CN201341288Y - Heat radiator and radiator - Google Patents

Abstract

A heat dissipating double-fuselage, including a heat sink and a fan, the heat sink includes a base and multiple radiating fins that extend out from the base, the heat sink is spaced and equipped with multiple fan fixed parts and multiple circuit board fixed parts, fan fixed part and circuit board fixed part are formed integrally by some radiating fins, the fixed part of the fan is located inside heat sink, the fixed part of the circuit board is set up in the outer fringe of heat sink suddenly, the fan includes a fan body and a flabellum, the flabellum is set up in the fan body rotatably, the fan body of the fan is fixed to the fixed part of the fan with multiple first fixings; thus, the structure is simplified, the assembly is easy, and the cost is reduced. The utility model discloses provide a radiator in addition.

Description

Heat sinks and radiators

technical field

The utility model relates to a cooling device and a radiator, in particular to a cooling device and a radiator for assisting electronic components in cooling.

Background technique

With the development of integrated circuits in the direction of densification and complexity, the heat generated by electronic components will also increase during operation, which will increase the temperature of electronic components and affect the normal operation of electronic components. Among them, the central processing unit ( The temperature of the CPU) is particularly high when it is working, so a cooling device must be installed to assist in heat dissipation, so as to ensure that the central processing unit can work stably at a reasonable temperature.

Announced on June 21, 2006, Taiwan, China Patent No.: No. M292733 discloses a "cooling device", including a radiator, a fan holder locked on the radiator and a fan holder installed on the fan holder. The fan, the radiator includes a body and a number of heat dissipation fins extending from the body; the fan fixing frame is a square frame, each of its four corners extends downwards with a fixing column, and each fixing column is equipped with a corresponding A fixing bolt is provided; at least two protrusions protrude outward from the four sides of the fan fixing frame, each of which is provided with a locking device; each of the four corners of the fan is provided with a perforation, and the fan fixing frame The locking device corresponds to the through hole of the fan, so that the fan and the fan fixing frame form an included angle to fix the fan to the fan fixing frame.

Announced on September 1, 2005, Taiwan, China Patent No.: No. M274575 discloses a "radiation device", which has: a heat dissipation fin, the two sides of one end surface are respectively formed with grooves, in each groove A number of perforations are provided at intervals at the bottom of the bottom; a heat dissipation fan is fixed on the other end surface of the heat dissipation fin; The two free ends of the fixed piece are respectively provided with holes, and each hole is provided with a fixing piece pushed by a spring; a heat conduction block is provided with a fixing hole at the position opposite to the perforation; several fixing pieces are arranged in sequence Through the fixing hole of the heat conduction block, the fixation hole of the fixation piece and the perforation of the heat dissipation fin, the heat conduction block, the fixation piece and the heat dissipation fin are mutually fixed.

In the conventional heat dissipation device, a fan fixing frame must be provided above the radiator for installing the fan. Or set a fixing sheet under the heat sink to fix the heat sink on the circuit board, so that the heat sink can contact the electronic components on the circuit board, and transfer the high temperature generated by the electronic components to the heat sink to assist in heat dissipation . However, no matter the setting of the fan fixing frame or the fixing plate, the overall structure of the heat dissipation device will be complicated, the assembly is difficult, and the cost will be increased.

The reason is that the author of the present invention feels that the above-mentioned deficiency can be improved, and proposes a utility model with a reasonable design and can effectively improve the above-mentioned deficiency.

Utility model content

The main purpose of the utility model is to provide a heat dissipation device and a heat sink, which can simplify the structure, facilitate the assembly, and reduce the cost.

In order to achieve the above object, the utility model provides a heat dissipation device, comprising: a heat sink, which includes a base and a plurality of heat dissipation fins extending from the base, the heat sink is provided with a plurality of The fan fixing part and a plurality of circuit board fixing parts, the fan fixing parts and the circuit board fixing parts are integrally formed by part of the cooling fins, the fan fixing parts are arranged inside the radiator, and the circuit board fixing parts and a fan, which includes a fan body and a fan blade, the fan blade is rotatably arranged on the fan body, and the fan body of the fan is fixed to the fan body with a plurality of first fixing pieces Some fan fixing parts.

The utility model further provides a radiator, comprising: a radiator, which includes a base and a plurality of cooling fins extending from the base, the radiator is provided with a plurality of fan fixing parts and a plurality of A circuit board fixing part, the fan fixing parts and the circuit board fixing parts are integrally formed by part of the cooling fins, the circuit board fixing parts protrude from the outer edge of the radiator, and the fan fixing parts are located on the and a fan, which includes a fan body and a fan blade, the fan blade is rotatably arranged on the fan body, and the fan body of the fan is fixed to the fans with a plurality of first fixing members fixed part.

The utility model further provides a radiator, which includes a base and a plurality of cooling fins extending from the base, and the radiator is provided with a plurality of fan fixing parts and a plurality of circuit board fixing parts at intervals. The fan fixing parts and the circuit board fixing parts are integrally formed by part of the cooling fins, the fan fixing parts are arranged inside the radiator, and the circuit board fixing parts protrude from the outer edge of the radiator.

The utility model further provides a radiator, which includes a base and a plurality of cooling fins extending from the base, the radiator is provided with a plurality of fan fixing parts and a plurality of circuit board fixing parts at intervals, the The fan fixing parts and the circuit board fixing parts are integrally formed by part of the cooling fins, the circuit board fixing parts protrude from the outer edge of the radiator, and the fan fixing parts are located inside the circuit board fixing parts.

The utility model has the following beneficial effects: the utility model is integrally formed with a plurality of fan fixing parts and a plurality of circuit board fixing parts, and the circuit board fixing parts protrude from the outer edge of the radiator. The fan fixing parts are arranged inside the heat sink or inside the circuit board fixing part, and the fan fixing parts can be used to install and fix the fan, and the circuit board fixing parts can be used to be fixed on the circuit board. Therefore, there is no need to install components such as a fan fixing frame and a fixing piece, which can simplify the structure, make the assembly simpler and easier, and reduce the cost.

In order to further understand the features and technical contents of the present utility model, please refer to the following detailed description and accompanying drawings of the present utility model. However, the attached drawings are only for reference and illustration, and are not intended to limit the present utility model.

Description of drawings

Fig. 1 is a three-dimensional exploded view of the heat dissipation device of the present invention.

Fig. 2 is a three-dimensional assembled view of the heat dissipation device of the present invention.

Fig. 3 is a bottom view of the radiator of the present invention.

FIG. 4 is an exploded perspective view of another embodiment of the heat sink of the present invention.

FIG. 5 is a three-dimensional assembled view of another embodiment of the heat sink of the present invention.

Explanation of main component symbols

1 Radiator

11 base

12 cooling fins

13 Fan fixing part

131 The first fixing hole

14 Circuit board fixing part

141 Second fixing hole

2 fans

21 Fan body

211 frame

212 bracket

213 base

214 locking hole

22 blades

3 first fixing piece

4 second fixing piece

Detailed ways

Please refer to Fig. 1 to Fig. 3, the utility model provides a kind of cooling device, and it is used for being installed on a circuit board, and is arranged on this circuit board (such as motherboard) Electronic component (such as central processing unit) , chips) are attached to each other to provide heat dissipation for the electronic component, thereby ensuring its stable operation. The heat dissipation device includes a heat sink 1, a fan 2 and a plurality of first fixing parts 3.

The heat sink 1 is made of a metal material with good thermal conductivity. The heat sink 1 includes a base 11 and a plurality of heat dissipation fins 12 extending from the base 11. In this embodiment, the base 11 is a cylinder, and these heat dissipation fins 12 extend from the outer edge of the base 11, and these heat dissipation fins 12 extend radially outwards, and the heat dissipation fins 12 are roughly arc-shaped fins, and these heat dissipation fins 12 are generally arc-shaped. Fins 12 surround the base 11 at intervals, making the heat sink 1 form a cylinder, but the shape and structure of the heat sink 1 are not limited, and can be appropriately changed according to needs. The base 11 can be a solid body or a hollow body, and when the base 11 is a hollow body, objects with good thermal conductivity such as copper, aluminum, or heat pipes can be plugged inside.

The heat sink 1 is provided with a plurality of fan fixing parts 13 at intervals, and the number of fan fixing parts 13 is not limited, and two, three or four fan fixing parts 13 may be provided. These fan fixing parts 13 are integrally formed by part of the cooling fins 12, the upper ends of the fan fixing parts 13 are flush with the upper ends of the cooling fins 12, and the lower ends of the fan fixing parts 13 extend downwards appropriately, so that the fan fixing parts 13 have a suitable the height of. In this embodiment, the fan fixing part 13 is a "C"-shaped cylinder, and a first fixing hole 131 is formed inside it, which penetrates up and down. However, the shape and structure of the fan fixing part 13 are not limited, and it can Appropriate changes.

A plurality of circuit board fixing portions 14 are projected at intervals from the outer edge of the heat sink 1 , and the number of circuit board fixing portions 14 is not limited, two, three or four etc. may be provided. These circuit board fixing parts 14 are integrally formed by part of the heat dissipation fins 12 and extend outwards. The circuit board fixing parts 14 are located at the lower end of the heat dissipation fins 12. Moreover, the circuit board fixing parts 14 and the fan fixing parts 13 form a staggered shape, and the fan fixing parts 13 and the circuit board fixing parts 14 are formed by extending different heat dissipation fins 12, that is, the circuit board fixing parts are viewed from top to bottom 14 and the fan fixing part 13 are mutually staggered. In this embodiment, the circuit board fixing part 14 is a "C"-shaped column, and a second fixing hole 141 is formed inside it, which penetrates up and down. However, the shape and structure of the circuit board fixing part 14 are not limited. Make appropriate changes as needed.

The fan 2 is an axial fan, which includes a fan body 21 and a blade 22, the fan body 21 has a frame 211, the frame 211 extends upward and inward to form a plurality of brackets 212, these brackets 212 A base 213 is connected to the inner end. The frame 211 has four corners and a plurality of locking holes 214 corresponding to the first fixing holes 131 . The center of the fan blade 22 is pivotally arranged on the base 213, so that the fan blade 22 is rotatably arranged in the fan body 21, and a stator and a rotor (not shown) are arranged between the base 213 and the fan blade 22 for driving. The fan blade 22 rotates in the fan body 21; the structure of the fan 2 is roughly the same as the conventional technology, which is not the key point of the utility model, so it will not be repeated here.

The first fixing parts 3 can be screws or fastening components. In this embodiment, the first fixing parts 3 are screws, and the first fixing parts 3 pass through the corresponding locking holes 214 of the fan 2 , and screwed and fixed in the corresponding first fixing hole 131 of the radiator 1, so that the four-corner screw lock of the fan 2 is fixed on the radiator 1, and the fan 2 can strengthen the air flow to improve the heat dissipation efficiency of the radiator 1; The heat dissipation device of the present invention is formed by the above composition.

The lower end of the cooling fins 12 of the heat sink 1 is provided with a plurality of circuit board fixing parts 14, so a plurality of second fixing parts 4 can be used to lock on the circuit board (not shown in the figure), and these second fixing parts 4 can be Screws or fastening components, these second fixing parts 4 are passed through the second fixing holes 141 corresponding to the radiator 1, and then fixed on the circuit board by screwing or buckling, so that the heat sink can be installed on the on the circuit board, and the bottom surface of the base 11 of the heat sink 1 is attached to the top surface of the electronic component, so that the high temperature of the electronic component can be transmitted to the heat sink 1 to assist the heat dissipation of the electronic component to ensure that the electronic component is at a reasonable temperature Get a stable job.

Please refer to FIG. 4 and FIG. 5 , in another implementation of the present utility model, the fan fixing parts 13 and the circuit board fixing parts 14 are all protruding from the outer edge of the radiator 1, and the fan fixing parts 13 are located at Inside the circuit board fixing parts 14 , the circuit board fixing parts 14 correspond to the fan fixing parts 13 , and the fan fixing parts 13 and the corresponding circuit board fixing parts 14 are formed by extending from the same cooling fin 12 .

The utility model is mainly provided with a plurality of fan fixing parts 13 and a plurality of circuit board fixing parts 14 integrally formed on the radiator 1, and the circuit board fixing parts 14 protrude from the outer edge of the radiator 1, and the fan fixing parts 13 is disposed inside the heat sink 1 or inside the circuit board fixing portion 14, the fan fixing portions 13 can be used to install and fix the fan 2, and the circuit board fixing portions 14 can be used to be fixed on the circuit board. Therefore, there is no need to install components such as a fan fixing frame and a fixing piece, which can simplify the structure, make the assembly simpler and easier, and reduce the cost.

However, the above descriptions are only preferred embodiments of the present utility model, and are not intended to limit the scope of patent protection of the present utility model. Therefore, all equivalent changes made by using the description and drawings of the utility model are all included in the same reason. Within the protection scope of the rights of the present utility model, Chen Ming is jointly granted.

Claims (20)

1. A cooling device, characterized in that it comprises: A heat sink, which includes a base and a plurality of heat dissipation fins extending from the base, the heat sink is provided with a plurality of fan fixing parts and a plurality of circuit board fixing parts at intervals, and the fan fixing parts and the The circuit board fixing parts are integrally formed by part of the cooling fins, the fan fixing parts are arranged inside the radiator, and the circuit board fixing parts protrude from the outer edge of the radiator; and A fan includes a fan body and a fan blade. The fan blade is rotatably arranged on the fan body. The fan body of the fan is fixed to the fan fixing parts by a plurality of first fixing pieces. 2. The heat dissipation device according to claim 1, wherein the fan fixing parts are "C" shaped columns, and each of the fan fixing parts is formed with a first fixing hole inside. 3. The heat dissipation device according to claim 1, wherein the circuit board fixing parts are "C"-shaped columns, and a second fixing hole is formed inside each of the circuit board fixing parts. 4. The heat dissipation device according to claim 1, 2 or 3, wherein the fixing parts of the circuit boards are located at the lower ends of the cooling fins, and the fixing parts of the circuit boards are lower than the fixing parts of the fans. 5. The heat dissipation device according to claim 1, 2 or 3, characterized in that: the circuit board fixing parts and the fan fixing parts form a staggered shape, and the fan fixing part and the circuit board fixing part are made of different heat dissipation fins extension formed. 6. A cooling device, characterized in that it comprises: A heat sink, which includes a base and a plurality of heat dissipation fins extending from the base, the heat sink is provided with a plurality of fan fixing parts and a plurality of circuit board fixing parts at intervals, and the fan fixing parts and the The circuit board fixing parts are integrally formed by part of the cooling fins, the circuit board fixing parts protrude from the outer edge of the radiator, and the fan fixing parts are located inside the circuit board fixing parts; and A fan includes a fan body and a fan blade. The fan blade is rotatably arranged on the fan body. The fan body of the fan is fixed to the fan fixing parts by a plurality of first fixing pieces. 7 . The heat dissipation device according to claim 6 , wherein the fan fixing parts are "C" shaped cylinders, and each of the fan fixing parts has a first fixing hole formed inside. 8. The heat dissipation device according to claim 6, wherein the circuit board fixing parts are "C"-shaped columns, and a second fixing hole is formed inside each of the circuit board fixing parts. 9. The heat dissipation device according to claim 6, 7 or 8, characterized in that: the circuit board fixing parts are located at the lower ends of the cooling fins, and the circuit board fixing parts are lower than the fan fixing parts. 10. The heat dissipation device according to claim 6, 7 or 8, characterized in that: the circuit board fixing parts correspond to the fan fixing parts, and the fan fixing parts and the corresponding circuit board fixing parts use the same heat sink Fin extensions are formed. 11. A heat sink, characterized in that it includes a base and a plurality of cooling fins extending from the base, the heat sink is provided with a plurality of fan fixing parts and a plurality of circuit board fixing parts at intervals, The fan fixing parts and the circuit board fixing parts are integrally formed by part of the cooling fins, the fan fixing parts are arranged inside the radiator, and the circuit board fixing parts protrude from the outer edge of the radiator. 12. The heat sink according to claim 11, characterized in that: the fan fixing parts are "C" shaped cylinders, and a first fixing hole is formed inside each of the fan fixing parts. 13. The heat sink according to claim 11, wherein the circuit board fixing parts are "C"-shaped columns, and a second fixing hole is formed inside each of the circuit board fixing parts. 14. The heat sink according to claim 11, 12 or 13, characterized in that: the circuit board fixing parts are located at the lower ends of the cooling fins, and the circuit board fixing parts are lower than the fan fixing parts. 15. The heat sink according to claim 11, 12 or 13, characterized in that: the circuit board fixing parts and the fan fixing parts form a staggered shape, and the fan fixing part and the circuit board fixing part are made of different heat dissipation fins extension formed. 16. A heat sink, characterized in that it includes a base and a plurality of cooling fins extending from the base, the heat sink is provided with a plurality of fan fixing parts and a plurality of circuit board fixing parts at intervals, The fan fixing parts and the circuit board fixing parts are integrally formed by part of the cooling fins, the circuit board fixing parts protrude from the outer edge of the radiator, and the fan fixing parts are located inside the circuit board fixing parts . 17. The heat sink according to claim 16, wherein the fan fixing parts are "C" shaped cylinders, and a first fixing hole is formed inside each of the fan fixing parts. 18. The heat sink according to claim 16, characterized in that: the circuit board fixing parts are "C"-shaped columns, and a second fixing hole is formed inside each of the circuit board fixing parts. 19. The heat sink according to claim 16, 17 or 18, characterized in that: the circuit board fixing parts are located at the lower ends of the cooling fins, and the circuit board fixing parts are lower than the fan fixing parts. 20. The heat sink according to claim 16, 17 or 18, characterized in that: the circuit board fixing parts correspond to the fan fixing parts, and the fan fixing parts and the corresponding circuit board fixing parts use the same heat sink Fin extensions are formed.

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