TW202004960A - Bonding apparatus - Google Patents

Abstract

The present invention discloses a boding apparatus. The bonding apparatus includes: a plurality of transfer portions that transfer a plurality of circuit substrates, and a plurality of head assemblies on which the chips are mounted on each of the plurality of circuit substrates supplied from each of the plurality of transfer portions, and are set to corresponding to each of the plurality of head assemblies and temporarily disposing the chip, a wafer placement portion for placing a wafer on which the chip is placed, and by using the wafer disposed from the wafer placement portion, the chip is picked up, and the chip is supplied to a chip pickup portion of one of the plurality of intermediate stages.

Description

Combining device

The present invention relates to a device, and more specifically, to a combination device.

As is well known, a bonding device is a device that separates a wafer from a wafer and mounts it on a circuit substrate (or lead frame). Such a bonding device is generally used to mount a chip on a circuit substrate. Here, the wafer may include a semiconductor wafer, a small electronic component, and the like. To achieve this operation, conventional bonding devices may include a mechanism for separating the wafer from the wafer and a mechanism for transferring the wafer. In this way, as described above, after the bonding device mounts a chip on the circuit board, in order to mount another chip or install the chip elsewhere, it is necessary to repeat the operations described above. In this case, it takes a lot of time and steps to mount all the required chips on the circuit board by the bonding device.

A bonding device related to the above has been disclosed in Korean Patent Invention No. 1999-0045650 (invention name: semiconductor wafer bonding method and device, applicant: Toshiba Corporation).

In view of the fundamental shortcomings of the conventional coupling device described above, the present invention aims to provide a coupling device.

The bonding device provided by the present invention includes: a plurality of transfer sections for transferring a plurality of circuit substrates; a plurality of mounting head assemblies for mounting chips on each of the transfer sections respectively transferred by the plurality of transfer sections On a plurality of circuit substrates; a plurality of intermediate stages, which are arranged to correspond to the plurality of mounting head assemblies, respectively, and can temporarily place the wafer; a wafer placement part, which is used to place a wafer and make the chip Placed on the wafer; and a wafer pick-up section for picking up the wafer from the wafer placed in the wafer placement section and transferring the wafer to one of the plurality of intermediate stages .

In addition, the coupling device of the present invention may further include a pre-heating section provided on each of the plurality of conveying sections.

Moreover, the bonding apparatus of the present invention may further include a heating portion provided in each of the plurality of transfer portions, and for each of the plurality of circuit substrates, the wafer is mounted on each of the The circuit board is partially heated.

Moreover, the plurality of mounting head assemblies include a first mounting head assembly, a second mounting head assembly, a third mounting head assembly, and a fourth mounting head assembly that are arranged at intervals from each other, wherein the fourth mounting head assembly and the One of the third mounting head assembly is operated, and one of the second mounting head assembly and the first mounting head assembly is operated.

Furthermore, if the other of the fourth mounting head assembly or the third mounting head assembly is operated, the other of the second mounting head assembly or the first mounting head assembly is operated.

In addition, the bonding device of the present invention may further include a visual part for photographing at least one of the plurality of circuit boards and the wafer.

Therefore, according to the bonding device of the embodiment of the present invention, a plurality of chips can be transferred and mounted on the circuit substrate, which is one of the objects of the present invention.

According to the bonding device of the embodiment of the present invention, different kinds of chips can be transferred and mounted on the circuit substrate, which is another object of the present invention.

According to the combination device of the embodiment of the present invention, the operation sequence and operation time can be reduced, and the operation efficiency can be improved, which is another object of the invention.

100、200、300‧‧‧Combined device

110, 210, 310

120, 220, 320‧‧‧ Unloading Department

130, 230, 330‧‧‧ Transmission Department

131‧‧‧ First Transmission Department

131a‧‧‧First Placement Department

131b‧‧‧First rail section

132‧‧‧Second Transmission Department

140, 240, 340‧‧‧ cleaner

141‧‧‧ cleaner support

142‧‧‧ cleaner head

150, 250, 350 ‧‧‧ preheating section

151‧‧‧First Preheating Department

152‧‧‧Second preheating section

160, 260, 360 ‧‧‧ heating

161‧‧‧First Heating Department

162‧‧‧Second heating section

163‧‧‧The third heating section

164‧‧‧The fourth heating section

170, 270, 370‧‧‧ mounting head assembly

171‧‧‧First mounting head assembly

171a‧‧‧First mounting head

171b‧‧‧First mounting head support

171c‧‧‧ First mounting head drive unit

172‧‧‧Second mounting head assembly

172a‧‧‧Second mounting head

173‧‧‧The third mounting head assembly

173a‧‧‧third mounting head

174‧‧‧ Fourth mounting head assembly

174a‧‧‧Fourth mounting head

180‧‧‧intermediate platform (common name)

181‧‧‧ First middle station

182‧‧‧Second middle station

183‧‧‧The third middle station

184‧‧‧The fourth center

185, 285, 385‧‧‧ Wafer pickup

185-1‧‧‧First wafer picking section

185-1a‧‧‧First wafer pickup head

185-1b‧‧‧First wafer pickup head support

185-2‧‧‧Second wafer pickup

185-2a‧‧‧Second wafer pickup head

186, 286, 386‧‧‧ Wafer Placement Department

187, 287, 387‧‧‧ Wafer Aligner

188, 288, 388‧‧‧ Wafer cassette

189, 289, 389‧‧‧ Wafer Transfer Department

191, 291, 391‧‧‧ Circuit board pre-alignment vision department

192, 292, 392

193, 293, 393

194, 294, 394‧‧‧ Intermediate Vision Department

195, 295, 395‧‧‧ Wafer Vision Department

280, 380‧‧‧ intermediate platform

296, 297‧‧‧ Wafer stage drive unit

D‧‧‧chip

P1, P2, P3, P4 ‧‧‧ circuit board (or lead frame)

W‧‧‧ Wafer

Fig. 1 is a plan view showing a coupling device according to an embodiment of the present invention.

FIG. 2 is a plan view showing a part of the bearing portion, preheating portion, and conveying portion of the coupling device in FIG. 1.

Figure 3 shows a plan view of the attachment head assembly and attachment/detachment portion of the coupling device shown in Figure 1.

FIG. 4 is a plan view showing the partial bonding apparatus in FIG. 1 that separates the wafer from the wafer.

Fig. 5 is a plan view showing a coupling device according to another embodiment of the invention.

Fig. 6 is a plan view showing a coupling device according to another embodiment of the invention.

The present invention can be clearly understood by referring to the drawings and the embodiments detailed below. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various forms. The embodiments herein are merely to make the present invention more complete, and to completely inform the technical field to which the present invention belongs that those skilled in the art can understand the scope of the present invention and are provided, and the present invention is only patented The scope of the scope is limited. In addition, the terms used in this specification are used to describe the embodiments, not to limit the present invention. In this specification, the meaning of the singular form may also include the meaning of the plural form unless specifically mentioned in the context. As used in this specification "comprising (comprises &)" and / or "comprising the (comprising,)" and does not exclude the components mentioned, may be present or more than one additional step, operation and / or other components Constituent elements, steps, operations, and/or components. The first and second terms can be used to describe various constituent elements, but the constituent elements should not be limited by these terms. These terms are only used to distinguish one component from other components.

Fig. 1 is a plan view showing a coupling device according to an embodiment of the present invention. FIG. 2 is a plan view showing a part of the bearing portion, preheating portion, and conveying portion of the coupling device in FIG. 1. FIG. 3 is a plan view showing the attachment head assembly and attachment/detachment portion of the coupling device in FIG. 1. FIG. FIG. 4 is a plan view showing the partial bonding apparatus in FIG. 1 that separates the wafer from the wafer.

As shown in FIGS. 1 to 4, the coupling device 100 of the present invention may include a carrying part 110, an unloading part 120, a conveying part 130, a cleaner 140, a pre-heating part 150, a heating part 160, and a first mounting head assembly 171 , Second mounting head assembly 172, third mounting head assembly 173, fourth mounting head assembly 174, first intermediate stage 181, second intermediate stage 182, third intermediate stage 183, fourth intermediate stage 184, wafer pick-up section 185 , A wafer placement section 186, a wafer aligner 187, a wafer transfer section 189, and a vision section (not shown).

The circuit substrates (or lead frames) P1, P2, P3, and P4 may be supplied to the carrier 110 from the outside. At this time, the carrying part 110 may supply the circuit boards P1, P2, P3, and P4 to the conveying part 130 in various ways. As an embodiment, the circuit substrates P1, P2, P3, and P4 are placed on the carrying portion 110, and the transfer portion 130 may load and move the placed circuit substrates P1, P2, P3, and P4. At this time, the carrying part 110 is detachably combined with a part of the conveying part 130, or a part of the conveying part 130 may be moved onto the carrying part 110. As another embodiment, the carrier 110 may have a robot arm that transfers the placed circuit substrates P1, P2, P3, and P4 to the transfer part 130. As another embodiment, the circuit substrates P1, P2, P3, and P4 are placed on the carrying portion 110, and the carrying portion 110 may include independent conveyor belts and rollers to convey the circuit substrates P1, P2, P3, and P4. In this case, the carrier 110 can transfer the circuit boards P1, P2, P3, and P4 by operating a conveyor belt, rollers, and the like provided on an independent table. At this time, the carrier 110 is not limited to the foregoing description, and may include all forms in which the circuit substrates P1, P2, P3, and P4 can be placed and the circuit substrates P1, P2, P3, and P4 are provided to the transfer portion 130.

After the wafer D is mounted on the circuit substrates P1, P2, P3, and P4 transferred by the transfer section 130, the circuit substrates P1, P2, P3, and P4 can be transferred from the transfer section 130 to the unloading section 120. At this time, the unloading part 120 may be formed similarly to the above-mentioned carrying part 110, and the circuit boards P1, P2, P3, and P4 may be recovered from the conveying part 130. The unloading part 120 may transfer the circuit substrates P1, P2, P3, and P4 on which the wafer D is mounted to the outside. At this time, the transmission method may be that the circuit boards P1, P2, P3, and P4 are automatically transmitted by a robot arm or the like, or the operator manually transmits it to the outside.

The transmission unit 130 as described above may have two groups. For example, the conveying part 130 may include a first conveying part 131 and a second conveying part 132 which are arranged at intervals from each other. At this time, the first transfer portion 131 can transfer the first circuit substrate P1 and the second circuit substrate P2 in the first direction (for example, the X-axis direction in FIG. 1), and the second transfer portion 132 can transfer the third circuit substrate P3 and the fourth circuit substrate P4 are transferred in the first direction. At this time, since the first conveying part 131 and the second conveying part 132 are the same or similar to each other, the following will be described and explained in detail with the first conveying part 131 for convenience of explanation.

The first transfer portion 131 may include a first placement portion 131a on which the first circuit substrate P1 or the second circuit substrate P2 is placed, and a first rail portion 131b provided to enable the first placement portion 131a to move linearly. At this time, an independent linear motor is provided between the first placement portion 131a and the first rail portion 131b, and the linear motor can linearly move the first placement portion 131a.

The cleaner 140 may be provided separately from the conveying part 130. At this time, the cleaner 140 may include a cleaner support portion 141 and a cleaner head 142 that is linearly movably provided on the cleaner support portion 141. At this time, the cleaner head 142 removes foreign matter on the outer surfaces of the circuit boards P1, P2, P3, and P4 by sucking air or supplying gas to the circuit boards P1, P2, P3, and P4.

The pre-heating part 150 may be disposed to face the cleaner 140. At this time, the pre-heating part 150 is provided below the circuit boards P1, P2, P3, and P4, and can heat the circuit boards P1, P2, P3, and P4. In particular, the preheating unit 150 may heat the circuit boards P1, P2, P3, and P4 by supplying hot gas to the circuit boards P1, P2, P3, and P4 or irradiating light or the like to the circuit boards P1, P2, P3, and P4. As another embodiment, the pre-heating part 150 may include a heater to heat the circuit substrates P1, P2, P3, and P4. At this time, the pre-heating part 150 may include a first pre-heating part 151 provided corresponding to the first conveying part 131 and a second pre-heating part 152 provided corresponding to the second conveying part 132.

The heating part 160 may be provided separately from the pre-heating part 150. At this time, when the wafer D is mounted on each circuit substrate P1, P2, P3, and P4, the heating section 160 can independently heat each circuit substrate P1, P2, P3, and P4. In this case, the heating portion 160 may locally heat the portions where the wafer D is mounted on the respective circuit boards P1, P2, P3, and P4. The heating section 160 may be configured the same as or similar to the pre-heating section 150.

The heating part 160 as described above may include the first heating part 161 corresponding to the first mounting position of the first circuit board P1, the second heating part 162 corresponding to the second mounting position of the second circuit board P2, corresponding to the first The third heating portion 163 of the third mounting position of the three circuit board P3 and the fourth heating portion 164 corresponding to the fourth mounting position of the fourth circuit board P4. In this case, there may be a plurality of first heating parts 161 to fourth heating parts 164 respectively. Here, the plurality of first heating parts 161 may be arranged to be separated from each other, and the plurality of second heating parts 162 may be arranged to be separated from each other. In addition, the plurality of third heating parts 163 may be provided separately from each other, and the plurality of fourth heating parts 164 may also be provided separated from each other. Accordingly, each heating part 160 may be provided in a portion where the wafer D is mounted.

The first mounting head assembly 171 to the fourth mounting head assembly 174 may each be driven independently of each other. Here, the first to fourth mounting head assemblies 171 to 174 can mount the wafer D to each circuit substrate P1, P2, P3, and P4. In this case, since the first mounting head assembly 171 and the fourth mounting head assembly 174 are the same or similar to each other, the first mounting head assembly 171 will be described in detail below.

The first mounting head assembly 171 may include a first mounting head 171a that picks up the wafer D to be mounted on the circuit boards P1, P2, P3, and P4 and a second direction that enables the first mounting head 171a to be different from the first direction (for example, (Y axis direction in FIG. 1) The first mounting head support portion 171b provided to move linearly. The first mounting head 171a can suck the wafer D and mount it on the first circuit board P1. Here, the first mounting head 171a can suck the wafer D by vacuum or the like. In addition, the first mounting head support portion 171b may include a linear motion guide that guides the linear movement of the first mounting head 171a. As another embodiment, the first mounting head support portion 171b may include a guide rail provided to guide the linear movement of the first mounting head 171a. Here, the first mounting head support portion 171b is not limited to the above-described configuration, but may include all other structures and devices having equivalent functions, which can guide the linear movement of the first mounting head 171a, and the first mounting head 171a It is set to move linearly. The first mounting head support portion 171b as described above may include an independent first mounting head driving portion 171c, which is located between the first mounting head 171a and the first mounting head support portion 171b, and makes the first mounting head 171a linear mobile. In accordance therewith, the first mounting head driving portion 171c can be formed in various ways. For example, the first mounting head driving portion 171c may include a ball screw connected to the first mounting head 171a and a motor provided on the first mounting head support portion 171b and connected to the ball screw. As another embodiment, the first mounting head driving portion 171c may include a linear motor provided between the first mounting head 171a and the first mounting head support portion 171b and connected to the first mounting head 171a. As another embodiment, the first mounting head driving portion 171c may include a cylinder provided on the first mounting head support portion 171b and connected to the first mounting head 171a. Here, the first mounting head driving portion 171c is not limited to the aforementioned configuration, and may include all structures connected to the first mounting head 171a and linearly moving the first mounting head 171a. For ease of explanation, the case where the first mounting head driving portion 171c includes a linear motor will be taken as an example for detailed description.

The wafer D may be temporarily placed on the first intermediate stage 181 to the fourth intermediate stage 184. Here, since the structures of the first intermediate stage 181 to the fourth intermediate stage 184 are the same as or similar to each other, the first intermediate stage 181 will be taken as an example for detailed description.

The wafer D picked up by the wafer picking section 185 can be placed and temporarily stored in the first intermediate stage 181. At this time, the first intermediate stage 181 may be in a fixed state. In addition, the first intermediate stage 181 may be configured in the form of a flat plate, and a wafer placement portion such as a groove or the like may be provided to place the wafer D. Accordingly, the first intermediate stage 181 may be disposed to correspond to the first mounting head assembly 171, and may be disposed between the first mounting head assembly 171 and the wafer pick-up portion 185.

The wafer pickup portion 185 picks up the wafer D of the wafer W and supplies it to one of the first intermediate stage 181 to the fourth intermediate stage 184. Here, the wafer pickup part 185 may include a first wafer pickup part 185-1 that supplies the wafer D to the first intermediate stage 181 and the second intermediate stage 182, and supplies the wafer D to the third intermediate stage 183 and the fourth intermediate stage The second wafer pickup portion 185-2 of the stage 184. Here, since the first wafer pick-up portion 185-1 and the second wafer pick-up portion 185-2 are the same as or similar to each other, the first wafer pick-up portion 185-1 will be taken as an example to explain in detail below.

The first wafer pickup portion 185-1 can pick up the wafer D from the wafer W. Here, the first wafer pickup portion 185-1 may include a first wafer pickup head 185-1a that picks up the wafer D, a first wafer pickup head support portion 185-1b that may linearly move the first wafer pickup head 185-1a, and The first wafer pickup head support portion 185-1b, which can move the first wafer pickup head 185-1a linearly in the first direction or the second direction, and can move the first wafer pickup head 185-1a up and down A wafer pickup head drive section (not shown). Here, the first wafer pick-up head 185-1a can fix the wafer D by vacuum or the like.

The wafer W can be placed on the wafer placement portion 186. Here, when the wafer D is separated from the wafer W, the wafer placement portion 186 may fix the wafer W or may apply a certain degree of force to the wafer W, so that the wafer D is easily separated.

The wafer aligner 187 may mechanically arrange the wafers W extracted from the wafer cassette 188 on which the wafers W are loaded. At this time, the wafer aligner 187 may be configured in the form of a guide rail, provided on the movement path of the wafer W, and may guide the movement of the wafer W.

The wafer transfer section 189 may transfer the wafer W placed on the ring-shaped wafer loading section (not shown) that can load the wafer W to the wafer placement section 186. At this time, the wafer transfer portion 189 may be configured in the form of a jig or the like, and may be connected to the wafer loading portion. In this case, the wafer transfer part 189 can be selectively coupled to the wafer loading part by changing the length.

The vision section may photograph at least one of the positions of the circuit boards P1, P2, P3, and P4 and the orientation of the wafer D. At this time, the vision portion may include a circuit board pre-alignment vision portion 191, a connection vision portion 192, a lower vision portion 193, an intermediate vision portion 194, and a wafer vision portion 195. The visual part as described above may include a camera that photographs at least one of the circuit boards P1, P2, P3, P4, and the wafer D. There may be a single or a plurality of visual parts as described above. At this time, when there are a single or a plurality of the visual parts, the visual parts can move linearly in at least one of the first direction and the second direction.

The circuit board pre-alignment vision part 191 can photograph the position of each circuit board P1, P2, P3, and P4. As an embodiment, there may be one circuit substrate pre-aligned vision portion 191. According to this, the circuit board pre-alignment vision part 191 can be moved to the movement path of each circuit board P1, P2, P3, and P4 so as to be disposed on the movement path of each circuit board P1, P2, P3, and P4. For example, when the first circuit substrate P1 and the second circuit substrate P2 move, the circuit substrate pre-alignment vision portion 191 may be provided on the moving path of the first circuit substrate P1 and the second circuit substrate P2. In addition, when the third circuit substrate P3 and the fourth circuit substrate P4 move, the circuit substrate pre-alignment vision portion 191 may be provided on the moving path of the third circuit substrate P3 and the fourth circuit substrate P4. At this time, the circuit board pre-alignment vision portion 191 may linearly move in the second direction to be disposed on the moving path of the third circuit board P3 and the fourth circuit board P4. As another embodiment, there may be a plurality of circuit substrate pre-alignment vision portions 191, and each circuit substrate pre-alignment vision portion 191 may be disposed to correspond to the first circuit substrate P1 and the third circuit substrate P3. At this time, each of the circuit board pre-alignment vision parts 191 can photograph the frames provided on the first circuit board P1 and the third circuit board P3. In particular, each of the circuit board pre-alignment vision parts 191 may be provided on a path where the first circuit board P1 and the third circuit board P3 move separately. For ease of understanding, the following will take a circuit substrate pre-alignment vision 191 as an example for further description.

The link vision portion 192 may be provided on the mounting head assembly 170. At this time, the connected vision portion 192 can photograph the state where the wafer D is bonded to each circuit board P1, P2, P3, and P4, or the state of each circuit board P1, P2, P3, and P4 itself. According to this, the connected visual part 192 may include a first connected visual part 192a, a second connected visual part 192b, a third connected visual part 192c, and a fourth connected visual part 192d provided corresponding to each mounting head assembly 170.

The lower vision portion 193 is provided on the moving path of the wafer D, and can photograph the orientation (for example, the degree of skew) of the wafer D adsorbed to each of the mounting heads 171a, 172a, 173a, and 174a. As an embodiment, it may further have a lower vision portion 193. At this time, the lower vision portion 193 may linearly move in the first direction so as to be disposed at a position corresponding to the movement path of each mounting head. As another embodiment, there may be a plurality of lower vision portions 193. At this time, there may be two lower vision portions 193, and one lower vision portion 193 may be disposed on the moving path of the first mounting head 171a or the second mounting head 172a, and the other lower vision portion 193 may be disposed on the third installation The moving path of the head 173a or the fourth mounting head 174a. As another embodiment, there may be a plurality of lower vision parts 193, and four lower vision parts 193 may be provided. Here, each lower vision portion 193 may be set to correspond to the movement path of each mounting head. According to this, each lower vision portion 193 may be in a fixed state. For ease of understanding, the case where each lower vision portion 193 is set to correspond to the path of each mounting head will be taken as an example for detailed description.

The intermediate vision portion 194 is provided on the intermediate stages 181, 182, 183, and 184, and can photograph the orientation of the wafer D on the intermediate stages 181, 182, 183, and 184. As an embodiment, there may be one intermediate vision portion 194, and one intermediate vision portion 194 may move linearly in at least one of the first direction and the second direction, so that the intermediate vision portion 194 corresponds to each intermediate stage 181, 182, 183 and 184. As another embodiment, there may be two intermediate vision parts 194, and one intermediate vision part 194 may be linearly moved between the first intermediate stage 181 and the second intermediate stage 182 so as to be disposed on the first intermediate stage 181 And above the second intermediate stage 182. In addition, another intermediate vision portion 194 may be linearly moved between the third intermediate stage 183 and the fourth intermediate stage 184 so as to be disposed above the third intermediate stage 183 and the fourth intermediate stage 184. Moreover, as another embodiment, there may be four intermediate vision portions 194, and each intermediate vision portion 194 may be provided corresponding to the respective first intermediate stage 181 to fourth intermediate stage 184. In this case, each intermediate vision portion 194 may be fixed at a position corresponding to each intermediate stage 181, 182, 183, and 184.

The wafer vision part 195 is provided above the wafer placement part 186 to photograph the wafer W. At this time, based on the wafer W image captured by the wafer vision unit 195, it can be determined whether the wafer D on the wafer W is defective. In addition, as described above, since the wafer vision unit 195 can image the position of the wafer W, it is possible to determine whether the position of the wafer W is the same as the predetermined position based on the captured image of the wafer W.

By measuring at least one of the orientation of the wafer D and the positions of the circuit boards P1, P2, P3, and P4 photographed by the visual part as described above, the position of the circuit board P1, P2, P3, and P4 or the position of the wafer D can be adjusted position. In this case, to adjust the positions of the circuit boards P1, P2, P3, and P4, the position of the transfer section 130 or the positions of the circuit boards P1, P2, P3, and P4 placed on the transfer section 130 may be adjusted. In addition, to adjust the orientation of the wafer D, the orientation of each mounting head 171a, 172a, 173a, and 174a or each wafer D on each intermediate stage 181, 182, 183, and 184 may be adjusted. In this case, at least one of the circuit board P1, P2, P3, and P4 and the wafer D is placed or sucked to have an independent position adjustment part to change the circuit board P1, P2, P3, and P4 With at least one of the wafers D.

Meanwhile, in the bonding apparatus 100 as described above, after a plurality of wafers D are separated on a plurality of circuit boards P1, P2, P3, and P4, the wafer D can be bonded to each circuit board P1, P2, P3, and P4 .

Specifically, when the bonding apparatus 100 is in the operating state, the wafer W loaded on the wafer cassette 188 can be extracted by the wafer transfer unit 189. At this time, the position of the wafer W can be adjusted by the wafer aligner 187, and the wafer W can be transferred from the wafer in the cassette 188 to the wafer placement portion 186 and placed in the wafer placement portion 186 .

In addition, the first to fourth circuit substrates P1 to P4 may be placed on the carrier 110 in order and transferred to the first transfer portion 131 and the second transfer portion 132. At this time, since the method of transferring the first circuit substrate P1 to the fourth circuit substrate P4 by the first transfer portion 131 or the second transfer portion 132 is similar, the following will be for the sake of understanding, the transfer of the second circuit substrate P2 to the first The similar method of the transmission unit 131 will be described in detail as follows.

The first transfer part 131 may place the second circuit substrate P2 supplied to the first transfer part 131 at the position of the first preheating part 151. The circuit board pre-alignment vision part 191 can photograph the frame of the second circuit board P2. By comparing the predetermined image with the captured frame, the position of the second circuit substrate P2 is determined, and the position of the second circuit substrate P2 can be adjusted so that the captured frame corresponds to the predetermined position.

When the second circuit substrate P2 as described above is placed on the first preheating portion 151, the first preheating portion 151 may heat the second circuit substrate P2. After that, the first transfer part 131 can mount the second circuit board P2 at the second mounting position. At this time, the second installation position may be a position where the second heating part 162 is provided.

After the second circuit board P2 is installed at the second mounting position as above, the first circuit board P1 can also be installed at the first mounting position through a process similar to that of the second circuit board P2. At this time, the first mounting position may be a position where the first heating part 161 is provided. Accordingly, there may be a plurality of first placement portions 131a, and the first circuit substrate P1 and the second circuit substrate P2 may be placed on each first placement portion 131a separately.

During the process as described above, the second transfer part 132 may install the fourth circuit substrate P4 at the fourth mounting position, and may install the third circuit substrate P3 at the third mounting position. At this time, the movement of the fourth circuit substrate P4 can be performed simultaneously with the movement of the second circuit substrate P2, and the movement of the third circuit substrate P3 can be performed simultaneously with the movement of the first circuit substrate P1.

When the first transfer portion 131 and the second transfer portion 132 install the first circuit board P1 to the fourth circuit board P4 at the first mounting position to the fourth mounting position, respectively, the second circuit board P2 and the fourth circuit board P4 The first circuit board P1 and the third circuit board P3 may be installed near the unloading part 120, and may be installed near the carrying part 110.

As described above, when the first to fourth circuit substrates P1 to P4 are placed at the first to fourth mounting positions, respectively, the new circuit substrates P1, P2, P3, and P4 can be placed at the first preheating section, respectively 151和第二先热部152。 151 and the second pre-heating portion 152.

Meanwhile, during the operation as described above, the wafer D may be supplied from the wafer W to the first intermediate stage 181 to the fourth intermediate stage 184. Since the method of supplying the wafer D to the first intermediate stage 181 to the fourth intermediate stage 184 is similar, the case where the wafer D is supplied to the fourth intermediate stage 184 will be taken as an example for the sake of understanding, and the detailed description will be described later.

Specifically, the second wafer pickup portion 185-2 can pick up the wafer D mounted on the wafer W. At this time, the second wafer pickup head 185-2a can pick up the wafer D by linear movement in the vertical direction. In addition, the second wafer pick-up head 185-2a can supply the wafer D to the fourth intermediate stage 184 by linear movement in the horizontal direction. At this time, the image captured by the wafer vision unit 195 can determine whether the wafer D is defective, and only pick up the good wafer D. During the supply of the wafer D to the fourth intermediate stage 184 as described above, the first wafer pick-up portion 185-1 may supply the wafer D to the second intermediate stage 182.

When the process as described above is completed, the second wafer pick-up section 185-2 and the first wafer pick-up section 185-1 may supply the wafer D to the third intermediate stage 183 and the first intermediate stage 181, respectively.

As described above, when the wafer D is supplied to the first intermediate stage 181 to the fourth intermediate stage 184, the intermediate vision section 194 may photograph the wafer D disposed on the first intermediate stage 181 to the fourth intermediate stage 184. By comparing the predetermined image with the captured wafer image, the orientation of the wafer D (for example, the degree of skew of the wafer D, etc.) can be determined, and the positions of the first intermediate stage 181 to the fourth intermediate stage 184 are changed, The orientation of the wafer D can be mapped to a predetermined position.

As described above, when the orientation adjustment of the wafer D is completed, the first mounting head 171a to the fourth mounting head 174a can linearly move the wafer D mounted on the first intermediate stage 181 to the fourth intermediate stage 184, Transferred to the first to fourth circuit substrates P1 to P4. At this time, the first to fourth mounting heads 171a to 174a can be moved from the portion close to the unloading portion 130, and the wafer D is mounted on each of the circuit boards P1, P2, P3, and P4. For example, the fourth mounting head 174a can be moved and the second mounting head 172a can be moved as in the following embodiment to mount the wafer D on the fourth circuit substrate P4 and the third circuit substrate P3. After that, by moving the third mounting head 173a and moving the first mounting head 171a, the wafer D can be mounted on the fourth circuit substrate P4 and the third circuit substrate P3. Thereafter, the fourth mounting head 174a, the second mounting head 172a, the third mounting head 173a, and the first mounting head 171a are moved in order again, and the wafer D can be mounted on the second circuit substrate P2 and the first circuit substrate P1. During the operation as described above, the first wafer pickup portion 185-1 and the second wafer pickup portion 185-2 may place the wafer D on the first intermediate stage 181 to the fourth intermediate stage 184 as described above.

As another embodiment, after the fourth mounting head 174a mounts the wafer D on the fourth circuit substrate P4, the third mounting head 173a may mount the wafer D on the fourth circuit substrate P4. At this time, when the third mounting head 173a mounts the wafer D on the fourth circuit substrate P4, the second wafer pick-up portion 185-2 may place the wafer D on the fourth intermediate stage 184. Thereafter, the fourth mounting head 174a may mount the wafer D on the second circuit substrate P2, and the second wafer pick-up portion 185-2 may place the wafer D on the third intermediate stage 183. The third mounting head 173a can mount the wafer D of the third intermediate stage 183 on the second circuit substrate P2.

After the operations described above, the second mounting head 172a can mount the wafer D on the third circuit substrate P3, and the first mounting head 171a can mount the wafer D on the third circuit substrate P3. After that, the second mounting head 172a and the first mounting head 171a can mount the wafer D on the first circuit board P1.

As another embodiment, the fourth mounting head 174a and the third mounting head 173a may be operated simultaneously to mount the mounting head piece D on the fourth circuit substrate P4 or the second circuit substrate P2, and the second mounting head 172a and the first A mounting head 171a can be operated simultaneously.

As another embodiment, it may be that one of the fourth mounting head 174a or the third mounting head 173a is operated, and one of the second mounting head 172a or the first mounting head 171a is operated. Alternatively, the other of the fourth mounting head 174a or the third mounting head 173a may be operated, and the other of the second mounting head 172a or the first mounting head 171a may be operated. In this way, the fourth mounting head 174a, the second mounting head 172a, the third mounting head 173a and the first mounting head 171a can be operated in sequence, or the third mounting head 173a, the second mounting head 172a, the fourth mounting head can be operated in sequence 174a and the first mounting head 171a. As another embodiment, the fourth mounting head 174a, the first mounting head 171a, the third mounting head 173a, and the second mounting head 172a may be operated in sequence, or the third mounting head 173a, the first mounting head 171a may be operated in sequence , A fourth mounting head 174a and a second mounting head 172a.

As described above, by operating the first to fourth mounting heads 171a to 174a, the wafer D can be quickly mounted on the first to fourth circuit substrates P1 to P4.

As described above, during the transfer of the wafer D by the first mounting head 171a to the fourth mounting head 174a, the lower vision portion 193 can photograph the orientation of the wafer D. At this time, by comparing the orientation of the photographed wafer D with a predetermined position, and changing the positions (for example, rotation, ascent, etc.) of the first mounting head 171a to the fourth mounting head 174a, the orientation of the wafer D can be adjusted to The place corresponding to the predetermined position. In addition, when the first mounting head 171a to the fourth mounting head 174a mount the chip D on the first to fourth circuit boards P1 to P4, the connection vision portion 192 measures the first to fourth circuit boards P1 to P4 by measuring the For the position, the positions of the first circuit board 171a to the fourth circuit board 174a can be adjusted so that the wafer D is mounted at the correct position.

In the bonding apparatus 100 as described above, in addition to the above, the wafer D can be selectively mounted on the first to fourth circuit substrates P1 to P4 according to the quality of the wafer D.

For example, when the wafer W is placed in the wafer cassette 188, by inspecting the surface of the wafer W, the status data of the wafer D related to the wafer W can be recorded in the wafer cassette 188. When the wafer cassette 188 is supplied to the bonding apparatus 100, the recorded data may be input to the bonding apparatus 100. Accordingly, the bonding device 100 can determine the position of the circuit board to be mounted according to the level of the wafer D. Specifically, the bonding apparatus 100 can mount the high-end wafer D only to the second circuit substrate P2 and the fourth circuit substrate P4 adjacent to the unloading portion 120. Furthermore, the bonding device 100 can mount the low-level wafer D only to the first circuit substrate P1 and the third circuit substrate P3 adjacent to the carrier 110. Also, as another embodiment, the bonding apparatus 100 may mount the high-end wafer D on the first circuit substrate P1 and the second circuit substrate P2 disposed on the first transfer portion 131. In addition, the bonding apparatus 100 can mount the low-level wafer D on the third circuit substrate P3 and the fourth circuit substrate P4 disposed on the second transfer portion 132. Here, the bonding apparatus 100 is not limited to the foregoing description, and it can be controlled to mount the high-quality wafer D only on a part of the plurality of circuit boards P1, P2, P3, and P4, and to mount the low-quality wafer D only on the majority The remaining parts of the circuit boards P1, P2, P3 and P4. Therefore, the combination device 100 can provide a circuit board on which only high-quality wafers D or only low-quality wafers D are mounted according to user requirements and product usage environments.

Except as described above, the bonding apparatus 100 can mount mutually different types of wafers D on each circuit substrate P1, P2, P3, and P4. For example, the first mounting head 171a and the third mounting head 173a can mount the type A wafer D, and the second mounting head 172a and the fourth mounting head 174a can mount the type B wafer D different from the type A wafer D. In this case, the wafer W including the wafer A of the type A and the wafer W including the wafer D of the type B may be supplied sequentially or simultaneously. In particular, in this case, there may be a plurality of wafer pickup portions 185, a wafer placement portion 186, a wafer aligner 187, and a wafer transfer portion 189, and a plurality of wafer pickup portions 185, a wafer placement portion 186, The wafer aligner 187 and the wafer transfer unit 189 may be provided in a layered manner or may be provided to be opposed to each other.

Therefore, the bonding apparatus 100 can simultaneously mount the wafer D separately and independently on the plurality of circuit boards P1, P2, P3, and P4, so that the work efficiency can be improved.

In addition, the bonding apparatus 100 can mount the wafer D in the correct position by simultaneously mounting various types of wafers D in the same apparatus.

Fig. 5 shows a plan view of a coupling device according to another embodiment of the present invention.

Referring to FIG. 5, the bonding apparatus 200 may include a carrying part 210, an unloading part 220, a conveying part 230, a cleaner 240, a pre-heating part 250, a heating part 260, a mounting head assembly 270, an intermediate stage 280, a wafer picking part 285, a wafer The circle placement part 286, the wafer aligner 287, the wafer transfer part 289, and the vision part (not shown). Here, the carrier 210, the unloading part 220, the conveying part 230, the cleaner 240, the pre-heating part 250, the heating part 260, the mounting head group 270, the intermediate stage 280, the wafer pickup part 285, the wafer placement part 286, the wafer The circular aligner 287 and the wafer transfer portion 289 are the same as or similar to those described in the foregoing FIGS. 1 to 4, and detailed descriptions of the above-mentioned configurations will be omitted below.

The vision portion may include a circuit substrate pre-alignment vision portion 291, a coupling vision portion 292, a lower vision portion 293, an intermediate vision portion 294, and a wafer vision portion 295. Here, since the circuit board pre-alignment vision portion 291, the coupling vision portion 292, the lower vision portion 293, the intermediate vision portion 294, and the wafer vision portion 295 are the same as or similar to those described in FIGS. 1 to 4, Therefore, detailed descriptions of the above-mentioned configurations will be omitted below.

Please refer to FIG. 5 and the aforementioned descriptions of FIGS. 1 to 4, the present invention may have a plurality of intermediate stages 280 and wafer pick-up portions 285. At this time, the plurality of wafer pick-up portions 285 may be fixed so as not to move, and the plurality of intermediate stages 280 can linearly move in at least one of the first direction and the second direction. Based on this, the plurality of intermediate stages 280 may be respectively provided in the wafer stage driving portions 296 and 297 that linearly move each intermediate stage 280 independently. In this manner, the wafer stage driving sections 296 and 297 may be formed in various forms including linear motors, ball screws and motors. As an embodiment, there may be one wafer stage driving section 296, 297, which is connected to all intermediate stages 280. As another embodiment, there may be a plurality of wafer stage driving parts 296 and 297 connected to the two intermediate stages 280. As another embodiment, there may be a plurality of wafer stage driving parts 296, 297, which are respectively connected to different intermediate stages 280. For ease of understanding, the case where a plurality of wafer stage driving units 296 and 297 are connected to the two intermediate stages 280 will be taken as an example for detailed description.

The plurality of wafer stage driving parts 296 and 297 may include a first wafer stage driving part 296 and a second wafer stage driving part 297 which are arranged to be opposed to each other. At this time, the first wafer stage driving part 296 may be connected to the first intermediate stage (not shown) and the second intermediate stage (not shown), and the second wafer stage driving part 297 may be connected to the third intermediate stage (not shown) Out) and a fourth intermediate station (not shown).

As described above, when the bonding apparatus 200 is in an operating state and wafers are supplied to each intermediate stage 280, the first wafer stage driving section 296 and the second wafer stage driving section 297 may set each intermediate stage 280 at each Below one wafer pickup portion 285 or the side surface of each wafer pickup portion 285. After that, when each wafer pickup 285 is operated to place the wafer D on each intermediate stage 280, the first wafer stage driving part 296 and the second wafer stage driving part 297 may return each intermediate stage 280 to return initial position.

Then, the method of mounting the wafer D on the circuit substrate P can be performed in the same or similar manner as described above.

Therefore, the bonding device 200 can transfer a plurality of chips D and mount them on the circuit board P.

The bonding device 200 can transfer different types of wafers D to be mounted on the circuit substrate P.

The combination device 200 can reduce the operation sequence and operation time, and can improve the operation efficiency.

Fig. 6 shows a plan view of a coupling device according to another embodiment of the present invention.

As shown in FIG. 6, the bonding apparatus 300 may include a carrying part 310, an unloading part 320, a conveying part 330, a cleaner 340, a pre-heating part 350, a heating part 360, a mounting head assembly 370, an intermediate stage 380, and a wafer picking part 385 , A wafer placement section 386, a wafer aligner 387, a wafer transfer section 389, and a vision section (not shown). Here, the carrier 310, the unloading unit 320, the transfer unit 330, the cleaner 340, the pre-heating unit 350, the heating unit 360, the mounting head assembly 370, the intermediate stage 380, the wafer pick-up unit 385, the wafer placement unit 386, the wafer The circular aligner 387 and the wafer transfer portion 389 are the same as or similar to those shown in FIGS. 1 to 4 described above, so detailed descriptions of the above-mentioned configurations will be omitted below.

The vision portion may include a circuit substrate pre-alignment vision portion 391, a connecting portion 392, a lower vision portion 393, an intermediate vision portion 394, and a wafer vision portion 395. Here, since the circuit board pre-alignment vision portion 391, the connection vision portion 392, the intermediate vision portion 394, and the wafer vision portion 395 are the same as or similar to those shown in the foregoing FIGS. 1 to 4, the following will be omitted. Detailed description.

Please refer to FIG. 6 and the foregoing description of FIGS. 1 to 4, the present invention may have a plurality of intermediate stages 380 and wafer pick-up portions 385. At this time, the plurality of wafer pickup portions 385 may move the wafer pickup head (not shown) in at least one of the first direction and the second direction. At this time, the plurality of intermediate stages 380 may be set to be fixed at predetermined positions. As such, each wafer pickup portion 385 may have a wafer pickup head driving portion (not shown) that moves each wafer pickup head in at least one of the first direction and the second direction and moves up and down. In this case, the wafer pickup head driving section may be formed in various forms including linear motors, ball screws, and motors. As another embodiment, the intermediate stage 380 and the wafer pickup head may be linearly moved as described above with reference to FIG. 5. In order to facilitate understanding, the case where the middle stage 380 moves linearly will be taken as an example to explain in detail.

As described above, when the bonding apparatus 300 is in an operating state and wafers are supplied to each intermediate stage 380, each wafer pick-up portion 385 may separate the wafer D from each wafer (not shown) and supply it to each An intermediate station 380. At this time, by linearly moving, the intermediate stage 380 can be set to correspond to the position of each wafer pickup portion 385.

As described above, when the wafer D is placed on each intermediate stage 380, the wafer D can be mounted on each circuit substrate P by the operation of each mounting head assembly 370. Accordingly, the first mounting head assembly 371 and the fourth mounting head assembly 374 can move linearly. For example, by disposing the lower vision portion 393 on the path where the third mounting head assembly 373 moves the wafer D, the fourth mounting head assembly 374 can be linearly moved in the first direction so that the wafer D passes through the lower vision portion 393 Above, wherein the lower vision portion 393 is provided on the path where the third mounting head assembly 373 moves the wafer D. In addition, by disposing the lower vision portion 393 on the path of the second mounting head assembly 372 to move the wafer D, the first mounting head assembly 371 can move linearly in the first direction, so that the wafer D passes through the lower vision portion 393 Above, wherein the lower vision portion 393 is provided on the path of the second mounting head assembly 372 moving the wafer D. In this case, the lower vision portion 393 may photograph the orientation of the wafer D that is respectively attracted to the first mounting head (not shown) and the fourth mounting head (not shown). Therefore, even without the four lower vision portions 393, the orientation of the wafer D adsorbed on each mounting head (not shown) can be confirmed.

As described above, after confirming the orientation of the wafer D attracted to each mounting head, each wafer D can be mounted on each circuit board P. At this time, since each mounting head assembly 370 mounts each wafer D on the circuit substrate P in the same or similar manner as described above, detailed descriptions thereof will be omitted below.

Therefore, the bonding device 300 can transfer a plurality of wafers D and mount them on the circuit board P.

The bonding device 300 can transfer different types of wafers D to be mounted on the circuit substrate P.

The combination device 300 can reduce the operation sequence and operation time, and can improve work efficiency.

Although the present invention is described and illustrated for one or more of the above embodiments, various modifications and changes can be made without departing from the gist and scope disclosed by the present invention. Accordingly, the scope of the appended claims covers all such modifications and changes as fall within the gist of the present invention.

100‧‧‧Combined device

110‧‧‧Carrying Department

120‧‧‧Unloading Department

130‧‧‧Department

140‧‧‧ cleaner

150‧‧‧Preheating Department

160‧‧‧Heating Department

170‧‧‧Mounting head assembly

180‧‧‧intermediate platform (common name)

185‧‧‧ Wafer Pickup Department

186‧‧‧ Wafer Placement Department

187‧‧‧wafer aligner

188‧‧‧wafer cassette

189‧‧‧ Wafer Transfer Department

191‧‧‧Circuit board pre-alignment vision department

192‧‧‧Link Vision Department

193‧‧‧ Lower Vision Department

194‧‧‧Intermediate Vision Department

195‧‧‧ Wafer Vision Department

Claims (6)

A bonding device comprising: a plurality of transfer sections for transferring a plurality of circuit substrates; a plurality of mounting head assemblies for mounting chips on the plurality of chips supplied by each of the plurality of transfer sections On each of the circuit substrates; a plurality of intermediate stages, which are arranged to correspond to each of the plurality of mounting head assemblies, and can temporarily place the wafer; a wafer placement section to place the wafer, Placing the wafer on the wafer; and a wafer pick-up section for picking up the wafer from the wafer placed in the wafer mounting section and supplying the wafer to the plurality of intermediate stages one. The joining device as described in item 1 of the scope of the patent application further includes: a pre-heating section, which is provided on each of the plurality of conveying sections. The bonding device as described in item 1 of the patent application scope further includes: a heating section provided in each of the plurality of transfer sections, and heating the wafer mounting in each of the plurality of circuit boards For each part of the circuit board. The combining device according to item 1 of the patent application scope, wherein the plurality of mounting head assemblies include a first mounting head assembly, a second mounting head assembly, a third mounting head assembly, and a fourth mounting head assembly that are arranged apart from each other , Wherein one of the fourth mounting head assembly and the third mounting head assembly is operated, and one of the second mounting head assembly and the first mounting head assembly is operated. The coupling device according to item 4 of the patent application scope, wherein the other of the fourth mounting head assembly and the third mounting head assembly is operated, and the second mounting head assembly and the first mounting The other of the head assemblies is operated. The bonding device as described in item 1 of the scope of the patent application further includes: a visual part that photographs at least one of the plurality of circuit boards and the wafer.

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