissipation blocks 40 are represented by the same shape and structure as the first heat dissipation block 20, but it is not limited thereto.

The heat pipe 50 includes an evaporation section 51 inserted into the first insertion hole 214 and a condensation section 52 inserted into the second insertion hole 412.

In this way, the second embodiment can achieve the same purpose and effect as the above-mentioned first embodiment. The waste heat transferred from the central processor 220 to the first heat sink 20 can be transferred through the heat pipe 50. The second heat dissipation block 40 performs heat dissipation to increase the heat dissipation effect.

It is understandable that, as shown in FIG. 9, in other variations of the second embodiment, if the heating power of the central processing unit 220 (see FIG. 2) is relatively large, it can also be installed on the second heat sink 40 The cooling fan 300 is added to increase the cooling effect.

Refer to FIG. 10, which is a third embodiment of the present invention. The third embodiment is similar to the second embodiment. The difference between the third embodiment and the second embodiment is:

The first peripheral surface 213 of the core 21 of the first heat dissipation block 20 is formed with a side insertion hole 215.

In the case where the space above the first heat dissipation block 20 is limited, the two heat dissipation blocks 40 are erected on the side of the first heat dissipation block 20, and the second bottom surface 411 of the core 41 faces the first circumference Surface 213, the second bottom surface 411 is formed with a second insertion hole 413.

The evaporation section 51 of the heat pipe 50 is inserted into the side insertion hole 215, and the condensation section 52 is inserted into the second insertion hole 413.

It can be understood that, if necessary, the heat dissipation fan 300 can also be added to the first and second heat dissipation blocks 20 and 40.

In this way, the third embodiment can also achieve the same purpose and effect as the above-mentioned second embodiment.

In summary, the CPU heat dissipation module of the present invention can not only produce a good fixing effect on the first heat dissipation block, but also make the first heat dissipation block have a good heat dissipation effect on the central processor, so it can indeed To achieve the purpose of the invention.

However, the above are only examples of the present invention. When the scope of implementation of the present invention cannot be limited by this, all simple equivalent changes and modifications made in accordance with the scope of the patent application of the present invention and the content of the patent specification still belong to This invention patent covers the scope.

100: CPU cooling module 10: CPU mounting frame 11: Base 12: Top cover 121: screw hole 20: The first heat sink 21: Core 211: First Top Surface 212: first bottom 213: First week 214: First jack 215: side jack 22: The first fin part 23: second fin 24: Piercing 30: Locking bolt 40: second heat sink 41: Core 411: second bottom 412: second jack 413: second jack 50: heat pipe 51: Evaporation section 52: Condensation section X: first direction Y: second direction Z: thickness direction 200: Motherboard 210: processor socket 220: central processing unit 221: heat sink 300: cooling fan 1: heat sink 2: Motherboard 201: Card Hole 3: bracket 301: Fastening mechanism 4: central processing unit

Other features and effects of the present invention will be clearly presented in the embodiments with reference to the drawings, in which: Figure 1 is an exploded perspective view illustrating a conventional method of fixing a heat sink on a motherboard; 2 is an incomplete exploded perspective view of a first embodiment of the CPU heat dissipation module of the present invention disposed on a motherboard, illustrating that a top cover of a CPU mounting frame of the first embodiment is in a closed position; Figure 3 is a combined side view of Figure 2; 4 is an incomplete combined perspective view of the CPU mounting frame with a processor socket and a central processing unit disposed on the motherboard, illustrating that the top cover of the CPU mounting frame is in an open position; Fig. 5 is a top view of a first heat dissipation block of the first embodiment; FIG. 6 is a view similar to FIG. 3, illustrating that a heat dissipation fan may be additionally installed on the first heat dissipation block as required; 7 is a partial exploded perspective view of a second embodiment group of the CPU heat dissipation module of the present invention; Figure 8 is a combined side view of Figure 7; Fig. 9 is a view similar to Fig. 8 illustrating that the cooling fan may be additionally installed on a second heat dissipation block of the second embodiment as required; 10 is a combined side view of a third embodiment group of the CPU heat dissipation module of the present invention.

100: CPU cooling module

10: CPU mounting frame

11: Base

12: Top cover

121: screw hole

20: The first heat sink

21: Core

211: First Top Surface

212: first bottom

213: First week

22: The first fin part

23: second fin

24: Piercing

30: Locking bolt

X: first direction

Y: second direction

Z: thickness direction

200: Motherboard

220: central processing unit

221: heat sink

Claims (7)

A CPU cooling module, including: A CPU mounting frame, including a base, and a top cover connected to the base, the top cover can be changed between an open position and a closed position relative to the base, the top cover has a number of screw holes; A first heat dissipation block is located above the top cover and has a first top surface and a first bottom surface. The first heat dissipation block is formed with a number extending from the first top surface to the first bottom surface and respectively corresponding to the Perforation of other screw holes; and The plurality of locking bolts respectively correspond to the perforations, and each locking bolt passes through the respective perforations to be detachably screwed with the respective screw holes. The CPU heat dissipation module according to claim 1, wherein the first heat dissipation block includes a core, the core has the first top surface and the first bottom surface, and the core further has a core connected to the first In the first outer peripheral surface between the top surface and the first bottom surface, each perforation extends from the first top surface to the first bottom surface and penetrates the first outer peripheral surface. The CPU heat dissipation module according to claim 2, wherein the first heat dissipation block further includes a plurality of first fin portions that are disposed opposite to each other on the core, and a plurality of first fin portions are disposed opposite to each other on the core. The second fin portion of the section, the first fin portions extend outward from the first outer peripheral surface in a first direction, and the first fin portions are in a second direction intersecting the first direction The second fin parts are arranged at intervals from the first outer peripheral surface along the second direction, and the second fin parts are arranged at intervals in the first direction. The CPU heat dissipation module according to claim 3, wherein the second direction is perpendicular to the first direction. The CPU heat dissipation module according to claim 3, further comprising a second heat dissipation block, and a heat pipe connected between the first and second heat dissipation blocks. The CPU heat dissipation module according to claim 5, wherein a first hole is formed on the first top surface of the core of the first heat dissipation block, and the two heat dissipation blocks have a first hole in contact with the first top surface There are two bottom surfaces, the second bottom surface is formed with a second insertion hole, and the heat pipe includes an evaporation section inserted into the first insertion hole and a condensation section inserted into the second insertion hole. The CPU heat dissipation module according to claim 5, wherein a side hole is formed on the first peripheral surface of the core of the first heat dissipation block, and the two heat dissipation blocks are arranged on the side of the first heat dissipation block , And has a second bottom surface facing the first peripheral surface, the second bottom surface is formed with a second insertion hole, the heat pipe includes an evaporation section inserted in the side insertion hole, and a second insertion Condensation section of the hole.

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